MA4SW510B-1 HMIC™ Silicon PIN Diode Switch with Integrated Bias Network RoHS Compliant M/A-COM Products V2 Features ♦ ♦ ♦ ♦ ♦ ♦ Broad Bandwidth Specified up to 18 GHz Usable up to 26 GHz Integrated Bias Network Low Insertion Loss / High Isolation Rugged, Glass Encapsulated Construction Fully Monolithic Description The MA4SW510B-1 device is a SP5T broadband switch with integrated bias network utilizing M/A-COM's HMICTM (Heterolithic Microwave Integrated Circuit) process, US Patent 5,268,310. This process allows the incorporation of silicon pedestals that form series and shunt diodes or vias by imbedding them in low loss, low dispersion glass. By using small spacing between elements, this combination of silicon and glass gives HMIC devices low loss and high isolation performance with exceptional repeatability through low millimeter frequencies. Large bond pads facilitate the use of low inductance ribbon bonds, while gold backside metallization allows for manual or automatic chip bonding via 80/20 - Au/Sn, 62/36/2 - Sn/Pb/Ag solders or electrically conductive silver epoxy. Yellow areas denote wire bond pads Parameter Absolute Maximum Operating Temperature -65oC to +125oC Storage Temperature -65oC to +150oC Junction Temperature +175oC Applied Reverse Voltage 50V Applications RF Incident Power +30dBm C.W. These high performance switches are suitable for use in multi-band ECM, Radar, and instrumentation control circuits where high isolation to insertion loss ratios are required. With a standard +5V/-5V, TTL controlled PIN diode driver, 80nS switching speeds can be achieved. Bias Current +25°C ± 20mA 1 Note: 1. Maximum operating conditions for a combination of RF power, D.C. bias and temperature: 1 ADVANCED: Data Sheets contain information regarding a product MA-COM Technical Solutions is • North America Tel: 800.366.2266 / Fax: 978.366.2266 considering for development. Performance is based on target specifications, simulated results, and/ • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 or prototype measurements. Commitment to develop is not guaranteed. • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product MA-COM Technical Solutions Visit www.macom.com for additional data sheets and product information. has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commit- MA-COM Technical Solutions and its affiliates reserve the right to make changes to the ment to produce in volume is not guaranteed. product(s) or information contained herein without notice. MA4SW510B-1 HMIC™ Silicon PIN Diode Switch with Integrated Bias Network M/A-COM Products RoHS Compliant V2 MA4SW510B-1 (SP5T) Electrical Specifications @ TAMB = +25oC, 10mA Bias current FREQUENCY BAND PARAMETER MIN 2GHz 6GHZ 12GHz 18GHz 2GHz 6GHZ 12GHz 18GHz 6GHZ 12GHz 18GHz 2GHz 6GHZ 12GHz 18GHz INSERTION LOSS ISOLATION INPUT RETURN LOSS OUTPUT RETURN LOSS SWITCHING SPEED 45 40 30 25 10GHz TYP MAX UNITS 1.5 1.0 1.5 2.1 dB dB dB dB dB dB dB dB dB dB dB dB dB dB dB 0.9 1.2 1.8 50 48 40 35 20 20 17 22 19 19 17 80 ns Note: 1.Typical switching speed measured from 10% to 90% of detected RF signal driven by TTL compatible drivers using RC output spiking network, R = 50 – 200Ω , C = 390 – 560pF. Operation of the MA4SW510B-1 Operation of the HMIC Series of PIN switches is achieved by the simultaneous application of negative DC current to the low loss port and positive DC current to the remaining isolated switching ports per the Driver Connections table below. The control currents should be supplied by constant current sources. For insertion loss, -10mA bias results in approximately –2V, and for Isolation ,+10mA yields approximately +0.9V at the respective bias nodes. The backside area of the die is the RF and DC return ground plane. Driver Connections CONTROL LEVEL (DC CURRENT) CONDITION OF RF OUTPUT B2 B3 B4 B5 B6 J2-J1 J3-J1 J4-J1 J5-J1 J6-J1 -10mA +10mA +10mA +10mA +10mA Low Loss Isolation Isolation Isolation Isolation +10mA -10mA +10mA +10mA +10mA Isolation Low Loss Isolation Isolation Isolation +10mA +10mA -10mA +10mA +10mA Isolation Isolation Isolation Isolation Low Loss +10mA +10mA +10mA -10mA +10mA Isolation Isolation Isolation Low Loss Isolation +10mA +10mA +10mA +10mA -10mA Isolation Isolation Isolation Isolation Low Loss 2 ADVANCED: Data Sheets contain information regarding a product MA-COM Technical Solutions is • North America Tel: 800.366.2266 / Fax: 978.366.2266 considering for development. Performance is based on target specifications, simulated results, and/ • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 or prototype measurements. Commitment to develop is not guaranteed. • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product MA-COM Technical Solutions Visit www.macom.com for additional data sheets and product information. has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commit- MA-COM Technical Solutions and its affiliates reserve the right to make changes to the ment to produce in volume is not guaranteed. product(s) or information contained herein without notice. MA4SW510B-1 HMIC™ Silicon PIN Diode Switch with Integrated Bias Network M/A-COM Products RoHS Compliant V2 MA4SW510B-1 TYPICAL INSERTION LOSS 0.00 IL ( dB ) -1.00 -2.00 J2 J3 J4 J5 J6 -3.00 -4.00 -5.00 2.00 4.00 6.00 8.00 10.00 12.00 14.00 16.00 18.00 16.00 18.00 FREQUENCY ( GHz ) MA4SW510B-1 TYPICAL ISOLATION 0.00 -10.00 ISO ( dB ) -20.00 -30.00 -40.00 -50.00 -60.00 J2 J3 J4 J5 J6 -70.00 -80.00 2.00 4.00 6.00 8.00 10.00 12.00 14.00 FREQUENCY ( GHz ) 3 ADVANCED: Data Sheets contain information regarding a product MA-COM Technical Solutions is • North America Tel: 800.366.2266 / Fax: 978.366.2266 considering for development. Performance is based on target specifications, simulated results, and/ • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 or prototype measurements. Commitment to develop is not guaranteed. • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product MA-COM Technical Solutions Visit www.macom.com for additional data sheets and product information. has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commit- MA-COM Technical Solutions and its affiliates reserve the right to make changes to the ment to produce in volume is not guaranteed. product(s) or information contained herein without notice. MA4SW510B-1 HMIC™ Silicon PIN Diode Switch with Integrated Bias Network M/A-COM Products RoHS Compliant V2 MA4SW510B-1 TYPICAL INPUT RETURN LOSS 0.00 IRL ( dB ) -5.00 -10.00 J2 J3 J4 J5 J6 12.00 14.00 -15.00 -20.00 -25.00 -30.00 2.00 4.00 6.00 8.00 10.00 16.00 18.00 16.00 18.00 FREQUENCY ( GHz ) MA4SW510B-1 TYPICAL OUTPUT RETURN LOSS 0.00 ORL ( dB ) -5.00 -10.00 J2 J3 J4 J5 J6 12.00 14.00 -15.00 -20.00 -25.00 -30.00 2.00 4.00 6.00 8.00 10.00 FREQUENCY ( GHz ) 4 ADVANCED: Data Sheets contain information regarding a product MA-COM Technical Solutions is • North America Tel: 800.366.2266 / Fax: 978.366.2266 considering for development. Performance is based on target specifications, simulated results, and/ • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 or prototype measurements. Commitment to develop is not guaranteed. • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product MA-COM Technical Solutions Visit www.macom.com for additional data sheets and product information. has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commit- MA-COM Technical Solutions and its affiliates reserve the right to make changes to the ment to produce in volume is not guaranteed. product(s) or information contained herein without notice. MA4SW510B-1 HMIC™ Silicon PIN Diode Switch with Integrated Bias Network RoHS Compliant M/A-COM Products V2 MA4SW510B-1 Schematic J1 (Input Common Port) DC Bias J6 J2 J5 J4 J3 5 ADVANCED: Data Sheets contain information regarding a product MA-COM Technical Solutions is • North America Tel: 800.366.2266 / Fax: 978.366.2266 considering for development. Performance is based on target specifications, simulated results, and/ • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 or prototype measurements. Commitment to develop is not guaranteed. • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product MA-COM Technical Solutions Visit www.macom.com for additional data sheets and product information. has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commit- MA-COM Technical Solutions and its affiliates reserve the right to make changes to the ment to produce in volume is not guaranteed. product(s) or information contained herein without notice. MA4SW510B-1 HMIC™ Silicon PIN Diode Switch with Integrated Bias Network M/A-COM Products RoHS Compliant V2 MA4SW510B-1 Chip Outline Drawing1,2 DIM A B C D E F G RF Bond Pads (J1-J6) DC Bond Pads (B2-B6) Chip Thickness Mils MIN Millimeters MAX 54 55 27 28 30 31 31 32 19 20 118.5 120.5 35 36 7 X 5 REF. 5 X 5 REF. 5 REF. MIN MAX 1.37 1.40 0.69 0.71 0.76 0.79 0.79 0.81 0.48 0.51 3.01 3.06 0.89 0.91 .178 X .127 REF. .127 X .127 REF. 0.127 REF. Notes: 1. 2. Topside and backside metallization is gold , 2.5µM thick typical. Yellow areas indicate wire bonding pads 6 ADVANCED: Data Sheets contain information regarding a product MA-COM Technical Solutions is • North America Tel: 800.366.2266 / Fax: 978.366.2266 considering for development. Performance is based on target specifications, simulated results, and/ • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 or prototype measurements. Commitment to develop is not guaranteed. • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product MA-COM Technical Solutions Visit www.macom.com for additional data sheets and product information. has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commit- MA-COM Technical Solutions and its affiliates reserve the right to make changes to the ment to produce in volume is not guaranteed. product(s) or information contained herein without notice. MA4SW510B-1 HMIC™ Silicon PIN Diode Switch with Integrated Bias Network RoHS Compliant M/A-COM Products V2 Wire/Ribbon and Die Attachment Recommendations Cleanliness These chips should be handled in a clean environment. Wire Bonding Thermosonic wedge wire bonding using 0.00025” x 0.003” ribbon or 0.001” diameter gold wire is recommended. A heat stage temperature of 150oC and a force of 18 to 22 grams should be used. Ultrasonic energy should be adjusted to the minimum required to achieve a good bond. RF bond wires should be kept as short and straight as possible. Mounting The HMIC switches have Ti-Pt-Au back metal. They can be die mounted with a gold-tin eutectic solder preform or conductive epoxy. Mounting surface must be clean and flat. Eutectic Die Attachment An 80/20, gold-tin, eutectic solder preform is recommended with a work surface temperature of 255oC and a tool tip temperature of 265oC. When hot gas is applied, the tool tip temperature should be 290oC. The chip should not be exposed to temperatures greater than 320oC for more than 20 seconds. No more than three seconds should be required for attachment. Solders containing tin should not be used. Epoxy Die Attachment A minimum amount of epoxy should be used. A thin epoxy fillet should be visible around the perimeter of the chip after placement. Cure epoxy per manufacturer’s schedule. (typically 125-150oC). Ordering Information Part Number Package MA4SW510B-1 Waffle Pack 7 ADVANCED: Data Sheets contain information regarding a product MA-COM Technical Solutions is • North America Tel: 800.366.2266 / Fax: 978.366.2266 considering for development. Performance is based on target specifications, simulated results, and/ • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 or prototype measurements. Commitment to develop is not guaranteed. • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product MA-COM Technical Solutions Visit www.macom.com for additional data sheets and product information. has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commit- MA-COM Technical Solutions and its affiliates reserve the right to make changes to the ment to produce in volume is not guaranteed. product(s) or information contained herein without notice.