FFA20U60DN FFA20U60DN Features • High voltage and high reliability • High speed switching • Low forward voltage Applications • • • • General purpose Switching mode power supply Free-wheeling diode for motor application Power switching circuits TO-3P 1 2 3 1. Anode 2.Cathode 3. Anode ULTRA FAST RECOVERY POWER RECTIFIER Absolute Maximum Ratings Symbol (per diode) TC=25°°C unless otherwise noted VRRM Parameter Peak Repetitive Reverse Voltage Value 600 Units V IF(AV) Average Rectified Forward Current 20 A IFSM Non-repetitive Peak Surge Current 60Hz Single Half-Sine Wave @ TC = 100°C 120 A TJ, TSTG Operating Junction and Storage Temperature - 65 to +150 °C Value 1.25 Units °C/W Thermal Characteristics Symbol RθJC Parameter Maximum Thermal Resistance, Junction to Case Electrical Characteristics Symbol VFM * IRM * (per diode) TC=25 °C unless otherwise noted Parameter Maximum Instantaneous Forward Voltage IF = 20A IF = 20A Maximum Instantaneous Reverse Current @ rated VR trr Irr Qrr Maximum Reverse Recovery Time Maximum Reverse Recovery Current Maximum Reverse Recovery Charge (IF =20A, di/dt = 200A/µs) WAVL Avalanche Energy Min. Typ. Max Units V TC = 25 °C TC = 100 °C - - 2.2 2.0 TC = 25 °C TC = 100 °C - - 10 100 - - 90 8 360 ns A nC 1.0 - - mJ µA * Pulse Test: Pulse Width=300µs, Duty Cycle=2% ©2002 Fairchild Semiconductor Corporation Rev. A, March 2002 FFA20U60DN Typical Characteristics 10 [µA] 1000 o o TC = 25 C 1 0.1 0.0 100 o TC = 100 C R TC = 100 C Reverse Current , I Forward Current , IF [A] 40 10 1 o TC = 25 C 0.1 0.01 1E-3 0.5 1.0 1.5 2.0 2.5 100 3.0 Forward Voltage , VF [V] Reverse Recovery Time , trr [ns] Typical Capacitance at 0V = 178 pF Capacitance , Cj [pF] 400 500 600 100 200 150 100 50 1 10 IF = 20A o TC = 25 C 90 80 70 60 50 40 100 100 500 di/dt [A/µs] Reverse Voltage , VR [V] Figure 4. Typical Reverse Recovery Time vs. di/dt [A] Figure 3. Typical Junction Capacitance F(AV) 16 IF = 20A 14 o Average Forward Current , I T C = 25 C 12 10 8 6 4 2 0 100 500 di/dt [A/µ s] Figure 5. Typical Reverse Recovery Current vs. di/dt ©2002 Fairchild Semiconductor Corporation 30 25 20 DC Reverse Recovery Current , Irr [A] 300 Figure 2. Typical Reverse Current vs. Reverse Voltage Figure 1. Typical Forward Voltage Drop vs. Forward Current 1 0.1 200 Reverse Voltage , VR [V] 15 10 5 0 60 80 100 120 140 160 o Case Temperature , TC [ C] Figure 6. Forward Current Derating Curve Rev. A, March 2002 FFA20U60DN Package Dimensions TO-3P 15.60 ±0.20 3.80 ±0.20 +0.15 1.00 ±0.20 18.70 ±0.20 23.40 ±0.20 19.90 ±0.20 1.50 –0.05 3.50 ±0.20 3.00 ±0.20 4.80 ±0.20 16.50 ±0.30 13.90 ±0.20 2.00 ±0.20 9.60 ±0.20 12.76 ±0.20 13.60 ±0.20 ø3.20 ±0.10 1.40 ±0.20 +0.15 5.45TYP [5.45 ±0.30] 5.45TYP [5.45 ±0.30] 0.60 –0.05 Dimensions in Millimeters ©2002 Fairchild Semiconductor Corporation Rev. A, March 2002 TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. ACEx™ Bottomless™ CoolFET™ CROSSVOLT™ DenseTrench™ DOME™ EcoSPARK™ E2CMOS™ EnSigna™ FACT™ FACT Quiet Series™ FAST® FASTr™ FRFET™ GlobalOptoisolator™ GTO™ HiSeC™ I2C™ ISOPLANAR™ LittleFET™ MicroFET™ MicroPak™ MICROWIRE™ OPTOLOGIC™ OPTOPLANAR™ PACMAN™ POP™ Power247™ PowerTrench® QFET™ QS™ QT Optoelectronics™ Quiet Series™ SLIENT SWITCHER® SMART START™ SMP™ STAR*POWER™ Stealth™ SuperSOT™-3 SuperSOT™-6 SuperSOT™-8 SyncFET™ TinyLogic™ TruTranslation™ UHC™ UltraFET® VCX™ STAR*POWER is used under license DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems 2. A critical component is any component of a life support which, (a) are intended for surgical implant into the body, device or system whose failure to perform can be or (b) support or sustain life, or (c) whose failure to perform reasonably expected to cause the failure of the life support when properly used in accordance with instructions for use device or system, or to affect its safety or effectiveness. provided in the labeling, can be reasonably expected to result in significant injury to the user. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Product Status Definition Advance Information Formative or In Design This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. Preliminary First Production This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. No Identification Needed Full Production This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. Obsolete Not In Production This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only. ©2002 Fairchild Semiconductor Corporation Rev. H5