SLSS003 − SEPTEMBER 1983 − REVISED MARCH 1988 D Designed for Use With the TL851 in Sonar D D D D D D N PACKAGE (TOP VIEW) Ranging Modules Like the SN28827 Digitally Controlled Variable-Gain Variable-Bandwidth Amplifier Operational Frequency Range of 20 kHz to 90 kHz TTL-Compatible Operates From Power Sources of 4.5 V to 6.8 V Interfaces to Electrostatic or Piezoelectric Transducers Overall Gain Adjustable With One External Resistor G1IN XIN GADJ LC VCC G1OUT G2IN BIAS 1 16 2 15 3 14 4 13 5 12 6 11 7 10 8 9 GND GCD GCA GCB GCC NC NC REC NC − No internal connection description The TL852 is an economical sonar ranging receiver integrated circuit for use with the TL851 control integrated circuit. A minimum of external components is required for operation, and this amplifier easily interfaces to Polaroid’s 50-kHz electrostatic transducer. An external 68-kΩ ±5% resistor from BIAS to GND provides the internal biasing reference. Amplifier gain can be set with a resistor from G1IN to GADJ. Required amplifier gain will vary for different applications. Using the detect-level measurement circuit of Figure 1, a nominal peak-to-peak value of 230 mV input during gain step 2 is recommended for most applications. For reliable operation, a level no lower than 50 mV should be used. The recommended detect level of 230 mV can be obtained for most amplifiers with an R1 value between 5 kΩ and 20 kΩ Digital control of amplifier gain is provided with gain control inputs GCA, GCB, GCC, and GCD. These inputs must be driven synchronously (all inputs stable within 0.1 µs) to avoid false receive output signals due to invalid logic counts. This can be done easily with the TL851 control integrated circuit. A plot showing relative gain for the various gain steps versus time can be seen in Figure 2. To dampen ringing of the 50-kHz electrostatic transducer, a 5-kΩ resistor from G1IN to XIN is recommended. An external parallel combination of inductance and capacitance between LC and VCC provides an amplifier with an externally controlled gain and Q. This not only allows control of gain to compensate for attenuation of signal with distance, but also maximizes noise and sidelobe rejection. Care must be taken to accurately tune the L-C combination at operating frequency or gain and Q will be greatly reduced at higher gain steps. AC coupling between stages of the amplifier is accomplished with a 0.01-mF capacitor for proper biasing. The receive output is normally held at a low level by an internal 1-µA current source. When an input of sufficient amplitude is received, the output is driven alternately by the 1-µA discharge current and a 50-µA charging current. A 1000-pF capacitor is required from REC to GND to integrate the received signal so that one or two noise pulses will not be recognized. XIN provides clamping for the transformer secondary when used for transducer transmit drive as shown in Figure 4 of the SN28827 data sheet. The TL852 is characterized for operation from 0°C to 40°C. Copyright 1988, Texas Instruments Incorporated !" #$ # % & ## '($ # ) # "( "# ) "" $ • POST OFFICE BOX 655303 DALLAS, TEXAS 75265 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443 • 1 SLSS003 − SEPTEMBER 1983 − REVISED MARCH 1988 functional block diagram VCC 5 50 µA VCC − 2.1 V G2IN GCA GCB GCC GCD 0.3 V 7 9 14 13 12 Gain Control REC 1 µA 15 Reg Ref 8 BIAS 0.7 V G1IN GADJ LC XIN GND 6 1 3 4 2 16 schematic of gain control inputs GCA, GCB, GCC, AND GCD VCC INPUT GND 2 • POST OFFICE BOX 655303 DALLAS, TEXAS 75265 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443 • G1OUT SLSS003 − SEPTEMBER 1983 − REVISED MARCH 1988 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Voltage at any pin with respect to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . − 0.5 V to 7 V Voltage at any pin with respect to VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . − 7 V to 0.5 V XIN input current (50% duty cycle) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±60 mA Continuous power dissipation at (or below) 25°C free-air temperature (see Note 1) . . . . . . . . . . . . 1150 mW Operating free-air temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . − 40°C to 85°C Storage temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . − 65°C to 150°C Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C † Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. This is a stress rating only, and functional operation of the device at these or any other conditions beyond those indicated in the recommended operating conditions section of this specification is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTE 1: For operation above 25°C, derate linearly at the rate of 9.2 mW/°C. recommended operating conditions Supply voltage, VCC High-level input voltage, VIH MIN MAX 4.5 6.8 UNIT V 2.1 GCA, GCB, GCC, GCD Low-level input voltage, VIL 0.6 Bias resistor between BIAS and GND Operating free-air temperature, TA V 64 72 kΩ 0 40 °C electrical characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP‡ II = 40 mA II = − 40 mA Input clamp voltage at XIN Open-circuit input voltage at GCA, GCB, GCC, GCD High-level input current, IIH, into GCA, GCB, GCC, GCD Low-level input current, IIL, into GCA, GCB, GCC, GCD Raceive output current MAX − 1.5 VCC = 5 V, VCC = 5 V, II = 0 VIH = 2 V VCC = 5 V, IG2IN = − 100 µA, VIL = 0 VO = 0.3 V 1 IG2IN = 100 µA, VO = 0.1 V − 50 Supply current, ICC ‡ Typical values are at VCC = 5 V and TA = 25°C. 2.5 • POST OFFICE BOX 655303 DALLAS, TEXAS 75265 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443 V V − 0.5 mA −3 mA µA A 45 • UNIT 2.5 mA 3 SLSS003 − SEPTEMBER 1983 − REVISED MARCH 1988 APPLICATION INFORMATION detect level versus gain step Detect level is measured by applying a 15-cycle burst of 49.4 kHz square wave just after the beginning of the gain step to be tested. The least burst amplitude that makes REC reach the trip level is defined to be the detect level. System gain is then inversely proportional to detect level. See the test circuit in Figure 1. VCC 68 kΩ TL331 8 L1 7 0.01 µF 1 mH 15-Cycle 49.4-kHz Variable-Amplitude Burst Generator 490 kΩ 6 21 mH 500 pF GADJ 2 XIN 1 0.0022 µF NC LC 3 5 kΩ G2IN VCC 4 R1 REC G1OUT 5 0.01 µF BIAS G1IN NC GCC GCB GCA GCD Trip Level 9 10 1000 pF 11 12 13 14 15 16 GND 5 kΩ All Resistors ±1%, 1/4 W All Capacitors ±1%, Film L1 Q > 60 at 50 kHz C1 Q > 500 at 50 kHz 15 Pulses Input Signal Trip Level Rec Output Comparator Output Figure 1. Detect-Level Measurement Circuit and Waveforms 4 • POST OFFICE BOX 655303 DALLAS, TEXAS 75265 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443 • Detect SLSS003 − SEPTEMBER 1983 − REVISED MARCH 1988 APPLICATION INFORMATION GAIN STEP TABLE GCD GCC GCB GCA L L L L L L L L H H H H L L L L H H H H L L L L L L H H L L H H L L H H L H L H L H L H L H L H STEP NUMBER 0 1 2 3 4 5 6 7 8 9 10 11 Receiver Gain vs Gain Step Numbers 100 70 Relative Receiver Gain 40 20 10 7 4 2 1 0.7 0.4 0.2 0.1 0 1 2 3 4 5 6 7 8 9 10 11 Gain Steps Figure 2 • POST OFFICE BOX 655303 DALLAS, TEXAS 75265 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443 • 5 PACKAGE OPTION ADDENDUM www.ti.com 18-Jul-2006 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty TL852CDR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL852CDRG4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL852CDRG4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL852CN ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TL852CN ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TL852CNE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TL852CNE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. 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Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device TL852CDR Package Package Pins Type Drawing SOIC D 16 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 2500 330.0 16.4 Pack Materials-Page 1 6.5 B0 (mm) K0 (mm) P1 (mm) 10.3 2.1 8.0 W Pin1 (mm) Quadrant 16.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TL852CDR SOIC D 16 2500 367.0 367.0 38.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. 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