TOSHIBA TLP2451

TLP2451
TOSHIBA Photocoupler GaAℓAs IRED + Photo IC
TLP2451
Industrial Inverter
MOSFET / IGBT Gate Driver
IH (Induction Heating)
Operate at high ambient temperatures up to 125°C
Unit: mm
7
6
5
1
2
3
4
3.95 ± 0.25
8
The Toshiba TLP2451 consists of GaAℓAs infrared right emitting diodes and
integrated high gain, high-speed photodetectors. The TLP2451 is housed in
the SO8 package.
The photodetector has an internal Faraday shield that provides a
guaranteed common-mode transient immunity of ±15 kV/μs. TLP2451 is
suitable for direct gate driving circuit for IGBTs or power MOSFETs.
5.1 ± 0.2
1.27 ± 0.15
z
Buffer logic type (Totem pole output)
z
Package type: SO8
z
Peak Output Current : IOP = ±0.6A (max)
z
Guaranteed performance over temperature: -40 to 125°C
z
Power supply voltage: 10 to 30 V
z
Threshold Input Current: IFLH = 5.0 mA (max)
z
Propagation delay time: tpLH/tpHL = 700ns (max)
z
Common mode transient immunity: ±15kV/μs （min）
z
Isolation voltage: 3750Vrms (min)
z
UL under application: UL1577, File No.E67349
z
z
c-UL under application: CSA Component Acceptance Service No. 5A, File No.E67349
Option(V4) VDE under application : EN60747-5-2
0.38
0.1 ± 0.1 2.5 ± 0.2
6.0 ± 0.2
0.305 min
11-5K1
JEDEC
―
JEITA
―
TOSHIBA
11-5K1
weight: 0.11 g (typ)
Pin Configuration (Top View)
(Note) When a EN60747-5-2 approved type is needed,
Please designate the “option(V4)”
Schematic
(M1)
ICC 8
VCC
1
8
2
7
3
6
5
4
SHIELD
IF
1:NC
2:ANODE
3:CATHODE
4:NC
5:GND
6:VO(Output)
7:NC
8:VCC
2+
VF
3−
(M2)
SHIELD
IO 6
VO
Truth Table
5
GND
1
Input
LED
M1
M2
Output
H
ON
ON
OFF
H
L
OFF
OFF
ON
L
2010-01-19
TLP2451
Absolute Maximum Ratings (Ta = 25 °C)
Characteristic
Symbol
Forward Current
LED
Unit
IF
25
mA
ΔIF /°C
-0.67
mA/°C
IFPT
50
mA
ΔIFPT /°C
-1.34
mA/°C
VR
5
V
“H” Peak Output Current (Note2)
IOPH
-0.6
A
“L” Peak Output Current (Note2)
IOPL
0.6
A
Output Voltage
VO
35
V
Supply Voltage
VCC
35
V
PO
80
mW
Forward Current Derating
(Ta ≥ 110°C)
Peak Transient Forward Current
(Note 1)
Peak Transient Forward Current Derating
(Ta ≥ 110°C)
Reverse Voltage
Detector
Rating
Output Power Dissipation
ΔPO /°C
-2.0
mW/°C
Operating Temperature Range
Output Power Dissipation Derating
Topr
-40 to 125
°C
Storage Temperature Range
Tstg
-55 to 150
°C
Lead Soldering Temperature
(Ta ≥ 110°C)
(10 s)
Isolation Voltage (AC,1 min.,R.H.≤ 60%)
(Note 3)
Tsol
260
°C
BVs
3750
Vrms
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: Pulse width ≤1ms, duty=50%.
Note 2: Exponential waveform pulse width PW ≤ 2 μs, f ≤ 10 kHz
Note 3: This device is regarded as a two terminal device: pins 1, 2, 3 and 4 are shorted together,
as are pins 5, 6, 7 and 8.
Recommended Operating Conditions
Characteristic
Symbol
Min
Typ.
Max
Unit
Input Current, High Level (Note 4)
IFLH
7.5
-
15
mA
Input Voltage, Low Level
VFHL
0
-
0.8
V
Supply Voltage*
VCC
10
-
30
V
IOPH/ IOPL
-
-
±0.2
A
Topr
-40
-
125
°C
Peak output current
Operating Temperature
* This item denotes operating range, not meaning of recommended operating conditions.
Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the
device. Additionally, each item is an independent guideline respectively. In developing designs using this product,
please confirm specified characteristics shown in this document.
Note 4: Input signal rise time (fall time) < 0.5 μs.
Note 5: A steep rising slope of the VCC may cause an unstable operation of the device. Therefore please design the
VCC rise slope under 3.0 V/μs.
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TLP2451
Electrical Characteristics (Ta = −40 to 125 °C, unless otherwise specified)
Symbol
Test
Circuit
VF
⎯
IF = 10 mA, Ta = 25 °C
∆VF/∆Ta
⎯
Input reverse current
IR
Input capacitance
CT
Characteristics
Forward voltage
Temperature coefficient of forward
voltage
“H” Level
Output current
(Note 6)
“L” Level
“H” Level
IOPH1
IOPH2
IOPL1
IOPL2
VOH
Test Condition
Min
Typ.*
Max
Unit
1.40
1.57
1.80
V
IF = 10 mA
⎯
−1.8
⎯
mV/°C
⎯
VR = 5 V, Ta = 25 °C
⎯
⎯
10
μA
⎯
V =0 V, f = 1 MHz
⎯
60
⎯
pF
1
VCC = 15 V
IF = 5 mA
V8-6 = 4 V
⎯
−0.4
−0.2
V8-6 = 10 V
⎯
⎯
−0.4
2
VCC = 15 V
IF = 0 mA
V6-5 = 2 V
0.2
0.5
⎯
3
VCC = 10 V
Output voltage
V6-5 = 10 V
0.4
⎯
⎯
IO = −100 mA,
IF = 5 mA
6.0
8.5
⎯
IO = 100 mA,
VF = 0.8 V
⎯
0.35
1.0
⎯
1.1
2.0
⎯
1.1
2.0
A
V
“L” Level
VOL
4
“H” Level
ICCH
5
“L” Level
ICCL
6
VCC = 10 to 30 V IF = 10 mA
VO=Open
IF = 0 mA
Threshold input current
L→H
IFLH
⎯
VCC = 15 V, VO > 1 V
⎯
1.2
5
mA
Threshold input voltage
H→L
VFHL
⎯
VCC = 15 V, VO < 1 V
0.8
⎯
⎯
V
VCC
⎯
10
⎯
30
V
Supply current
Supply voltage
⎯
mA
*All typical values are at Ta=25°C, VCC=10 V unless otherwise specified
Note 6: Duration of Io time ≤ 50 μs, 1 pulse
Note 7: This product is more sensitive than conventional products to electrostatic discharge (ESD) owing to its low
power consumption design. It is therefore all the more necessary to observe general precautions regarding
ESD when handling this component.
Isolation Characteristics (Ta = 25 °C)
Characteristic
Capacitance input to output
Isolation resistance
Symbol
CS
RS
Test Condition
VS = 0 V , f = 1MHz
R.H. ≤ 60 %, VS = 500 V
BVS
Typ.
Max
Unit
⎯
0.8
⎯
pF
⎯
Ω
12
(Note 3) 1×10
10
14
3750
⎯
⎯
AC, 1 second, in oil
⎯
10000
⎯
DC, 1 minute, in oil
⎯
10000
⎯
AC, 1 minute
Isolation voltage
(Note 3)
Min
3
Vrms
Vd c
2010-01-19
TLP2451
Switching Characteristics (Ta = −40 to 125 °C, unless otherwise specified)
Characteristics
Propagation delay time
Test
Circuit
Symbol
L→H
tpLH
H→L
tpHL
Output rise time (10−90 %)
tr
Output fall time (90−10 %)
tf
Switching time dispersion
Test Condition
Min
Typ.*
Max
IF = 0 → 5 mA
100
⎯
700
IF = 5 → 0 mA
100
⎯
700
Rg = 47 Ω
IF = 0 → 5 mA
⎯
50
⎯
Cg = 3 nF
IF = 5 → 0 mA
⎯
50
⎯
IF = 0 , 5 mA
⎯
⎯
500
−15
⎯
⎯
15
⎯
⎯
VCC = 30 V
7
| tpHL-tpLH |
between ON and OFF
Common mode transient immunity
CMH
at HIGH level output
8
Common mode transient immunity
CML
at LOW level output
IF = 5 mA
VCM =1000 Vp-p V
O (min) = 26 V
VCC = 30 V
IF = 0 m
Ta = 25 °C
VO (max) = 1 V
Unit
ns
kV/μs
( * ): All typical values are at Ta = 25 °C.
Note 8: A ceramic capacitor (0.1 μF) should be connected from pin 8 (VCC) to pin 5 (GND) to stabilize the operation
of the high gain linear amplifier. Failure to provide the bypass may impair the switching property.
The total lead length between capacitor and coupler should not exceed 1 cm.
Test Circuit 1: IOPH
1
Test Circuit 2: IOPL
8
1
8
0.1μF
V8-6
IOPL
A IOPH
IF
A
VCC
0.1μF
4
4
5
5
Test Circuit 3: VOH
1
Test Circuit 4: VOL
8
VO
1
IF
VCC
VF
IO
0.1μF
8
0.1μF
V
4
VCC
V6-5
IO
VCC
V
4
5
5
VOL
*VOH =VCC－VO
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TLP2451
Test Circuit 5: ICCH
Test Circuit 6: ICCL
ICCH
8
1
IF
0.1μF
ICCL
8
1
A
VCC
A
VCC
0.1μF
4
4
5
5
Test Circuit 7: tpLH, tpHL, tr, tf, |tpLH, tpHL|
IF=5mA(P.G)
(f=25kHz , duty=50%, tr = tf = less than 5ns)
8 0.1μF
1
P.G.
VO
IF monitor
VCC
Cg =3 nF
Rg = 47 Ω
4
IF
tr
VOH
tf
90%
50%
10%
VO
5
tpHL
tpLH
RIN=100Ω
VOL
Test Circuit 8: CMH, CML
1
SW
A
VCM
8
IF
10%
0.1μF
B
VO
VCC
+
tr
1000V
tf
SW : A(IF=5mA)
VO
5
4
90%
VCM
−
CMH
1V
26V
CML
SW : B(IF=0mA)
800(V )
CM =
L t ( μs)
r
CM
H
=
800(V )
t f ( μs)
CML (CMH) is the maximum rate of rise (fall) of the common mode voltage that can be sustained with
the output voltage in the low (high) state.
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TLP2451
PRECAUTIONS OF SURFACE MOUNTING TYPE PHOTOCOUPLER SOLDERING &
GENERAL STORAGE
(1) Precautions for Soldering
1) When Using Soldering Reflow
z
An example of a temperature profile when Sn-Pb eutectic solder is used:
This profile is based on the device’s
maximum heat resistance guaranteed
value.
Set the preheat temperature/heating
temperature to the optimum temperature
corresponding to the solder paste type
used by the customer within the
described profile.
z
An example of a temperature profile when lead(Pb)-free solder is used:
This profile is based on the device’s
maximum heat resistance guaranteed
value.
Set the preheat temperature/heating
temperature to the optimum temperature
corresponding to the solder paste type
used by the customer within the
described profile.
z Reflow soldering must be performed once or twice.
z The mounting should be completed with the interval from the first to the last mountings being 2 weeks.
2) When using soldering Flow (Applicable to both eutectic solder and Lead(Pb)-Free solder)
z Apply preheating of 150 deg.C for 60 to 120 seconds.
z Mounting condition of 260 deg.C or less within 10 seconds is recommended.
z Flow soldering must be performed once
3) When using soldering Iron (Applicable to both eutectic solder and Lead(Pb)-Free solder)
z Complete soldering within 10 seconds for lead temperature not exceeding 260 deg.C or within 3 seconds
not exceeding 350 deg.C.
z Heating by soldering iron must be only once per 1 lead
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TLP2451
(2) Precautions for General Storage
1) Do not store devices at any place where they will be exposed to moisture or direct sunlight.
2) When transportation or storage of devices, follow the cautions indicated on the carton box.
3) The storage area temperature should be kept within a temperature range of 5 degree C
to 35 degree C, and relative humidity should be maintained at between 45% and 75%.
4) Do not store devices in the presence of harmful (especially corrosive)gases, or in dusty conditions.
5) Use storage areas where there is minimal temperature fluctuation. Because rapid temperature
changes can cause condensation to occur on stored devices, resulting in lead oxidation or corrosion,
as a result, the solderability of the leads will be degraded.
6) When repacking devices, use anti-static containers.
7) Do not apply any external force or load directly to devices while they are in storage.
8) If devices have been stored for more than two years, even though the above conditions have been
followed, it is recommended that solderability of them should be tested before they are used.
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TLP2451
Specification for Embossed–Tape Packing (TP) for SO8 Coupler
1. Applicable Package
Package
Product Type
SO8
Photocoupler
2. Product Naming System
Type of package used for shipment is denoted by a symbol suffix after a product number. The method of
classification is as below.
(Example)
TLP2451 (TP)
Tape type
Device name
3. Tape Dimensions
3.1 Orientation of Device in Relation to Direction of Tape Movement
Device orientation in the recesses is as shown in Figure 1.
Tape feed
Figure 1 Device Orientation
3.2 Tape Packing Quantity: 2500 devices per reel
3.3 Empty Device Recesses Are as Shown in Table 1.
Table 1 Empty Device Recesses
Standard
Occurrences of 2 or more
successive empty device
recesses
Single empty device
recesses
Remarks
Within any given 40-mm section of
tape, not including leader and trailer
0
6 devices (max) per reel
Not including leader and trailer
3.4 Start and End of Tape
The start of the tape has 50 or more empty holes. The end of tape has 50 or more empty holes and two
empty turns only for a cover tape.
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TLP2451
3.5 Tape Specification
(1) Tape material: Plastic (protection against electrostatics)
(2) Dimensions: The tape dimensions are as shown in Figure 2 and table 2.
F
B
D
E
G
φ1.6 ± 0.1
K0
12.0 ± 0.3
+0.1
0.3 ± 0.05 φ1.5 −0
A
3.3 ± 0.1
Figure 2 Tape Forms
Table 2 Tape Dimensions
Unit: mm
Unless otherwise specified: ±0.1
Symbol
Dimension
Remark
A
6.5
―
B
5.6
―
D
5.5
Center line of indented square hole and sprocket hole
E
1.75
F
8.0
G
4.0
K0
3.1
Distance between tape edge and hole center
+0.1
Cumulative error -0.3 (max) per 10 feed holes
Cumulative error +0.1 (max) per 10 feed holes
-0.3
Internal space
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TLP2451
3.6 Reel
A
C
U
B
(1) Material: Plastic
(2) Dimensions: The reel dimensions are as shown in Figure 3 and Table 3.
E
W1
W2
Figure 3 Reel Form
Table 3 Reel Dimensions
Unit: mm
Symbol
Dimension
A
Φ330 ±2
B
Φ80 ±1
C
Φ13 ±0.5
E
2.0 ±0.5
U
4.0 ±0.5
W1
13.5 ±0.5
W2
17.5 ±1.0
4. Packing
Either one reel or five reels of photocoupler are packed in a shipping carton.
5. Label Indication
The carton bears a label indicating the product number, the symbol representing classification of
standard, the quantity, the lot number and the Toshiba company name.
6. Ordering Method
When placing an order, please specify the product number, the tape type and the quantity as shown in the
following example.
(Example)
TLP2451 (TP) 2500 pcs
Quantity (must be a multiple of 2500)
Tape type
Device name
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TLP2451
RESTRICTIONS ON PRODUCT USE
• Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively “Product”) without notice.
• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with
TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission.
• Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the
Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of
all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes
for Product and the precautions and conditions set forth in the “TOSHIBA Semiconductor Reliability Handbook” and (b) the
instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their
own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such
design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts,
diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating
parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS’ PRODUCT DESIGN OR
APPLICATIONS.
• Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring
equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document.
Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or
reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious
public impact (“Unintended Use”). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used
in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling
equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric
power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this
document.
• Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
• Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any
applicable laws or regulations.
• The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to
any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
• ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY
WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR
LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND
LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO
SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS
FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
• GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or
vapor. Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product.
• Do not use or otherwise make available Product or related software or technology for any military purposes, including without
limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile
technology products (mass destruction weapons). Product and related software and technology may be controlled under the
Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product
or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations.
• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of
noncompliance with applicable laws and regulations.
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