SMD FYLS - 3528UBC Features: z z z Suitable for all SMT assembly and solder process. Available on tape and Reel Package :2000pcs/ Reel Description. z z z The Blue source color devices are made with Gallium Arsenide Phosphide on Gallium Phosphide blue Light Emitting Diode. It is recommended to use a wrist band or anti-electrostatic glove when handling the LEDs. All devices equipment and machinery must be electrically grounded. Package Dimensions 2 1 2 Polarity mark C0.8 Notes: 1. All dimension units are millimeters（Inches） 2. All dimension tolerance ±0.2mm unless otherwise noted. 3. An epoxy meniscus may extend about 1.5mm down the leads. 1 SMD Selection Guide Part No. FYLS-3528UBC Dice IV(mcd)@20mA lens type Blue(InGaN) Viewing Angle Min Typ 2θ1/2 --- 250 120 Water clear Electrical/Optical Characteristics at Ta=25 ゜с Symbol λd Parameter Dominate wavelength Device min. typ. units test conditions Blue 465 468 nm IF=20mA 3.0 3.2 V IF=20mA VF Forward Voltage IR Reverse Current 5 µA VR=5V C capactiance 100 PF VF=0V,f=1MHZ Absolute Maximum Ratings At= 25 ゜с Parameter White Units Power dissipation 100 mW DC Forward Current 30 mA Peak Forward Current(1) 100 mA Reverse Voltage 5 V Operating/storage Temperature Note: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. -40℃ to +85℃ SMD Typical Electrical/Optical Characteristics Curves(Ta=25°Unless Otherwise Noted) Spectral Reduance Normalized Response ) 1 ( (1)peak@470nm /Blue Relative Luminous intensity vs Forward current Forward Current Vs Forward Voltage Relative Intensity (Lop@20mA=1) Forward Current(mA) 50 40 30 20 10 0 2.7 2.9 3.3 3.1 3.5 3.7 3.9 4.1 4.3 4.5 4.7 Forward Current IF(mA) Forward Voltage(V) Luminous Intensity Vs.Ambient Temperature Forward Current Derating Curve 0 4 0 3 0 2 0 0 1 Forward Current(mA) 0 5 0 8 0 9 0 7 0 6 0 5 0 4 0 3 0 2 0 1 0 Relative Luminous Intensity 0 6 Ambient Temperature TA( ) Ambient Temperature TA( C ) SMD Precautions for use: 1. Suggest the LEDs should be kept between 5℃ and 30℃and 60%RH or less before opening the package, The max. storage period before opening the package is 1 year. 2. After opening the package, the LEDs should be kept at 30℃/35%RH or less, and it should be used within 1 hours. In the event of incomplete usage, it is advised that user preheat the remaining devices at 60±5℃ for 12 hours prior to use. 3. The temperature of manual of soldering not more then 300℃ within 2 sec. The temperature of Reflow soldering not more then 260℃ within 2 sec, should not be done more than twice. When soldering, don’t tress on LEDs during heating. After soldering, don’t warp the circuit board. 4. Repair should not be done after the LEDs have been soldered. When repair is unavoidable,Double-head soldering iron should be used. It should be confirmed beforehand whether the characteristics of the LEDs will be damaged by repair or not. (1) Reflow soldering Temperature profile Temperature Peak temperature Melting-point Pre-heat Soak Reflow Cooling Time Solder=Sn63-Pb37 Solder= Pb-Free Average ramp-up rate:4℃/sec.max Peak preheat temperature:100-150℃ Average ramp-up rate:4℃/sec.max Peak preheat temperature:100-150℃ preheat time:100seconds.max ramp-down rate:6℃/sec.max Peak temperature:230℃ Time within 5℃ of actual peak temperature=10 sec. max Duration above 183℃ is 80 sec. max preheat time:100seconds.max ramp-down rate:6℃/sec.max Peak temperature:250℃ Time within 5℃ of actual peak temperature=10 sec. max Duration above 217℃ is 80 sec. max SMD Recommended Soldering Pattern(Unit:mm) Taping Dimension (Unit:mm) Reel end of Tape no LED Reel Leed Min. 200mm LED mounting part NO LED Reel Leed Min. 200mm SMD Packing and Shipping Spec. L1 sb W1 sb Zip-lock Desiccant Antistatic Bag Spec. Spec. Spec. 203.0. 198.0 Unit:mm ) s c p ( Y T ' Q Box Dimension(cm):30 * 19* 11.5 Desiccant . O N T R A P 10 Reels per box CARTON Dimension(cm):39*32*38 6boxs/carton 0603B/0603/0805: 4000pcs*10Reels*6boxs S G K S G K M C 8 3 * 1 3 * 8 3 W W : S . G . N A E M C/NO 0805B/1206B/1206 1210/1204: 3000pcs*10Reels*6boxs* 3528:2000pcs*10Reels*6boxs 5050:1000pcs*8Reels*6boxs