MADP-064908-131000 Unconnected Double Tee Surmount TM PIN Chip RoHS Compliant Rev. V3 Features ♦ ♦ ♦ ♦ ♦ ♦ ♦ Case Style - ODS-1310 No Wire Bonds Required Rugged Silicon-Glass Construction Silicon Nitride Passivation Polymer Scratch Protection Ultra-Low Parasitic Capacitance and Inductance Higher RF C.W. Power Handling Better Performance than Packaged Devices Description and Applications This device is a silicon glass PIN diode chip fabricated with M/A-COM Tech Solutions patented HMIC process. This 80μm I-region length device features six silicon pedestals embedded in a low loss, low dispersion glass. The diodes are formed on the top of a pedestal and connections to the backside of the device are facilitated by making the pedestal sidewalls electrically conductive. Selective backside metallization is applied producing a surface mount device. The topside is fully encapsulated with silicon nitride and has an additional polymer layer for scratch protection. These protective coatings prevent damage to the junction and the anode air-bridge during handling and assembly. The vertical silicon diode topology provides for a highly efficient heat transfer medium. These surface mount devices are suitable for usage in higher (3W avg.) incident power switches. Small parasitic inductance and excellent RC constant make these devices ideal for absorptive SPST, reflective SP2T switches, and attenuator circuits, where higher P1db and power handling values are required. Absolute Maximum Ratings1 @ TAMB = +25°C (unless otherwise specified) Parameter Absolute Maximum Forward Current 250mA Reverse Voltage –100V Operating Temperature -55°C to +125°C Storage Temperature -55°C to +150°C Junction Temperature +175°C C.W. Incident Power +35dBm Mounting Temperature +300°C for 10 seconds 1. Operation of this device above any one of these parameters may cause permanent damage. ADVANCED: Data Sheets contain information regarding a product MA-COM Technical Solutions is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements. Commitment to develop is not guaranteed. PRELIMINARY: Data Sheets contain information regarding a product MA-COM Technical Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. Inches Min. Max. Millimeters Min. Max. A 0.060 0.062 1.524 1.575 B 0.036 0.038 0.914 0.965 C 0.004 0.008 0.102 0.203 D 0.011 0.012 0.279 0.305 Dim 1. Backside Metal: 0.1microns thick. 2. Shaded Areas Indicate Backside Ohmic Gold Contacts. • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 • India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588 Visit www.macomtech.com for additional data sheets and product information. MA-COM Technical Solutions and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. MADP-064908-131000 Unconnected Double Tee Surmount TM PIN Chip RoHS Compliant Rev. V3 Electrical Specifications @ +25 °C, per Diode Junction Symbol Conditions Units CT -40V, 1MHz1 CT Min. Typ. Max. pF 0.05 0.07 -40V, 1GHz1,3 pF 0.04 0.06 RS 10mA, 1GHz2,3 Ω 5.0 VF 10mA V 0.83 VR -10μA V IR -70V μA –0.1 TL +10mA /-6mA ns 200 θTH 1A /10mA °C/W 150 –70 1.00 –100 –10 1. Total capacitance, CT, is equivalent to the sum of Junction Capacitance ,Cj, and Parasitic Capacitance, Cpar. 2. Series resistance RS is equivalent to the total diode resistance : Rs = Rj (Junction Resistance) + Rc (Ohmic Resistance) 3. Rs, CT, TL, θTH are measured on an HP4291A Impedance Analyzer with die mounted in a ceramic package with Sn 60/Pb 40 solder Equivalent Double Tee Equivalent Circuit Top View 6 1 5 2 3 4 Notes: 1. Ports 2 and 5 have a Connected Cathode-Anode Node. 2. Ports 1,3,4, and 6 Have a Singular, Un-Connected Node. ADVANCED: Data Sheets contain information regarding a product MA-COM Technical Solutions is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements. Commitment to develop is not guaranteed. PRELIMINARY: Data Sheets contain information regarding a product MA-COM Technical Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 • India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588 Visit www.macomtech.com for additional data sheets and product information. MA-COM Technical Solutions and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. MADP-064908-131000 Unconnected Double Tee Surmount TM PIN Chip RoHS Compliant Rev. V3 SP2T All Series Reflective Switch with +5V and TTL Logic Control ( 2-18 GHz ) J1? +1.8 V 22?pF J22?pF 15 nH J2 22 pF 22 pF J3 1 4 3,6 5 2 HM IC Die 22 pF 15 nH 22 pF 15 nH B2 Bias B3 Bias +5 V +5V +5V 100 Ω +5V 100Ω SN7406, SN7416 TTL Open Collector G ate Driver ( X2 ) RF Truth Table for Reflective SP2T using Singular Power Supply: +5V, + I Only RF State B2 Diode Bias B3 Diode Bias J1 – J2 Low Loss & J1– J3 Isolation J1 – J3 Low Loss & J1–J2 Isolation +3.6V @ +14mA +0.5V @ 0mA +0.5V @ 0mA + 3.6V @ + 14mA Notes: 1. Diode Forward Voltage Differential (ΔVf ) @ 15mA = 0.9V 2. Insertion Loss Diode Bias = (+ 5V – (2)* 0.9V – 1.8V ) / ( 100Ω ) = 14mA 3. Off Isolation Diode Back Bias Voltage = | – ( +1.8V – 0.5V ) | = | – 1.3V |. ADVANCED: Data Sheets contain information regarding a product MA-COM Technical Solutions is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements. Commitment to develop is not guaranteed. PRELIMINARY: Data Sheets contain information regarding a product MA-COM Technical Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 • India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588 Visit www.macomtech.com for additional data sheets and product information. MA-COM Technical Solutions and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. MADP-064908-131000 Unconnected Double Tee Surmount TM PIN Chip RoHS Compliant Rev. V3 SPST All Series Absorptive Switch with +5V and TTL Logic Control ( 2-18 GHz ) +5V 22pF TTL DRIVER 15nH -5V J1 B1 Bias 22pF J2 1 2 3,4 22pF 15nH HMIC Die 5 6 43Ω RF Truth Table for Absorptive SPST using +5V, –5V Power Supplies RF State J1 – J2 Low Loss J1 – J2 Isolation TTL Value 0 1 B1 Diode Bias - 1.8V @ -20mA +2.7V @ + 20mA Notes: 1. Diode Forward Voltage Differential ( ΔVf ) @ 20mA = 0.9 V 2. Diode Rs @ 20mA = 3.5Ω 3. Insertion Loss Diode Bias = – 1.8 V @ -20mA from a Constant Current Source 4. Off Isolation Diode Back Bias Voltage through (2) Diodes = | – ( +2.7 V – 0 V ) | = | – 2.7 V |. ADVANCED: Data Sheets contain information regarding a product MA-COM Technical Solutions is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements. Commitment to develop is not guaranteed. PRELIMINARY: Data Sheets contain information regarding a product MA-COM Technical Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 • India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588 Visit www.macomtech.com for additional data sheets and product information. MA-COM Technical Solutions and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. MADP-064908-131000 Unconnected Double Tee Surmount TM PIN Chip RoHS Compliant Rev. V3 SPST All Series Reflective Switch with +5V and TTL Logic Control (2–18 GHz) +5V SN7406, SN7416 Open Collector Gate Driver +5V 47 Ω 1kΩ 22 pF 15 nH 15 nH B1 Bias J1 J2 1 2 5 6 3,4 22 pF 22 pF HMIC Die RF Truth Table for Reflective SPST using Singular Power Supply: +5V, + I Only RF State TTL Value B1 Diode Bias J1 – J2 Low Loss 0 + 0.5V @ +20mA J1–J2 Isolation 1 +5.0V @ 0mA ADVANCED: Data Sheets contain information regarding a product MA-COM Technical Solutions is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements. Commitment to develop is not guaranteed. PRELIMINARY: Data Sheets contain information regarding a product MA-COM Technical Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 • India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588 Visit www.macomtech.com for additional data sheets and product information. MA-COM Technical Solutions and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. MADP-064908-131000 Unconnected Double Tee Surmount TM PIN Chip RoHS Compliant Rev. V3 MADP-064908 SPICE Model PinDiodeModel NLPINM1 Is=1.0E-14 A Vi=0.0 V Un=900 cm^2/V-sec Wi=7.5 um Rr=20 K Ohm Cmin=0.05 pF Tau=0.20 usec Rs=0.1 Ohm Cj0=0.06 pF Vj=0.7 V M=0.5 Fc=0.5 Imax=1.0E+6 A/m^2 Kf=0.0 Af=1.0 wBv=80 V wPmax=3.0 W Ffe=1.0 Equivalent per Diode Schematic Ls Cp Rp R via R via _ N otes : Rs = 2 * R via + R p ADVANCED: Data Sheets contain information regarding a product MA-COM Technical Solutions is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements. Commitment to develop is not guaranteed. PRELIMINARY: Data Sheets contain information regarding a product MA-COM Technical Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. + • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 • India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588 Visit www.macomtech.com for additional data sheets and product information. MA-COM Technical Solutions and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. MADP-064908-131000 Unconnected Double Tee Surmount TM PIN Chip RoHS Compliant Rev. V3 Assembly Guidelines Handling All semiconductor chips should be handled with care to avoid damage or contamination from perspiration and skin oils. The use of plastic tipped tweezers or vacuum pickups is strongly recommended for individual components. Bulk handling should insure that abrasion and mechanical shock are minimized. Bonding Attachment to a circuit board is made simple through the use of surface mount technology. Mounting pads are conveniently located on the bottom surface of these devices and are removed from the active junction locations. These devices are well suited for solder attachment onto hard and soft substrates. Conductive silver epoxy may also be used for lower Incident power applications (<1W Average Power). The epoxy should be approximately 1-2mils thick and cured at approximately 90°C to 150°C per the manufacturer’s schedule. When soldering these devices on to a hard substrate, hot gas die bonding is preferred. We recommend utilizing a vacuum tip and force of 60 to 100 grams be applied to the top surface of the device. Position the die so that its mounting pads are aligned with the circuit board mounting pads and reflow the solder by heating the circuit trace near the mounting pad while applying 60 to 100 grams of force perpendicular to the top surface of the die. The solder connections to the pads must not be made one at a time. Doing so would create un-equal heat flow and thermal stress to the chip. Solder reflow should not be performed by causing heat to flow through the top surface of the die. Since the HMIC glass is transparent, the edges of the mounting pads can be visually inspected through the die to ensure proper solder flow after attachment is complete. Typical solder re-flow profiles are provided in Application Note 538 “Surface Mounting Instructions“ located on the MA-COM website at www.macomtech.com Ordering Information Part Number MADP-064908-131000 ADVANCED: Data Sheets contain information regarding a product MA-COM Technical Solutions is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements. Commitment to develop is not guaranteed. PRELIMINARY: Data Sheets contain information regarding a product MA-COM Technical Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. Packaging Die in Gel Pack • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 • India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588 Visit www.macomtech.com for additional data sheets and product information. MA-COM Technical Solutions and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.