CEL UPC3231GV

BIPOLAR ANALOG INTEGRATED CIRCUIT
PC3231GV
GENERAL PURPOSE 5 V 100 MHz AGC AMPLIFIER
DESCRIPTION
The PC3231GV is a silicon monolithic IC designed for use as AGC amplifier for digital CATV, cable modem and
digital terrestrial systems. This IC consists of gain control amplifier and video amplifier.
The package is 8-pin SSOP (Shrink Small Outline Package) suitable for surface mount.
This IC is manufactured using our 30 GHz fmax UHS0 (Ultra High Speed Process) silicon bipolar process.
This process uses silicon nitride passivation film. This material can protect chip surface from external pollution
and prevent corrosion/migration. Thus, this IC has excellent performance, uniformity and reliability.
FEATURES
• Low distortion
: IM3 = 53.5 dBc TYP. @ single-ended output, Vout = 105 dBV (0.5 Vp-p) /tone
• Low noise figure
: NF = 5.0 dB TYP. @ maximum gain
• Wide AGC dynamic range
: GCRin = 61 dB TYP. @ input prescribe
• On-chip video amplifier
: Vout = 1.0 Vp-p TYP. @ single-ended output
• Supply voltage
: VCC = 5.0 V TYP.
• Packaged in 8-pin SSOP suitable for surface mounting
APPLICATION
• Digital terrestrial TV/Digital CATV/Cable modem receivers
ORDERING INFORMATION
Part Number
Order Number
PC3231GV-E1
PC3231GV-E1-A
Package
8-pin plastic SSOP
Marking
3231
(4.45 mm (175)) (Pb-Free)
Supplying Form
 Embossed tape 8 mm wide
 Pin 1 indicates pull-out direction of tape
 Qty 1 kpcs/reel
Remark To order evaluation samples, contact your nearby sales office.
Part number for sample order: PC3231GV-A
Caution: Observe precautions when handling because these devices are sensitive to electrostatic discharge
Document No. PU10658EJ01V0DS (1st edition)
Date Published May 2007 NS CP(N)
PC3231GV
INTERNAL BLOCK DIAGRAM AND PIN CONNECTIONS
PRODUCT LINE-UP OF 5 V AGC AMPLIFIER
Part Number
PC3217GV
ICC
GMAX
GMIN
GCR
NF
IM3
(mA)
(dB)
(dB)
(dB)
(dB)
(dBc)
23
53
0
53
6.5
50
Note1
PC3218GV
23
63
10
53
3.5
50
Note1
PC3219GV
36.5
42.5
0
42.5
9.0
58
Note1
PC3221GV
33
60
10
50
4.2
56
Note1
PC3231GV
36
65
4
61
5.0
53.5
Note2
Notes 1. f1 = 44 MHz, f2 = 45 MHz, Vout = 0.7 Vp-p/tone, single-ended output
2. f1 = 44 MHz, f2 = 45 MHz, Vout = 0.5 Vp-p/tone, single-ended output
2
Data Sheet PU10658EJ01V0DS
Package
8-pin SSOP (4.45 mm (175))
PC3231GV
PIN EXPLANATIONS
Pin
No.
1
Pin Name
Applied
Pin
Voltage
Voltage
(V)
VCC
4.5 to 5.5
(V)
Function and Application

Power supply pin.
This pin should be externally equipped
with bypass capacitor to minimize ground
impedance.
2
INPUT1

Internal Equivalent Circuit
Note
1.32

Signal input pins to AGC amplifier.
This pin should be coupled with capacitor
for DC cut.
3
INPUT2

1.32
4
VAGC
0 to VCC

Gain control pin.
This pin’s bias govern the AGC output
level.
Minimum Gain at VAGC : 0 to 0.1 V
Maximum Gain at VAGC : 2.7 to 3.3 V
Recommended to use AGC voltage with
externally resister (example: 1 k).
5
GND2
0

Ground pin.
This pin should be connected to system
ground with minimum inductance.

Ground pattern on the board should be
formed as wide as possible.
6
OUTPUT2

1.91
Signal output pins of video amplifier.
This pin should be coupled with capacitor
for DC cut.
7
OUTPUT1

1.91
8
GND1
0

Ground pin.
This pin should be connected to system
ground with minimum inductance.
Ground pattern on the board should be
formed as wide as possible.

All ground pins must be connected
together with wide ground pattern to
decrease impedance difference.
Note Pin voltage is measured at VCC = 5.0 V.
Data Sheet PU10658EJ01V0DS
3
PC3231GV
ABSOLUTE MAXIMUM RATINGS
Parameter
Symbol
Test Conditions
Ratings
Unit
Supply Voltage
VCC
TA = +25C
6.0
V
Gain Control Voltage Range
VAGC
TA = +25C
0 to VCC
V
Power Dissipation
PD
TA = +85C
250
mW
Storage Temperature
Tstg
55 to +150
C
Note
Note Mounted on double-sided copper-clad 50  50  1.6 mm epoxy glass PWB
RECOMMENDED OPERATING RANGE
Parameter
Symbol
Supply Voltage
VCC
Operating Ambient Temperature
TA
Test Conditions
VCC = 4.5 to 5.5 V
MIN.
TYP.
MAX.
Unit
4.5
5.0
5.5
V
40
+25
+85
C
Gain Control Voltage Range
VAGC
0

3.3
V
Operating Frequency Range
fBW
30

90
MHz
4
Data Sheet PU10658EJ01V0DS
PC3231GV
ELECTRICAL CHARACTERISTICS
(T A = +25C, VCC = 5 V, f = 45 MHz, ZS = 50 , ZL = 250 , single-ended output)
Parameter
Symbol
Test Conditions
MIN.
TYP.
MAX.
Unit
DC Characteristics
Circuit Current
ICC
VCC = 5 V, No input signal
Note 1
28
36
44
mA
AGC Voltage High Level
VAGC (H)
@ Maximum gain
Note 1
2.7

3.3
V
AGC Voltage Low Level
VAGC (L)
@ Minimum gain
Note 1
0

0.1
V
fC = 3 dB
Note 1
30

90
MHz
RF Characteristics
IF Input Voltage Range
fIFin
Maximum Voltage Gain
GMAX
VAGC = 2.7 V, Pin = 60 dBm
Note 1
62.5
65
67.5
dB
Minimum Voltage Gain
GMIN
VAGC = 0.1 V, Pin = 30 dBm
Note 1
0
4
7
dB
Gain Control Range (input prescribe)
GCRin
VAGC = 0.1 to 2.7 V
Note 1
55.5
61

dB
Gain Control Range (output prescribe)
GCRout
Vout = 1.0 Vp-p
Note 1
45
55

dB
Output Voltage
Vout
Pin = 61 to 6 dBm
Note 1

1.0

Vp-p
Maximum Output Voltage
Voclip
VAGC = 3.0 V
Note 1
2.0
3.3

Vp-p
Noise Figure
NF
VAGC = 3.0 V
Note 2

5.0
6.5
dB
3rd Order Intermodulation Distortion
IM3
f1 = 44 MHz, f2 = 45 MHz,
50
53.5

dBc

1.35//6

k//pF
Pin = 20 dBm/tone,
Vout = 105 dB V (0.5 Vp-p) /tone Note 1
Input Impedance
Zin
VAGC = 0 V
Note 3
Notes 1. By measurement circuit 1
2. By measurement circuit 2
3. By measurement circuit 3
Data Sheet PU10658EJ01V0DS
5
PC3231GV
MEASUREMENT CIRCUIT 1
Note Balun Transformer: TOKO 617DB-1674 B4F (Double balanced type)
MEASUREMENT CIRCUIT 2
Note Balun Transformer: TOKO 617DB-1674 B4F (Double balanced type)
6
Data Sheet PU10658EJ01V0DS
PC3231GV
MEASUREMENT CIRCUIT 3
MEASUREMENT CIRCUIT 4 (PRESSURE IMPROVEMENT RECOMMENDATION CIRCUIT)
Note Balun Transformer: TOKO 617DB-1674 B4F (Double balanced type)
Data Sheet PU10658EJ01V0DS
7
PC3231GV
MEASUREMENT CIRCUIT 5 (PRESSURE IMPROVEMENT RECOMMENDATION CIRCUIT)
Note Balun Transformer: TOKO 617DB-1674 B4F (Double balanced type)
MEASUREMENT CIRCUIT 6 (PRESSURE IMPROVEMENT RECOMMENDATION CIRCUIT)
The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
8
Data Sheet PU10658EJ01V0DS
PC3231GV
ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD
(MEASUREMENT CIRCUIT 1)
Note Balun Transformer
Remarks
1. Back side: GND pattern
2. Au plated on pattern
3.
: Through hole
Data Sheet PU10658EJ01V0DS
9
PC3231GV
TYPICAL CHARACTERISTICS (T A = +25C , unless otherwise specified)
Remark The graphs indicate nominal characteristics.
10
Data Sheet PU10658EJ01V0DS
PC3231GV
Remark The graphs indicate nominal characteristics.
Data Sheet PU10658EJ01V0DS
11
PC3231GV
Remark The graphs indicate nominal characteristics.
12
Data Sheet PU10658EJ01V0DS
PC3231GV
Remark The graphs indicate nominal characteristics.
Data Sheet PU10658EJ01V0DS
13
PC3231GV
S-PARAMETERS (T A = +25C, VCC = 5.0 V, VAGC = 0 V)
S11FREQUENCY
S22FREQUENCY
14
Data Sheet PU10658EJ01V0DS
PC3231GV
PACKAGE DIMENSIONS
8-PIN PLASTIC SSOP (4.45 mm (175)) (UNIT: mm)
Data Sheet PU10658EJ01V0DS
15
PC3231GV
NOTES ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired
oscillation).
All the ground pins must be connected together with wide ground pattern to decrease impedance difference.
(3) The bypass capacitor should be attached to VCC line.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions.
For soldering
methods and conditions other than those recommended below, contact your nearby sales office.
Soldering Method
Infrared Reflow
Wave Soldering
Partial Heating
Soldering Conditions
Condition Symbol
Peak temperature (package surface temperature)
: 260C or below
Time at peak temperature
: 10 seconds or less
Time at temperature of 220C or higher
: 60 seconds or less
Preheating time at 120 to 180C
: 12030 seconds
Maximum number of reflow processes
: 3 times
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
Peak temperature (molten solder temperature)
: 260C or below
Time at peak temperature
: 10 seconds or less
Preheating temperature (package surface temperature)
: 120C or below
Maximum number of flow processes
: 1 time
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
Peak temperature (pin temperature)
: 350C or below
Soldering time (per side of device)
: 3 seconds or less
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
Caution Do not use different soldering methods together (except for partial heating).
16
Data Sheet PU10658EJ01V0DS
IR260
WS260
HS350