SF2069A-1 • Low Insertion Loss • Hermetic 19 x 6.5 mm Surface-mount Case • Complies with Directive 2002/95/EC (RoHS) 96.00 MHz SAW Filter Pb Absolute Maximum Ratings Rating Value Units Maximum Incident Power in Passband +10 dBm Max. DC voltage between any 2 terminals 30 VDC Storage Temperature Range -40 to +150 Suitable for lead-free soldering - Max. Soldering Profile °C 260°C for 30 s SMP-75 Electrical Characteristics Characteristic Nominal Center Frequency ( @ 25°C ) Minimum Insertion Loss Attenuation Passband Amplitude Ripple (p-p) Group Delay Ripple Relative Attenuation (relative to αmin) Operating Temperature Sym Notes fO Min Typ Max Units 95.9 96.00 14 5.0 0.8 80 96.1 16 1.5 125 MHz dB MHz dB ns +85 dB dB °C 1 αmin ≤ 1dB , B1dB ±2.40MHz ±2.40MHz 4.3 40 to 87 MHz 111 to 150 MHz 43 50 -40 TA 1 Impedance Matching to 50 Ω unbalanced Case Style Lid Symbolization (YY = year, WW = week) 48 55 External L-C SMP-75 19 x 6.5 mm Nominal Footprint RFM SF2069A-1 YYWW CAUTION: Electrostatic Sensitive Device. Observe precautions for handling. Notes: 1. 2. 3. 4. 5. 6. 7. Unless noted otherwise, all specifications apply over the operating temperature range with filter soldered to the specified demonstration board with impedance matching to 50 W and measured with 50 Ω network analyzer. Unless noted otherwise, all frequency specifications are referenced to the nominal center frequency, fc. Rejection is measured as attenuation below the minimum IL point in the passband. Rejection in final user application is dependent on PCB layout and external impedance matching design. See Application Note No. 42 for details. "LRIP" or "L" after the part number indicates "low rate initial production" and "ENG" or "E" indicates "engineering prototypes." The design, manufacturing process, and specifications of this filter are subject to change. Either Port 1 or Port 2 may be used for either input or output in the design. However, impedances and impedance matching may vary between Port 1 and Port 2, so that the filter must always be installed in one direction per the circuit design. US and international patents may apply. www.RFM.com E-mail: [email protected] ©2008 by RF Monolithics, Inc. Page 1 of 2 SF2069A-1 - 6/26/08 SMP-75 Case 10-Terminal Ceramic Surface-Mount Case 19 x 6.5 mm Nominal Footprint Case Dimensions Dimension A B C D E H P Min 18.80 6.30 mm Nom 19.00 6.50 1.75 2.29 1.02 1.0 1.905 Max 19.30 6.80 2.00 Min 0.740 0.248 Inches Nom 0.748 0.256 0.069 0.090 0.040 0.039 0.075 Max 0.760 0.268 0.079 Electrical Connections Connection Port 1 Port 2 Terminals Hot 10 Ground Return 1 Hot 5 Ground Return 6 Case Ground All others Single Ended Operation Return is ground Differential Operation Return is hot Materials Solder Pad Termination Au plating 30 - 60 µinches (76.2-152 µm) over 80-200 µinches (203-508 µm) Ni. Lid Fe-Ni-Co Alloy Electroless Nickel Plate (8-11% Phosphorus) 100-200 µinches Thick Body Al2O3 Ceramic Pb Free D C B H P (8 Places) A 6 5 5 6 7 4 4 7 8 3 3 8 9 2 2 9 10 1 1 10 TOP VIEW www.RFM.com E-mail: [email protected] ©2008 by RF Monolithics, Inc. E (10 Places) BOTTOM VIEW Page 2 of 2 SF2069A-1 - 6/26/08