TWL6040 SWCS052A – AUGUST 2010 – REVISED DECEMBER 2011 www.ti.com 8-CHANNEL HIGH_QUALITY LOW-POWER AUDIO CODEC FOR PORTABLE APPLICATIONS FEATURES 1 • • 2 • • • • • • • • • • Four audio digital-to-analog (DAC) channels Stereo capless headphone drivers: – Up to 104-dB DR – Power tune for performance/power consumption tradeoff Stereo 8 Ω, 1.5 W per channel speaker drivers Differential earpiece driver Stereo line-out Two audio analog-to-digital (ADC) channels: – 96-dBA SNR Four audio inputs: – Three differential microphone inputs – Stereo line-in/FM input Two vibrator/haptics feedback channels: – Differential H-bridge drivers Two low-noise analog microphone bias outputs Two digital microphone bias outputs Analog low-power loop from line-in to headphone/speaker outputs Dual phase-locked loops (PLLs) for flexible clock support: – 32-kHz sleep clock input for system low-power playback mode • • • • • • – 12-/19.2-/26-/38.4-MHz system clock input Accessory plug/unplug detection, accessory button press detection Integrated power supplies: – Negative charge pump for capless headphone driver – Two low dropout voltage regulators (LDOs) for high power supply rejection ratio (PSRR) 2 I C control Thermal protection: – Host interrupt Power supplies: – Analog: 2.1 V – Digital I/O: 1.8 V – Battery 2.3 to 5.5 V Package 6-mm × 6-mm 120-pin PBGA APPLICATIONS • • • Mobile and smart phones MP3 players Handheld devices 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. OMAP4 is a trademark of Texas Instruments. PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. Copyright © 2010–2011, Texas Instruments Incorporated PRODUCT PREVIEW Check for Samples: TWL6040 TWL6040 SWCS052A – AUGUST 2010 – REVISED DECEMBER 2011 www.ti.com DESCRIPTION The TWL6040 device is an audio coder/decoder (codec) with a high level of integration providing analog audio codec functions for portable applications, as shown in Figure 1. It contains multiple audio analog inputs and outputs, as well as microphone biases and accessory detection. It is connected to the OMAP4™ host processor through a proprietary PDM interface for audio data communication enabling partitioning with optimized power consumption and performance. Multichannel audio data is multiplexed to a single wire for downlink (PDML) and uplink (PDMUL). The OMAP4 device provides the TWL6040 device with five PDM audio-input channels (DL0–DL4). Channels DL0–DL3 are connected to four parallel DAC channels multiplexed to stereo headphone (HSL, HSR), stereo speaker (HFL, HFR), and earpiece (EAR) or stereo line outputs (AUXL, AUXR). The stereo headphone path has a low-power (LP) mode operating from a 32-kHz sleep clock to enable more than 100 hours of MP3 playback time. Very-high dynamic range of 104 dBA is achieved when using the system clock input and DAC path high-performance (HP) mode. Class-AB headphone drivers provide a 1-Vrms output and are ground centered for capless connection to headphone, thus enabling system size and cost reduction. The earpiece driver is a differential class-AB driver with 2 Vrms capability to a typical 32-Ω load or 1.4 Vrms to a typical 16-Ω load. PRODUCT PREVIEW Stereo speaker path has filterless class-D outputs with 1.5-W capability per channel. For output power maximization supply connection to an external boost is supported. Speaker drivers also support also hearing aid coil loads. For vibrator and haptic feedback support, the TWL6040 has two PWM channels with independent input signals from DL4 or inter-integrated circuit (I2C™). Vibrator drivers are differential H-bridge outputs, enabling fast acceleration and deceleration of vibrator motor. An external driver for a hearing aid coil or a piezo speaker requiring high voltage can be connected to line outputs. The TWL6040 supports three differential microphone inputs (MMIC, HMIC, SMIC) and a stereo line-input (AFML, AFMR) multiplexed to two parallel ADCs. The PDM output from the ADCs is transmitted to the OMAP4 processor through UL0 and UL1. AFML, AFMR inputs can also be looped to analog outputs (LB0, LB1). Two LDOs provide a voltage of 2.1 V to bias analog microphones (MBIAS and HBIAS). The maximum output current is 2 mA for each analog bias, allowing up to two microphones on one bias. Two LDOs provide a voltage of 1.8 V/1.85 V to bias digital microphones (DBIAS1 and DBIAS2). One bias generator can bias up several digital microphones at the same time, with a total maximum output current of 10 mA. The TWL6040 has an integrated negative charge pump (NCP) and two LDOs (HS LDO and LS LDO) for high PSRR. The only external supply needed is 2.1 V, which is available from the 2.1-V DC-DC of the TWL6030 power management IC (PMIC) in the OMAP4 system. By powering audio from low-noise 2.1-V DC-DC of low power consumption, high dynamic range and high output swing at headset output are achieved. All other supply inputs can be directly connected to battery or system 1.8-V I/O. Two integrated PLLs enable operatation from a 12/19.2/26/38.4-MHz system clock (MCLK) or, in LP playback mode, from a 32-kHz sleep clock (CLK32K). The frequency plan is based on a 48-kS/s audio data rate for all channels, and host processor uses sample-rate converters to interface with different sample rates (for example, 44.1 kHz). In the specific case of low-power audio playback, the 44.1-kS/s and 48-kS/s rates are supported by the TWL6040. Transitions between sample rates or input clocks are seamless. Accessory plug and unplug detections are submitting send/end signal to the terminal periodic accessory button press detection properties can be programmed according to supported (PLUGDET). Some headsets have a manual switch for through the microphone input pin. This feature is supported by a to minimize current consumption in sleep mode. Detection cycle system requirements. Figure 1 shows a simplified block diagram of the device. 2 Copyright © 2010–2011, Texas Instruments Incorporated TWL6040 SWCS052A – AUGUST 2010 – REVISED DECEMBER 2011 www.ti.com AAFL VDDAMBIAS HBIAS HMBIAS MBIAS HMICP HMICN 0:30 dB MMBIAS VDDUL Uplink VDDDMBIAS DBIAS1 MMICN ADCL 1 GNDAMIC MMICP MicAmpL VSSUL AAFR DMBIAS1 GNDDMIC MicAmpR ADCR 1 SMICP SMICN DBIAS2 DMBIAS2 0:30 dB LineInAmpR UL0 UL1 DL0 PDMUP PDMCLK PDM interface PDMCLKLB SDA SCL AFMR LineInAmpL DL1 DL2 LB0 AFML DL3 –18:24 dB DL4 PDMFRAME GPO1(2,3) LB1 EarDrv GNDVCM VDDEAR EARP Interface EARN –24:6 dB HSLDrv 2 I C registers PRODUCT PREVIEW PDMDN VSSEAR HSL PBKG 1 HSDACL –30:0 dB VDDV2V1 VDDLDO HSRDrv HSR LS LDO 1 HSDACR VDDDL –30:0 dB GNDLDO AUXLN CFLYP CFLYN Negative charge pump AUXRP Downlink AUXRN PGAL NCPOUT HFLDrv NCPFB VDDHFL HFLP Power REF REFP REFN VSSDL AUXLP VDDREGNCP GNDNCP VSSHS GNDHS HS LDO VSSLDOIN VSSLDO VDDHS 1 Reference temp sense HFLN HFDACL GNDHFL –52:6 dB PGAR GNDREF HFRDrv VDDHFR HFRP PLUGDET ACCONN VDDVIO Accessory connector detection 1 PDM to 1 PCM VDDPLL MCLK HFRN HFDACR 8 8 HP PLL PCM to PWM 8 CLK32K VSSPLL GNDHFR –52:6 dB VIBLDrv VDDVIBL VIBLP 1 VIBLN 1 GNDVIBL LP PLL Clock system 8 8 Osc 8 PCM to PWM VIBRDrv VDDVIBR VIBRP 1 1 VIBRN GNDVIBR SWCS044-001 Figure 1. Simplified Block Diagram Copyright © 2010–2011, Texas Instruments Incorporated 3 TWL6040 SWCS052A – AUGUST 2010 – REVISED DECEMBER 2011 www.ti.com space For the complete TWL60xx data sheet, contact your TI sales representative. The document is internally available for download on ESP under the corresponding TWL60xx product folders and can be shared with customers. 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PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2012 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Qty Drawing Eco Plan Lead/Ball Finish (2) MSL Peak Temp Samples (3) (Requires Login) TWL6040A2ZQZ ACTIVE BGA MICROSTAR JUNIOR ZQZ 120 250 Green (RoHS & no Sb/Br) SNAGCU Level-3-260C-168 HR TWL6040A2ZQZR ACTIVE BGA MICROSTAR JUNIOR ZQZ 120 2500 Green (RoHS & no Sb/Br) SNAGCU Level-3-260C-168 HR TWL6040A3SRSZQZ ACTIVE BGA MICROSTAR JUNIOR ZQZ 120 250 Green (RoHS & no Sb/Br) SNAGCU Level-3-260C-168 HR TWL6040A3SRSZQZR ACTIVE BGA MICROSTAR JUNIOR ZQZ 120 2500 Green (RoHS & no Sb/Br) SNAGCU Level-3-260C-168 HR TWL6040A3ZQZ ACTIVE BGA MICROSTAR JUNIOR ZQZ 120 250 Green (RoHS & no Sb/Br) SNAGCU Level-3-260C-168 HR TWL6040A3ZQZR ACTIVE BGA MICROSTAR JUNIOR ZQZ 120 2500 Green (RoHS & no Sb/Br) SNAGCU Level-3-260C-168 HR (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2012 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. 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