MMSD914T1G, SMMSD914T1G, MMSD914T3G Switching Diode Features http://onsemi.com SOD−123 Surface Mount Package High Breakdown Voltage Fast Speed Switching Time AEC−Q101 Qualified and PPAP Capable S Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant* SOD−123 CASE 425 PLASTIC 1 CATHODE MAXIMUM RATINGS Rating Symbol Value Unit Continuous Reverse Voltage VR 100 Vdc Peak Forward Current IF 200 mAdc IFM(surge) 500 mAdc 1.0 2.0 A A Peak Forward Surge Current Non−repetitive Peak Forward Surge Current Pulse Width =1 second Pulse Width =1 micro second THERMAL CHARACTERISTICS Characteristic Total Device Dissipation FR−5 Board (Note 1) TA = 25C Derate above 25C Thermal Resistance, Junction−to−Ambient Junction and Storage Temperature Range MARKING DIAGRAM 1 IFSM Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 2 ANODE 5D M G 5D M G G 2 = Specific Device Code = Date Code = Pb−Free Package (Note: Microdot may be in either location) ORDERING INFORMATION Symbol Max Unit Device Package Shipping† PD 425 mW MMSD914T1G SOD−123 (Pb−Free) 3,000 / Tape & Reel 3.4 mW/C SMMSD914T1G SOD−123 (Pb−Free) 3,000 / Tape & Reel MMSD914T3G SOD−123 10,000 / Tape & Reel (Pb−Free) RqJA TJ, Tstg C/W 290 −55 to +150 C 1. FR−5 = 1.0oz Cu, 1.0inz pad †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Semiconductor Components Industries, LLC, 2011 November, 2011 − Rev. 10 1 Publication Order Number: MMSD914T1/D MMSD914T1G, SMMSD914T1G, MMSD914T3G ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) Characteristic Symbol Min Max Unit V(BR) 100 − Vdc − − 25 5.0 nAdc mAdc OFF CHARACTERISTICS Reverse Breakdown Voltage (IBR = 100 mAdc) Reverse Voltage Leakage Current (VR = 20 Vdc) (VR = 75 Vdc) IR Forward Voltage (IF = 10 mAdc) VF − 1000 mVdc Diode Capacitance (VR = 0 Vdc, f = 1.0 MHz) CD − 4.0 pF Reverse Recovery Time (IF = IR = 10 mAdc) (Figure 1) trr − 4.0 ns 820W +10 V 2k 100 mH 0.1 mF tr IF 0.1 mF tp t IF trr 10% t DUT 50 W OUTPUT PULSE GENERATOR 50 W INPUT SAMPLING OSCILLOSCOPE 90% IR VR INPUT SIGNAL Notes: 1. A 2.0 kW variable resistor adjusted for a Forward Current (IF) of 10 mA. Notes: 2. Input pulse is adjusted so IR(peak) is equal to 10 mA. Notes: 3. tp » trr Figure 1. Recovery Time Equivalent Test Circuit http://onsemi.com 2 iR(REC) = 1 mA OUTPUT PULSE (IF = IR = 10 mA; measured at iR(REC) = 1 mA) MMSD914T1G, SMMSD914T1G, MMSD914T3G 100 10 I R, REVERSE CURRENT (A) 10 TA = 85C TA = -40C 1.0 TA = 25C TA = 125C 1.0 TA = 85C 0.1 TA = 55C 0.01 TA = 25C 0.1 0.2 0.4 0.6 0.8 1.0 0.001 1.2 10 0 20 30 VF, FORWARD VOLTAGE (VOLTS) VR, REVERSE VOLTAGE (VOLTS) Figure 2. Forward Voltage Figure 3. Leakage Current 0.68 CD , DIODE CAPACITANCE (pF) IF, FORWARD CURRENT (mA) TA = 150C 0.64 0.60 0.56 0.52 0 2 4 6 VR, REVERSE VOLTAGE (VOLTS) Figure 4. Capacitance http://onsemi.com 3 8 40 50 MMSD914T1G, SMMSD914T1G, MMSD914T3G PACKAGE DIMENSIONS SOD−123 CASE 425−04 ISSUE G D ÂÂÂÂ ÂÂÂÂ ÂÂÂÂ A NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. A1 1 HE DIM A A1 b c D E HE L q E 2 q MILLIMETERS NOM MAX 1.17 1.35 0.05 0.10 0.61 0.71 --0.15 1.60 1.80 2.69 2.84 3.68 3.86 ------10 MIN 0.037 0.000 0.020 --0.055 0.100 0.140 0.010 0 INCHES NOM 0.046 0.002 0.024 --0.063 0.106 0.145 ----- MAX 0.053 0.004 0.028 0.006 0.071 0.112 0.152 --10 STYLE 1: PIN 1. CATHODE 2. ANODE L b MIN 0.94 0.00 0.51 --1.40 2.54 3.56 0.25 0 C SOLDERING FOOTPRINT* ÉÉ ÉÉ ÉÉ ÉÉ 0.91 0.036 2.36 0.093 4.19 0.165 ÉÉ ÉÉ ÉÉ ÉÉ SCALE 10:1 1.22 0.048 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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