SN761646 www.ti.com SLES251 – NOVEMBER 2009 DIGITAL TV TUNER IC Check for Samples: SN761646 FEATURES 1 VHI RFIN UHF RFIN2 UHF RFIN1 GPP2 VHI OSC B 24 RF GND UHF OSC B2 2 23 MIXOUT2 OSC GND 3 22 MIXOUT1 CP 4 21 IF IN VTU 5 20 RFAGC OUT IF GND 6 19 SDA IF OUT 7 18 SCL VCC 8 17 GPP1 XTAL2 XTAL1 IFGCA CTRL 10 11 12 13 14 15 16 IFGCA OUT1 9 IFGCA OUT2 Digital TVs Digital CATVs Set-Top Boxes 1 IFGCA GND • • • UHF OSC C2 IFGCA IN2 APPLICATIONS 32 31 30 29 28 27 26 25 IFGCA IN1 • • • • VHI OSC C • RHB PACKAGE (TOP VIEW) UHF OSC B1 • Integrated Mixer/Oscillator/PLL and IF GCA VHF-H, UHF 2-Band Local Oscillator I2C Bus Protocol (Fixed Address) 30-V Tuning Voltage Output Two General Purpose Ports Selectable Wide/Narrow Band RF AGC Detector Crystal Oscillator 4 MHz/8 MHz/16 MHz Support Programmable Reference Divider Ratio (24/28/48/56/64/96/128) IF GCA Enable/Disable Control Standby Mode 5-V Power Supply 32-Pin Quad Flatpack No Lead (QFN) Package UHF OSC C1 • • • • • • DESCRIPTION The SN761646 is a low-phase-noise synthesized tuner IC designed for digital TV tuning systems. The circuit consists of a PLL synthesizer, two-band local oscillator and mixer, RF AGC detector circuit and IF gain controlled amplifier, and is available in a small outline package. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2009, Texas Instruments Incorporated SN761646 SLES251 – NOVEMBER 2009 www.ti.com FUNCTIONAL BLOCK DIAGRAM IF IN MIX OUT1 MIX OUT2 UHF OSC B2 UHF OSC C2 UHF OSC C1 UHF OSC B1 VHI OSC C VHI OSC B OSC GND IF AMP VHF-H OSC UHF OSC IF OUT IF GND VHF-H MIXER VHI RF IN UHF MIXER RF AGC OUT RF AGC DETECT UHF RF IN1 UHF RF IN2 RF GND PROGRAMMABLE DIVIDER CP VTU XTAL1 XTAL2 4MHz/8MHz XTALOSC 24/28/48/56/ 64/96/128DIV PHASE DETECTOR CHARGE PUMP OP AMP VCC SCL SDA I2C BUS INTERFACE GENERAL PURPOSE PORT IF GCAOUT1 IF GCA 50k IF GCAOUT2 IF GCA GND 50k 100k IF GCA CTRL Submit Documentation Feedback IF GCA IN2 IF GCA IN1 GPP1 GPP2 2 Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): SN761646 SN761646 www.ti.com SLES251 – NOVEMBER 2009 TERMINAL FUNCTIONS Table 1. TERMINAL NAME DESCRIPTION NO. SCHEMATIC CP 4 Charge-pump output Figure 1 GPP1 17 General purpose port output 1 (open collector type) Figure 2 GPP2 28 General purpose port output 2 (emitter follower type) Figure 3 IFGCA CTRL 14 IF GCA control voltage input Figure 4 IFGCA GND 11 IF GCA ground IFGCA IN1 9 IF GCA input Figure 5 IFGCA IN2 10 IF GCA input Figure 5 IFGCA OUT1 13 IF GCA output Figure 6 IFGCA OUT2 12 IF GCA output Figure 6 IF GND 6 IF ground IF IN 21 IF amplifier input Figure 7 IF OUT 7 IF amplifier output Figure 8 MIXOUT1 22 Mixer output 1 Figure 9 MIXOUT2 23 Mixer output 2 Figure 9 OSC GND 3 Oscillator ground RF AGC OUT 20 RF AGC output RF GND 24 Mixer ground SCL 18 Serial clock input Figure 11 SDA 19 Serial data input/output Figure 12 UHF OSC B1 31 UHF oscillator base 1 Figure 13 UHF OSC B2 2 UHF oscillator base 2 Figure 13 UHF OSC C1 32 UHF oscillator collector 1 Figure 13 UHF OSC C2 1 UHF oscillator collector 2 Figure 13 UHF RF IN1 27 UHF RF input 1 Figure 14 UHF RF IN2 26 UHF RF input 2 Figure 14 VCC 8 Supply voltage VHI OSC B 29 VHF-H oscillator base Figure 15 VHI OSC C 30 VHF-H oscillator collector Figure 15 VHI RF IN 25 VHF-H RF input Figure 16 VTU 5 Tuning voltage amplifier output Figure 17 XTAL1 15 Crystal oscillator Figure 18 XTAL2 16 Crystal oscillator Figure 18 Figure 10 50k 10 25 17 4 25 Figure 1. CP Figure 2. GPP1 Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): SN761646 3 SN761646 SLES251 – NOVEMBER 2009 www.ti.com 1k 14 100k 10 28 50k Figure 3. GPP2 Figure 4. IF GCA CTRL Vbais 1k 1k 9 10 15 13 12 Figure 5. . IF GCA IN1 and IF GCA IN2 Figure 6. IF GCA OUT1 and IF GCA OUT2 2k 10 A 7 25 1k 25 1k 21 1k Figure 7. IF IN 25 Figure 8. IF OUT 23 25 22 A 20 Figure 9. MIXOUT1 and MIXOUT2 Figure 10. RF AGC OUT 25 1k 19 1k 18 Figure 11. SCL 4 Figure 12. SDA Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): SN761646 SN761646 www.ti.com SLES251 – NOVEMBER 2009 26 1 27 32 3k 20 3k 20 2 31 8k 8k Figure 13. UHF OSC B1, UHF OSC B2, UHF OSC C1, and UHF OSC C2 Figure 14. UHF RF IN1 and UHF RF IN2 30 25 40 3k 29 3k 8k 8k Figure 15. VHI OSC B and VHI OSC C Figure 16. VHI RF IN 5 16 15 10 20 50k Figure 17. VTU Figure 18. XTAL1 and XTAL2 Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): SN761646 5 SN761646 SLES251 – NOVEMBER 2009 www.ti.com ABSOLUTE MAXIMUM RATINGS (1) (2) over recommended operating free-air temperature range (unless otherwise noted) VALUE UNIT VCC Supply voltage range (3) VCC –0.4 to 6.5 V VGND Input voltage range 1 (3) RF GND, OSC GND –0.4 to 0.4 V VVTU Input voltage range 2 (3) VTU –0.4 to 35 V VIN Input voltage range 3 (3) Other pins –0.4 to 6.5 V TA Operating free-air temperature range –20 to 85 °C θJA Package thermal impedance (4) 32.4 °C/W Tstg Storage temperature range –65 to 150 °C TJ Maximum junction temperature 150 °C (1) (2) (3) (4) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. Overshoot or undershoot of input voltage beyond absolute maximum rating may induce failure. Latch up performance exceeds +/-100mA per JESD78, except for GPP1 (pin 17). Voltage values are with respect to the IF GND of the circuit. The package thermal impedance is calculated in accordance with JESD 51-5 (High-K). RECOMMENDED OPERATING CONDITIONS MIN NOM MAX 4.5 5 5.5 V 30 33 V GPP1 –5 mA GPP2 10 mA 85 °C VCC Supply voltage VCC VVTU Tuning supply voltage VTU IGPP1 Output current of general purpose port 1 IGPP2 Output current of general purpose port 2 TA Operating free-air temperature –20 UNIT xxx This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. IF IN, MIXOUT1, and MIXOUT2 (pins 21–23) withstand 1.5 kV; all other pins withstand 2 kV, according to the Human-Body Model (1.5 kΩ, 100 pF). 6 Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): SN761646 SN761646 www.ti.com SLES251 – NOVEMBER 2009 ELECTRICAL CHARACTERISTICS Total Device and Serial Interface VCC = 4.5 V to 5.5 V, TA = –20°C to 85°C (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT ICC1 Supply current 1 BS[2:1] = 10, IGPP1,2 = 0 mA, IFGCA disabled 80 mA ICC2 Supply current 2 BS[2:1] = 10, IGPP1,2 = 0 mA, IFGCA enabled 110 mA ICC-STBY Standby supply current BS[2:1] = 11 VIH High-level input voltage (SCL, SDA) VIL Low-level input voltage (SCL, SDA) IIH High-level input current (SCL, SDA) IIL Low-level input current (SCL, SDA) –10 VPOR Power-on-reset supply voltage (threshold of supply voltage between reset and operation mode) 2.1 8 14 2.3 mA V 1.05 V 10 μA μA 2.8 3.5 V I2C Interface VOL Low-level output voltage (SDA) VCC = 5 V, IOL = 3 mA 0.4 V lSDAH High-level output leakage current (SDA) VSDA = 5.5 V 10 μA fSCL Clock frequency (SCL) 400 kHz tHD-DAT Data hold time 0.9 μs tBUF Bus free time 1.3 μs tHD-STA Start hold time 0.6 μs tLOW SCL-low hold time 1.3 μs tHIGH SCL-high hold time 0.6 μs tSU-STA Start setup time 0.6 μs tSU-DAT Data setup time 0.1 tr Rise time (SCL, SDA ) 0.3 μs tf Fall time (SCL, SDA) 0.3 μs tSU-STO Stop setup time 100 See Figure 19 0 μs 0.6 Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): SN761646 μs 7 SN761646 SLES251 – NOVEMBER 2009 www.ti.com PLL and General Purpose Port VCC = 4.5 V to 5.5 V, TA = –20°C to 85°C (unless otherwise noted) PARAMETER TEST CONDITIONS N Divider ratio 15-bit frequency word fXTAL Crystal oscillator frequency See Figure 21 ZXTAL Crystal oscillator input impedance 8 MHz, VCC = 5 V, TA = 25°C VVTUL Tuning amplifier low-level output voltage RL = 22 kΩ, VTU = 30 V IVTUOFF Tuning amplifier leakage current Tuning amplifier = off, VTU = 30 V ICP11 ICP10 ICP01 Charge-pump current ICP00 ICP100 MIN MAX 4 16 1.5 0.2 0.45 0.6 V 10 μA 600 750 CP[2:0] = 010 250 350 450 CP[2:0] = 001 100 140 200 CP[2:0] = 000 35 70 95 900 1200 CP[2:0] = 100, Mode = 1 PLL locked ICPOFF Charge-pump leakage current VCP = 2 V, TA = 25°C IGPP1 General purpose port 1 (GPP1) output current VGPP1ON General purpose port 1 (GPP1) output ON voltage IGPP2 General purpose port 2 (GPP2) output current 650 1.95 –15 IGPP1 = –2 mA, VCC = 5 V, TA = 25°C IGPP2 = 10 mA 2.9 IGPP2 = 10 mA, VCC = 5 V, TA = 25°C 3.4 VGPP22 General purpose port 2 (GPP2) output voltage IGPP2OFF General purpose port 2 (GPP2) OFF leakage VGPP2 = 0 V current MHz kΩ 450 Charge-pump output voltage UNIT 32767 CP[2:0] = 011 VCP VGPP21 TYP 512 μA V 15 nA –5 mA 0.6 V 10 mA V 3.6 8 μA RF AGC VCC = 5 V, TA = 25°C, measured in Figure 20 reference measurement circuit at 50-Ω system, IF = 44 MHz, IF filter characteristics: fpeak = 44 MHz (unless otherwise noted) PARAMETER IOAGC0 TEST CONDITIONS RF AGC output source current IOAGC1 MIN TYP 300 nA ATC = 1 9 μA RF AGC peak sink current ATC = 0 VOAGCH RFAGCOUT output high voltage (max level) ATC = 1 VOAGCL RFAGCOUT output low voltage (min level) 4.0 ATC = 1 0.3 ATP[2:0] = 000, ATC=0, AISL=0 114 VAGCSP01 ATP[2:0] = 001, ATC=0, AISL=0 112 ATP[2:0] = 010, ATC=0, AISL=0 110 ATP[2:0] = 011, ATC=0, AISL=0 108 VAGCSP04 ATP[2:0] = 100, ATC=0, AISL=0 106 VAGCSP05 ATP[2:0] = 101, ATC=0, AISL=0 104 VAGCSP06 ATP[2:0] = 110, ATC=0, AISL=0 102 8 Start-point IF output level Submit Documentation Feedback μA 100 3.5 VAGCSP00 VAGCSP03 UNIT ATC = 0 IOAGCSINK VAGCSP02 MAX 4.5 V V dBμV Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): SN761646 SN761646 www.ti.com SLES251 – NOVEMBER 2009 Mixer, Oscillator, IF Amplifier (DIF OUT) VCC = 5 V, TA = 25°C, measured in Figure 20 reference measurement circuit at 50-Ω system, IF = 44 MHz, IF filter characteristics: fpeak = 44 MHz (unless otherwise noted) PARAMETER GC4D GC6D GC7D GC9D NF4D NF6D NF7D NF9D CM4D CM6D CM7D CM9D VIFO4D VIFO6D VIFO7D VIFO9D ΦPLVL4D ΦPLVL6D ΦPLVL7D ΦPLVL9D (1) (2) (3) (4) TEST CONDITIONS Conversion gain (mixer-IF amplifier), VHF-HIGH Conversion gain (mixer-IF amplifier), UHF Noise figure, VHF-HIGH Noise figure, UHF Input voltage causing 1% cross-modulation distortion, VHF-HIGH Input voltage causing 1% cross-modulation distortion, UHF IF output voltage, VHF-HIGH IF output voltage, UHF Phase noise, VHF-HIGH Phase noise, UHF TYP (1) 29 fin = 467 MHz (1) 29 fin = 473 MHz (1) 29 fin = 864 MHz (1) 29 fin = 177 MHz fin = 177 MHz 9 fin = 467 MHz 10 fin = 473 MHz 10 fin = 864 MHz 12 fin = 177 MHz (2) 79 fin = 467 MHz (2) 79 fin = 473 MHz (2) 77 fin = 864 MHz (2) 77 fin = 177 MHz 117 fin = 467 MHz 117 fin = 473 MHz 117 fin = 864 MHz 117 fin = 177 MHz (3) –85 (4) –77 fin = 473 MHz (3) –80 fin = 864 MHz (4) –77 fin = 467 MHz UNIT dB dB dB dB dBμV dBμV dBμV dBμV dBc/Hz dBc/Hz IF = 44 MHz, RF input level = 70 dBμV fundes = fdes ±6 MHz, Pin = 70 dBμV, AM 1 kHz, 30%, DES/CM = S/I = 46 dB Offset = 1 kHz, CP current = 350 μA, reference divider = 128, crystal = 8 MHz Offset = 1 kHz, CP current = 900 μA, reference divider = 128, crystal = 8 MHz Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): SN761646 9 SN761646 SLES251 – NOVEMBER 2009 www.ti.com IF Gain Controlled Amplifier VCC = 5 V, TA = 25°C, measured in Figure 20 reference measurement circuit at 50-Ω system, IF = 45.75 MHz, IF filter characteristics: fpeak = 44 MHz (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP UNIT IIFGCA Input current (IF GCA CTRL) VIFGCA = 3 V 60 µA VIFGCAMAX Maximum gain control voltage Gain Maximum 3 VCC V VIFGCAMIN Minimum gain control voltage Gain Minimum 0 0.2 GIFGCAMAX Maximum gain VIFGCA = 3 V 65 dB GIFGCAMIN Minimum gain VIFGCA = 0 V –1 dB GCRIFGCA Gain control range VIFGCA = 0 V to 3 V 66 dB VIFGCAOUT Output voltage Single-ended output, VIFGCA = 3 V 2.1 Vp-p NFIFGCA Noise figure VIFGCA=3V 11 dB Third order intermodulation distortion fIFGCAIN1 = 43 MHz, fIFGCAIIN2 = 44 MHz, VIFGCAOUT = –2 dBm, VIFGCA = 3 V –50 dBc IIP3IFGCA Input intercept point VIFGCA = 0 V 11 dBm RIFGCAIN Input resistance (IF GCA IN1, IF GCA IN2) 1 kΩ RIFGCAOUT Output resistance (IF GCA OUT1, IF GCA OUT2) 25 Ω IM3IFGCA 10 Submit Documentation Feedback 30 MAX V Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): SN761646 SN761646 www.ti.com SLES251 – NOVEMBER 2009 FUNCTIONAL DESCRIPTION I2C Bus Mode I2C Write Mode (R/W = 0) Table 2. Write Data Format MSB LSB Address byte (ADB) 1 1 0 0 0 0 0 R/W = 0 A (1) Divider byte 1 (DB1) 0 N14 N13 N12 N11 N10 N9 N8 A (1) Divider byte 2 (DB2) N7 N6 N5 N4 N3 N2 N1 N0 A (1) Control byte 1 (CB1) 1 0 ATP2 ATP1 ATP0 RS2 RS1 RS0 A (1) CP1 CP0 AISL 0 GPP2 GPP1 BS2 BS1 A (1) 1 1 ATC MODE T3/DISGCA T2 T1/CP2 T0 A (1) Band switch byte (BB) Control byte 2 (CB2) (1) A : acknowledge Table 3. Write Data Symbol Description SYMBOL ADB DESCRIPTION DEFAULT Address byte (Write mode) ADB[7:0]=11000000 N[14:0] Programmable counter set bits N14 = N13 = N12 = ... = N0 = 0 N = N14 × 214 + N13 × 213 + ... + N1 × 2 + N0 ATP[2:0] RF AGC start-point control bits (see Table 4) ATP[2:0] = 000 RS[2:0] Reference divider ratio-selection bits (see Table 5) RS[2:0] = 000 CP[1:0] Charge-pump current-set bit (see Table 6) CP[1:0] = 00 AISL RF AGC detector input selection bit AISL = 0 AISL = 0: IF amplifier AISL = 1: Mixer output GPP[2:1] General purpose port output control bit GPP[2:1]=00 GPPn = 0: Output transistor = OFF GPPn = 1: Output transistor = ON BS[4:1] ATC Band selection bits BS2 BS1 0 1 0 1 1 0 0 1 BS[2:1]=00 Not allowed VHF-HI UHF Standby mode/stop MOP function RF AGC current-set bit ATC = 0 ATC = 0: Current = 300 nA ATC = 1: Current = 9 μA Mode T3/DISGCA T2 T1/CP2 T0 Mode = 0: IF GCA enabled T3/DISGCA, T2, T1/CP2, T0 are test bits (see Table 7) Mode = 1: T3/DISGCA =0 : IF GCA enabled T3/DISGCA =1 : IF GCA disabled T1/CP2 : Icp control bit, See Table 6 MODE = 0 T[3:0] = 0000 Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): SN761646 11 SN761646 SLES251 – NOVEMBER 2009 www.ti.com Table 4. RF AGC Start Point ATP2 ATP1 ATP0 IFOUT LEVEL (dBμV) 0 0 0 114 0 0 1 112 0 1 0 110 0 1 1 108 1 0 0 106 1 0 1 104 1 1 0 102 1 1 1 Disabled (Hi-Z) Table 5. Reference Divider Ratio RS2 RS1 RS0 REFERENCE DIVIDER RATIO 0 0 0 24 0 0 1 28 0 1 0 48 0 1 1 56 1 0 0 64 1 0 1 96 1 1 0 128 1 1 1 Reserved Table 6. Charge-Pump Current CP2 CP1 CP0 X 0 0 0 70 X 0 0 1 140 X 0 1 0 350 X 0 1 1 600 1 1 0 0 900 Table 7. Test Bits (1) CHARGE PUMP CURRENT (μA) MODE (1) MODE T3/DISGCA T2 T1/CP2 T0 DEVICE OPERATION 0 0 0 0 X Normal operation 1 X X X X Normal operation 0 X 1 X X Test mode 0 1 X X X Test mode RFAGC is not available in test mode. I2C Read Mode (R/W = 1) Table 8. Read Data Format MSB Address byte (ADB) Status byte (SB) (1) 12 LSB 1 1 0 0 0 0 0 R/W = 1 A (1) POR FL 1 1 1 1 1 1 – A : acknowledge Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): SN761646 SN761646 www.ti.com SLES251 – NOVEMBER 2009 Table 9. Read Data Symbol Description SYMBOL DESCRIPTION ADB Address byte (Read mode) POR Power-on-reset flag DEFAULT ADB[7:0] = 11000001 POR = 1 POR set: power on POR reset: end-of-data transmission procedure FL (1) In-lock flag PLL locked (FL = 1), unlocked (FL = 0) (1) Lock detector works by using phase error pulse at the phase detector. Lock flag (FL) is set or reset according to this pulse width disciminator. Hence unstableness of PLL may cause the lock detect circuit to malfunction. In order to stable PLL, it is required to evaluate application circuit in various condition of loop-gain (loo-p filter, CP current), and to verify with whole conditions of actual application Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): SN761646 13 SN761646 SLES251 – NOVEMBER 2009 www.ti.com Example I2C Data Write Sequences Telegram examples: Start - ADB - DB1 Start - ADB - DB1 Start - ADB - CB1 Start - ADB - CB1 Start - ADB - CB2 - DB2 - CB1 – BB - CB2 - Stop DB2 - Stop BB - CB2 - Stop BB - Stop Stop Abbreviations: ADB: Address byte BB: Bandswitch byte CB1: Control byte 1 CB2: Control byte 2 DB1: Divider byte 1 DB2: Divider byte 2 Start: Start condition Stop: Stop condition t HD-STA t SU-STA t HIGH tF SCL t SU-DAT t LOW t SU-STO tR SDA t HD-DAT t BUF Figure 19. I2C Timing Chart 14 Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): SN761646 SN761646 www.ti.com SLES251 – NOVEMBER 2009 APPLICATION INFORMATION R4 VC2 C10 VC1 C1 R1 GPP2 R5 C33 L1 C2 C3 C31 C7 R7 UHF OSC C2 27 26 25 VHI RF IN C13 1 28 UHF RF IN2 C6 C8 29 UHF RF IN1 L3 30 GPP2 C9 R6 31 VHI OSC B 32 C5 VHI OCS C R2 UHF OSC B1 VC3 UHF OSC C1 C4 L2 UHF IN1 R27 C32 VHI IN R26 Vcc RF GND R25 24 L6 R3 R9 2 UHF OSC B2 MIX OUT2 23 3 OSC GND MIX OUT1 22 R24 (See Note A) R8 C14 L7 L10 C30 L8 C11 R10 L9 C29 4 CP IF IN 21 C28 C12 5 VTU VTU RF AGC OUT 20 C26 C27 RFAGCOUT R28 C15 6 IF GND SDA 19 7 IF OUT SCL R11 C16 C17 IF GCA OUT2 IF GCA OUT1 IF GCA CTRL XTAL1 XTAL2 R15 IFGCA IN1 IF GCA GND 8 VCC IF GCA IN2 Vcc 9 10 11 12 13 14 15 16 18 SCL C35 GPP1 17 C19 SDA C34 R29 IF GCA IN1 IF OUT R31 Vcc GPP1 X1 R13 C25 IFGCA IN2 C24 C20 R17 IFGCA OUT2 C21 R18 R20 IFGCA OUT1 R19 IFGCA CTRL C23 C22 R21 R23 R22 A. To prevent abnormal oscillation, connect C14, which does not affect a PLL. B. This application information is advisory and performance-check is required at actual application circuits. TI assumes no responsibility for the consequences of use of this circuit, such as an infringement of intellectual property rights or other rights, including patents, of third parties. Figure 20. Reference Measurement Circuit Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): SN761646 15 SN761646 SLES251 – NOVEMBER 2009 www.ti.com Table 10. Component Values for Measurement Circuit (1) PARTS NAME VALUE PARTS NAME VALUE C1 (VHI OSC B) 7 pF L6 (MIXOUT) 680 nH (LK1608R68K-T) C2 (VHI OSC C) 5 pF L7 (MIX OUT) 680 nH (LK1608R68K-T) C3 (VHI OSC) 0.5 pF L8 (IF IN) Short C4 (UHF OSCB1) 1.5 pF L9 (MIX OUT) Short C5 (UHF OSCC1) 1 pF L10 (MIXOUT) Short C6 (UHF OSCC2) 1 pF R1 (VHI OSC B) 4.7 Ω C7 (UHF OSCB2) 1.5 pF R2 (UHF OSC B1) 7.5 Ω C8 (UHF OSC) 10 pF R3 (UHF OSC B2) 7.5 Ω C9 (UHF OSC) 100 pF R4 (VHI OSC) 3.3 kΩ C10 (VHI OSC) 51 pF R5 (VHI OSC) 3.3 kΩ C11 (CP) 0.01 µF/50 V R6 (UHF OSC) 1kΩ C12 (CP) 22 pF/50 V R7 (UHF OSC) 2.2 kΩ C13 (VTU) 2.2 nF R8 (CP) 47 kΩ C14 (VTU) 150 pF R9 (VTU) 3kΩ C15 (VTU) 2.2 nF/50 V R10 (VTU) 22 kΩ C16 (IF OUT) 2.2 nF R11 (IF OUT) 200 Ω C17 (VCC) 0.1 µF R13 (IFGCA IN1) 50 Ω C19 (IFGCA IN1) 2.2 nF R15 (IF GCA IN) 0Ω C20 (IFGCA IN2) 2.2 nF R17 (IFGCA IN2) 0Ω C21 (IFGCA OUT2) 2.2 nF R18 (IFGCA OUT2) 200 Ω C22 (IFGCA OUT1) 2.2 nF R19 (IFGCA OUT2) Open C23 (IFGCA CTRL) 0.1 µF R20 (IFGCA OUT2) Open C24 (XTAL) 15 pF R21 (IFGCA OUT1) Open C25 (XTAL) 15 pF R22 (IFGCA OUT1) 200 Ω C26 (RFAGC OUT) 0.1 µF R23 (IFGCA OUT1) 50 Ω C27 (RFAGC OUT) 0.047 µF R24 (MIXOUT) Open C28 (IF IN) Open R25 (MIXOUT) 0Ω C29 (MIXOUT) 6 pF R26 (VHI IN) 50 Ω C30 (MIXOUT) 2.2 nF R27 (UHF RFIN1) 50 Ω C31 (VHI RF IN) 2.2 nF R28 (SDA) 330 Ω C32 (UHF RFIN2) 2.2 nF R29 (SCL) 330 Ω C33 (UHF RFIN1) 2.2 nF R31 (GPP1) Open C34 (SDA) Open VC1 (VHI OSC) MA2S372 C35 (SCL) Open VC2 (VHI OSC) MA2S374 L1 (VHI OSC) φ2.0 mm, 3T, wire 0.4 mm, L VC3 (UHF OSC) MA2S372 L2 (UHF OSC) φ1.8 mm, 3T, wire 0.4 mm, R X1 8 MHz crystal L3 (UHF OSC) φ1.8 mm, 3T, wire 0.4 mm, R (1) 16 If frequency = 44 MHz, local frequency range: VHF-HIGH: 221–511 MHz UHF: 517–908 MHz Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): SN761646 SN761646 www.ti.com SLES251 – NOVEMBER 2009 APPLICATION INFORMATION (CONTINUED) XTAL1 XTAL2 Reference Crystal Oscillation Circuit 15 16 CRYSTAL X1 FREQUENCY X1 CAPACITORS C24 C25 4 MHz HC49SFNB04000H0 (Kyocera) 27 pF 27 pF 8 MHz CX5032GB08000H0 (Kyocera) 15 pF 15 pF 16 MHz CX3225GB16000D0 (Kyocera) 14 pF 14 pF TYPE C24 Figure 21. Reference Crystal Oscillation Circuit Test Circuits DUT SG Spectrum Analyzer 200 W VHI RFIN 50 W 50 W IFOUT Gv = 20log(VOUT/VIN) + 14.0 VIN VOUT 50 W Figure 22. Conversion Gain Measurement Circuit DUT SG Spectrum Analyzer 200 W UHFRF IN1 50 W 50 W VIN IFOUT Gv = 20log(VOUT/VIN) + 14.0 VOUT UHFRF IN2 50 W Figure 23. UHF Conversion Gain Measurement Circuit DUT SG IFGCAIN1 50 W 50 W VIN IFGCAIN2 Vout difft 200 W Spectrum Analyzer IFGCAOUT1 VOUT IFGCAOUT2 IFGCACTRL 50 W Gv = 20log(VOUTDIFF/VIN) = 20log(VOUT/VIN) + 6 + 14.0 250 W DC Power Source Figure 24. IF GCA Gain Measurement Circuit Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): SN761646 17 SN761646 SLES251 – NOVEMBER 2009 www.ti.com NF Meter Noise Source DUT Figure 25. Noise Figure Measurement Circuit Signal Generator fdes: P = 70 dBmV Signal Generator Mix Pad fdes ±6 MHz AM 30%, 1 kHz Modulation Analyzer DUT Figure 26. 1% Cross-Modulation Distortion Measurement Circuit TYPICAL CHARACTERISTICS General Purpose Port 2 (GPP2) Output Voltage 5.0 4.5 Vcc=5.5V 4.0 Vcc=5.0V Output Voltage [V] 3.5 Vcc=4.5V 3.0 2.5 2.0 1.5 1.0 0.5 0.0 0 2 4 6 8 10 12 14 16 18 20 Output Current [mA] Figure 27. GPP2 Output Current vs Output Voltage 18 Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): SN761646 SN761646 www.ti.com SLES251 – NOVEMBER 2009 TYPICAL CHARACTERISTICS (continued) IF GCA Gain vs Control Voltage 70 60 50 Vcc=5.5V Gain [dB] 40 Vcc=5.0V Vcc=4.5V 30 20 10 0 -10 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 IF GCA CTRL voltage [V] Figure 28. IF GCA Gain vs Control Voltage S-Parameter 40MHz 500MHz Figure 29. VHI RFIN Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): SN761646 19 SN761646 SLES251 – NOVEMBER 2009 www.ti.com TYPICAL CHARACTERISTICS (continued) 900MHz 350MHz Figure 30. UHF RFIN 60MHz 30MHz Figure 31. IFOUT 20 Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): SN761646 SN761646 www.ti.com SLES251 – NOVEMBER 2009 TYPICAL CHARACTERISTICS (continued) 20MHz 70MHz Figure 32. IF GCA IN 70MHz 20MHz Figure 33. IF GCA OUT Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): SN761646 21 PACKAGE OPTION ADDENDUM www.ti.com 31-Mar-2012 PACKAGING INFORMATION Orderable Device SN761646RHBR Status (1) NRND Package Type Package Drawing QFN RHB Pins Package Qty 32 3000 Eco Plan (2) Green (RoHS & no Sb/Br) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) CU NIPDAU Level-2-260C-1 YEAR (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. 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