TDK IBF12012A007V

Advance Data Sheet: iBF Series – Non-isolated SMT Power Module
iBF Series DC/DC Power Modules
4.5-14V Input, 12A Output
Surface Mount Power Module
iBF power modules perform local voltage conversion from any bus
voltage in the 5V to 12V range. The iBF12012A007V utilizes a
low component count that results in both a low cost structure and
a high level of performance. The open-frame, compact, surface
mountable design features a low profile and weight as well as
additional edge plated pads that allow for extremely flexible and
robust manufacturing processes.
Features
• Size – 20.32mm x 11.43 mm x 8.5
mm (0.80 in. x 0.45 in. x 0.335 in.)
• DOSA Compatible Footprint
• Edge plated castellations for forming
inspectable solder joints
• Surface mountable
• Maximum weight 5.5g (0.194 oz)
• Up to 66W of output power in high
ambient temperature, low airflow
environments with no power derating
• Positive logic on/off
• Flexible Output Voltage Sequencing
• Starts with pre-biased output
• Output voltage adjustment – industry
standard
• Outstanding transient response
without the need for external loop
tuning components
• Constant switching frequency
• Remote Sense
• Power Good
• Full, auto-recovery protection:
o Input under voltage
o Short circuit
o Thermal limit
• ISO Certified manufacturing facilities
• Patent pending
©2010 TDK Innoveta Inc.
iBF12_Full_Datasheet_092010.doc 9/22/2010
Optional Features
• Negative logic on/off
• No output voltage sequencing
• Solder bumping for enhanced
solderability on the EPC footprint
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Advance Data Sheet: iBF Series – Non-isolated SMT Power Module
Ordering information:
Product
Identifier
Package Size
Platform
Input
Voltage
Output
Current/
Power
Units
Main
Output
Voltage
# of
Outputs
i
B
F
12
012
A
007
V
0.80 in. x
0.45 in.
TDK
Innoveta
iBF
4.5V to
14V
12
Amps
0.70V to
5.5V
Safety
Class
Feature Set
0
06
-
-
See option
table
Single
RoHS
Indicator
R
R=RoHS 6
Compliant
Option Table:
Feature Set
Positive
Logic On/Off
00
X
Negative
Logic On/Off
01
02
X
Product Label
Marking
X
x
-000
X
x
-001
x
-002
x
-003
X
X
05
06
LGA Solder
Bumping*
X
03
04
EPC Solder
Bumping*
Sequence
X
X
x
-004
X
x
-005
X
07
X
x
-006
x
-007
* LGA solder bumping option is recommended for customers using the DOSA standard land grid array
footprint and EPC soldering bumping is recommended for customers using the inspectable edge plated
castellation pads
Product Offering:
Code
iBF12012A007V
Input Voltage
Output Voltage
Output Current
Maximum
Output Power
Efficiency
4.5V-14V
0.70V-5.5V
12A
66W
94%
3320 Matrix Drive, Suite 100
Richardson, TX 75802
Phone (877) 498-0099 Toll Free
(469) 916-4747
Fax
(877) 498-0143 Toll Free
(214) 239-3101
[email protected]
http://www.tdkinnoveta.com/
©2010 TDK Innoveta Inc.
iBF12_Full_Datasheet_092010.doc 9/22/2010
℡ (877) 498-0099
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Advance Data Sheet: iBF Series – Non-isolated SMT Power Module
Mechanical Specification:
Dimensions are in mm [in]. Unless otherwise specified tolerances are: x.x ± 0.5 [0.02], x.xx ± 0.25 [0.010]
See ordering information
for solder bumping
options
Pin Locations: (bottom view)
Pin Assignment:
PIN
FUNCTION
PIN
FUNCTION
1
2
ON/OFF
VIN
6
7
VOUT
SENSE +
3
SEQ
8
4
GND
9
SENSE RES
PW GOOD
5
TRIM
10
SYNC RES
©2010 TDK Innoveta Inc.
iBF12_Full_Datasheet_092010.doc 9/22/2010
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Advance Data Sheet: iBF Series – Non-isolated SMT Power Module
Recommended Footprint (top view):
FOR DOSA STANDARD PADS
©2010 TDK Innoveta Inc.
iBF12_Full_Datasheet_092010.doc 9/22/2010
FOR EPC PADS, AND
EPC/DOSA DUAL FOOTPRINT
℡ (877) 498-0099
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Advance Data Sheet: iBF Series – Non-isolated SMT Power Module
Absolute Maximum Ratings:
Stress in excess of Absolute Maximum Ratings may cause permanent damage to the device.
Characteristic
Min
Continuous Input Voltage
Max
Unit
-0.25
15
Vdc
Storage Temperature
-55
125
˚C
Operating Temperature Range (Tc)
-40
115*
˚C
Notes & Conditions
Measured at the location specified in the thermal
measurement figure; maximum temperature varies
with output current – see curve in the thermal
performance section of the data sheet.
* Engineering estimate
Input Characteristics:
Unless otherwise specified, specifications apply over all rated Input Voltage, Resistive Load, and Temperature conditions.
Characteristic
Min
Typ
Max
Unit
Operating Input Voltage
4.5
Maximum Input Current
---
Startup Delay Time from application of input voltage
Notes & Conditions
---
14
Vdc
---
11.5
A
Vin=4.5 to Vin,max; Io=Io,max
---
5
---
mS
Vo=0 to 0.1*Vo,set; on/off=on,
Io=Io,max, Tc=25˚C
Startup Delay Time from on/off
---
5
---
mS
Vo=0 to 0.1*Vo,set; Vin=Vi,nom,
Io=Io,max,Tc=25˚C
Output Voltage Rise Time
---
4
---
mS
Io=Io,max,Tc=25˚C, Vo=0.1 to
0.9*Vo,set
Input Reflected Ripple
---
17
---
mApp
Input Ripple Rejection
---
45*
---
dB
Turn on input voltage
---
4.2
---
V
Turn off input voltage
*Engineering Estimate
---
3.5
---
V
See input/output ripple measurement
figure; BW=20 MHz
@ 120 Hz
Caution: The power modules are not internally fused. An external input line normal blow fuse with a
maximum value of 15A is required, see the Safety Considerations section of the data sheet.
©2010 TDK Innoveta Inc.
iBF12_Full_Datasheet_092010.doc 9/22/2010
℡ (877) 498-0099
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Advance Data Sheet: iBF Series – Non-isolated SMT Power Module
Electrical Data:
Characteristic
Unit
Notes & Conditions
Output Voltage Initial Setpoint
-2
-
+2
%
Vo=3.3Vsetting, Vin=Vin,nom; Io=Io,max;
Tc = 25˚C
Output Voltage Tolerance
-3
-
+3
%
Over all rated input voltage, load, and
temperature conditions to end of life
-----------
83
85.5
87
92
94.5
-----------
%
%
%
%
%
Vin=12V; Io=Io,max; Tc=25˚C
---
mV
Vin=Vin,min to Vin,max
Io=Io,min to Io,max
Efficiency
Min
Vo = 1.2V
Vo = 1.5V
Vo = 1.8V
Vo = 3.3V
Vo = 5.0V
Typ
Max
Line Regulation
---
Load Regulation
---
---
mV
Output Current
0
---
12
A
Output Current Limiting Threshold
---
18
---
A
Vo = 0.9*Vo,nom, Tc<Tc,max)
Short Circuit Current
---
1
---
A
Vo = 0.25V, Tc = 25˚C
Output Ripple and Noise Voltage
---
30
---
mVpp
Measured across one 0.1 uF ceramic
capacitor and 2 x 47uF ceramic capacitor –
see input/output ripple measurement figure;
BW = 20MHz.
Output Voltage Adjustment Range
0.7
---
5.5
V
Output Voltage Sense Range
---
---
0.5
V
Dynamic Response:
Recovery Time
---
40
---
uS
Transient Voltage
---
260
---
mV
---
600
---
kHz
100
---
1500*
uF
Switching Frequency
External Load Capacitance
Vref
0.69
V
di/dt =10A/uS, Vin=Vin,nom; Vo=1.5V, load
step from 25% to 75% of Io,max, Cout =
Co,min
Fixed
Required for trim calculation
F
10000
Ω
Required for trim calculation
*Please contact TDK Innoveta for technical support for very low esr capacitor banks or if higher capacitance is required
©2010 TDK Innoveta Inc.
iBF12_Full_Datasheet_092010.doc 9/22/2010
℡ (877) 498-0099
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Advance Data Sheet: iBF Series – Non-isolated SMT Power Module
Electrical Characteristics:
Typical Efficiency vs. Input Voltage
99
98
97
Efficiency, h(%)
Efficiency, h(%)
97
96
95
94
93
95
93
91
89
92
87
91
85
90
0
0
1.2 2.4 3.6 4.8
6
Vin = 7V
Vin = 14V
7.2 8.4 9.6 10. 12
8
Vin = 7V
Vin = 14V
Vin = 12V
Vin = 9V
Vo = 5V
Vin = 12V
Vin = 4.5V
Vo = 3.3V
94
95
Efficiency, h(%)
93
91
89
87
92
90
88
86
84
82
80
85
0
1.2 2.4 3.6 4.8
6
0
7.2 8.4 9.6 10.8 12
1.2 2.4 3.6 4.8
Vin = 7V
Vin = 14V
6
7.2 8.4 9.6 10.8 12
Output Current (A)
Output Current (A)
Vin = 7V
Vin = 14V
Vin = 12V
Vin = 4.5V
Vo = 1.8V
Vin = 12V
Vin = 4.5V
Vo = 1.5V
93
91
89
87
85
83
81
79
77
75
90
Efficiency, h(%)
Efficiency, h(%)
6
Output Current (A)
Output Current (A)
Efficiency, h(%)
1.2 2.4 3.6 4.8
7.2 8.4 9.6 10. 12
8
85
80
75
70
0
1.2 2.4 3.6 4.8
0
6
7.2 8.4 9.6 10. 12
8
Output Current (A)
Vin = 7V
Vin = 14V
Vo = 1.2V
©2010 TDK Innoveta Inc.
iBF12_Full_Datasheet_092010.doc 9/22/2010
1.2 2.4 3.6 4.8
6
7.2 8.4 9.6 10. 12
8
Output Current (A)
Vin = 7V
Vin = 14V
Vin = 12V
Vin = 4.5V
Vin = 12V
Vin = 4.5V
Vo = 0.7V
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Advance Data Sheet: iBF Series – Non-isolated SMT Power Module
Electrical Characteristics:
Typical Power Dissipation vs. Input Voltage
Power Dissipation (W)
Power Dissipation (W)
4
3.5
3
2.5
2
1.5
1
0.5
0
0
1.2 2.4 3.6 4.8
6
4
3.5
3
2.5
2
1.5
1
0.5
0
0
7.2 8.4 9.6 10. 12
8
1.2 2.4 3.6 4.8
Vin = 7V
Vin = 14V
Vin = 12V
Vin = 9V
Vo = 5V
Vin = 12V
Vin = 4.5V
Vo = 3.3V
3.5
Power Dissipation (W)
3.5
Power Dissipation (W)
7.2 8.4 9.6 10. 12
8
Output Current (A)
Output Current (A)
Vin = 7V
Vin = 14V
6
3
2.5
2
1.5
1
0.5
3
2.5
2
1.5
1
0.5
0
0
0
0
1.2 2.4 3.6 4.8
6
1.2 2.4 3.6 4.8
7.2 8.4 9.6 10. 12
8
6
7.2 8.4 9.6 10. 12
8
Output Current (A)
Output Current (A)
Vin = 7V
Vin = 14V
Vin = 7V
Vin = 14V
Vin = 12V
Vin = 4.5V
Vo = 1.5V
3.5
3
Power Dissipation (W)
Power Dissipation (W)
Vo = 1.8V
Vin = 12V
Vin = 4.5V
3
2.5
2
1.5
1
0.5
0
0
1.2 2.4 3.6 4.8
6
7.2 8.4 9.6 10. 12
8
2.5
2
1.5
1
0.5
0
0
1.2 2.4 3.6 4.8
Output Current (A)
Vin = 7V
Vin = 14V
Vo = 1.2V
©2010 TDK Innoveta Inc.
iBF12_Full_Datasheet_092010.doc 9/22/2010
6
7.2 8.4 9.6 10. 12
8
Output Current (A)
Vin = 12V
Vin = 4.5V
Vin = 7V
Vin = 14V
Vin = 12V
Vin = 4.5V
Vo = 0.7V
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Advance Data Sheet: iBF Series – Non-isolated SMT Power Module
Electrical Characteristics:
Vert = 5A/div
Horz =50ms/div
Vert = 10mV/div
Horz = 20us/div
Vo=2.5V Typical Output Ripple at nominal Input voltage and
full load at Ta=25 degrees
CH1 = 0.5V/div
CH2 = 2V/div
Typical Output Short Circuit Current – CH3, blue
Horz = 2ms/div
Vert = 50mV/div
Horz = 2us/div
lVo=1.8V Typical startup characteristic from on/off at light load.
Upper trace - output voltage, lower trace – on/off signal
Vo=1.8V Typical Input Ripple at nominal Input Voltage and full
load at Ta=25 degrees. Input capacitors 3 x 22uF ceramic
CH1 = 200mV/div
CH2 = 5A/div
CH1 = 200mV/div
CH2 = 5A/div
Horz = 100us/div
Horz = 100us/div
Vo=1.8V Typical output voltage transient response to load step
from 25% to 75% of full load with output current slew rate of
10A/uS. (Cext = 2x47uF ceramic capacitor)
©2010 TDK Innoveta Inc.
iBF12_Full_Datasheet_092010.doc 9/22/2010
Vo=3.3V Typical output voltage transient response to load step
from 0% to 50% of full load with output current slew rate of
10A/uS. (Cext = 2x47uF ceramic capacitor)
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Advance Data Sheet: iBF Series – Non-isolated SMT Power Module
Electrical Characteristics (continued):
Input Current (A)
Output Voltage (V)
2
1.5
1
0.5
0
2
3.5
5
6.5
8
9.5
11
12.5
14
7
6
5
4
3
2
1
0
2
3.5
5
Input Voltage (V)
Io_min = 0A
Io_mid = 6A
Io_max = 12A
Vo=1.8V Typical Output Voltage vs. Input Voltage
Characteristics
Io_min = 0A
Output Voltage (V)
Output Voltage (V)
1.5
1
0.5
6
8
10
12
14
16
18
Io_mid = 6A
1.2 2.4 3.6 4.8
20
14
Io_max = 12A
6
7.2 8.4 9.6 10. 12
8
Output Current (A)
Vin = 12V
Vin = 4.5V
Vo=1.8V Typical Current Limit Characteristics
Output Voltage (V)
12.5
1.79
1.78
Output Current (A)
Vin = 7V
Vin = 14V
11
1.81
1.8
0
4
9.5
1.83
1.82
0
2
8
Vo=1.8V Typical Input Current vs. Input Voltage
Characteristics
2
0
6.5
Input Voltage (V)
Vin = 7V
Vin = 12V
Vin = 14V
Vin = 4.5V
Vo=1.8V Typical load regulation
6
5.5
5
4.5
4
3.5
3
2.5
2
1.5
1
0.5
0
1
2
3
4
5
6
7
8
9 10 11 12 13 14 15
Input Voltage (V)
Upper Limit
Lower Limit
Output Voltage versus Input Voltage Operating Range
©2010 TDK Innoveta Inc.
iBF12_Full_Datasheet_092010.doc 9/22/2010
℡ (877) 498-0099
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Advance Data Sheet: iBF Series – Non-isolated SMT Power Module
Thermal Performance:
14
14
12
Output Current (A)
Output Current (A)
12
10
8
NC
6
0.5 m/s (100 LFM)
1.0 m/s (200 LFM)
2.0 m/s (400 LFM)
4
2
10
8
NC
6
0.5 m/s (100 LFM)
4
1.0 m/s (200 LFM)
2.0 m/s (400 LFM)
2
Tc, Thermal Limit
0
Tc, Thermal Limit
0
25
40
55
70
85
100
115
130
25
Temperature (oC)
40
55
70
85
100
115
130
Temperature (oC)
Vo=5.0V, Vin=12V maximum output current vs. ambient
temperature at nominal input voltage for natural convection
(60lfm) to 400lfm with airflow from pin 2 to pin 3.
Vo=3.3V, Vin=12V maximum output current vs. ambient
temperature at nominal input voltage for natural convection
(60lfm) to 400lfm with airflow from pin 2 to pin 3.
12
Output Current (A)
10
8
6
NC
0.5 m/s (100 LFM)
1.0 m/s (200 LFM)
2.0 m/s (400 LFM)
Tc, Thermal Limit
4
2
0
25
40
55
70
85
100
115
130
Temperature (°C)
Vo=0.7V, Vin=12V maximum output current vs. ambient
temperature at nominal input voltage for natural convection
(60lfm) to 400lfm with airflow from pin 2 to pin 3.
iBF12012A007V thermal measurement location – top view
The thermal curves provided are based upon measurements made in TDK Innoveta’s experimental test setup that is
described in the Thermal Management section. Due to the large number of variables in system design, TDK Innoveta
recommends that the user verify the module’s thermal performance in the end application. The critical component should
be thermo coupled and monitored, and should not exceed the temperature limit specified in the derating curve above. It is
critical that the thermocouple be mounted in a manner that gives direct thermal contact or significant measurement errors
may result. TDK Innoveta can provide modules with a thermocouple pre-mounted to the critical component for system
verification tests.
©2010 TDK Innoveta Inc.
iBF12_Full_Datasheet_092010.doc 9/22/2010
℡ (877) 498-0099
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Advance Data Sheet: iBF Series – Non-isolated SMT Power Module
Soldering Information:
iBF surface mountable power modules are intended to be compatible with standard surface mount component
soldering processes and either hand placed or automatically picked and placed. The figure below shows the position
for vacuum pick up. The maximum weight of the power module is 5.5g (0.19 oz.). Improper handling or cleaning
processes can adversely affect the appearance, testability, and reliability of the power modules. The iBF product is a
moisture sensitivity level 2 device. Contact TDK Innoveta technical support for guidance regarding proper handling,
cleaning, and soldering of TDK Innoveta’s power modules.
Reflow Soldering
The iBF platform is an open frame power module manufactured with SMT (surface mount technology). Due to the high
thermal mass of the power module and sensitivity to heat of some SMT components, extra caution should be taken
when reflow soldering. Failure to follow the reflow soldering guidelines described below may result in permanent
damage and/or affect performance of the power modules.
The iBF power modules can be soldered using natural convection, forced convection, IR (radiant infrared), and
convection/IR reflow technologies. The module should be thermally characterized in its application to develop a
temperature profile. Thermal couples should be mounted to terminal 2 and terminal 6 and be monitored. The
temperatures should be maintained below 260 degrees. Oven temperature and conveyer belt speeds should be
controlled to ensure these limits are not exceeded. In most manufacturing processes, the solder paste required to form
a reliable connection can be applied with a standard 6 mil stencil.
Recommended Reflow Profile
300
250
Temperature (ºC)
Liquidus Line
200
150
100
50
0
0
50
100
150
200
250
300
350
Reflow Time (seconds)
iBF Power Module suggested reflow-soldering profile
©2010 TDK Innoveta Inc.
iBF12_Full_Datasheet_092010.doc 9/22/2010
℡ (877) 498-0099
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Advance Data Sheet: iBF Series – Non-isolated SMT Power Module
Thermal Management:
An important part of the overall system design process
is thermal management; thermal design must be
considered at all levels to ensure good reliability and
lifetime of the final system. Superior thermal design
and the ability to operate in severe application
environments are key elements of a robust, reliable
power module.
A finite amount of heat must be dissipated from the
power module to the surrounding environment. This
heat is transferred by the three modes of heat
transfer: convection, conduction and radiation. While
all three modes of heat transfer are present in every
application, convection is the dominant mode of heat
transfer in most applications. However, to ensure
adequate cooling and proper operation, all three
modes should be considered in a final system
configuration.
power module of interest. The module temperature
should be measured in the final system configuration
to ensure proper thermal management of the power
module. For thermal performance verification, the
module temperature should be measured at the
component indicated in the thermal measurement
location figure on the thermal performance page for
the power module of interest. In all conditions, the
power module should be operated below the
maximum operating temperature shown on the
derating curve. For improved design margins and
enhanced system reliability, the power module may be
operated at temperatures below the maximum rated
operating temperature.
Module
Centerline
A
I
R
F
L
O
W
The open frame design of the power module provides
an air path to individual components. This air path
improves convection cooling to the surrounding
environment, which reduces areas of heat
concentration and resulting hot spots.
Test Setup: The thermal performance data of the
power module is based upon measurements obtained
from a wind tunnel test with the setup shown in the
wind tunnel figure. This thermal test setup replicates
the typical thermal environments encountered in most
modern electronic systems with distributed power
architectures. The electronic equipment in
networking, telecom, wireless, and advanced
computer systems operates in similar environments
and utilizes vertically mounted PCBs or circuit cards in
cabinet racks.
The power module, as shown in the figure, is mounted
on a printed circuit board (PCB) and is vertically
oriented within the wind tunnel. The cross section of
the airflow passage is rectangular. The spacing
between the top of the module and a parallel facing
PCB is kept at a constant (0.5 in). The power
module’s orientation with respect to the airflow
direction can have a significant impact on the
module’s thermal performance.
Thermal Derating: For proper application of the
power module in a given thermal environment, output
current derating curves are provided as a design
guideline on the Thermal Performance section for the
©2010 TDK Innoveta Inc.
iBF12_Full_Datasheet_092010.doc 9/22/2010
Adjacent PCB
12.7
(0.50)
76 (3.0)
AIRFLOW
Air Velocity and Ambient Temperature
Measurement Location
Air Passage
Centerline
Wind Tunnel Test Setup Figure Dimensions are in
millimeters and (inches).
Heat transfer by convection can be enhanced by
increasing the airflow rate that the power module
experiences. The maximum output current of the
power module is a function of ambient temperature
(TAMB) and airflow rate as shown in the thermal
performance figures on the thermal performance page
for the power module of interest. The curves in the
figures are shown for natural convection through 2 m/s
(400 ft/min). The data for the natural convection
condition has been collected at 0.3 m/s (60 ft/min) of
airflow, which is the typical airflow generated by other
heat dissipating components in many of the systems
that these types of modules are used in. In the final
system configurations, the airflow rate for the natural
convection condition can vary due to temperature
gradients from other heat dissipating components.
℡ (877) 498-0099
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Advance Data Sheet: iBF Series – Non-isolated SMT Power Module
Operating Information:
Over-Current Protection: The power modules have
short circuit protection to protect the module during
severe overload conditions. During overload
conditions, the power modules may protect
themselves by entering a hiccup current limit mode.
The modules will operate normally once the output
current returns to the specified operating range. Long
term operation outside the rated conditions and prior
to the hiccup protection engaging is not recommended
unless measures are taken to ensure the module’s
thermal limits are being observed.
Remote On/Off: - The power modules have an
internal remote on/off circuit. The user must supply
compatible switch between the GND pin and the on/off
pin. The maximum voltage generated by the power
module at the on/off terminal is Vin,max. The
maximum allowable leakage current of the switch is
10uA. The switch must be capable of maintaining a
low signal Von/off < 0.5V while sinking 1mA.
The standard on/off logic is positive logic. In the
circuit configuration shown the power module will turn
off if the external switch is on and it will be on if the
switch is off and the on/off pin is pulled up to Vin by an
external 20K ohm resistor. If the positive logic feature
is not being used, terminal 1 should be left open.
Rpullup
Rpullup
Vin (+)
On/ Off
GND
On/Off Circuit for negative logic
Remote Sense: The power modules feature remote
sense to compensate for the effect of output
distribution drops. The output voltage sense range
defines the maximum voltage allowed between the
output power terminals and output sense terminals,
and it is found on the electrical data page for the
power module of interest. If the positive remote sense
feature is not being used, the Sense terminal should
be connected to the Vo terminal.
The output voltage at the Vo terminal can be
increased by either the remote sense or the output
voltage adjustment feature. The maximum voltage
increase allowed is the larger of the remote sense
range or the output voltage adjustment range; it is not
the sum of both. As the output voltage increases due
to the use of the remote sense, the maximum output
current may need to be decreased for the power
module to remain below its maximum power rating.
Vin (+)
The negative remote sense terminal is not internally
connected. This feature is not currently available in
this product series.
On/ Off
Synchronization: The synchronization terminal is not
internally connected. This feature is not currently
available in this product series
GND
On/Off Circuit for positive logic
An optional negative logic is available. In the circuit
configuration shown the power module will turn on if
the external switch is on and it will be off if the on/off
pin is pulled up to Vin by an external 20K ohm
resistor. If the negative logic feature is not being
used, terminal 1 should be left open.
©2010 TDK Innoveta Inc.
iBF12_Full_Datasheet_092010.doc 9/22/2010
Power Good: The power module features an opendrain power good signal which indicates if the output
voltage is being regulated. When power is applied to
the module, but the output voltage is more than +/12% from the nominal voltage set point due to input
under voltage, over temperature, over load, or loss of
control the power good will be pulled to ground
through a 50 ohm maximum impedance. The
maximum leakage current of the power good pin is
15uA. The voltage on the power good pin should be
limited to less than 5.5V in all cases. If the power
good feature is not used, the pin should be left open.
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Advance Data Sheet: iBF Series – Non-isolated SMT Power Module
Output Voltage Adjustment: The output voltage of
the power module may be adjusted by using an
external resistor connected between the Vout trim
terminal and GND terminal. If the output voltage
adjustment feature is not used, trim terminal should be
left open. Care should be taken to avoid injecting
noise into the power module’s trim pin. A small
0.01uF capacitor between the power module’s trim pin
and GND pin may help avoid this.
Vout (V)
Ru (Kohm)
0.7
690
1.2
13.5
1.5
8.52
1.8
6.21
2.5
3.81
3.3
2.64
5.0
1.6
Voltage Sequencing:
Some iBF power modules include a voltage sequence
feature. The voltage sequence feature enables the
user to implement various types of power up and
power down sequencing schemes including sequential
startup, ratiometric startup, and simultaneous startup.
If the sequencing feature is not being used the pin
should be left open or tied to Vin. When the voltage
sequencing feature is used the pre-bias immunity
feature is disabled.
Trim
Rup
GND
Vout(+)
Circuit to increase output voltage
With a resistor between the trim and GND terminals,
the output voltage is adjusted up. To adjust the output
voltage from Vo,nom to Vo,up the trim resistor should
be chosen according to the following equation:
( Vref⋅ F)


 ( Voup − Vref)
Ru := 
ohm
The values of Vref and F are found in the electrical
data section for the power module of interest. The
maximum power available from the power module is
fixed. As the output voltage is trimmed up, the
maximum output current must be decreased to
maintain the maximum rated power of the module.
To use the voltage sequence feature, the module
should be set to an On state using the on/off feature.
The input voltage should be applied and in the
specified operating range for 10mS during which a
50mV voltage potential should be maintained on the
sequence pin. After the 10mS interval, an analog
voltage can be applied to the sequence pin and the
module’s output will track the applied voltage on a one
to one basis until the output reaches its set point
voltage. The final sequence voltage must be higher
than the module set point. For sequential shut down,
the sequence pin voltage should be lowered. The
module will decrease its output voltage on a one to
one basis.
The voltage sequencing circuit has a brief internal
response time between the voltage appearing on the
sequence pin and impacting the output voltage. If
necessary, the impact of the time delay can be
minimized by limiting the slew rate of the voltage on
the sequence pin to less than 0.5 V/ms.
For additional assistance using the voltage
sequencing function, please contact TDK Innoveta
technical support.
e.g. Vo = 1.8V
Ru := 
0.69⋅ 10000 

 ( 1.8 − 0.69) 
©2010 TDK Innoveta Inc.
iBF12_Full_Datasheet_092010.doc 9/22/2010
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Advance Data Sheet: iBF Series – Non-isolated SMT Power Module
EMC Considerations: TDK Innoveta power modules
are designed for use in a wide variety of systems and
applications. For assistance with designing for EMC
compliance, please contact TDK Innoveta technical
support.
Reliability:
The power modules are designed using TDK
Innoveta’s stringent design guidelines for component
derating, product qualification, and design reviews.
The MTBF is calculated to be greater than 14M hours
at full output power and Ta = 40˚C using the Telcordia
SR-332 calculation method.
Input Impedance:
The source impedance of the power feeding the
DC/DC converter module will interact with the DC/DC
converter. To minimize the interaction, low-esr
capacitors should be located at the input to the
module. It is recommended that a 22uF ceramic input
capacitor be placed as close as possible to the
module. Data is provided on the electrical
characteristics page, showing the typical input ripple
voltage with three 22uF ceramic capacitors (TDK part
C3225X7R1C226MT).
Quality:
TDK Innoveta’s product development process
incorporates advanced quality planning tools such as
FMEA and Cpk analysis to ensure designs are robust
and reliable. All products are assembled at ISO
certified assembly plants.
Input/Output Ripple and Noise Measurements:
1uH
1
2
Battery
+
1
2
1
200uF
esr<0.1
100KHz
2
+
1
1
RLoad
Cext
300uF
Vinput
esr<0.1
100KHz
-
Voutput
2
2
Ground
Plane
The input reflected ripple is measured with a current probe and oscilloscope. The ripple current is the current through the 1uH inductor.
The output ripple measurement is made approximately 9 cm (3.5 in.) from the power module using an oscilloscope and BNC socket. The
capacitor Cext is located about 5 cm (2 in.) from the power module; its value varies from code to code and is found on the electrical data page
for the power module of interest under the ripple & noise voltage specification in the Notes & Conditions column.
©2010 TDK Innoveta Inc.
iBF12_Full_Datasheet_092010.doc 9/22/2010
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Advance Data Sheet: iBF Series – Non-isolated SMT Power Module
Safety Considerations:
As of the publishing date, certain safety agency
approvals may have been received on the iBF series
and others may still be pending. Check with TDK
Innoveta for the latest status of safety approvals on
the iBF product line.
For safety agency approval of the system in which the
DC-DC power module is installed, the power module
must be installed in compliance with the creepage and
clearance requirements of the safety agency.
To preserve maximum flexibility, the power modules
are not internally fused. An external input line normal
blow fuse with a maximum value of 15A is required by
safety agencies. A lower value fuse can be selected
based upon the maximum dc input current and
maximum inrush energy of the power module.
Warranty:
TDK Innoveta’s comprehensive line of power solutions
includes efficient, high-density DC-DC converters.
TDK Innoveta offers a three-year limited warranty.
Complete warranty information is listed on our web
site or is available upon request from TDK Innoveta.
3320 Matrix Drive, Suite 100
Richardson, TX 75802
Phone (877) 498-0099 Toll Free
(469) 916-4747
Fax
(877) 498-0143 Toll Free
(214) 239-3101
[email protected]
http://www.tdkinnoveta.com/
©2010 TDK Innoveta Inc.
iBF12_Full_Datasheet_092010.doc 9/22/2010
Information furnished by TDK Innoveta is believed to be accurate and reliable. However, TDK Innoveta assumes no responsibility
for its use, nor for any infringement of patents or other rights of third parties, which may result from its use. No license is granted
by implication or otherwise under any patent or patent rights of TDK Innoveta. TDK Innoveta components are not designed to be
used in applications, such as life support systems, wherein failure or malfunction could result in injury or death. All sales are
subject to TDK Innoveta’s Terms and Conditions of Sale, which are available upon request. Specifications are subject to change
℡ (877) 498-0099
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