FAIRCHILD FYPF1004DN

FYPF1004DN
FYPF1004DN
Features
• Low forward voltage drop
• High frequency properties and switching speed
• Guard ring for over-voltage protection
Applications
TO-220F
• Switched mode power supply
• Freewheeling diodes
1
2
3
1. Anode 2.Cathode 3. Anode
SCHOTTKY BARRIER RECTIFIER
Absolute Maximum Ratings TC=25°°C unless otherwise noted
Symbol
Parameter
Value
Units
VRRM
Maximum Repetitive Reverse Voltage
40
V
VR
Maximum DC Reverse Voltage
40
V
IF(AV)
Maximum Average Rectified Current
10
A
IFSM
Maximum Forward Surge Current (per diode)
60Hz Single Half-Sine Wave
@ TC = 130°C
80
A
TJ, TSTG
Operating Junction and Storage Temperature
-40 to +150
°C
Value
4.5
Units
°C/W
Value
Units
Thermal Characteristics
Symbol
RθJC
Parameter
Maximum Thermal Resistance, Junction to Case (per diode)
Electrical Characteristics (per diode) TC=25 °C unless otherwise noted
Symbol
VFM *
IRM *
Parameter
Maximum Instantaneous Forward Voltage
IF = 5A
IF = 5A
IF = 10A
IF = 10A
Maximum Instantaneous Reverse Current
@ rated VR
V
TC = 25 °C
TC = 125 °C
TC = 25 °C
TC = 125 °C
0.55
0.49
0.67
0.65
TC = 25 °C
TC = 125 °C
1
40
mA
* Pulse Test: Pulse Width=300µs, Duty Cycle=2%
©2000 Fairchild Semiconductor International
Rev. A, July 2000
FYPF1004DN
Typical Characteristics
100
o
Reverse Current, I R[mA]
Forward Current, I F[A]
TJ=150 C
10
1
o
TJ=125 C
0.1
o
TJ=75 C
o
TJ=25 C
0.01
0.0
0.5
10
o
TJ=125 C
1
o
TJ=75 C
0.1
0.01
o
TJ=25 C
0.001
1.0
0
1.5
10
Forward Voltage Drop, VF[V]
Figure 1. Typical Forward Voltage Characteristics
(per diode)
40
10
Transient Thermal Impedance [ C/W]
600
o
500
TJ=25 C
o
Junction Capacitance, C J[pF]
30
Figure 2. Typical Reverse Current
vs. Reverse Voltage (per diode)
700
400
300
200
100
90
80
0
10
20
30
40
1
100µ
1m
10m
100m
1
10
Pulse Duration [s]
Reverse Voltage, VR[V]
Figure 4. Thermal Impedance Characteristics
(per diode)
Figure 3. Typical Junction Capacitance
(per diode)
100
Max. Forward Surge Current, I FSM[A]
12
Average Forward Current, IF(AV)[A]
20
Reverse Voltage, VR[V]
DC
10
8
6
4
2
0
0
20
40
60
80
100
120
140
160
o
Case Temperature, TC[ C]
Figure 5. Forward Current Derating Curve
©2000 Fairchild Semiconductor International
80
60
40
20
0
1
10
100
Number of Cycles @ 60Hz
Figure 6. Non-Repetive Sureg Current
(per diode)
Rev. A, July 2000
FYPF1004DN
Package Dimensions
3.30 ±0.10
TO-220F
10.16 ±0.20
2.54 ±0.20
ø3.18 ±0.10
(7.00)
(1.00x45°)
15.87 ±0.20
15.80 ±0.20
6.68 ±0.20
(0.70)
0.80 ±0.10
)
0°
(3
9.75 ±0.30
MAX1.47
#1
+0.10
0.50 –0.05
2.54TYP
[2.54 ±0.20]
2.76 ±0.20
2.54TYP
[2.54 ±0.20]
9.40 ±0.20
4.70 ±0.20
0.35 ±0.10
Dimensions in Millimeters
©2000 Fairchild Semiconductor International
Rev. A, July 2000
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is
not intended to be an exhaustive list of all such trademarks.
ACEx™
Bottomless™
CoolFET™
CROSSVOLT™
E2CMOS™
FACT™
FACT Quiet Series™
FAST®
FASTr™
GTO™
HiSeC™
ISOPLANAR™
MICROWIRE™
POP™
PowerTrench®
QFET™
QS™
Quiet Series™
SuperSOT™-3
SuperSOT™-6
SuperSOT™-8
SyncFET™
TinyLogic™
UHC™
VCX™
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NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR
INTERNATIONAL.
As used herein:
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the body,
or (b) support or sustain life, or (c) whose failure to perform
when properly used in accordance with instructions for use
provided in the labeling, can be reasonably expected to
result in significant injury to the user.
2. A critical component is any component of a life support
device or system whose failure to perform can be
reasonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification
Product Status
Definition
Advance Information
Formative or In
Design
This datasheet contains the design specifications for
product development. Specifications may change in
any manner without notice.
Preliminary
First Production
This datasheet contains preliminary data, and
supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice in order to improve
design.
No Identification Needed
Full Production
This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at
any time without notice in order to improve design.
Obsolete
Not In Production
This datasheet contains specifications on a product
that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.
©2000 Fairchild Semiconductor International
Rev. E