TLP708
TOSHIBA PHOTOCOUPLER
GaAℓAs LED & PHOTO-IC
TLP708,TLP708F
TLP708
Unit: mm
4.58±0.25
high-gain, high-speed photodetector. The TLP708 is housed in the SDIP6 package.
Compared to the standard DIP8 package, TLP708 is smaller in size, yet comes with
possible to reduce the mounting footprint for applications that require certifications for
3.65 +0.15
−0.25
international safety standards under a reinforced isolation category. As such, it is
1 2 3
safety standards.
The photodetector has an open-collector output stage, and an internal Faraday shield
that provides a guaranteed common-mode transient immunity of ±15 kV/μs. As
TLP708 is also able to operate up to 125℃, it is suitable for use in applications like
industrial equipments where it is necessary to operate under high ambient
TLP708F is of a long creepage distance and clearance distance type.
7.62±0.25
1.27±0.2
temperatures.
4.0 −0.20
The Toshiba TLP708 consists of a GaAℓAs light emitting diode and an integrated
+0.25
6.8±0.25
6 5 4
0.25± +0.10
−0.05
Factory Automation (FA)
Home Electrical Appliances
Operates at high ambient temperatures up to 125°C
1.25±0.25
0.4±0.1
9.7±0.3
z Input threshold current :
IFHL = 5mA (Max)
z Switching time (tpHL/tpLH):
75ns (Max)
TOSHIBA
z Data transfer rate:
15 MBd (Typ.)
Weight: 0.26 g (t y p .)
z Guaranteed Performance over temperature:
-40 to 125℃
z Power supply voltage:
4.5 to 5.5V
TLP708F
z Common mode transient immunity:
±15 kV /μs (Min)
z Isolation voltage:
5000Vrms (Min)
11-5J1
11-5J1
Unit: mm
4.58±0.25
6 5 4
UL1577, File No. E67349
z cUL recognized:
CSA Component Acceptance Service No.5A,
File No. E67349
z VDE-approved: Option (D4) EN60747-5-2 (Note)
1.27±0.2
Note: When an EN60747-5-2 approved type is needed,
0.4±0.1
please designate the Option (D4).Option (D4) Type
7.62±0.25
+0.25
1 2 3
z UL recognized:
3.9 −0.15
8.0 mm (min)
8.0 mm (min)
0.4 mm (min)
−0.05
7.0 mm (min)
7.0 mm (min)
0.4 mm (min)
0.25± +0.10
10.16 mm Pitch
TLP708F Type
+0.15
3.65 −0.25
Creepage distance
Clearance distance
Insulation thickness
7.62 mm Pitch
TLP708 Type
6.8±0.25
z Construction mechanical rating
0.75±0.25
11.7±0.3
11-5J101
TOSHIBA
Pin Configuration (Top View)
11-5J101
Weight: 0.26 g (t y p .)
1
VCC
GND
SHIELD
1:ANODE
2:N.C.
5
2
3
6
4
3:CATHODE
4:GND
5:VO(Output)
6:VCC
1
2012-07-27
TLP708,TLP708F
Schematic
Truth Table
ICC
IO 6
IF
1＋
VCC
Input
Output
H
L
L
H
VO
5
3－
GND
SHIELD
4
Note: A 0.1μF bypass capacitor must be connected between pins 6 and 4.
Absolute Maximum Ratings (Ta = 25℃)
LED
Characteristics
Rating
Unit
Forward Current
(Ta < 110℃)
IF
25
mA
Forward Current Derating
(Ta ≥ 110℃)
ΔIF/℃
-0.67
mA/℃
Pulse Forward Current (Note 1)
(Ta < 110℃)
IFP
50
mA
Pulse Forward Current Derating
(Ta ≥ 110℃)
ΔIFP/℃
-1.34
mA/℃
VR
5
V
PD
40
mW
ΔPD/℃
-1.0
mW/℃
IO
25
mA
Output Voltage
VO
6
V
Supply Voltage
VCC
6
V
Reverse Voltage
Input Power Dissipation
(Ta < 110℃)
Input Power Dissipation Derating (Ta ≥ 110℃)
Output Current
DETECTOR
Symbol
(Ta ≤ 125℃)
Output Power Dissipation
(Ta < 110℃)
PO
80
mW
Output Power Dissipation
Derating
(Ta ≥ 110℃)
ΔPO/℃
-2.0
mW/℃
Operating Temperature Range
Topr
−40 to 125
℃
Storage Temperature Range
Tstg
−55 to 150
℃
Lead solder Temperature (10s)
Tsol
260
℃
Isolation voltage (Note 2)
BVS
5000
Vrms
Note: Using continuously under heavy loads (e.g. an application of high temperature/current/voltage and a significant change in
temperature, etc.) may cause this product to decrease in reliability significantly even if the operating conditions (i.e. operating
temperature/current/voltage, etc.) are within the absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling
Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and estimated failure rate,
etc)
Note 1: Pulse width ≤ 1ms, duty=50%
Note 2: R.H. ≤ 60%, Ta = 25℃, AC 1 min
This device is regarded as a two-terminal device: pins 1, 2 and 3 are shorted together,
and pins 4, 5 and 6 are shorted together.
2
2012-08-07
TLP708,TLP708F
Recommended Operating Condition
Characteristics
Symbol
Min.
Typ.
Max.
Unit
‘L’ level input voltage
VFL
0
―
0.8
V
‘H’ level input current
IFH
7.5
―
15
mA
Supply voltage*
VCC
4.5
―
5.5
V
Operating temperature range
Topr
-40
―
125
℃
* This item denotes operating ranges, not meaning of recommended operating conditions.
Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the device. In
addition, each item is an independent guideline. In developing designs using this product, please confirm the specified
characteristics shown in this document.
Electrical Characteristics
(Unless otherwise specified, Ta = -40 to 125℃, VCC = 4.5 to 5.5V)
Symbol
Test
Circuit
VF
―
IF = 10 mA, Ta = 25℃
ΔVF /ΔTa
―
Input reverse current
IR
Input capacitance
“H” level output current
Characteristic
Input forward current
Temperature coefficient of forward voltage
Test Conditions
Min.
Typ.*
Max.
Unit
1.40
1.57
1.80
V
IF = 10 mA
―
−1.8
―
mV/℃
―
VR = 5 V, Ta = 25℃
―
―
10
μA
CT
―
VF = 0 V, f = 1 MHz, Ta = 25℃
―
60
―
pF
―
250
IOH
1
0.5
10
―
0.3
0.6
V
―
1.5
5.0
mA
VF = 0.8 V, VO = 5.5 V
―
VF = 0.8 V, VO = 5.5 V
Ta = 25℃
IF = 10 mA
IOL = 13 mA (sink)
μA
“L” level output voltage
VOL
2
Input threshold current
IFHL
―
IOL = 13 mA (sink)
“H” level supply current
ICCH
3
IF = 0 mA
―
1.5
5.0
mA
“L” level supply current
ICCL
4
IF = 10 mA
―
1.4
5.0
mA
Min.
Typ.
Max.
Unit
―
0.8
―
pF
―
Ω
Vrms
VO < 0.6 V
*All typical values are at Ta=25°C, VCC=5V unless otherwise specified.
Isolation Characteristics (Ta = 25°C)
Characteristic
Symbol
Capacitance input to output
CS
Isolation resistance
RS
Test Conditions
VS = 0V , f = 1MHz
R.H. ≤ 60%,VS = 500V
(Note 2)
AC,1 minute
Isolation voltage
BVS
(Note 2)
1×10
12
10
14
5000
―
―
AC,1 second,in oil
―
10000
―
DC,1 minute,in oil
―
10000
―
3
Vdc
2012-08-07
TLP708,TLP708F
Switching Characteristics
(Unless otherwise specified, Ta = -40 to 125°C, VCC = 4.5 to 5.5 V)
Characteristic
Test
Circuit
Symbol
Propagation delay time to logic low
output
Propagation delay time to logic high
output
tpHL
IF=0→7.5mA
tpLH
IF=7.5→0mA
Switching time dispersion between
|tpHL-
ON and OFF
tpLH|
Propagation delay skew (Note 5)
tpsk
Output fall time（90-10%）
Output rise time（10－90%）
Common mode transient immunity
5
Max.
Unit
—
35
75
ns
—
35
75
ns
RL=350Ω
CL=15pF
—
12
35
ns
(Note 4)
-50
—
50
ns
—
6
—
ns
—
18
—
ns
+15
—
—
kV/μs
-15
—
—
kV/μs
RL=350Ω
CL=15pF
(Note 4)
IF=0↔7.5mA
IF=0→7.5mA
tr
IF=7.5→0mA
(Note 4)
CL=15pF
VCM=1000Vp-p , IF=0mA,
CML
at low level output
Typ.*
tf
6
Common mode transient immunity
Min.
RL =350Ω
CMH
at high level output
Test Conditions
VCC=5V , Ta=25℃
VCM=1000Vp-p , IF=10mA,
VCC=5V , Ta=25℃
*All typical values are at Ta=25℃
Note 3 : A ceramic capacitor (0.1μF) should be connected from pin 6 (VCC) to pin 4 (GND) to stabilize the operation of the high gain
linear amplifier. Failure to provide the bypass may impair the switching property. The total lead length between the capacitor
and coupler should not exceed 1 cm.
Note 4 : f=5MHz, duty=50%, input current tr=tf=4.5ns,
CL is approximately 15pF which includes probe and ｊig/stray wiring capacitance.
Note 5: Propagation delay skew is defined as the difference between the largest and smallest propagation delay times (i.e. tpHL or
tpLH) of multiple samples. Evaluations of these samples are conducted under identical test conditions (supply voltage, input
current, temperature, etc).
TEST CIRCUIT 1:
VF
IOH Test Circuit
1
6
2
5
0.1μF
IOH
A
4
3
1
6
2
5
4
3
TEST CIRCUIT 4:
VOL IO
↑
V
VCC
ICCH Test Circuit
A
VCC
1
6
2
5
0.1 μF
ICCH
A
VCC
0.1 μF
4
3
0.1μF
SHIELD
ICCL
5
2
IF
VOL Test Circuit
IF
ICCL Test Circuit
6
1
VCC
VO
SHIELD
TEST CIRCUIT 3:
TEST CIRCUIT 2:
4
3
SHIELD
SHIELD
4
2012-08-07
TLP708,TLP708F
TEST CIRCUIT 5:
tpHL, tpLH Test Circuit
IF=7.5mA(P.G.)
(f=5MHz , duty=50%, tr=tf=4.5ns)
1
6
2
5
P.G.
IF monitor
3
*CL=15pF
IF
0.1μF
RL=350Ω
VO
4
*CL=15pF
SHIELD
tpHL
tpLH
VO
90%
VCC
VOL
RIN=100Ω
50%
1.5 V
10%
tf
tr
CL includes probe and stray capacitance.
P.G.: Pulse generator
TEST CIRCUIT 6:
Common-Mode Transient Immunity Test Circuit
1000 V
90%
IF
SW
→
6
1
VCM
RL=350Ω
10%
0.1 μF
A
B
2
5
3
4
tf
tr
VO
・SW B : IF=0 mA
VCC
CMH
2V
VO
0.8 V
CML
・SW A : IF=10 mA
＋
VCM
－
CM
5
H
=
800(V )
t r ( μs)
CM
L
=−
800(V )
t f (μs)
2012-08-07
TLP708,TLP708F
IF
IF
(mA)
IF – Ta
(mA)
IF – V F
Input forward voltage
VF
Input forward current
Input forward current
Ta = 125°C
100°C
80°C
50°C
25°C
0°C
−20°C
−40°C
(V)
This curve shows the maximum limit
to the input forward current.
Ambient temperature
VOL – Ta
VOL (V)
VCC = 5 V
Ta = 25°C
VO
(V)
IF = 10 mA
IO = 12.8 mA
IO = 16 mA
Output voltage
Low-level output voltage
(°C)
VO – IF
VCC = 5 V
IO = 9.6 mA
RL = 350 Ω
RL = 4 kΩ
RL = 1 kΩ
IO = 6.4 mA
Ambient temperature
Ta
Input forward current
(°C)
High-level /Low-level supply current
ICCH/ICCL (mA)
VCC = 5 V
RL = 350 Ω
RL = 1 kΩ
Ambient temperature
IF
(mA)
ICCH, ICCL – Ta
IFHL – Ta
Threshold input current (H/L)
IFHL (mA)
Ta
Ta
RL = 4 kΩ
ICCL
ICCH
VCC = 5 V
ICCH: IF = 0 mA
ICCL: IF = 10 mA
Ambient temperature
(°C)
6
Ta
(°C)
2012-08-07
TLP708,TLP708F
tpHL: RL = 350 Ω
RL = 1 kΩ
RL = 4 kΩ
tpLH: RL = 4 kΩ
tpLH: RL = 350 Ω
tpLH: RL = 1 kΩ
Ambient temperature
Ta
|tpHL – tpLH|
VCC = 5 V
IF = 7.5 mA
(ns)
|tpHL – tpLH| – Ta
(°C)
tpLH: RL = 1 kΩ
IF
RL = 4 kΩ
RL = 1 kΩ
Ta
(ns)
|tpHL – tpLH|
Pulse width distortion
(ns)
tpLH, tpHL
Propagation delay time
tpLH: RL = 4 kΩ
Input forward current
RL = 350 Ω
(°C)
|tpHL – tpLH| – IF
VCC = 5 V
Ta = 25°C
tpLH: RL = 350 Ω
IF = 7.5 mA
Ambient temperature
tpLH, tpHL – IF
tpHL: RL = 350 Ω
RL = 1 kΩ
RL = 4 kΩ
VCC = 5 V
Pulse width distortion
Propagation delay time
tpLH, tpHL
(ns)
tpLH, tpHL – Ta
(mA)
VCC = 5 V
Ta = 25°C
tpLH: RL = 4 kΩ
tpLH: RL = 350 Ω
tpLH: RL = 1 kΩ
Input forward current
IF
(mA)
NOTE: The above characteristics curves are presented for reference only and not guaranteed by production test,
unless otherwise noted.
7
2012-08-07
TLP708,TLP708F
PRECAUTIONS OF SURFACE MOUNTING TYPE PHOTOCOUPLER SOLDERING &
GENERAL STORAGE
(1) Precautions for Soldering
1) When Using Soldering Reflow
z
An example of a temperature profile when Sn-Pb eutectic solder is used:
( °C )
z
An example of a temperature profile when lead(Pb)-free solder is used:
( °C )
z
Reflow soldering should be performed no more than twice.
z
The mounting should be completed with the interval from the first to the last mountings being 2 weeks.
2) When using soldering flow (Applicable to both eutectic solder and lead (Pb)-free solder)
z
Apply preheating of 150˚C for 60 to 120 seconds.
z
Mounting condition of 260˚C or less within 10 seconds is recommended.
z
Flow soldering should be performed no more than once.
3) When using soldering iron (Applicable to both eutectic solder and Lead(Pb)-Free solder)
z
Complete soldering within 10 seconds for lead temperature not exceeding 260˚C or within 3 seconds
not exceeding 350˚C.
z
Heating by soldering iron should be performed no more than once per lead.
8
2012-08-07
TLP708,TLP708F
(2) Precautions for General Storage
1) Do not store devices in places where they will be exposed to moisture or direct sunlight.
2) During transportation or storage of devices, follow the cautions indicated on the carton box.
3) The storage area temperature should be kept within a temperature range of 5˚C
to 35˚C, and the relative humidity should be maintained between 45% and 75%.
4) Do not store devices in the presence of harmful (especially corrosive) gases, or under dusty conditions.
5) Use storage areas where there is minimal temperature fluctuation. The solderability of the leads will be
degraded as rapid temperature changes can cause condensation to form on the stored devices,
resulting in lead oxidation or corrosion.
6) When repacking devices, use anti-static containers.
7) Do not apply any external force or load directly to devices when they are in storage.
8) If devices have been stored for more than two years, it is recommended that their solderability be tested
before they are used even if the above precautions have been followed.
9
2012-08-07
TLP708,TLP708F
Specifications for Embossed-Tape Packing
(TP) for SDIP6 Type Photocoupler
1. Applicable Package
Package Name
Product Type
SDIP6
Photocouplers
2. Product Naming System
Type of package used for shipment is denoted by a symbol suffix after a product number. The method of classification is as
below.
(Example)
TLP708 (TP, F)
[[G]]/RoHS COMPATIBLE (Note 6)
Tape type
Device name
3. Tape Dimensions
3.1
Orientation of Devices in Relation to Direction of Tape Movement
Device orientation in the recesses is as shown in Figure 1.
Tape feed
Figure 1 Device Orientation
3.2
Tape Packing Quantity: 1500 devices per reel
3.3
Empty Device Recesses Are as Shown in Table 1.
Table 1 Empty Device Recesses
Item
Standard
Occurrences of 2 or more
successive empty device
recesses
0
Single empty device
recesses
3.4
Remarks
Within any given 40-mm section of
tape, not including leader and trailer
6 devices (max) per reel
Not including leader and trailer
Start and End of Tape:
The start of the tape has 30 or more empty holes. The end of the tape has 30 or more empty holes and two empty
turns as a cover tape.
10
2012-08-07
TLP708,TLP708F
Tape Specification
(1)
Tape material: Plastic (protection against electrostatics)
(2)
Dimensions: The tape dimensions are as shown in Figure 2 and Table 2.
2.0 ± 0.1
+0.1
0.4 ± 0.05 φ1.5 −0
G
B
D
E
F
K0
16.0 ± 0.3
3.5
A
φ1.6 ± 0.1
4.55 ± 0.2
Figure 2 Tape Forms
Table 2 Tape Dimension
Unit: mm
Unless otherwise specified: ±0.1
Symbol
Dimension
Remark
A
10.4
⎯
B
5.1
⎯
D
7.5
Center line of indented square hole and sprocket hole
E
1.75
F
12.0
G
4.0
Distance between tape edge and hole center
+0.1
Cumulative error −0.3 (max) per 10 feed holes
+0.1
Cumulative error −0.3 (max) per 10 feed holes
K0
4.1
Internal space
11
2012-08-07
TLP708 / TLP708F
3.6
Reel
(1)
Material: Plastic
(2)
Dimensions: The reel dimensions are as shown in Figure 3 and Table 3.
Table 3 Reel Dimension
A
C
4
B
Unit: mm
E
Symbol
Dimension
A
φ380 ± 2
B
φ80 ± 1
C
φ13 ± 0.5
E
2.0 ± 0.5
U
4.0 ± 0.5
W1
17.5 ± 0.5
W2
21.5 ± 1.0
W1
W2
Figure 3 Reel Forms
4. Packing
Either one reel or five reels of photocouplers are packed in a shipping carton.
5. Label Indication
The carton bears a label indicating the product number, the symbol representing classification of standard, the quantity, the
lot number and the Toshiba company name.
6. Ordering Method
When placing an order, please specify the product number, the CTR rank, the tape type and the quantity as shown in the
following example.
(Example)
TLP708 (TP, F) 1500 pcs
Quantity (must be a multiple of 1500)
[[G]]/RoHS COMPATIBLE (Note 6)
Tape type
Device name
Note 6 :Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility
of Product.
RoHS is the Directive 2002/95/EC of the European Parliament and of the Council of 27 January 2003 on the restriction of
the use of certain hazardous substances in electrical and electronics equipment.
12
2012-08-07
TLP708 / TLP708F
RESTRICTIONS ON PRODUCT USE
• Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively "Product") without notice.
• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with
TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission.
• Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the
Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of
all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes
for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the
instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their
own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such
design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts,
diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating
parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR
APPLICATIONS.
• PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE
EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH
MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT
("UNINTENDED USE"). Except for specific applications as expressly stated in this document, Unintended Use includes, without
limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for
automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions,
safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. IF YOU USE
PRODUCT FOR UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT. For details, please contact your
TOSHIBA sales representative.
• Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
• Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any
applicable laws or regulations.
• The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to
any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
• ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY
WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR
LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND
LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO
SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS
FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
• GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or
vapor. Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product.
• Do not use or otherwise make available Product or related software or technology for any military purposes, including without
limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile
technology products (mass destruction weapons). Product and related software and technology may be controlled under the
applicable export laws and regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the
U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited
except in compliance with all applicable export laws and regulations.
• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES
OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.
13
2012-08-07