CYPRESS CY7C107D_09

CY7C107D
CY7C1007D
1-Mbit (1M x 1) Static RAM
Functional Description [1]
Features
• Pin- and function-compatible with CY7C107B/CY7C1007B
• High speed
— tAA = 10 ns
• Low Active Power
— ICC = 80 mA @ 10 ns
• Low CMOS Standby Power
The CY7C107D and CY7C1007D are high-performance
CMOS static RAMs organized as 1,048,576 words by 1 bit.
Easy memory expansion is provided by an active LOW Chip
Enable (CE) and tri-state drivers. These devices have an
automatic power-down feature that reduces power
consumption by more than 65% when deselected. The output
pin (DOUT) is placed in a high-impedance state when:
• Deselected (CE HIGH)
— ISB2 = 3 mA
• When the write operation is active (CE and WE LOW)
• 2.0V Data Retention
Write to the device by taking Chip Enable (CE) and Write
Enable (WE) inputs LOW. Data on the input pin (DIN) is written
into the memory location specified on the address pins (A0
through A19).
• Automatic power-down when deselected
• CMOS for optimum speed/power
• TTL-compatible inputs and outputs
• CY7C107D available in Pb-free 28-pin 400-Mil wide Molded
SOJ package. CY7C1007D available in Pb-free 28-pin
300-Mil wide Molded SOJ package
Read from the device by taking Chip Enable (CE) LOW while
while forcing Write Enable (WE) HIGH. Under these conditions, the contents of the memory location specified by the
address pins appears on the data output (DOUT) pin.
Logic Block Diagram
DIN
ROW DECODER
A0
A1
A2
A3
A4
A5
A6
A7
A8
CE
SENSE AMPS
INPUT BUFFER
1M x 1
ARRAY
POWER
DOWN
COLUMN DECODER
A9
A10
A11
A12
A13
A14
A15
A16
A17
A18
A19
WE
DOUT
Note
1. For guidelines on SRAM system design, please refer to the ‘System Design Guidelines’ Cypress application note, available on the internet at www.cypress.com.
Cypress Semiconductor Corporation
Document #: 38-05469 Rev. *E
•
198 Champion Court
•
San Jose, CA 95134-1709
•
408-943-2600
Revised February 22, 2007
CY7C107D
CY7C1007D
Pin Configuration [2]
SOJ
Top View
A10
A11
A12
A13
A14
A15
NC
A16
A17
A18
A19
DOUT
WE
GND
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
VCC
A9
A8
A7
A6
A5
A4
NC
A3
A2
A1
A0
DIN
CE
Selection Guide
CY7C107D-10
CY7C1007D-10
Unit
Maximum Access Time
10
ns
Maximum Operating Current
80
mA
Maximum CMOS Standby Current, ISB2
3
mA
Note
2. NC pins are not connected on the die.
Document #: 38-05469 Rev. *E
Page 2 of 10
CY7C107D
CY7C1007D
DC Input Voltage [3] .................................. −0.5V to VCC + 0.5V
Maximum Ratings
Exceeding the maximum ratings may impair the useful life of
the device. These user guidelines are not tested.
Storage Temperature ..................................... −65°C to +150°C
Ambient Temperature with
Power Applied.................................................. −55°C to +125°C
Supply Voltage on VCC Relative to GND [3] ....−0.5V to +6.0V
DC Voltage Applied to Outputs
in High-Z State [3] ...................................... −0.5V to VCC + 0.5V
Current into Outputs (LOW) ........................................ 20 mA
Static Discharge Voltage........................................... > 2001V
(per MIL-STD-883, Method 3015)
Latch-up Current .................................................... > 200 mA
Operating Range
Range
Ambient
Temperature
VCC
Speed
Industrial
–40°C to +85°C
5V ± 0.5V
10 ns
Electrical Characteristics (Over the Operating Range)
Parameter
Description
7C107D-10
7C1007D-10
Test Conditions
Min
VOH
Output HIGH Voltage
IOH = −4.0 mA
VOL
Output LOW Voltage
IOL = 8.0 mA
VIH
Input HIGH Voltage
Unit
Max
2.4
[3]
V
0.4
V
2.2
VCC + 0.5
V
−0.5
0.8
V
VIL
Input LOW Voltage
IIX
Input Leakage Current
GND < VI < VCC
−1
+1
µA
IOZ
Output Leakage Current
GND < VI < VCC, Output Disabled
–1
+1
µA
ICC
VCC Operating Supply Current VCC = Max,
IOUT = 0 mA,
f = fmax = 1/tRC
100 MHz
80
mA
83 MHz
72
mA
66 MHz
58
mA
40 MHz
37
mA
ISB1
Automatic CE Power-down
Current— TTL Inputs
Max VCC, CE > VIH,
VIN >VIH or VIN < VIL, f = f max
10
mA
ISB2
Automatic CE Power-down
Current— CMOS Inputs
Max VCC, CE > VCC – 0.3V,
VIN > VCC – 0.3V or VIN < 0.3V, f = 0
3
mA
Note
3. VIL (min) = –2.0V and VIH(max) = VCC + 1V for pulse durations of less than 5 ns.
Document #: 38-05469 Rev. *E
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CY7C107D
CY7C1007D
Capacitance [4]
Parameter
CIN: Addresses
Description
Input Capacitance
Test Conditions
CIN: Controls
COUT
Max
Unit
7
pF
10
pF
10
pF
TA = 25°C, f = 1 MHz, VCC = 5.0V
Output Capacitance
Thermal Resistance [4]
Parameter
Description
ΘJA
Thermal Resistance
(Junction to Ambient)
ΘJC
Thermal Resistance
(Junction to Case)
Test Conditions
Still Air, soldered on a 3 × 4.5 inch,
four-layer printed circuit board
300-Mil
Wide SOJ
400-Mil
Wide SOJ
Unit
59.16
58.76
°C/W
40.84
40.54
°C/W
AC Test Loads and Waveforms [5]
ALL INPUT PULSES
3.0V
Z = 50Ω
90%
OUTPUT
50 Ω
* CAPACITIVE LOAD CONSISTS
OF ALL COMPONENTS OF THE
TEST ENVIRONMENT
30 pF*
90%
10%
10%
GND
1.5V
Rise Time: ≤ 3 ns
(a)
(b)
Fall Time: ≤ 3 ns
High-Z characteristics:
R1 480Ω
5V
OUTPUT
INCLUDING
JIG AND
SCOPE
R2
255Ω
5 pF
(c)
Notes
4. Tested initially and after any design or process changes that may affect these parameters.
5. AC characteristics (except High-Z) are tested using the load conditions shown in Figure (a). High-Z characteristics are tested for all speeds using the test load
shown in Figure (c).
Document #: 38-05469 Rev. *E
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CY7C107D
CY7C1007D
Switching Characteristics (Over the Operating Range) [6]
Parameter
7C107D-10
7C1007D-10
Description
Min
Unit
Max
Read Cycle
tpower [7]
VCC(typical) to the first access
100
µs
tRC
Read Cycle Time
10
ns
tAA
Address to Data Valid
tOHA
Data Hold from Address Change
tACE
CE LOW to Data Valid
[8]
tLZCE
CE LOW to Low Z
tHZCE
CE HIGH to High Z [8, 9]
tPU
[10]
tPD
[10]
Write Cycle
CE LOW to Power-Up
10
3
ns
10
3
ns
ns
5
0
CE HIGH to Power-Down
ns
ns
ns
10
ns
[11]
tWC
Write Cycle Time
10
ns
tSCE
CE LOW to Write End
7
ns
tAW
Address Set-Up to Write End
7
ns
tHA
Address Hold from Write End
0
ns
tSA
Address Set-Up to Write Start
0
ns
tPWE
WE Pulse Width
7
ns
tSD
Data Set-Up to Write End
6
ns
tHD
Data Hold from Write End
0
ns
3
ns
tLZWE
tHZWE
WE HIGH to Low Z
[8]
WE LOW to High Z
[8, 9]
6
ns
Notes
6. Test conditions assume signal transition time of 3 ns or less, timing reference levels of 1.5V, input pulse levels of 0 to 3.0V, and output loading of the specified
IOL/IOH and 30-pF load capacitance.
7. tPOWER gives the minimum amount of time that the power supply should be at typical VCC values until the first memory access can be performed.
8. At any given temperature and voltage condition, tHZCE is less than tLZCE and tHZWE is less than tLZWE for any given device.
9. tHZCE and tHZWE are specified with a load capacitance of 5 pF as in part (c) of “AC Test Loads and Waveforms [5]” on page 4. Transition is measured when the outputs enter a
high impedance state.
10. This parameter is guaranteed by design and is not tested.
11. The internal write time of the memory is defined by the overlap of CE LOW and WE LOW. CE and WE must be LOW to initiate a write, and the transition of any of these
signals can terminate the write. The input data set-up and hold timing should be referenced to the leading edge of the signal that terminates the write.
Document #: 38-05469 Rev. *E
Page 5 of 10
CY7C107D
CY7C1007D
Data Retention Characteristics (Over the Operating Range)
Parameter
Description
Conditions
VDR
VCC for Data Retention
ICCDR
Data Retention Current
tCDR [5]
Chip Deselect to Data Retention Time
tR
[12]
Min
Max
2.0
V
VCC = VDR = 2.0V, CE > VCC – 0.3V,
VIN > VCC – 0.3V or VIN < 0.3V
Operation Recovery Time
Unit
3
mA
0
ns
tRC
ns
Data Retention Waveform
DATA RETENTION MODE
4.5V
VCC
VDR > 2V
4.5V
tR
tCDR
CE
Switching Waveforms
Read Cycle No. 1 (Address Transition Controlled) [13, 14]
tRC
ADDRESS
tOHA
DATA OUT
tAA
PREVIOUS DATA VALID
DATA VALID
Read Cycle No. 2 [14, 15]
ADDRESS
tRC
CE
tACE
tHZCE
tLZCE
DATA OUT
VCC
SUPPLY
CURRENT
HIGH IMPEDANCE
HIGH
IMPEDANCE
DATA VALID
tPD
tPU
50%
50%
ICC
ISB
Notes
12. Full device operation requires linear VCC ramp from VDR to VCC(min) > 50 µs or stable at VCC(min) > 50 µs.
13. Device is continuously selected, CE = VIL.
14. WE is HIGH for read cycle.
15. Address valid prior to or coincident with CE transition LOW.
Document #: 38-05469 Rev. *E
Page 6 of 10
CY7C107D
CY7C1007D
Switching Waveforms(continued)
Write Cycle No. 1 (CE Controlled) [16]
tWC
ADDRESS
tSA
tSCE
CE
tHA
tAW
tPWE
WE
tHD
tSD
DATA IN
DATA VALID
HIGH IMPEDANCE
DATA OUT
Write Cycle No. 2 (WE Controlled) [16]
tWC
ADDRESS
tSCE
CE
tAW
tSA
tHA
tPWE
WE
tSD
tHD
DATA VALID
DATA IN
tHZWE
HIGH IMPEDANCE
DATA UNDEFINED
DATA OUT
tLZWE
Truth Table
CE
WE
DOUT
Mode
Power
H
X
High Z
Power-Down
Standby (ISB)
L
H
Data Out
Read
Active (ICC)
L
L
High Z
Write
Active (ICC)
Note
16. If CE goes HIGH simultaneously with WE going HIGH, the output remains in a high-impedance state.
Document #: 38-05469 Rev. *E
Page 7 of 10
CY7C107D
CY7C1007D
Ordering Information
Speed
(ns)
10
Package
Diagram
Ordering Code
Operating
Range
Package Type
CY7C107D-10VXI
51-85032
28-pin (400-Mil) Molded SOJ (Pb-free)
CY7C1007D-10VXI
51-85031
28-pin (300-Mil) Molded SOJ (Pb-free)
Industrial
Please contact your local Cypress sales representative for availability of these parts.
Package Diagrams
Figure 1. 28-pin (400-Mil) Molded SOJ, 51-85032
PIN 1 I.D
14
1
.395
.405
15
DIMENSIONS IN INCHES
.435
.445
MIN.
MAX.
28
.720
.730
SEATING PLANE
.128
.148
.026
.032
.050
TYP.
.007
.013
0.004
.025 MIN.
.360
.380
51-85032-*B
.015
.020
Document #: 38-05469 Rev. *E
Page 8 of 10
CY7C107D
CY7C1007D
Package Diagrams(continued)
Figure 2. 28-pin (300-Mil) Molded SOJ, 51-85031
NOTE :
1. JEDEC STD REF MO088
2. BODY LENGTH DIMENSION DOES NOT INCLUDE MOLD PROTRUSION/END FLASH
MOLD PROTRUSION/END FLASH SHALL NOT EXCEED 0.006 in (0.152 mm) PER SIDE
MIN.
MAX.
3. DIMENSIONS IN INCHES
DETAIL
A
EXTERNAL LEAD DESIGN
PIN 1 ID
14
1
0.291
0.300
15
0.330
0.350
28
OPTION 1
0.697
0.713
0.014
0.020
OPTION 2
SEATING PLANE
0.120
0.140
0.050
TYP.
0.026
0.032
0.013
0.019
A
0.007
0.013
0.004
0.025 MIN.
0.262
0.272
51-85031-*C
All product and company names mentioned in this document may be the trademarks of their respective holders.
Document #: 38-05469 Rev. *E
Page 9 of 10
© Cypress Semiconductor Corporation, 2006-2007. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the
use of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to
be used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its
products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
CY7C107D
CY7C1007D
Document History Page
Document Title: CY7C107D/CY7C1007D, 1-Mbit (1M x 1) Static RAM
Document Number: 38-05469
REV.
ECN NO.
Issue Date
Orig. of
Change
**
201560
See ECN
SWI
Advance Information data sheet for C9 IPP
*A
233722
See ECN
RKF
DC parameters modified as per EROS (Spec # 01-02165)
Pb-free offering in Ordering Information
*B
263769
See ECN
RKF
Added Data Retention Characteristics table
Added Tpower Spec in Switching Characteristics Table
Shaded Ordering Information
*C
307601
See ECN
RKF
Reduced Speed bins to –10 and –12 ns
*D
560995
See ECN
VKN
Converted from Preliminary to Final
Removed Commercial Operating range
Removed 12 ns speed bin
Added ICC values for the frequencies 83MHz, 66MHz and 40MHz
Updated Thermal Resistance table
Updated Ordering Information Table
Changed Overshoot spec from VCC+2V to VCC+1V in footnote #3
*E
802877
See ECN
VKN
Changed ICC specs from 60 mA to 80 mA for 100MHz, 55 mA to 72 mA for
83MHz, 45 mA to 58 mA for 66MHz, 30 mA to 37 mA for 40MHz
Document #: 38-05469 Rev. *E
Description of Change
Page 10 of 10