TI SN74LVC06A-Q1

SN74LVC06A-Q1
www.ti.com .................................................................................................................................................. SCAS761B – FEBRUARY 2004 – REVISED APRIL 2008
HEX INVERTER BUFFER/DRIVER
WITH OPEN-DRAIN OUTPUTS
FEATURES
1
•
•
•
•
•
•
D OR PW PACKAGE
(TOP VIEW)
Qualified for Automotive Applications
Operate From 1.65 V to 3.6 V
Inputs and Open-Drain Outputs Accept
Voltages up to 5.5 V
Max tpd of 3.7 ns at 3.3 V
Ioff Supports Partial-Power-Down Mode
Operation
Latch-Up Performance Exceeds 250 mA Per
JESD 17
1A
1Y
2A
2Y
3A
3Y
GND
1
14
2
13
3
12
4
11
5
10
6
7
9
8
VCC
6A
6Y
5A
5Y
4A
4Y
DESCRIPTION/ORDERING INFORMATION
This hex inverter buffer/driver is designed for 1.65-V to 3.6-V VCC operation.
The outputs of the SN74LVC06A device are open drain and can be connected to other open-drain outputs to
implement active-low wired-OR or active-high wired-AND functions. The maximum sink current is 24 mA.
Inputs can be driven from either 3.3-V or 5-V devices. This feature allows the use of this device as a translator in
a mixed 3.3-V/5-V system environment.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
ORDERING INFORMATION (1)
PACKAGE (2)
TA
–40°C to 125°C
(1)
(2)
ORDERABLE PART NUMBER
TOP-SIDE MARKING
SOIC – D
Reel of 2500
SN74LVC06AQDRQ1
LVC06AQ
TSSOP – PW
Reel of 2000
SN74LVC06AQPWRQ1
LVC06AQ
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
FUNCTION TABLE
(EACH INVERTER)
INPUT
A
OUTPUT
Y
H
L
L
H
LOGIC DIAGRAM, EACH INVERTER (POSITIVE LOGIC)
A
Y
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2004–2008, Texas Instruments Incorporated
SN74LVC06A-Q1
SCAS761B – FEBRUARY 2004 – REVISED APRIL 2008 .................................................................................................................................................. www.ti.com
Absolute Maximum Ratings (1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
VCC
Supply voltage range
–0.5
6.5
V
VI
Input voltage range (2)
–0.5
6.5
V
VO
Output voltage range
6.5
V
IIK
Input clamp current
VI < 0
–50
mA
IOK
Output clamp current
VO < 0
–50
mA
IO
Continuous output current
±50
mA
±100
mA
–0.5
Continuous current through VCC or GND
θJA
Package thermal impedance
Tstg
Storage temperature range
(1)
(2)
(3)
(3)
D package
86
PW package
113
–65
150
UNIT
°C/W
°C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.
The package thermal impedance is calculated in accordance with JESD 51-7.
Recommended Operating Conditions (1)
VCC
Supply voltage
VIH
High-level input voltage
Operating
Data retention only
VCC = 1.65 V to 1.95 V
MIN
MAX
1.65
3.6
1.5
Low-level input voltage
VI
Input voltage
VO
Output voltage
IOL
Low-level output current
TA
Operating free-air temperature
1.7
VCC = 2.7 V to 3.6 V
2
2
V
0.35 × VCC
VCC = 2.3 V to 2.7 V
0.7
VCC = 2.7 V to 3.6 V
0.8
V
0
5.5
V
0
5.5
V
VCC = 1.65 V
4
VCC = 2.3 V
8
VCC = 2.7 V
12
VCC = 3 V
(1)
V
0.65 × VCC
VCC = 2.3 V to 2.7 V
VCC = 1.65 V to 1.95 V
VIL
UNIT
mA
24
–40
125
°C
All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
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Copyright © 2004–2008, Texas Instruments Incorporated
Product Folder Link(s): SN74LVC06A-Q1
SN74LVC06A-Q1
www.ti.com .................................................................................................................................................. SCAS761B – FEBRUARY 2004 – REVISED APRIL 2008
Electrical Characteristics
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
IOL = 100 µA
VOL
II
ICC
ΔICC
Ci
(1)
MIN TYP (1)
VCC
MAX
1.65 V to 3.6 V
0.2
IOL = 4 mA
1.65 V
0.45
IOL = 8 mA
2.3 V
0.7
IOL = 12 mA
2.7 V
0.5
IOL = 24 mA
3V
0.65
UNIT
V
µA
VI = 5.5 V or GND
3.6 V
±5
VI = VCC or GND, IO = 0
3.6 V
10
µA
2.7 V to 3.6 V
1
mA
One input at VCC – 0.6 V, Other inputs at VCC or GND
VI = VCC or GND
3.3 V
5
pF
All typical values are at VCC = 3.3 V, TA = 25°C.
Switching Characteristics
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1)
PARAMETER
tpd
FROM
(INPUT)
TO
(OUTPUT)
A
Y
VCC = 2.7 V
MIN
VCC = 3.3 V
± 0.3 V
MAX
MIN
MAX
3.9
1
3.7
UNIT
ns
Operating Characteristics, TA = 25°C
PARAMETER
Cpd
Power dissipation capacitance per buffer/driver
TEST
CONDITIONS
VCC = 3.3 V
f = 10 MHz
2.5
TYP
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Copyright © 2004–2008, Texas Instruments Incorporated
Product Folder Link(s): SN74LVC06A-Q1
UNIT
pF
3
SN74LVC06A-Q1
SCAS761B – FEBRUARY 2004 – REVISED APRIL 2008 .................................................................................................................................................. www.ti.com
PARAMETER MEASUREMENT INFORMATION
(OPEN DRAIN)
VLOAD
S1
RL
From Output
Under Test
Open
TEST
GND
RL
CL
(see Note A)
S1
tPZL (see Notes E and F)
VLOAD
tPLZ (see Notes E and G)
VLOAD
tPHZ/tPZH
VLOAD
LOAD CIRCUIT
INPUT
VCC
VI
2.7 V
3.3 V ± 0.3 V
VM
tr/tf
≤ 2.5 ns
≤ 2.5 ns
2.7 V
2.7 V
1.5 V
1.5 V
VLOAD
6V
6V
CL
RL
V∆
50 pF
50 pF
500 Ω
500 Ω
0.3 V
0.3 V
VI
Timing Input
VM
0V
tw
tsu
th
VI
VM
Input
VM
VM
Data Input
VM
0V
0V
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VOLTAGE WAVEFORMS
PULSE DURATION
VI
VM
Input
VM
0V
Output
VM
VOL
tPHL
VM
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
tPLZ
VLOAD/2
VM
tPZH
VOH
Output
VM
0V
Output
Waveform 1
S1 at VLOAD
(see Note B)
tPLH
VM
VM
tPZL
VOH
VM
VI
Output
Control
tPHL
tPLH
VI
VOL + V∆
VOL
tPHZ
Output
Waveform 2
S1 at VLOAD
(see Note B)
VM
VLOAD/2 - V∆
VLOAD/2
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω.
D. The outputs are measured one at a time, with one transition per measurement.
E. Since this device has open-drain outputs, tPLZ and tPZL are the same as tpd.
F. tPZL is measured at VM.
G. tPLZ is measured at VOL + V∆.
H. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
4
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Copyright © 2004–2008, Texas Instruments Incorporated
Product Folder Link(s): SN74LVC06A-Q1
PACKAGE OPTION ADDENDUM
www.ti.com
17-Aug-2012
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LVC06AQDRQ1
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LVC06AQPWRG4Q1
ACTIVE
TSSOP
PW
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LVC06AQPWRQ1
ACTIVE
TSSOP
PW
14
Call TI
Samples
(Requires Login)
SN74LVC06AQDRG4Q1
TBD
(3)
Call TI
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN74LVC06A-Q1 :
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
17-Aug-2012
• Catalog: SN74LVC06A
• Enhanced Product: SN74LVC06A-EP
NOTE: Qualified Version Definitions:
• Catalog - TI's standard catalog product
• Enhanced Product - Supports Defense, Aerospace and Medical Applications
Addendum-Page 2
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