SN74AC04-Q1 HEX INVERTER SCAS786B − NOVEMBER 2004 − REVISED JANUARY 2008 D D D D Qualified for Automotive Applications 2-V to 6-V VCC Operation Inputs Accept Voltages to 6 V Max tpd of 7 ns at 5 V PW PACKAGE (TOP VIEW) 1A 1Y 2A 2Y 3A 3Y GND description/ordering information The SN74AC04 device contains six independent inverters. The device performs the Boolean function Y = A. 1 14 2 13 3 12 4 11 5 10 6 9 7 8 VCC 6A 6Y 5A 5Y 4A 4Y ORDERING INFORMATION† ORDERABLE PART NUMBER PACKAGE‡ TA TOP-SIDE MARKING −40°C to 125°C TSSOP − PW Reel of 2000 SN74AC04QPWRQ1 AC04Q −40°C to 85°C TSSOP − PW Reel of 2000 SN74AC04IPWRQ1 AC04I † For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. ‡ Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. FUNCTION TABLE (each inverter) INPUT A OUTPUT Y H L L H logic diagram, each inverter (positive logic) A Y Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2008, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 SN74AC04-Q1 HEX INVERTER SCAS786B − NOVEMBER 2004 − REVISED JANUARY 2008 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to VCC + 0.5 V Output voltage range, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to VCC + 0.5 V Input clamp current, IIK (VI < 0 or VI > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA Output clamp current, IOK (VO < 0 or VO > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±200 mA Package thermal impedance, θJA (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113°C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. The package thermal impedance is calculated in accordance with JESD 51-7. recommended operating conditions (see Note 3) VCC Supply voltage VCC = 3 V VIH High-level High level input voltage MIN MAX 2 6 Low-level Low level input voltage VI Input voltage VO Output voltage IOH IOL ∆t/∆v TA High-level High level output current Low-level Low level output current VCC = 4.5 V 3.15 VCC = 5.5 V 3.85 V 0.9 VCC = 4.5 V 1.35 VCC = 5.5 V 1.65 V 0 VCC V 0 VCC V VCC = 3 V −12 VCC = 4.5 V −24 VCC = 5.5 V −24 VCC = 3 V 12 VCC = 4.5 V 24 VCC = 5.5 V 24 Input transition rise or fall rate 8 free air temperature Operating free-air V 2.1 VCC = 3 V VIL UNIT Q-suffix devices −40 125 I-suffix devices −40 85 mA mA ns/ V °C NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SN74AC04-Q1 HEX INVERTER SCAS786B − NOVEMBER 2004 − REVISED JANUARY 2008 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS IOH = −50 50 µA VOH IOH = −24 24 mA IOL = 50 µA II VI = VCC or GND ICC VI = VCC or GND, Ci VI = VCC or GND IO = 0 tPLH tPHL tPLH tPHL MIN 2.9 2.99 2.9 2.9 4.5 V 4.4 4.49 4.4 4.4 5.5 V 5.4 5.49 5.4 5.4 3V 2.56 2.4 2.46 4.5 V 3.86 3.7 3.76 5.5 V 4.86 4.7 MAX UNIT MAX V 4.76 3V 0.002 0.1 0.1 0.1 4.5 V 0.001 0.1 0.1 0.1 5.5 V 0.001 0.1 0.1 0.1 3V 0.36 0.5 0.44 4.5 V 0.36 0.5 0.44 5.5 V 0.36 0.5 0.44 5.5 V ± 0.1 ±1 ±1 µA 5.5 V 2 40 20 µA 2.8 FROM (INPUT) TO (OUTPUT) A Y FROM (INPUT) TO (OUTPUT) A Y V pF free-air temperature TA = −40°C TO 125°C TA = −40°C TO 85°C MAX MIN MAX MIN TA = 25°C range, UNIT MIN TYP 1.5 4.5 9 1 11 1 10 1.5 4.5 8.5 1 10 1 9.5 switching characteristics over recommended operating VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 1) PARAMETER MIN 3V switching characteristics over recommended operating VCC = 3.3 V ± 0.3 V (unless otherwise noted) (see Figure 1) PARAMETER TA = −40°C TO 85°C TYP IOL = 12 mA IOL = 24 mA MAX TA = −40°C TO 125°C MIN IOH = −12 mA VOL TA = 25°C VCC free-air TA = 25°C MAX temperature TA = −40°C TO 125°C TA = −40°C TO 85°C ns range, UNIT MIN TYP MAX MIN MAX MIN MAX 1.5 4 7 1 8.5 1 7.5 1.5 3.5 6.5 1 7.5 1 7 ns operating characteristics, VCC = 5 V, TA = 25°C PARAMETER Cpd TEST CONDITIONS Power dissipation capacitance CL = 50 pF, POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 f = 1 MHz TYP 45 UNIT pF 3 SN74AC04-Q1 HEX INVERTER SCAS786B − NOVEMBER 2004 − REVISED JANUARY 2008 PARAMETER MEASUREMENT INFORMATION TEST tPLH/tPHL S1 Open From Output Under Test CL = 50 pF (see Note A) S1 Open 50% VCC 50% VCC 0V tPLH 2 × VCC 500 Ω VCC Input (see Note B) tPHL In-Phase Output 50% VCC tPHL 500 Ω tPLH Out-of-Phase Output LOAD CIRCUIT VOH 50% VCC VOL 50% VCC VOH 50% VCC VOL VOLTAGE WAVEFORMS NOTES: A. CL includes probe and jig capacitance. B. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns. C. The outputs are measured one at a time, with one input transition per measurement. Figure 1. Load Circuit and Voltage Waveforms 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 10-Feb-2010 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74AC04QPWRG4Q1 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AC04QPWRQ1 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. 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