SGDS023A − FEBRUARY 2002 − REVISED APRIL 2008 D Qualified for Automotive Applications D EPIC (Enhanced-Performance Implanted D OR PW PACKAGE (TOP VIEW) CMOS) Process 1A 1Y 2A 2Y 3A 3Y GND D Inputs Are TTL-Voltage Compatible D Latch-Up Performance Exceeds 250 mA Per D JESD 17 ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0) 1 14 2 13 3 12 4 11 5 10 6 9 7 8 VCC 6A 6Y 5A 5Y 4A 4Y description The SN74AHCT14Q contains six independent inverters. This device performs the Boolean function Y = A. Each circuit functions as an independent inverter, but because of the Schmitt action, the inverters have different input threshold levels for positive-going (VT+) and for negative-going (VT−) signals. ORDERING INFORMATION{ −40°C to 125°C ORDERABLE PART NUMBER PACKAGE‡ TA TOP-SIDE MARKING SOIC − D Tape and reel SN74AHCT14QDRQ1 TSSOP − PW Tape and reel SN74AHCT14QPWRQ1 AHCT14Q HB14Q † For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at http://www.ti.com. ‡ Package drawings, thermal data, and symbolization are available at http://www.ti.com/packaging. FUNCTION TABLE (each inverter) INPUT A OUTPUT Y H L L H logic symbol† 1A 2A 3A 4A 5A 6A 1 2 3 4 5 6 9 8 11 10 13 12 1Y 2Y 3Y 4Y 5Y 6Y † This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. EPIC is a trademark of Texas Instruments. Copyright 2008, Texas Instruments Incorporated !"# $"%&! '#( '"! ! $#!! $# )# # #* "# '' +,( '"! $!#- '# #!#&, !&"'# #- && $##( POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 SGDS023A − FEBRUARY 2002 − REVISED APRIL 2008 logic diagram, each inverter (positive logic) A Y absolute maximum ratings over operating free-air temperature range (unless otherwise noted)‡ Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V Output voltage range, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to VCC + 0.5 V Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −20 mA Output clamp current, IOK (VO < 0 or VO > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25 mA Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA Package thermal impedance, θJA (see Note 2): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86°C/W PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113°C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C ‡ Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. The package thermal impedance is calculated in accordance with JESD 51-7. recommended operating conditions (see Note 3) MIN MAX 4.5 5.5 V Input voltage 0 5.5 V VO IOH Output voltage 0 VCC −8 mA IOL TA Low-level output current 8 mA 125 °C VCC VI Supply voltage High-level output current Operating free-air temperature −40 UNIT V NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SGDS023A − FEBRUARY 2002 − REVISED APRIL 2008 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) VCC MIN TA = 25°C TYP MAX MIN MAX VT+ Positive-going input threshold voltage 4.5 V 0.9 1.9 0.9 1.9 5.5 V 1 2.1 1 2.1 VT− Negative-going input threshold voltage 4.5 V 0.5 1.5 0.5 1.5 5.5 V 0.6 1.7 0.6 1.7 ∆VT Hysteresis (VT+ − VT−) 4.5 V 0.4 1.4 0.4 1.4 5.5 V 0.4 1.5 0.4 1.5 PARAMETER TEST CONDITIONS UNIT V V V IOH = −50 mA IOH = −8 mA 4.5 V 4.4 VOH 4.5 V 3.94 IOL = 50 mA IOL = 8 mA 4.5 V 0.1 0.1 VOL 4.5 V 0.36 0.44 II ICC VI = 5.5 V or GND VI = VCC or GND, 0 V to 5.5 V ∆ICC† One input at 3.4 V, Other inputs at VCC or GND IO = 0 4.5 4.4 V 3.8 V ±0.1 ±1 mA 5.5 V 2 20 mA 5.5 V 1.35 1.5 mA Ci VI = VCC or GND 5V 2 10 † This is the increase in supply current for each input at one of the specified TTL voltage levels rather than 0 V or VCC. pF switching characteristics over recommended operating free-air temperature range VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 1) PARAMETER FROM (INPUT) TO (OUTPUT) LOAD CAPACITANCE tPLH tPHL A Y CL = 15 pF tPLH tPHL A Y CL = 50 pF TA = 25°C MIN TYP MAX MIN MAX 4 7 1 8 4 7 1 8 5.5 8 1 9 5.5 8 1 9 MIN TYP MAX UNIT ns ns noise characteristics, VCC = 5 V, CL = 50 pF, TA = 25°C (see Note 4) PARAMETER UNIT VOL(P) VOL(V) Quiet output, maximum dynamic VOL 0.9 V Quiet output, minimum dynamic VOL −0.7 V VOH(V) VIH(D) Quiet output, minimum dynamic VOH 4.3 V High-level dynamic input voltage 2.1 VIL(D) Low-level dynamic input voltage NOTE 4: Characteristics are for surface-mount packages only. V 0.5 V TYP UNIT operating characteristics, VCC = 5 V, TA = 25°C PARAMETER Cpd TEST CONDITIONS Power dissipation capacitance No load, POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 f = 1 MHz 12 pF 3 SGDS023A − FEBRUARY 2002 − REVISED APRIL 2008 PARAMETER MEASUREMENT INFORMATION From Output Under Test RL = 1 kΩ From Output Under Test Test Point S1 VCC Open TEST GND CL (see Note A) CL (see Note A) S1 tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open Drain Open VCC GND VCC LOAD CIRCUIT FOR 3-STATE AND OPEN-DRAIN OUTPUTS LOAD CIRCUIT FOR TOTEM-POLE OUTPUTS 3V 1.5 V Timing Input 0V tw 3V 1.5 V Input 1.5 V th tsu 3V 1.5 V Data Input 1.5 V 0V 0V VOLTAGE WAVEFORMS PULSE DURATION VOLTAGE WAVEFORMS SETUP AND HOLD TIMES 3V 1.5 V Input 1.5 V 0V tPLH In-Phase Output tPHL 50% VCC tPHL Out-of-Phase Output VOH 50% VCC VOL Output Waveform 1 S1 at VCC (see Note B) VOH 50% VCC VOL 1.5 V tPLZ ≈VCC 50% VCC Output Waveform 2 S1 at GND (see Note B) VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS 1.5 V 0V tPZL tPZH tPLH 50% VCC 3V Output Control VOL + 0.3 V VOL tPHZ 50% VCC VOH − 0.3 V VOH ≈0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤ 3 ns, tf ≤ 3 ns. D. The outputs are measured one at a time with one input transition per measurement. Figure 1. Load Circuit and Voltage Waveforms 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 12-Oct-2011 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp SN74AHCT14QDRG4Q1 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHCT14QDRQ1 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHCT14QPWRG4Q1 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHCT14QPWRQ1 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM (3) Samples (Requires Login) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. 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