ISSI IS41C44052C

IS41C44052C
IS41LV44052C
4Mx4
16Mb DRAM WITH FAST PAGE MODE
ADVANCED INFORMATION
AUGUST 2010
FEATURES
DESCRIPTION
• Fast Page Mode Access Cycle
• TTL compatible inputs and outputs
• Refresh Interval: 2,048 cycles/32 ms
• Refresh Mode: RAS-Only,
CAS-before-RAS (CBR), and Hidden
• Single power supply:
5V±10% (IS41C44052C)
3.3V ± 10% (IS41LV44052C)
• Byte Write and Byte Read operation via two CAS
The ISSI IS41C/41LV44052C is a 4,194,304 x 4-bit high-performance CMOS Dynamic Random Access Memory. The
Fast Page Mode allows 2,048 or 4096 random accesses
within a single row with access cycle time as short as 20
ns per 4-bit word.
These features make the IS41C/41LV44052C ideally suited
for high-bandwidth graphics, digital signal processing,
high-performance computing systems, and peripheral
applications.
The IS41C/41LV44052C is packaged in a 24/26-pin 300-mil
TSOP2 with JEDEC standard pinout.
• Industrial temperature range -40°C to +85°C
• RoHS compliant
KEY TIMING PARAMETERS
Parameter
-50
-60
Unit
RAS Access Time (trac)
50
60
ns
CAS Access Time (tcac)
13
15
ns
Column Address Access Time (taa)
25
30
ns
PIN CONFIGURATION
Fast Page Mode Cycle Time (tpc)
20
25
ns
24 (26) Pin TSOP 2
Read/Write Cycle Time (trc)
84
104
ns
VDD
1
24
GND
I/O0
2
23
I/O3
I/O1
3
22
I/O2
WE
4
21
CAS
RAS
5
20
OE
NC
6
19
A9
A10
7
18
A8
A0
8
17
A7
A1
9
16
A6
A2
10
15
A5
A3
11
14
A4
VDD
12
13
GND
PIN DESCRIPTIONS
A0-A10
I/O0-3
WE
OE
RAS
CAS
Vdd
GND
NC
Address Inputs (2K Refresh)
Data Inputs/Outputs
Write Enable
Output Enable
Row Address Strobe
Column Address Strobe
Power
Ground
No Connection
Copyright © 2010 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without
notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can reasonably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such applications unless Integrated Silicon
Solution, Inc. receives written assurance to its satisfaction, that:
a.) the risk of injury or damage has been minimized;
b.) the user assume all such risks; and
c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. 00B
08/09/2010
1
IS41C44052C
IS41LV44052C
FUNCTIONAL BLOCK DIAGRAM
OE
WE
CAS
CONTROL
LOGIC
CAS
WE
CONTROL
LOGICS
CAS
OE
CONTROL
LOGIC
WE
OE
DATA I/O BUS
COLUMN DECODERS
SENSE AMPLIFIERS
A0-A10
ROW DECODER
REFRESH
COUNTER
ADDRESS
BUFFERS
MEMORY ARRAY
4,194,304 x 4
DATA I/O BUFFERS
RAS
CLOCK
GENERATOR
RAS
RAS
I/O0-I/O3
TRUTH TABLE
Function
Standby
Read
Write: Word (Early Write)
Read-Write
Hidden Refresh Read Write(1)
RAS-Only Refresh
CBR Refresh
RAS
H
L
L
L
L→H→L
L→H→L
H→L
H→L
CAS
H
L
L
L
L
L
H
L
WE
X
H
L
H→L
H
L
X
X
OE
X
L
X
L→H
L
X
X
X
Address tr/tc
X
ROW/COL
ROW/COL
ROW/COL
ROW/COL
ROW/COL
ROW/NA
X
I/O
High-Z
Dout
Din
Dout, Din
Dout
Dout
High-Z
High-Z
Note:
1. EARLY WRITE only.
2
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. 00B
08/09/2010
IS41C44052C
IS41LV44052C
Functional Description
Auto Refresh Cycle
The IS41C/41LV44052C are CMOS DRAMs optimized
for high-speed bandwidth, low power applications. During
READ or WRITE cycles, each bit is uniquely addressed
through the 11 address bit. These are entered 11 bits (A0A10) at a time. The row address is latched by the Row
Address Strobe (RAS). The column address is latched by
the Column Address Strobe (CAS). RAS is used to latch
the first nine bits and CAS is used the latter ten bits.
To retain data, 2,048 refresh cycles are required in each
32 ms period. There are two ways to refresh the memory:
Memory Cycle
A memory cycle is initiated by bring RAS LOW and it
is terminated by returning both RAS and CAS HIGH.
To ensures proper device operation and data integrity
any memory cycle, once initiated, must not be ended or
aborted before the minimum tras time has expired. A new
cycle must not be initiated until the minimum precharge
time trp, tcp has elapsed.
Read Cycle
A read cycle is initiated by the falling edge of CAS or
OE, whichever occurs last, while holding WE HIGH. The
column address must be held for a minimum time specified by tar. Data Out becomes valid only when trac, taa,
tcac and toea are all satisfied. As a result, the access time
is dependent on the timing relationships between these
parameters.
1. By clocking each of the 2,048 row addresses (A0 through
A10) with RAS at least once every 32 ms. Any read,
write, read-modify-write or RAS-only cycle refreshes
the addressed row.
2. Using a CAS-before-RAS refresh cycle. CAS-before-RAS
refresh is activated by the falling edge of RAS, while
holding CAS LOW. In CAS-before-RAS refresh cycle,
an internal 9-bit counter provides the row addresses
and the external address inputs are ignored.
CAS-before-RAS is a refresh-only mode and no data
access or device selection is allowed. Thus, the output
remains in the High-Z state during the cycle.
Power-On
After application of the Vdd supply, an initial pause of
200 µs is required followed by a minimum of eight initialization cycles (any combination of cycles containing a
RAS signal).
During power-on, it is recommended that RAS track with
Vdd or be held at a valid Vih to avoid current surges.
Write Cycle
A write cycle is initiated by the falling edge of CAS and
WE, whichever occurs last. The input data must be valid
at or before the falling edge of CAS or WE, whichever
occurs last.
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Rev. 00B
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3
IS41C44052C
IS41LV44052C
ABSOLUTE MAXIMUM RATINGS(1)
Symbol
Vt
Vdd
Iout
Pd
Ta
Tstg
Parameters
Voltage on Any Pin Relative to GND
5V 3.3V
Supply Voltage
5V
3.3V
Output Current
Power Dissipation
Commercial Operation Temperature
Industrial Operation Temperature
Storage Temperature
Rating
–1.0 to +7.0
–0.5 to +4.6
–1.0 to +7.0
–0.5 to +4.6
50
1
0 to +70
-40 to +85
–55 to +125
Unit
V
V
mA
W
°C
°C
Note:
1. Stress greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device.
This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions
for extended periods may affect reliability.
RECOMMENDED OPERATING CONDITIONS (Voltages are referenced to GND.)
Symbol Parameter
Test Condition
Min. Typ.
Max.
Unit
Vdd
Supply Voltage
5V
4.5
5.0
5.5
V
3.3V
3.0
3.3
3.6
Vih
Input High Voltage
5V
2.0
— Vdd + 1.0 V
3.3V
2.0
— Vdd + 0.3
Vil
Input Low Voltage
5V
–1.0 —
0.8
V
3.3V
–0.3 —
0.8
Iil
Input Leakage Current
Any input 0V ≤ Vin ≤ Vdd
–5
5
µA
Other inputs not under test = 0V
Iio
Output Leakage Current Output is disabled (Hi-Z)
–5
5
µA
0V ≤ Vout ≤ Vdd
Voh
Output High Voltage Level
Ioh = –5.0 mA
5V
2.4
—
V
Ioh = –2.0 mA 3.3V
2.4
—
Vol
Output Low Voltage Level
Iol = 4.2 mA
5V
—
0.4
V
Iol = 2 mA
3.3V
—
0.4
Commercial Ambient Temperature
0
—
+70
°C
Ta
Industrial Ambient Temperature
-40
—
+85
CAPACITANCE(1,2)
Symbol
Cin1
Cin2
Cio
Parameter
Input Capacitance: A0-A10
Input Capacitance: RAS, CAS, WE, OE Data Input/Output Capacitance: I/O0-I/O3
Max.
5
7
7
Unit
pF
pF
pF
Notes:
1. Tested initially and after any design or process changes that may affect these parameters.
2. Test conditions: Ta = 25°C, f = 1 MHz.
4
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IS41C44052C
IS41LV44052C
ELECTRICAL CHARACTERISTICS(1)
(Recommended Operating Conditions unless otherwise noted.)
Symbol Parameter
Test Condition
Vdd/Speed Min.
Idd1 Standby Current: TTL
RAS, CAS ≥ VihCommercial
Industrial
RAS, CAS ≥ Vdd – 0.2V Max. Unit
5V
3.3V
—
5V
—
3.3V
—
2
0.5
3
2
mA
5V
3.3V
—
—
1
0.5
mA
Idd2 Standby Current: CMOS
Idd3 Operating Current: RAS, CAS,
Random Read/Write(2,3)
Address Cycling, trc = trc (min.)
Average Power Supply Current
-50
-60
—
—
120
110
mA
Idd4 Operating Current:
RAS= Vil, CAS ≥ Vih
Fast Page Mode(2,3,4)
trc = trc (min.)
Average Power Supply Current
-50
-60
—
—
90
80
mA
Idd5 Refresh Current:
RAS Cycling, CAS ≥ Vih
RAS-Only(2,3)
trc = trc (min.)
Average Power Supply Current
-50
-60
—
—
120
110
mA
Idd6 Refresh Current: RAS, CAS Cycling
CBR(2,3,5)
trc = trc (min.)
Average Power Supply Current
-50
-60
­—
­ —
120
110
mA
Notes:
1. An initial pause of 200 µs is required after power-up followed by eight RAS refresh cycles (RAS-Only or CBR) before proper device
operation is assured. The eight RAS cycles wake-up should be repeated any time the tref refresh requirement is exceeded.
2. Dependent on cycle rates.
3. Specified values are obtained with minimum cycle time and the output open.
4. Column-address is changed once each Fast Page cycle.
5. Enables on-chip refresh and address counters.
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. 00B
08/09/2010
5
IS41C44052C
IS41LV44052C
AC CHARACTERISTICS(1,2,3,4,5,6)
(Recommended Operating Conditions unless otherwise noted.)
-50 -60
Symbol
Parameter
Min.
Max.
Min.
Max.
trc
Random READ or WRITE Cycle Time
84
—
104
—
(6, 7)
trac
Access Time from RAS —
50
—
60
(6, 8, 15)
tcac
Access Time from CAS
—
13
—
15
(6)
taa
Access Time from Column-Address —
25
—
30
tras
RAS Pulse Width
50
10K
60
10K
trp
RAS Precharge Time
30
—
40
—
(23)
tcas
CAS Pulse Width 8
10K
10
10K
(9)
tcp
CAS Precharge Time 9
—
9
—
tcsh
CAS Hold Time (21)
38
—
40
—
(10, 20)
trcd
RAS to CAS Delay Time
12
37
14
45
tasr
Row-Address Setup Time
0
—
0
—
trah
Row-Address Hold Time
8
—­
10
—
tasc
Column-Address Setup Time(20)
0
—
0
—
(20)
tcah
Column-Address Hold Time 8
—
10
—
tar
Column-Address Hold Time
30
—
40
—
(referenced to RAS)
trad
RAS to Column-Address Delay Time(11)
10
25
12
30
tral
Column-Address to RAS Lead Time
25
—
30
—
trpc
RAS to CAS Precharge Time
5
—
5
—
trsh
RAS Hold Time
8
—
10
—
trhcp
RAS Hold Time from CAS Precharge
30
—
35
—
tclz
CAS to Output in Low-Z(15, 24)
0
—
0
—
tcrp
CAS to RAS Precharge Time(21)
5
—
5
—
(19, 24)
tod
Output Disable Time
3
15
3
15
(15, 16)
toe
Output Enable Time
—
12
—
15
toed
Output Enable Data Delay (Write)
12
—
15
—
toehc
OE HIGH Hold Time from CAS HIGH
5
—
5
—
toep
OE HIGH Pulse Width
10
—
10
—
toes
OE LOW to CAS HIGH Setup Time
5
—
5
—
trcs
Read Command Setup Time(17, 20)
0
—
0
—
trrh
Read Command Hold Time
0
—
0
—
(referenced to RAS)(12)
trch
Read Command Hold Time
0
—
0
—
(referenced to CAS)(12, 17, 21)
twch
Write Command Hold Time(17)
8
—
10
—
twcr
Write Command Hold Time
40
—
50
—
(referenced to RAS)(17)
twp
Write Command Pulse Width(17)
8
—
10
—
twpz
WE Pulse Widths to Disable Outputs
7
—
7
—
6
Units
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
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Rev. 00B
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IS41C44052C
IS41LV44052C
AC CHARACTERISTICS (Continued)(1,2,3,4,5,6)
(Recommended Operating Conditions unless otherwise noted.)
-50 -60
Symbol
Parameter
Min.
Max.
Min.
Max.
(17)
trwl
Write Command to RAS Lead Time 13
—
15
—
(17, 21)
tcwl
Write Command to CAS Lead Time
8
—
10
—
(14, 17, 20)
twcs
Write Command Setup Time
0
—
0
—
tdhr
Data-in Hold Time (referenced to RAS)
39
—
39
—
tach
Column-Address Setup Time to CAS 15
—
15
—
Precharge during WRITE Cycle
toeh
OE Hold Time from WE during
8
—
10
—
READ-MODIFY-WRITE cycle(18)
tds
Data-In Setup Time(15, 22)
0
—
0
—
tdh
Data-In Hold Time(15, 22)
8
—
10
—
trwc
READ-MODIFY-WRITE Cycle Time 108
—
133
—
trwd
RAS to WE Delay Time during
64
—
77
—
READ-MODIFY-WRITE Cycle(14)
tcwd
CAS to WE Delay Time(14, 20)
26
—
32
—
tawd
Column-Address to WE Delay Time(14)
39
—
47
—
tpc
Fast Page Mode READ or WRITE 20
—
25
—
Cycle Time
trasp
RAS Pulse Width 50
100K
60
100K
(15)
tcpa
Access Time from CAS Precharge
—
30
—
35
tprwc
READ-WRITE Cycle Time(24)
56
—
68
—
tcoh
Data Output Hold after CAS LOW
5
—
5
—
toff
Output Buffer Turn-Off Delay from
0
12
0
15
CAS or RAS(13,15,19, 24)
twhz
Output Disable Delay from WE
3
10
3
10
tcsr
CAS Setup Time (CBR REFRESH)(20, 25)
5
—
5
—
( 21, 25)
tchr
CAS Hold Time (CBR REFRESH)
8
—
10
—
tord
OE Setup Time prior to RAS during 0
—
0
—
HIDDEN REFRESH Cycle
tref
Auto Refresh Period
2,048 Cycles
—
32
—
32
tt
Transition Time (Rise or Fall)(2, 3)
1
50
1
50
Units
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ms
ns
AC TEST CONDITIONS
Output load: Two TTL Loads and 50 pF (Vdd = 5.0V ±10%)
One TTL Load and 50 pF (Vdd = 3.3V ±10%)
Input timing reference levels: Vih = 2.0V, Vil = 0.8V (Vdd = 5.0V ±10%);
Vih = 2.0V, Vil = 0.8V (Vdd = 3.3V ±10%)
Output timing reference levels: Voh = 2.4V, Vol = 0.4V (Vdd = 5V ±10%, 3.3V ±10%)
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7
IS41C44052C
IS41LV44052C
Notes:
1.An initial pause of 200 µs is required after power-up followed by eight RAS refresh cycle (RAS-Only or CBR) before proper device
operation is assured. The eight RAS cycles wake-up should be repeated any time the tref refresh requirement is exceeded.
2.Vih (MIN) and Vil (MAX) are reference levels for measuring timing of input signals. Transition times, are measured between Vih
and Vil (or between Vil and Vih) and assume to be 1 ns for all inputs.
3.In addition to meeting the transition rate specification, all input signals must transit between Vih and Vil (or between Vil and Vih)
in a monotonic manner.
4.If CAS and RAS = Vih, data output is High-Z.
5.If CAS = Vil, data output may contain data from the last valid READ cycle.
6.Measured with a load equivalent to one TTL gate and 50 pF.
7.Assumes that trcd ­trcd (MAX). If trcd is greater than the maximum recommended value shown in this table, trac will increase by
the amount that trcd exceeds the value shown.
8.Assumes that trcd ž trcd (MAX).
9.If CAS is LOW at the falling edge of RAS, data out will be maintained from the previous cycle. To initiate a new cycle and clear the
data output buffer, CAS and RAS must be pulsed for tcp.
10.Operation with the trcd (MAX) limit ensures that trac (MAX) can be met. trcd (MAX) is specified as a reference point only; if trcd
is greater than the specified trcd (MAX) limit, access time is controlled exclusively by tcac.
11.Operation within the trad (MAX) limit ensures that trcd (MAX) can be met. trad (MAX) is specified as a reference point only; if trad
is greater than the specified trad (MAX) limit, access time is controlled exclusively by taa.
12.Either trch or trrh must be satisfied for a READ cycle.
13.toff (MAX) defines the time at which the output achieves the open circuit condition; it is not a reference to Voh or Vol.
14.twcs, trwd, tawd and tcwd are restrictive operating parameters in LATE WRITE and READ-MODIFY-WRITE cycle only. If twcs ž
twcs (MIN), the cycle is an EARLY WRITE cycle and the data output will remain open circuit throughout the entire cycle. If trwd ž
trwd (MIN), tawd ž tawd (MIN) and tcwd ž tcwd (MIN), the cycle is a READ-WRITE cycle and the data output will contain data read
from the selected cell. If neither of the above conditions is met, the state of I/O (at access time and until CAS and RAS or OE go
back to Vih) is indeterminate. OE held HIGH and WE taken LOW after CAS goes LOW result in a LATE WRITE (OE-controlled)
cycle.
15.Output parameter (I/O) is referenced to corresponding CAS input.
16.During a READ cycle, if OE is LOW then taken HIGH before CAS goes HIGH, I/O goes open. If OE is tied permanently LOW, a
LATE WRITE or READ-MODIFY-WRITE is not possible.
17.Write command is defined as WE going low.
18.LATE WRITE and READ-MODIFY-WRITE cycles must have both tod and toeh met (OE HIGH during WRITE cycle) in order to
ensure that the output buffers will be open during the WRITE cycle. The I/Os will provide the previously written data if CAS remains
LOW and OE is taken back to LOW after toeh is met.
19.The I/Os are in open during READ cycles once tod or toff occur.
20.Determined by falling edge of CAS.
21.Determined by rising edge of CAS.
22.These parameters are referenced to CAS leading edge in EARLY WRITE cycles and WE leading edge in LATE WRITE or READMODIFY-WRITE cycles.
23.CAS must meet minimum pulse width.
24.The 3 ns minimum is a parameter guaranteed by design.
25.Enables on-chip refresh and address counters.
8
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08/09/2010
IS41C44052C
IS41LV44052C
FAST-PAGE-MODE READ CYCLE
tRC
tRAS
tRP
RAS
tCSH
tCRP
tRSH
tCAS tCLCH
tRCD
tRRH
CAS
tAR
tRAD
tRAH
tASR
ADDRESS
tRAL
tCAH
tASC
Row
Column
Row
tRCS
tRCH
WE
tAA
tRAC
tCAC
tCLC
I/O
tOFF(1)
Open
Open
Valid Data
tOE
tOD
OE
tOES
Don’t Care
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9
IS41C44052C
IS41LV44052C
FAST PAGE MODE READ-MODIFY-WRITE CYCLE
tRASP
tRP
RAS
tPRWC
tCAS
tCSH
tCRP
tCAS
tRCD
tRSH
tCAS
tCP
tCRP
tCP
CAS
tAR
tRAH
tASR
ADDRESS
tCPWD
tRAL
tCAH
tCPWD
tRAD
tASC
Row
tCAH
tAR
Column
tASC
Column
tCWL
tRWD
tAWD
tCWD
tRCS
tCAH
tASC
Column
tCWL
tRWL
tCWL
tAWD
tCWD
tWP
tAWD
tCWD
tWP
tWP
WE
tAA
tAA
tCAC
tOEA
OE
tCAC
tOEA
tOEZ
tOED
tRAC
OUT
IN
tOEA
tOEZ
tOED
tDH
tDS tCLZ
tCLZ
I/O
tAA
tCAC
tDS
OUT
IN
tDH
tOEZ
tOED
tCLZ
OUT
tDS
tDH
IN
Don’t Care
10
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08/09/2010
IS41C44052C
IS41LV44052C
FAST-PAGE-MODE EARLY WRITE CYCLE (OE = DON'T CARE)
tRC
tRAS
tRP
RAS
tCSH
tCRP
tRSH
tCAS tCLCH
tRCD
CAS
tAR
tRAD
tASR
ADDRESS
tRAH
tRAL
tCAH
tACH
tASC
Row
Column
Row
tCWL
tRWL
tWCR
tWCS
tWCH
tWP
WE
tDHR
tDS
I/O
tDH
Valid Data
Don’t Care
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11
IS41C44052C
IS41LV44052C
FAST-PAGE-MODE READ WRITE CYCLE (LATE WRITE and READ-MODIFY-WRITE Cycles)
tRWC
tRAS
tRP
RAS
tCSH
tCRP
tRSH
tCAS tCLCH
tRCD
CAS
tAR
tRAD
tRAH
tASR
tRAL
tCAH
tASC
tACH
ADDRESS
Row
Column
Row
tRWD
tCWL
tRWL
tCWD
tAWD
tRCS
tWP
WE
tAA
tRAC
tCAC
tCLZ
I/O
tDS
Open
Valid DOUT
tOE
tOD
tDH
Valid DIN
Open
tOEH
OE
Don’t Care
12
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IS41C44052C
IS41LV44052C
FAST PAGE MODE EARLY WRITE CYCLE
tRASP
tRP
RAS
tCRP
tCAS
tRCD
tRHCP
tRSH
tCAS
tPC
tCAS
tCSH
tCP
tCP
tCRP
CAS
tAR
tRAH
tRAD
tASC
tASR
ADDRESS
Row
tCAH
tASC
tAR
Column
tWCH
tASC
Column
tCWL
tWCS
tRAL
tCAH
Column
tCWL
tCWL
tWCH tWCS
tWCS
tWP
tCAH
tWP
tWCH
tWP
WE
tWCR
OE
tDHR
tDS
I/O
tDH
Valid DIN
tDS
tDH
Valid DIN
tDS
tDH
Valid DIN
Don’t Care
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. 00B
08/09/2010
13
IS41C44052C
IS41LV44052C
AC WAVEFORMS
READ CYCLE (With WE-Controlled Disable)
RAS
tCSH
tCRP
tRCD
tCP
tCAS
CAS
tAR
tRAD
tRAH
tASR
ADDRESS
tCAH
tASC
Row
tASC
Column
Column
tRCS
tRCH
tRCS
WE
tAA
tRAC
tCAC
tCLZ
Open
I/O
tWHZ
tCLZ
Valid Data
Open
tOE
tOD
OE
Don’t Care
RAS-ONLY REFRESH CYCLE (OE, WE = DON'T CARE)
tRC
tRAS
tRP
RAS
tCRP
tRPC
CAS
tASR
ADDRESS
I/O
tRAH
Row
Row
Open
Don’t Care
14
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. 00B
08/09/2010
IS41C44052C
IS41LV44052C
CBR REFRESH CYCLE (Addresses; WE, OE = DON'T CARE)
tRP
tRAS
tRP
tRAS
RAS
tCHR
tRPC
tCP
tCHR
tRPC
tCSR
tCSR
CAS
Open
I/O
Don’t Care
HIDDEN REFRESH CYCLE(1) (WE = HIGH; OE = LOW)
tRAS
tRP
tRAS
RAS
tCRP
tRCD
tRSH
tCHR
CAS
tAR
tRAD
tRAH tASC
tASR
ADDRESS
Row
tRAL
tCAH
Column
tAA
tRAC
tOFF(2)
tCAC
tCLZ
I/O
Open
Valid Data
tOE
Open
tOD
tORD
OE
Don’t Care
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. 00B
08/09/2010
15
IS41C44052C
IS41LV44052C
ORDERING INFORMATION: 5V
Industrial Range: -40°C to +85°C
peed (ns)
S
50
Order Part No.
Refresh
IS41C44052C-50CTGI
2K
Package
300-mil TSOP-II, Cu leadframe plated with matte SnBi
ORDERING INFORMATION: 3.3V
Industrial Range: -40°C to +85°C
peed (ns)
S
50
Order Part No.
Refresh
IS41LV44052C-50CTGI 2K
Package
300-mil TSOP-II, Cu leadframe plated with matte SnBi
Note:
The -50 speed option supports 50ns and 60ns timing specifications.
16
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. 00B
08/09/2010
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. 00B
08/09/2010
Θ
Package Outline
4. REFERENCE DOCUMENT : JEDEC SPEC. MS-025 , A
07/07/2008
3. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION/INTRUSION.
2. DIMENSION D AND E1 DO NOT INCLUDE MOLD PROTRUSION.
1. CONTROLLING DIMENSION : MM
NOTE :
Θ
IS41C44052C
IS41LV44052C
17