VISHAY BY527

BY527
Vishay Telefunken
Silicon Mesa Rectifier
Features
D
D
D
D
D
Controlled avalanche characteristics
Glass passivated junction
Hermetically sealed package
Low reverse current
High surge current capability
Applications
94 9539
General purpose
Absolute Maximum Ratings
Tj = 25_C
Parameters
Peak reverse voltage, non repetitive
Reverse voltage
Peak forward surge current
Repetitive peak forward current
Average forward current
Pulse avalanche peak power
Pulse energy in avalanche mode,
non repetitive
(inductive load switch off)
Junction and storage
temperature range
Test Conditions
Type
tp=10ms,
half sinewave
ϕ=180°
Tj=175°C, tp=20ms,
half sinus wave
I(BRV)R=1A, Tj=175°C
i2*t–rating
Symbol
VRSM
VR
IFSM
Value
1250
800
50
Unit
V
V
A
IFRM
IFAV
PR
12
2
1000
A
A
W
ER
20
mJ
i2*t
8
A2*s
Tj=Tstg
–55...+175
°C
Symbol
RthJA
RthJA
Value
45
100
Unit
K/W
K/W
Maximum Thermal Resistance
Tj = 25_C
Parameter
Junction ambient
Document Number 86007
Rev. 2, 24-Jun-98
Test Conditions
l=10mm, TL=constant
on PC board with spacing 25mm
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BY527
Vishay Telefunken
Electrical Characteristics
Tj = 25_C
Parameter
Forward voltage
g
Test Conditions
IF=1A
IF=10A
VR=800V
VR=800V, Tj=100°C
IR=100mA, tp/T=0.01,
tp=0.3ms
VR=0, f=0.47MHz
IF=0.5A, IR=1A, iR=0.25A
IF=1A, di/dt=5A/ms,
VR=50V
IF=1A, di/dt=5A/ms
Reverse current
Breakdown voltage
Diode capacitance
Reverse recovery
y time
Reverse recovery charge
Type
Symbol
VF
VF
IR
IR
V(BR)
Min
Typ
0.9
Max
1.0
1.65
1
10
0.1
5
1250
CD
trr
trr
50
Qrr
Unit
V
V
mA
mA
V
4
4
pF
ms
ms
3
mC
120
1.2
l
I FAV– Average Forward Current ( A )
R thJA – Therm. Resist. Junction / Ambient ( K/W )
Characteristics (Tj = 25_C unless otherwise specified)
l
100
80
TL=constant
60
40
20
1.0
0.8
0.6
0.4
RthJA=100K/W
PCB
VR = VR RM
0.2
0
0
0
5
10
15
20
25
30
l – Lead Length ( mm )
94 9101
0
Figure 1. Typ. Thermal Resistance vs. Lead Length
40
80
120
160
200
Tamb – Ambient Temperature ( °C )
94 9163
Figure 3. Max. Average Forward Current vs.
Ambient Temperature
I FAV– Average Forward Current ( A )
I R – Reverse Current ( mA )
1000
100
Scattering Limit
10
1
1.6
1.2
0.8
RthJA
0.4
VR = VR RM
0.1
0
94 9176
2.0
40
80
120
160
0
200
Tj – Junction Temperature ( °C )
Figure 2. Reverse Current vs. Junction Temperature
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v45K/W
VR = VR RM
l=12mm
0
94 9172
40
80
120
160
200
Tamb – Ambient Temperature ( °C )
Figure 4. Max. Average Forward Current vs.
Ambient Temperature
Document Number 86007
Rev. 2, 24-Jun-98
BY527
Vishay Telefunken
100
80
10
CD – Diode Capacitance ( pF )
IF – Forward Current ( A )
Tj = 25°C
Tj = 175°C
1
0.1
60
40
20
0.01
0
0
0.6
1.2
1.8
2.4
3.0
0.1
VF – Forward Voltage ( V )
94 9175
1
100
10
VR – Reverse Voltage ( V )
94 9177
Figure 5. Typ. Forward Current vs. Forward Voltage
Z thp – Thermal Resistance for Pulse Cond. (K/W)
f = 0.47 MHz
Tj = 25°C
Figure 6. Typ. Diode Capacitance vs. Reverse Voltage
1000
VR RM= 1000 V, RthJA=100K/W
100
tp/T=0.5
10
tp/T=0.2
Tamb= 25°C
tp/T=0.1
Tamb= 45°C
tp/T=0.05
Tamb= 60°C
tp/T=0.02
Tamb= 70°C
tp/T=0.01
1
10–5
Tamb= 100°C
10–4
10–3
10–2
10–1
100
101
tp – Pulse Length ( s )
94 9178
100
101
IFRM – Repetitive Peak
Forward Current ( A )
102
Figure 7. Thermal Response
Dimensions in mm
∅ 3.6 max.
Sintered Glass Case
SOD 57
Weight max. 0.5 g
26 min.
Document Number 86007
Rev. 2, 24-Jun-98
Cathode Identification
4.2 max.
94 9538
technical drawings
according to DIN
specifications
∅ 0.82 max.
26 min.
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BY527
Vishay Telefunken
Ozone Depleting Substances Policy Statement
It is the policy of Vishay Semiconductor GmbH to
1. Meet all present and future national and international statutory requirements.
2. Regularly and continuously improve the performance of our products, processes, distribution and operating
systems
with respect to their impact on the health and safety of our employees and the public, as well as their impact on
the environment.
It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as
ozone depleting substances ( ODSs ).
The Montreal Protocol ( 1987 ) and its London Amendments ( 1990 ) intend to severely restrict the use of ODSs and
forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban
on these substances.
Vishay Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the use of
ODSs listed in the following documents.
1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively
2 . Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental
Protection Agency ( EPA ) in the USA
3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C ( transitional substances ) respectively.
Vishay Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone depleting
substances and do not contain such substances.
We reserve the right to make changes to improve technical design and may do so without further notice.
Parameters can vary in different applications. All operating parameters must be validated for each customer application
by the customer. Should the buyer use Vishay-Telefunken products for any unintended or unauthorized application, the
buyer shall indemnify Vishay-Telefunken against all claims, costs, damages, and expenses, arising out of, directly or
indirectly, any claim of personal damage, injury or death associated with such unintended or unauthorized use.
Vishay Semiconductor GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany
Telephone: 49 ( 0 ) 7131 67 2831, Fax number: 49 ( 0 ) 7131 67 2423
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Document Number 86007
Rev. 2, 24-Jun-98