DATA SHEET BIPOLAR ANALOG INTEGRATED CIRCUIT μPC3228T5S ED LOW DISTORTION DOWN-CONVERTER + AGC AMPLIFIER + VIDEO AMPLIFIER DESCRIPTION The μPC3228T5S is a silicon bipolar monolithic IC designed for use as IF down-converter for digital TV, digital CATV. This IC consists of AGC amplifier, mixer and video amplifier. IN U The package is 32-pin plastic QFN (Quad Flat Non-lead) package suitable for surface mount. This IC is manufactured using our 30 GHz fmax UHS0 (Ultra High Speed Process) silicon bipolar process. This process uses silicon nitride passivation film. This material can protect chip surface from external pollution and prevent corrosion/migration. Thus, this IC has excellent performance, uniformly and reliability. FEATURES • Total performance : ICC = 85 mA TYP. @ VCC = 5 V • AGC AMPLIFIER + MIXER + DRIVER BLOCK : fRF (BW) = 20 to 800 MHz : CG = 28 dB TYP. • VIDEO AMPLIFIER BLOCK NT : GCR = 70 dB TYP. : IM3 = 47 dBc MIN./57 dBc TYP. @ Single Ended-OUT = 0.5 Vp-p/tone : GV = 59 dB TYP. : fIF (BW) = 20 to 100 MHz : IM3 = 45 dBc MIN./55 dBc TYP. @ Output = 110 dBu/tone, Differential-out • High-density surface mounting SC O APPLICATION : 32-pin plastic QFN package (5.0 × 5.0 × 0.75 mm) • Digital CATV • Cable modem receivers ORDERING INFORMATION Part Number Order Number μPC3228T5S-E2 μPC3228T5S-E2-A Package 32-pin plastic QFN (Pb-Free) Marking C3228 Supplying Form • Embossed tape 12 mm wide • Pin 8,9 face the perforation side of the tape • Qty 2.5 kpcs/reel • Dry pack specification DI Remark To order evaluation samples, contact your nearby sales office. Part number for sample order: μPC3228T5S-A Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge. The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Document No. PU10623EJ01V0DS (1st edition) Date Published June 2006 NS CP(K) μPC3228T5S INTERNAL BLOCK DIAGRAM AND PIN CONFIGURATION Note 15 LO-IN2 Driv-OUT1 27 Driver AMP GND-Driv 29 12 VCC-IF2 11 IF-OUT2 IF_IN AMP2 Driver AMP NC GND-REG VAGC Data Sheet PU10623EJ01V0DS 8 6 5 4 VCC-IF1 GND-REG NT 2 GND-IF1 Note GND-IF1 DI SC O Note 1, 9, 17, 25-pin: Connected to the lead frame. 2 10 IF-OUT1 9 1 IF-IN2 32 3 IF-IN1 31 13 GND-LO AGC Control IF_IN AMP 14 LO-IN1 IN U LO AMP Driv-OUT2 28 GND 30 ED 16 GND-MIX RF_AGC AMP GND-Driv 26 17 GND-MIX 18 VCC-LO 19 VCC-MIX 20 VCC-Driv 21 VCC-AGC 22 RF-IN1 25 GND-IF2 Note 7 GND-AGC 23 RF-IN2 24 GND-AGC (Top View) GND-IF2 Note μPC3228T5S ABSOLUTE MAXIMUM RATINGS Symbol Co n d it i o n s Supply Volt age VCC TA = +25°C Power Dissipation PD TA = +80°C Operating Ambient Temperature TA Storage Temperature Tstg Ratings U ni t 6.0 V Note 800 mW Note −20 to +80 °C −55 to +150 °C ED Parameter Note Mounted on double-sided copper-clad 50 × 50 × 1.6 mm epoxy glass PWB RECOMMENDED OPERATING RANGE (TA = +25°C, unless otherwise specified) Symbol Supply Voltage VCC Operating Ambient Temperature TA Gain Control Voltage Range VAGC fRF (BW) IF Operating Frequency Range fIF (BW) MIN. TYP. VCC = 4.5 to 5.5 V MAX. Unit 4 .5 5 .0 5.5 V −20 +25 +80 °C 0 − 3.3 V 20 − 800 MHz 20 − 100 MHz DI SC O NT RF Operating Frequency Range Conditions IN U Parameter Data Sheet PU10623EJ01V0DS 3 μPC3228T5S ELECTRICAL CHARACTERISTICS (TA = +25°C, VCC = 5 V, unless otherwise specified) Parameter Symbol Test Conditions MIN. TYP. MAX. Unit DC Characteristics Circuit Current ICC No input signal Note 1 65 85 110 mA VAGC (H) @ Maximum gain Note 1 2.5 − 3.5 V AGC Voltage Low Level VAGC (L) @ Minimum gain Note 1 − 0 − V ED AGC Voltage High Level RF Characteristics (RF AGC Amplifier Block + Mixer Block + Driver Amplifier: fRF = 80 MHz, fLO = 130 MHz, PLO = −10 dBm, ZS = 50 Ω, ZL = 400 Ω/16 pF) fRF RF Gain Control Range GCR1 Mixer Conversion Gain CG 3rd Order Intermodulaion Distortion IM31 fC = −3 dB Note 1 20 − 800 MHz VAGC = 0 to 2.5 V Note 1 62 70 − dB 25 28 31 dB VAGC = 2.5 V Differential-IN: Vin = +18 dBmV Note 1 IN U RF Input Frequency Range f1 = 44 MHz, f2 = 45 MHz, Vin = +30 dBmV/tone, 47 57 − dBc − 8.3 − dB 20 − 100 MHz 56 59 62 dB 45 55 − dBc − 1.0 − Vp-p − 3.0 − dB Single Ended-OUT = 0.5 Vp-p/tone Note 1 Noise Figure NF1 IF Characteristics VAGC = 2.5 V, f = 50 MHz, Differential-Output Note 2 IF Input Frequency Range IF Amplifier Gain NT (IF Amplifier Block + Driver Amplifier: fIF = 50 MHz, ZS = 50 Ω, ZL = 2 100 Ω) 3rd Order Intermodulaion Distortion fC = −3 dB GV Vin = −7 dBmV, IM32 Vout Differential-IN/OUT Noise Figure NF2 Note 5 Note 5 f1 = 49.5 MHz, f2 = 50.5 MHz, Vout = 110 dBu/tone, Differential-IN/OUT Note 5 Single Ended-Output Note 5 SC O IF Output Voltage fIF VAGC = 0 V, f = 50 MHz, Single Ended-Output Note 2 Total Block (RF AGC Amplifier + Mixer + Driver Amplifier + SAW Filter + IF Ampliter + Driver Amplifier), SAW Filter : EPCOS X6889M (fIF = 49 MHz, PLO = −10 dBm, fRF = 70 to 130 MHz, ZS = 50 Ω, ZL = 1 050 Ω) LO-RF Leakage LORF VAGC = 2.5 V, 22-pin 75 Ω Termination − −54 −44 dBmV LO-IF Leakage LOIF VAGC = 2.5 V, − −40 −25 dBc fLO = 110 to 180 MHz Note 3 Vout = 0.7 Vp-p Single Ended-Output fRF = 130 MHz, fLO = 179 MHz Note 4 DI Notes 1. By measurement circuit 1 2. By measurement circuit 2 3. By measurement circuit 3 4. By measurement circuit 4 5. By measurement circuit 5 4 Data Sheet PU10623EJ01V0DS μPC3228T5S MEASUREMENT CIRCUIT 1 S.G Vin 1 nF 1 nF 1 nF 1 nF 1 nF 25 17 18 19 20 IN U Driver AMP 1 nF 10 9 S.G 51 Ω 50 Ω 1 nF 0.1 μ F 0.1 μ F 1 000 Ω 0.1 μ F 1 000 Ω 50 Ω 50 Ω 8 32 SC O 0.1 μ F 11 IF_IN AMP2 7 0.1 μ F 31 Note 12 AGC Control IF_IN AMP 14 13 6 51 Ω Driver AMP 29 30 Note LO AMP 5 1 nF 28 15 NT Vout2 400 Ω 27 3 16 pF 1 nF 2 Vout1 1 Differential Probe (10:1) 1 MΩ//7 pF PLO 16 RF_AGC AMP 26 4 VOUT = Vout1 – Vout2 VCC 21 24 50 Ω 23 1 nF 22 Spectrum Analyzer ED 51 Ω 100 pF 0.1 μ F 1 kΩ VAGC DI Note Balun Transformer : TOKO 617DB-1674 B4F (Double balanced type) Data Sheet PU10623EJ01V0DS 5 μPC3228T5S MEASUREMENT CIRCUIT 2 Noise Figure Noise Figure Meter 1 nF 1 nF 1 nF 1 nF 1 nF 31 IF_IN AMP DI 17 18 IF_IN AMP2 Driver AMP 8 7 6 5 32 100 pF 0.1 μ F Noise Source 19 AGC Control SC O 0.1 μ F Driver AMP 1 kΩ VAGC Noise Figure Meter 50 Ω Note Balun Transformer : TOKO 617DB-1674 B4F (Double balanced type) 6 14 13 4 0.1 μ F LO AMP 29 30 Note 15 NT 50 Ω 28 3 51 Ω 1 nF 27 2 MA/Com H183-4 30-3 000 MHz 51 Ω 1 nF 16 RF_AGC AMP 26 1 Hybrid Coupler 20 22 23 24 25 IN U VCC 50 Ω 21 1 nF ED Noise Source Data Sheet PU10623EJ01V0DS Note 1 nF 10 9 S.G 51 Ω 1 nF 0.1 μ F 12 11 PLO 0.1 μ F 1 000 Ω 0.1 μ F 1 000 Ω 50 Ω 50 Ω μPC3228T5S MEASUREMENT CIRCUIT 3 Lo-RF Leakage 50 Ω 24 Ω VOUT 25 IF_IN AMP 17 18 19 Driver AMP 4 3 2 1 0.1 μ F 20 IF_IN AMP2 0.1 μ F 14 13 10 PLO Note 1 nF S.G 51 Ω 50 Ω 1 nF 0.1 μ F 12 11 VCC 0.1 μ F 1 000 Ω 0.1 μ F 1 000 Ω 9 8 32 AGC Control SC O 0.1 μ F 31 Driver AMP 7 29 30 Note 51 Ω 28 6 1 nF LO AMP 5 400 Ω 27 15 NT 16 pF 16 RF_AGC AMP 26 1 nF 21 22 1 nF 23 24 1 nF IN U 1 nF 1 nF 1 nF 1 nF ED Spectrum Analyzer 100 pF 1 kΩ DI VAGC Note Balun Transformer : TOKO 617DB-1674 B4F (Double balanced type) Data Sheet PU10623EJ01V0DS 7 μPC3228T5S MEASUREMENT CIRCUIT 4 (fRF = 70 to 130 MHz (fIF = 49.1 MHz ± 0.6 MHz), fLO = 119 to 179 MHz, PLO = −10 dBm, Vout = 0.7 Vp-p (Single Ended)) ED LO-IF Leakage S.G Vin 51 Ω 1 nF 1 nF 1 nF 1 nF 1 nF 29 IF_IN AMP 17 18 20 19 11 IF_IN AMP2 Driver AMP 1 nF 0.1 μ F 0.1 μ F 1 000 Ω 0.1 μ F 1 000 Ω 100 pF 1 kΩ DI Note Balun Transformer : TOKO 617DB-1674 B4F (Double balanced type) Data Sheet PU10623EJ01V0DS Spectrum Analyzer Vout1 VAGC 8 50 Ω 1 nF 8 5 4 3 2 1 0.1 μ F S.G 51 Ω 9 7 32 10 PLO Note 12 AGC Control 6 31 14 13 Driver AMP SC O 0.1 μ F LO AMP 28 30 0.1 μ F 21 27 15 NT SAW Filter EPCOS X6889M 16 RF_AGC AMP 26 1 nF IN U 25 1 nF VCC 22 23 24 1 nF 50 Ω 50 Ω Vout2 49 M fLO μPC3228T5S MEASUREMENT CIRCUIT 5 51 Ω 1 nF 1 nF 1 nF 1 nF 1 nF 25 VIN = Vin1 – Vin2 Differential-IN 17 18 19 20 21 IN U 0.1 μ F 10 8 7 Driver AMP 6 0.1 μ F 11 IF_IN AMP2 SC O 50 Ω Vin2 32 IF_IN AMP 5 0.1 μ F 51 Ω 31 Note 1 nF 51 Ω 1 nF 0.1 μ F 12 AGC Control 4 S.G Vin1 Driver AMP NT Note 14 13 29 30 15 LO AMP 3 Vin 28 2 1 nF 27 1 400 Ω 16 pF 16 RF_AGC AMP 26 1 nF VCC 22 23 24 1 nF ED IF Block Vout2 0.1 μ F 1 000 Ω 0.1 μ F 1 000 Ω 9 Spectrum Analyzer 50 Ω 50 Ω Vout1 VOUT = Vout1 – Vout2 Differential-OUT 100 pF 1 kΩ VAGC DI Note Balun Transformer : TOKO 617DB-1674 B4F (Double balanced type) Data Sheet PU10623EJ01V0DS 9 μPC3228T5S ILLUSTRATION OF THE EVALUATION BOARD VCC RF R1 C1 VOUT1 C4C5 C1 C2 VOUT2 IF C1 C2 OUT2 C1 C2 C2 C3 C2 Note R3 C2 R3 R3 OUT1 NT R1 Note C1 C1 R2 C1 IN U R2 R1 C1 C1 IF C1 ED LO SC O VCC VAGC Note Balun Transformer : TOKO 617DB-1674 B4F (Double balanced type) Remarks 1. Back side: GND pattern 2. Solder plated on pattern 3. : Through hole USING THE NEC EVALUATION BOARD Values Maker Part Number Size C1 1 nF Murata GRM39CH 1608 C2 0.1 μF Murata GRM39B 1608 C3 100 pF Murata GRM39CH 1608 C4 10 pF Murata GRM36B 1005 DI Symbol 10 C5 6 pF Murata GRM36B 1005 R1 51 Ω Susumu RR0816 510SSM 1608 R2 200 Ω Susumu RR0816 201SSM 1608 R3 1 000 Ω Susumu RR0816 102SSM 1608 Data Sheet PU10623EJ01V0DS μPC3228T5S PACKAGE DIMENSIONS 32-PIN PLASTIC QFN (UNIT: mm) (Top View) (Side View) ED 5.0±0.1 (1.75) (0.865) 0.4 2 1 (1.1) Exposed Die Pad To be connected DI SC O (0.21) IN U (Side View) (0.20) 0.76±0.1 Laser Marked Index (1.75) NT 1 2 (0.75) 0.85 MAX. C3228 (Bottom View) 0.16±0.05 5.0±0.1 Data Sheet PU10623EJ01V0DS 11 μPC3228T5S NOTES ON CORRECT USE (1) Observe precautions for handling because of electro-static sensitive devices. (2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation). All the ground terminals must be connected together with wide ground pattern to decrease impedance difference. RECOMMENDED SOLDERING CONDITIONS ED (3) The bypass capacitor should be attached to VCC line. This product should be soldered and mounted under the following recommended conditions. methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Peak temperature (package surface temperature) Time at peak temperature Time at temperature of 220°C or higher Preheating time at 120 to 180°C Maximum number of reflow processes Maximum chlorine content of rosin flux (% mass) Wave Soldering Peak temperature (molten solder temperature) Time at peak temperature Condit io n Sy mbol : 260°C or below : 10 seconds or less IN U Infrared Reflow S o l d e r i n g Condit ion s For soldering IR260 : 60 seconds or less : 120±30 seconds : 3 times : 0.2%(Wt.) or below : 260°C or below : 10 seconds or less WS260 Preheating temperature (package surface temperature) : 120°C or below Maximum number of flow processes Partial Heating NT Maximum chlorine content of rosin flux (% mass) : 1 time : 0.2%(Wt.) or below Peak temperature (terminal temperature) : 350°C or below Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Soldering time (per side of device) : 3 seconds or less DI SC O Caution Do not use different soldering methods together (except for partial heating). 12 Data Sheet PU10623EJ01V0DS HS350