SCLS524B − AUGUST 2003 − REVISED APRIL 2008
Qualified for Automotive Applications
ESD Protection Exceeds 1000 V Per
PW PACKAGE
(TOP VIEW)
MIL-STD-883, Method 3015; Exceeds 150 V
Using Machine Model (C = 200 pF, R = 0)
Operating Range 2-V to 5.5-V VCC
1Y
1A
1B
2Y
2A
2B
GND
description/ordering information
The SN74AHC02 contains four independent 2-input
NOR gates that perform the Boolean function
Y = A B or Y = A + B in positive logic.
1
14
2
13
3
12
4
11
5
10
6
9
7
8
VCC
4Y
4B
4A
3Y
3B
3A
ORDERING INFORMATION{
ORDERABLE
PART NUMBER
PACKAGE‡
TA
TOP-SIDE
MARKING
−40°C to 125°C
TSSOP − PW
Tape and reel
SN74AHC02QPWRQ1
AHC02Q1
† For the most current package and ordering information, see the Package Option Addendum at the end
of this document, or see the TI web site at http://www.ti.com.
‡ Package drawings, thermal data, and symbolization are available at http://www.ti.com/packaging.
FUNCTION TABLE
(each gate)
INPUTS
A
B
OUTPUT
Y
H
X
L
X
H
L
L
L
H
logic diagram (positive logic)
1A
1B
2A
2B
2
1
3
1Y
3A
3B
5
4
6
2Y
4A
4B
8
10
9
11
12
13
3Y
4Y
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 2008, Texas Instruments Incorporated
! "#$ ! %#&'" ($)
(#"! " !%$""! %$ *$ $! $+! !#$!
!(( ,-) (#" %"$!!. ($! $"$!!'- "'#($
$!. '' %$$!)
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1
SCLS524B − AUGUST 2003 − REVISED APRIL 2008
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Output voltage range, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to VCC + 0.5 V
Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −20 mA
Output clamp current, IOK (VO < 0 or VO > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25 mA
Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
Package thermal impedance, θJA (see Note 2)
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied.
Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 3)
VCC
VIH
Supply voltage
VCC = 2 V
VCC = 3 V
High-level input voltage
VCC = 5.5 V
VCC = 2 V
VIL
VI
VO
IOH
∆t/∆v
MAX
2
5.5
Low-level input voltage
Input voltage
Output voltage
VCC = 2 V
VCC = 3.3 V ± 0.3 V
High-level output current
Low-level output current
Input transition rise or fall rate
UNIT
V
1.5
2.1
V
3.85
0.5
VCC = 3 V
VCC = 5.5 V
VCC = 5 V ± 0.5 V
VCC = 2 V
IOL
MIN
0.9
V
1.65
0
5.5
V
0
VCC
−50
mA
V
−4
−8
50
VCC = 3.3 V ± 0.3 V
VCC = 5 V ± 0.5 V
4
VCC = 3.3 V ± 0.3 V
VCC = 5 V ± 0.5 V
100
8
20
mA
mA
mA
ns/V
TA
Operating free-air temperature
−40
125
°C
NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications
of Slow or Floating CMOS Inputs, literature number SCBA004.
2
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SCLS524B − AUGUST 2003 − REVISED APRIL 2008
electrical characteristics over recommended operating free-air temperature range (unless otherwise
noted)
PARAMETER
TEST CONDITIONS
IOH = −50 mA
VOH
IOH = −4 mA
IOH = −8 mA
IOL = 50 mA
VOL
IOL = 4 mA
IOL = 8 mA
II
ICC
VI = 5.5 V or GND
VI = VCC or GND,
Ci
VI = VCC or GND
IO = 0
VCC
MIN
TA = 25°C
TYP
MAX
MIN
2V
1.9
2
1.9
3V
2.9
3
2.9
4.5 V
4.4
4.5
4.4
3V
2.58
4.5 V
3.94
MAX
UNIT
V
2.48
3.8
2V
0.1
0.1
3V
0.1
0.1
4.5 V
0.1
0.1
V
3V
0.36
0.5
4.5 V
0.36
0.5
0 V to 5.5 V
±0.1
±1
mA
2
20
mA
5.5 V
5V
4
10
pF
switching characteristics over recommended operating free-air temperature range,
VCC = 3.3 V ± 0.3 V (unless otherwise noted) (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
LOAD
CAPACITANCE
tPLH
tPHL
A or B
Y
CL = 15 pF
tPLH
tPHL
A or B
Y
CL = 50 pF
MIN
TA = 25°C
TYP
MAX
MIN
MAX
5.6
7.9
1
9.5
5.6
7.9
1
9.5
8.1
11.4
1
13
8.1
11.4
1
13
MIN
MAX
UNIT
ns
ns
switching characteristics over recommended operating free-air temperature range,
VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
LOAD
CAPACITANCE
tPLH
tPHL
A or B
Y
CL = 15 pF
tPLH
tPHL
A or B
Y
CL = 50 pF
MIN
TA = 25°C
TYP
MAX
3.6
5.5
1
6.5
3.6
5.5
1
6.5
5.1
7.5
1
8.5
5.1
7.5
1
8.5
MIN
MAX
UNIT
ns
ns
noise characteristics, VCC = 5 V, CL = 50 pF, TA = 25°C (see Note 4)
PARAMETER
UNIT
VOL(P)
VOL(V)
Quiet output, maximum dynamic VOL
0.8
V
Quiet output, minimum dynamic VOL
−0.8
V
VOH(V)
VIH(D)
Quiet output, minimum dynamic VOH
4.9
High-level dynamic input voltage
3.5
VIL(D)
Low-level dynamic input voltage
NOTE 4: Characteristics are for surface-mount packages only.
POST OFFICE BOX 655303
V
V
1.5
• DALLAS, TEXAS 75265
V
3
SCLS524B − AUGUST 2003 − REVISED APRIL 2008
operating characteristics, VCC = 5 V, TA = 25°C
PARAMETER
Cpd
TEST CONDITIONS
Power dissipation capacitance
No load,
TYP
f = 1 MHz
UNIT
15
pF
PA
RAMETER MEASUREMENT INFORMATION
From Output
Under Test
RL = 1 kΩ
From Output
Under Test
Test
Point
S1
VCC
Open
TEST
GND
CL
(see Note A)
CL
(see Note A)
S1
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open Drain
Open
VCC
GND
VCC
LOAD CIRCUIT FOR
3-STATE AND OPEN-DRAIN OUTPUTS
LOAD CIRCUIT FOR
TOTEM-POLE OUTPUTS
VCC
50% VCC
Timing Input
tw
tsu
VCC
Input
50% VCC
50% VCC
0V
th
VCC
50% VCC
Data Input
50% VCC
0V
0V
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VOLTAGE WAVEFORMS
PULSE DURATION
VCC
50% VCC
Input
50% VCC
0V
tPLH
In-Phase
Output
tPHL
50% VCC
tPHL
Out-of-Phase
Output
VOH
50% VCC
VOL
VCC
Output
Control
Output
Waveform 1
S1 at VCC
(see Note B)
50% VCC
0V
tPZL
VOH
50% VCC
VOL
tPLZ
≈VCC
50% VCC
tPZH
tPLH
50% VCC
50% VCC
Output
Waveform 2
S1 at GND
(see Note B)
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
VOL + 0.3 V
VOL
tPHZ
50% VCC
VOH − 0.3 V
VOH
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤ 3 ns, tf ≤ 3 ns.
D. The outputs are measured one at a time with one input transition per measurement.
E. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
4
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PACKAGE OPTION ADDENDUM
www.ti.com
12-Oct-2011
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
SN74AHC02QPWRG4Q1
ACTIVE
TSSOP
PW
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74AHC02QPWRQ1
ACTIVE
TSSOP
PW
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
(3)
Samples
(Requires Login)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN74AHC02-Q1 :
• Catalog: SN74AHC02
• Enhanced Product: SN74AHC02-EP
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
12-Oct-2011
• Military: SN54AHC02
NOTE: Qualified Version Definitions:
• Catalog - TI's standard catalog product
• Enhanced Product - Supports Defense, Aerospace and Medical Applications
• Military - QML certified for Military and Defense Applications
Addendum-Page 2
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