TOSHIBA TLP2403

TLP2403
Photocouplers
GaAℓAs Infrared LED & Photo IC
TLP2403
1. Applications
•
High-Speed Digital Interfacing for Instrumentation and Control Devices
•
Simplex/Multiplex Data Transmission
2. General
The Toshiba TLP2403 consists of a high-output GaAℓAs light-emitting diode coupled with a high-speed photodiode-transistor chip. It is housed in the SO8 package.
The TLP2403 uses a high-speed, high-gain detector element and thus is ideal for applications which require lowinput current and high-speed data transmission.
3. Features
(1)
Package: SO8
(2)
Operating temperature: -40 to 100
(3)
Current transfer ratio: 400% (min) @IF = 0.5 mA
(4)
Maximum output current: 60 mA
(5)
Propagation delay time: tpHL = 2 µs (typ.), tpLH = 4 µs (typ.) @ RL = 4.7 kΩ, IF = 0.5 mA
(6)
Isolation voltage: 3750 Vrms (min)
(7)
Safety standards
UL-approved: UL1577 File No.E67349
cUL-approved: CSA Component Acceptance Service No.5A, File No.E67349
Note:
VDE-approved: Option (V4) EN60747-5-2 (Note)
When an EN60747-5-2 approved type is needed, please designate the Option (V4)
(V4).
4. Packaging and Pin Configuration
1: NC
2: Anode
3: Cathode
4: NC
5: GND (Emitter)
6: Output (Collector)
7: Base
8: VCC
SO8
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TLP2403
5. Internal Circuit
Fig. 5.1 Internal Circuit
6. Principle of Operation
6.1. Mechanical Parameters
Characteristics
Min
Unit
Creepage distances
4.0
mm
Clearance
4.0
Internal isolation thickness

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TLP2403
7. Absolute Maximum Ratings (Note)
Unless otherwise specified, Ta = 25
Characteristics
LED
Symbol
Forward current
Note
IF
Forward current derating
(Ta ≥ 85)
∆IF/
Pulse forward current
Pulse forward current derating
IFP
(Ta ≥ 85)
Transient pulse forward current
Transient pulse forward current
derating
∆IFP/
IFPT
(Ta ≥ 85)
(Note 1)
(Note 2)
∆IFPT/
Rating
Unit
20
mA
-0.67
mA/
40
mA
-1.0
mA/
1
A
-25
mA/
Reverse voltage
VR
5
V
Power dissipation
PD
40
mW
∆PD/
-1.0
mW/
IO
60
mA
Power dissipation derating
(Ta ≥ 85)
Detector Output current
Output current derating
∆IO/
-0.6
mA/
Output voltage
(Ta ≥ 25)
VO
-0.5 to 18
V
Supply voltage
VCC
-0.5 to 18
Emitter-base reverse voltage
VEB
0.5
Output power dissipation
Output power dissipation
derating
(Ta ≥ 25)
Common Operating temperature
Storage temperature
Lead soldering temperature
Isolation voltage
PO
100
mW
∆PO/
-1.0
mW/
Topr
-40 to 100

Tstg
-55 to 125
(10 s)
Tsol
260
AC, 1 min, R.H. ≤ 60%
BVS
(Note 3)
3750
Vrms
Note:
Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: Pulse width (PW) ≤ 1 ms, duty = 50%
Note 2: Pulse width (PW) ≤ 1 µs, 300 pps
Note 3: This device is considered as a two-terminal device: Pins 1, 2, 3 and 4 are shorted together, and pins 5, 6, 7
and 8 are shorted together.
8. Recommended Operating Conditions (Note)
Characteristics
Symbol
Note
Min
Typ.
Max
Unit
mA
Forward current
IF
0.5

15
Output current
IO


30
Supply voltage
VCC


16
V
Operating temperature
Topr
-40

100

(Note 1)
Note:
The recommended operating conditions are given as a design guide necessary to obtain the intended
performance of the device. Each parameter is an independent value. When creating a system design using
this device, the electrical characteristics specified in this datasheet should also be considered.
Note 1: Denotes the operating range, not the recommended operating condition.
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TLP2403
9. Electrical Characteristics (Note)
Unless otherwise specified, Ta = 0 to 100
Characteristics
Input forward voltage
Input temperature coefficient
of forward voltage
Symbol
Note
VF
∆VF/∆Ta
Test
Circuit
Test Condition
Min
Typ.
Max
Unit
IF = 1.6 mA, Ta = 25
1.30
1.45
1.70
V
IF = 1.6 mA

-1.8

mV/
Input reverse current
IR
VR = 5 V, Ta = 25


10
µA
Input capacitance
Ct
V = 0 V, f = 1 MHz, Ta = 25

60

pF
High-level output current
IOH
VF = 0.8 V, VCC = VO = 18 V

0.1
100
µA
High-level supply current
ICCH
IF = 0 mA, VCC = 5 V,
VO = Open

0.01
10
µA
Low-level supply current
ICCL
IF = 1.6 mA, VCC = 5 V,
VO = Open
0.1
1
1.5
mA
Current transfer ratio
IO/IF
IF = 0.5 mA, VCC = 4.5 V,
VO = 0.4 V
400
1000

%
IF = 1.6 mA, VCC = 4.5 V,
VO = 0.4 V
500
900

IF = 1.6 mA, VCC = 4.5 V,
IOL = 6.4 mA

0.1
0.4
IF = 5 mA, VCC = 4.5 V,
IOL = 15 mA

0.1
0.4
IF = 12 mA, VCC = 4.5 V,
VO = 24 mA

0.15
0.4
Min
Typ.
Max
Unit

0.8

pF
1×1012
1014

Ω
Vrms
Low-level output voltage
Note:
VOL
V
All typical values are at Ta = 25.
10. Isolation Characteristics
Unless otherwise specified, Ta = 25
Characteristics
Symbol
Note
Test Conditions
Capacitance (input to output)
CS
(Note 1) VS = 0 V, f = 1 MHz
Isolation resistance
RS
(Note 1) VS = 500 V, R.H. ≤ 60%
Isolation voltage
BVS
3750


AC, 1 s in oil

10000

DC, 1 min in oil

10000

AC, 1 min
Vdc
Note 1: This device is considered as a two-terminal device: Pins 1, 2, 3 and 4 are shorted together, and pins 5, 6, 7
and 8 are shorted together.
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TLP2403
11. Switching Characteristics
Unless otherwise specified, Ta = 0 to 100, VCC = 5 V
Characteristics
Propagation delay time
(H/L)
Propagation delay time
(L/H)
Symbol
Note
tpHL
Test
Circuit
Fig.
12.1.1
tpLH
Fig.
12.1.1
Common-mode transient
immunity at output high
CMH
(Note 1)
Common-mode transient
immunity at output low
CML
(Note 2)
Fig.
12.1.2
Test Condition
Min
Typ.
Max
Unit
IF = 0.5 mA, RL = 4.7 kΩ,
Ta = 25

2
25
µs
IF = 0.5 mA, RL = 4.7 kΩ

2
30
IF = 12 mA, RL = 270 Ω,
Ta = 25

0.3
1
IF = 12 mA, RL = 270 Ω

0.3
2
IF = 1.6 mA, RL = 2.2 kΩ,
Ta = 25

0.5
10
IF = 1.6 mA, RL = 2.2 kΩ

0.5
15
IF = 0.5 mA, RL = 4.7 kΩ,
Ta = 25

4
60
IF = 0.5 mA, RL = 4.7 kΩ

4
90
IF = 12 mA, RL = 270 Ω,
Ta = 25

1
7
IF = 12 mA, RL = 270 Ω

1
10
IF = 1.6 mA, RL = 2.2 kΩ,
Ta = 25

4.5
35
IF = 1.6 mA, RL = 2.2 kΩ

4.5
50
IF = 0 mA, RL = 2.2 kΩ,
VCM = 10 V, VO(min) = 2 V

500

IF = 1.6 mA, RL = 2.2 kΩ,
VCM = 10 V, VO(max) = 0.8 V

-500

µs
V/µs
Note 1: CMH is the maximum rate of rise of the common mode voltage that can be sustained with the output voltage
in the logic high state (VO > 2.0 V).
Note 2: CML is the maximum rate of fall of the common mode voltage that can be sustained with the output voltage in
the logic low state (VO < 0.8 V).
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TLP2403
12. Test Circuits and Characteristics Curves
12.1. Test Circuits
Fig. 12.1.1 Switching Time Test Circuit
Fig. 12.1.2 Common-Mode Transient Immunity
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TLP2403
13. Soldering and Storage
13.1. Precautions for Soldering
The soldering temperature should be controlled as closely as possible to the conditions shown below, irrespective
of whether a soldering iron or a reflow soldering method is used.
•
When using soldering reflow (See Fig. 13.1.1 and 13.1.2)
Reflow soldering must be performed once or twice.
The mounting should be completed with the interval from the first to the last mountings being 2 weeks.
Fig. 13.1.1 An example of a temperature profile
when Sn-Pb eutectic solder is used
•
Fig. 13.1.2 An example of a temperature profile
when lead(Pb)-free solder is used
When using soldering flow (Applicable to both eutectic solder and Lead(Pb)-Free solder)
Apply preheating of 150 for 60 to 120 seconds.
Mounting condition of 260 within 10 seconds is recommended.
Flow soldering must be performed once.
•
When using soldering Iron (Applicable to both eutectic solder and Lead(Pb)-Free solder)
Complete soldering within 10 seconds for lead temperature not exceeding 260 or within 3 seconds not
exceeding 350
Heating by soldering iron must be done only once per lead.
13.2. Precautions for General Storage
•
Avoid storage locations where devices may be exposed to moisture or direct sunlight.
•
Follow the precautions printed on the packing label of the device for transportation and storage.
•
Keep the storage location temperature and humidity within a range of 5 to 35 and 45% to 75%,
respectively.
•
Do not store the products in locations with poisonous gases (especially corrosive gases) or in dusty
conditions.
•
Store the products in locations with minimal temperature fluctuations. Rapid temperature changes during
storage can cause condensation, resulting in lead oxidation or corrosion, which will deteriorate the
solderability of the leads.
•
When restoring devices after removal from their packing, use anti-static containers.
•
Do not allow loads to be applied directly to devices while they are in storage.
•
If devices have been stored for more than two years under normal storage conditions, it is recommended
that you check the leads for ease of soldering prior to use.
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TLP2403
14. Land Pattern Dimensions for Reference Only
Fig. 14.1 Land Pattern Dimensions for Reference Only (unit: mm)
15. Marking
Fig. 15.1 Marking
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TLP2403
16. EN60747-5-2 Option (V4) Specification
•
Part number: TLP2403 (Note)
•
The following part naming conventions are used for the devices that have been qualified according to
option (V4) of EN60747.
Example: TLP2403(V4-TP, F)
V4: EN60747 option specification
TP: Standard taping name
Note: Use TOSHIBA standard type number for safety standard application.
e.g., TLP2403(V4-TP, F) → TLP2403
Fig. 16.1 EN60747 Insulation Characteristics
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TLP2403
Fig. 16.2 Insulation Related Specifications (Note)
Note:
Note:
If a printed circuit is incorporated, the creepage distance and clearance may be reduced below this value. (e.
g., at a standard distance between soldering eye centers of 3.5 mm). If this is not permissible, the user shall
take suitable measures.
This photocoupler is suitable for safe electrical isolation only within the safety limit data.
Maintenance of the safety data shall be ensured by means of protective circuits.
Fig. 16.3 Marking Example (Note)
Note:
The above marking is applied to the photocouplers that have been qualified according to option (V4) of EN60747.
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TLP2403
Package Dimensions
Unit: mm
Weight: 0.11 g (typ.)
Package Name(s)
TOSHIBA: 11-5K1S
Nickname: SO8
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TLP2403
RESTRICTIONS ON PRODUCT USE
• Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively "Product") without notice.
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written permission, reproduction is permissible only if reproduction is without alteration/omission.
• Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible
for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which
minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage
to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate
the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA
information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the
precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application
with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications,
including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating
and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample
application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications.
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Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product.
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noncompliance with applicable laws and regulations.
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