FORYARD FYLS

SMD
FYLS
FYLS – 3528U
3528UGC
Features:
Single color
Suitable for all SMT assembly and solder process.
Available on tape and Reel
Package :2000pcs/ Reel
Description.
The green source color devices are made with Gallium Arsenide Phosphide on Gallium Phosphide green
Light Emitting Diode.
It is recommended to use a wrist band or anti-electrostatic glove when handling the LEDs.
All devices.equipment and machinery must be electrically grounded.
Package Dimensions
Notes:
1. All dimension units are millimeters（Inches）
2. All dimension tolerance ±0.2mm unless otherwise noted.
3. An epoxy meniscus may extend about 1.5mm down the leads.
SMD
Selection Guide
Part No.
FYLS-3528UGC
Dice
IV(mcd)@20mA
lens type
Green(Gap)
Viewing
Angle
Min
Typ
2θ1/2
85
120
120
Water clear
Electrical/Optical Characteristics at Ta=25゜с
Symbol
λd
Parameter
Dominate
wavelength
VF
Forward Voltage
IR
Reverse Current
Device
min.
typ.
units
test conditions
Green
567
570
nm
IF=20mA
1.6
2.0
V
IF=20mA
5
µA
VR=5V
Absolute Maximum Ratings At= 25゜с
Parameter
White
Units
Power dissipation
60
mW
DC Forward Current
25
mA
Peak Forward Current(1)
140
mA
Reverse Voltage
5
V
Operating/storage Temperature
Note:
1. 1/10 Duty Cycle, 0.1ms Pulse Width.
-40℃ to +85℃
SMD
Reliability Test items And Conditions
The reliability of products shall be satisfied with items listed below.
Confidence level:90%
LTPD:10%
test
sample
Ac/Rc
Hours/Cycles
Size
NO.
Items
test condition
1
Reflow
Temp:240℃±5℃ Min:5sec
2
Temperature cycle
3
Thermal shock
4
High
6Min
22pcs
0/1
300 Cycles
22pcs
0/1
300 Cycles
22pcs
0/1
temp:100℃
1000hrs.
22pcs
0/1
H: +100℃ 15min.～5min
L:-40℃～
15min
H: +100℃ 5min.～10sec.
L:-10℃ 5min
Temperature
Storage
5
LOW Temperature Storage
temp:-55℃
1000hrs.
22pcs
0/1
6
DC Operating Life
IF=20mA
1000hrs.
22pcs
0/1
85℃/R,H80%
1000hrs.
22pcs
0/1
Temperature /High
Humidity
(1)
(1)GaP & AlGaInP 568/Green
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Forward Current(mA)
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Forward Current Derating Curve
0
6
1000
0
5
0 0
4
3
0
2
0 0
1
0
8
0
9
0
7
0
6
0
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0
4
0
2
0
3
0
1
0
Ambient Temperature TA( C)
Relative Luminous Intensity
High
Forward Current(mA)
7
100
0
-60
-35
-10
15
40
Ambient Temperature TA( C )
65
90
SMD
SMT Reflow Soldering Instuctions
Number of reflow process shall be less than 2 times and cooling
Process to normal temperature is required between first and second soldering process
Temperature Profile (lead Solder)
Temperature Profile (lead Solder)
8sec max
230°c
4°c/sec max
4°c/sec max
60sec.max
Above 200°c
4°c/sec max
OVER 120 sec
Time
Recommended Soldering Pattern(Units:mm)
60sec.max
Above 220°c
180-200°c
Temperature
140-160°c
Temperature
5sec max
260°c
4°c/sec max
OVER 120 sec
Time
SMD
Packing and Shipping Spec.
L1
sb
W1
sb
Zip-lock
Desiccant
Antistatic
Bag
Spec.
Spec.
Spec.
203.0.
198.0
Unit:mm
)
s
c
p
(
Y
T
'
Q
Box Dimension(cm):30 * 19* 11.5
Desiccant
.
O
N
T
R
A
P
10 Reels per box
CARTON
Dimension(cm):39*32*38
6boxs/carton
0603B/0603/0805:
4000pcs*10Reels*6boxs
S
G
K S
G
K M
C
8
3
*
1
3
*
8
3
W
W :
S
.
G .
N A
E
M
C/NO
0805B/1206B/1206 1210/1204:
3000pcs*10Reels*6boxs*
3528:2000pcs*10Reels*6boxs
5050:1000pcs*8Reels*6boxs