ONSEMI SMMSD4148T1G

MMSD4148T1G,
SMMSD4148T1G,
MMSD4148T3G,
SMMSD4148T3G
Switching Diode
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Features






SOD−123 Surface Mount Package
High Breakdown Voltage
Fast Speed Switching Time
AEC−Q101 Qualified and PPAP Capable
S Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant*
SOD−123
CASE 425
STYLE 1
1
CATHODE
2
ANODE
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Continuous Reverse Voltage
VR
100
V
Peak Forward Current
IF
200
mA
IFSM
1.0
2.0
A
TJ, Tstg
−55 to
+150
C
Characteristic
Symbol
Max
Unit
Total Device Dissipation FR−5 Board (Note 2)
TA = 25C
Derate above 25C
PD
425
mW
3.4
mW/C
290
C/W
Peak Forward Surge Current
(Note 1)
t < 1 sec
t = 1 msec
Operating and Storage Junction Temperature
Range
MARKING DIAGRAM
1
5I
M
G
THERMAL CHARACTERISTICS
Thermal Resistance Junction−to−Ambient
RqJA
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Typical Values
2. FR−5 = 1.0 oz Cu, 1.0 inz pad
5I M G
G
= Device Code
= Date Code
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Package
Shipping†
MMSD4148T1G
SOD−123
(Pb−Free)
3,000 /
Tape & Reel
SMMSD4148T1G
SOD−123
(Pb−Free)
3,000 /
Tape & Reel
MMSD4148T3G
SOD−123
(Pb−Free)
10,000 /
Tape & Reel
SMMSD4148T3G
SOD−123
(Pb−Free)
10,000 /
Tape & Reel
Device
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques Reference
Manual, SOLDERRM/D.
 Semiconductor Components Industries, LLC, 2011
November, 2011 − Rev. 11
1
Publication Order Number:
MMSD4148T1/D
MMSD4148T1G, SMMSD4148T1G, MMSD4148T3G, SMMSD4148T3G
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)
Symbol
Characteristic
Min
Max
100
−
−
−
25
5.0
−
1000
−
4.0
−
4.0
Unit
OFF CHARACTERISTICS
Reverse Breakdown Voltage
(IBR = 100 mA)
V(BR)
Reverse Voltage Leakage Current
(VR = 20 V)
(VR = 75 V)
IR
Forward Voltage
(IF = 10 mA)
VF
Diode Capacitance
(VR = 0 V, f = 1.0 MHz)
CD
Reverse Recovery Time
(IF = IR = 10 mA) (Figure 1)
trr
V
nA
mA
mV
pF
ns
820 W
+10 V
2k
100 mH
0.1 mF
tr
IF
0.1 mF
tp
t
IF
trr
10%
t
DUT
50 W OUTPUT
PULSE
GENERATOR
50 W INPUT
SAMPLING
OSCILLOSCOPE
90%
IR
VR
INPUT SIGNAL
1.
2.
3.
A 2.0 kW variable resistor adjusted for a Forward Current (IF) of 10 mA.
Input pulse is adjusted so IR(peak) is equal to 10 mA.
tp » trr
Figure 1. Recovery Time Equivalent Test Circuit
http://onsemi.com
2
iR(REC) = 1 mA
OUTPUT PULSE
(IF = IR = 10 mA; measured
at iR(REC) = 1 mA)
MMSD4148T1G, SMMSD4148T1G, MMSD4148T3G, SMMSD4148T3G
100
10
I R, REVERSE CURRENT (A)

10
TA = 85C
TA = -40C
1.0
TA = 25C
TA = 125C
1.0
TA = 85C
0.1
TA = 55C
0.01
TA = 25C
0.1
0.2
0.4
0.6
0.8
1.0
0.001
1.2
10
0
20
30
VF, FORWARD VOLTAGE (VOLTS)
VR, REVERSE VOLTAGE (VOLTS)
Figure 2. Forward Voltage
Figure 3. Leakage Current
0.68
CD , DIODE CAPACITANCE (pF)
IF, FORWARD CURRENT (mA)
TA = 150C
0.64
0.60
0.56
0.52
0
2
4
6
VR, REVERSE VOLTAGE (VOLTS)
Figure 4. Capacitance
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3
8
40
50
MMSD4148T1G, SMMSD4148T1G, MMSD4148T3G, SMMSD4148T3G
PACKAGE DIMENSIONS
SOD−123
CASE 425−04
ISSUE G
D
ÂÂÂÂ
ÂÂÂÂ
ÂÂÂÂ
A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
A1
1
HE
DIM
A
A1
b
c
D
E
HE
L
q
E
2
MILLIMETERS
NOM
MAX
1.17
1.35
0.05
0.10
0.61
0.71
--0.15
1.60
1.80
2.69
2.84
3.68
3.86
------10 
MIN
0.037
0.000
0.020
--0.055
0.100
0.140
0.010
0
INCHES
NOM
0.046
0.002
0.024
--0.063
0.106
0.145
-----
MAX
0.053
0.004
0.028
0.006
0.071
0.112
0.152
--10 
STYLE 1:
PIN 1. CATHODE
2. ANODE
q
L
b
MIN
0.94
0.00
0.51
--1.40
2.54
3.56
0.25
0
C
SOLDERING FOOTPRINT*
ÉÉ
ÉÉ
ÉÉ
0.91
0.036
2.36
0.093
4.19
0.165
ÉÉ
ÉÉ
ÉÉ
SCALE 10:1
1.22
0.048
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
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time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under
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4
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MMSD4148T1/D