MIC-5603 Advanced Mezzanine Card based on 3rd Generation Intel® Core™ Processors with ECC Features NEW Supports 3rd or 2nd Generation Intel® Core™ Processor family Intel® QM67 PCH chipset with KVM over LAN Up to 8 GB (DDR3 1066/1333/1600 MHz) soldered SDRAM with ECC Two Gigabit Ethernet (RJ-45), one USB 2.0 (or two for full-size sku), one console (micro-USB), and one HDMI Type D ( or Type A for full-size sku) to front panel AMC connector routes Gigabit Ethernet (x2), SATA 3.0 (x2), PCIe x4 Dual XAUI, SRIO, PCIe or custom fabrics on fat pipes with optional AMC fabric mezzanine Boot from network, onboard flash, CFast card or external devices Supports IPMI v1.5 and Serial-over-LAN function AMC.0, AMC.1, AMC.2, and AMC.3 compliant RoHS COMPLIANT 2002/95/EC Introduction The Advantech MIC-5603 is a single-width mid-size or full-size general purpose processor AMC module for ATCA or MicroTCA applications. Its design is based on 3rd generation Intel® Core™ processors in a BGA package combined with the Intel® QM67 chipset. This AMC module supports processors with integrated memory and graphics controllers, and a maximum L3 cache of 4MB. It can support up to 8 GB, dual-channel, on-board DDR3 memory with ECC at 1600 MHz, making it ideal for mission critical applications requiring low latency and reliable memory access. For graphics or control applications the front panel HDMI port provides support for the processor’s integrated Intel® HD 4000 graphics controller with DirectX v11, along with OpenGL v3.1 and OpenCL v1.1 capabilities. As standard feature, external Ethernet connectivity is provided on two dedicated GbE front panel ports, one each from the Intel® QM67 PCH and the onboard Intel® 82580 quad port LAN controller, which also provides two additional GbE ports to the AMC base fabric. The Intel® PCH brings new and enhanced remote management capabilities with KVM over LAN as well as introducing faster I/O than previous generation designs with SATA-III to AMC ports 2..3 and PCIe x4 gen.2 to ports 4..7. This module can also be configured to boot from the network, local CFast compact flash or flash disk, or external storage media such as HDD or USB drives. To enable maximum application flexibility, the MIC-5603 is not only designed to support PICMG AMC sub-specifications such as AMC.1/.2/.3, it also has a fabric expansion mezzanine interface that allows the implementation of standard or customized mezzanine modules that offer enhanced fat pipe connectivity and I/O support. For example, the fabric expansion mezzanine can implement an Intel® 82599 controller offering dual 10 GbE to the fat pipes or a PCIe-to-SRIO bridge or any other type of PCIe device for tailored connectivity to ports 8..11 and 17..20. A dedicated Module Management Controller (MMC) monitors onboard conditions and manages hot swap operation, module replacement and field upgrades without the need to power down the carrier system. Specifications Processor System CPU Max. Speed PCH Ethernet USB 2.0 CFast Onboard Intel 3rd Generation Core i7 mobile processors up to 2.5 GHz (4 MB L3 cache) 3.2 GHz (turbo boost frequency with 1 core) Intel QM67 UEFI BIOS based on AMI (1. Redundant flash with HPM.1 update & rollback, 2. Configuration settings can be changed over IPMI) 5.0 GT/s point-to-point DMI interface to PCH Dual channel DDR3 1066MT/s, 1333MT/s, and 1600MT/s SDRAM with ECC. 8 GB RAM (soldered on-board memory) Intel 82580EB Quad-port Gigabit Ethernet controller Two GbE accessible on front panel via RJ-45 and two SerDes links to AMC ports 0 and 1 One x86 Serial Port (USB slave connector through onboard USB to Serial converter) Two 10/100/1000BASE-T through PCIe based Intel 82580 & 82579 MAC/PHY One port (Type A) Mezzanine Module with CFast socket (NOTE 1) 8 GB (standard) or 16 GB (optional) industrial grade internal SATA flash disk AMC edge connector Other Compatibility MMC IPMI Compliancy Supervision Interval LEDs Standards Two SATA interfaces (6Gbps) to common option ports 2..3 One SATA routed to CF daughter board (optional) WindRiver PNE-LE 3.0, RHEL, CentOS, Windows Server 2008, Windows 7 Enterprise NXP LPC1768 IPMI 1.5 with IPMI 2.0 features (e.g. RMCP, SOL) using Advantech IPMI Core One MMC watchdog, One payload watchdog IPMI compliant x1 blue for hot swap, x1 red/amber for failure and OOS, x1 green for general purpose PICMG AMC.0, AMC.1, AMC.2, AMC.3, IPMI v1.5, HPM.1 BIOS Bus Memory Ethernet Front I/O Interface Mass Storage SATA Interfaces Operating System System Management Watchdog Timer Miscellaneous Compliance DMI Technology Max. Capacity Controllers Interface Serial (COM) All product specifications are subject to change without notice Last updated : 18-Jun-2012 MIC-5603 Block Diagram 1xLAN NC-SI DDR3 4GB High speed B2B Connector 1000BX PCIex8, 1x PCIex1, 1xUSB i82580 PCIex4 1000BX 2xSRIO/XAUI/PCIe (2 Quad Lanes) 4 diffpairs Display ports SATA USB SATA IO Header (full-size sku only) P5 P6 SATA (for CF module) SPI Flash Clocks P8 XAUI/ SRIO/ PCIex4 Redriver SATA GPIO P9 P10 USB2 UART P12 FPGA P13 UART UART Micro AB XAUI/ SRIO HW MONITOR Handle SW TEMP. Sensor FRU E2PROM PICMG3.0+ User LEDs NC-SI MMC MISC P15 P17 UART, SPI, GPIO Reset button Fat Pipes XAUI P11 P14 USB Slave Fat Pipes PCIe P7 (Located on AMM) LPC, SPI SATA Header P4 PCIex4 USB (Located on AMM or CFast module) Flash Common options P3 3rd or 2nd Generation Intel® Core™ Processor + Intel® QM67 Chipset LOM PHY P0 P1 P2 72bit (AMM) AMC fabric mezzanine 72bit HDMI (Type D for mid-size sku/Type A for full-size sku) AMC CONNECTOR DDR3 4GB GPIO P18 P19 RTM P20 Clocks PCIe Ref clock IPMB-L TCLK FCLK Clock Mgmnt. IPMB-L Specifications (Cont.) Power Consumption Physical Characteristics Environment Regulatory Configuration TDP (Estimated) Dimensions (W x D) Temperature Humidity Vibration (5 ~ 500Hz) Shock Altitude Conformance NEBS Level 3 Intel Core i7-3555LE + QM67 + 8GB on-board DDR-III memory 40W max. Mid-size (or Full-size), 180.6 x 73.5 mm Operating Non-operating -5 ~ 55° C (23 ~ 131° F) (NOTE 2) -40 ~ 70° C (-40 ~ 158° F) IEC60068-2-78 (95%RH @ 40° C) IEC60068-2-6 (0.002G2/Hz, 1Grms) IEC60068-2-27 (10G, 11ms) 4,000m above sea level 10,000m above sea level UL94V0, FCC Class B, CE, RoHS & WEEE Ready Designed for GR-63-Core and GR-1089-Core Ordering Information Part Number (NOTE3, NOTE4) MIC-5603A2FZ-M4E MIC-5603A2FZ-M8E MIC-5603A2M-M4E MIC-5603A2M-M8E MIC-5603AFZ-M4E MIC-5603AFZ-M8E MIC-5603AM-M4E MIC-5603AM-M8E Description Full-size front panel, Intel i7-3555LE, 4GB DDR3 with ECC, AMC Mezzanine Module with 8 GB on-board flash Full-size front panel, Intel i7-3555LE, 8GB DDR3 with ECC, AMC Mezzanine Module with 8 GB on-board flash Mid-size front panel, Intel i7-3555LE, 4GB DDR3 with ECC, CFast module with 8 GB on-board flash Mid-size front panel, Intel i7-3555LE, 8GB DDR3 with ECC, CFast module with 8 GB on-board flash Full-size front panel, Intel i7-2655LE, 4GB DDR3 with ECC, AMC Mezzanine Module with 8 GB on-board flash Full-size front panel, Intel i7-2655LE, 8GB DDR3 with ECC, AMC Mezzanine Module with 8 GB on-board flash Mid-size front panel, Intel i7-2655LE, 4GB DDR3 with ECC, CFast module with 8 GB on-board flash Mid-size front panel, Intel i7-2655LE, 8GB DDR3 with ECC, CFast module with 8 GB on-board flash Where Z stands for fabric expansion mezzanine module option (Z = X for XAUI, Z= S for SRIO, Z = R for SAS RAID). Note: 1. CFast module, available on the mid-size sku as default, and the AMC Mezzanine Module are mutually exclusive. For 16 GB on-board flash, please contact your local Advantech sales. 2. Operating Temperature: depending on the actual air flow through the AMC slot. 3. For lower or higher on-board memory support, please contact your local Advantech sales for options. 4. For the Intel Core i7-3517UE or i7-2610EU support, please contact your local Advantech sales. Online Download www.advantech.com/products