ROHM BA2902YFV-CE2

Operational Amplifier Series
Automotive Ground Sense
Operational Amplifiers
BA2904Yxxx-C, BA2902Yxx-C
●Key Specifications
 Wide operating supply voltage
Single supply :
Dual supply :
 Low supply current
BA2904Yxxx-C
BA2902Yxx-C
 Input bias current :
 Input offset current :
 Operating temperature range :
●General Description
BA2904Yxxx-C,BA2902Yxx-C integrate two or four
independent Op-Amps and ground sense input
Amplifier on a single chip. These Op-Amps have some
features of high-gain, low power consumption, and can
operate from +3V to +36V (single power supply ).
BA2904Yxxx-C, BA2902Yxx-C are manufactured for
automotive requirements of engine control unit, electric
power steering, and so on.
●Features
 AEC-Q100 Qualified
 Single or dual power supply operation
 Wide operating supply voltage
 Standard Op-Amp Pin-assignments
 Common-mode Input Voltage Range includes ground
level, allowing direct ground sensing
 Low supply current
 High open loop voltage gain
 Internal ESD protection circuit
 Wide temperature range
●Packages
SOP8
SOP14
SSOP-B8
SSOP-B14
MSOP8
+3.0V to +36V
±1.5V to ±18V
0.5mA(Typ.)
0.7mA(Typ.)
20nA(Typ.)
2nA(Typ.)
-40℃ to +125℃
W(Typ.) x D(Typ.) x (Max.)
5.00mm x 6.20mm x 1.71mm
8.70mm x 6.20mm x 1.71mm
3.00mm x 6.40mm x 1.35mm
5.00mm x 6.40mm x 1.35mm
2.90mm x 4.00mm x 0.90mm
●Application
 Engine Control Unit
 Electric Power Steering (EPS)
 Anti-Lock Braking System (ABS)
 Automotive electronics
●Selection Guide
Maximum operating temperature
Output current
Source/Sink
Automotive
supply current
+125°C
Dual
30mA / 20mA
0.5mA
BA2904YF-C
BA2904YFV-C
BA2904YFVM-C
Quad
30mA / 20mA
0.7mA
BA2902YF-C
BA2902YFV-C
○Product structure:Silicon monolithic integrated circuit
○This product is not designed protection against radioactive rays.
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TSZ02201-0RAR1G200110-1-2
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Datasheet
BA2904Yxxx-C, BA2902Yxx-C
●Simplified schematic
VCC
- IN
OUT
+ IN
VEE
Figure 1. Simplified schematic (one channel only)
●Pin Configuration
BA2904YF-C : SOP8
BA2904YFV-C : SSOP-B8
BA2904YFVM-C : MSOP8
OUT1 1
2
-IN1
+IN1
3
VEE
4
CH1
- +
Pin No.
Symbol
1
OUT1
8 VCC
2
-IN1
7 OUT2
3
+IN1
4
VEE
5
+IN2
6 -IN2
CH2
+ -
6
-IN2
7
OUT2
8
VCC
Pin No.
Symbol
1
OUT1
5 +IN2
BA2902YF-C : SOP14
BA2902YFV-C : SSOP-B14
OUT1 1
-IN1 2
2
-IN1
3
+IN1
13 -IN4
4
VCC
12 +IN4
5
+IN2
6
-IN2
7
OUT2
14 OUT4
CH1
- +
CH4
+ -
+IN1 3
VCC 4
11 VEE
5
10 +IN3
+IN2
-IN2 6
OUT2 7
- +
CH2
+ CH3
8
OUT3
9 -IN3
9
-IN3
8 OUT3
10
+IN3
11
VEE
12
+IN4
13
-IN4
14
OUT4
Package
SOP8
SSOP-B8
MSOP8
SOP14
SSOP-B14
BA2904YF-C
BA2904YFV-C
BA2904YFVM-C
BA2902YF-C
BA2902YFV-C
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Datasheet
BA2904Yxxx-C, BA2902Yxx-C
●Ordering Information
B
A
2
9
0
x
Y
x
x
x
-
Packaging and forming specification
C : Automotive(Engine control unit、EPS、
ABS, and so on)
E2: Embossed tape and reel
Package
F
: SOP8
SOP14
FV : SSOP-B8
SSOP-B14
FVM : MSOP8
Parts Number.
BA2904Yxxx
BA2902Yxx
Cxx
(SOP8/SOP14/SSOP-B8/SSOP-B14)
TR: Embossed tape and reel
(MSOP8)
●Line-up
Topr
Supply voltage
Number of
channels
Dual
-40°C to +125°C
+3 to +36V
Quad
Package
Orderable Parts Number
SOP8
Reel of 2500
BA2904YF-CE2
SSOP-B8
Reel of 2500
BA2904YFV-CE2
MSOP8
Reel of 3000
BA2904YFVM-CTR
SOP14
Reel of 2500
BA2902YF-CE2
SSOP-B14
Reel of 2500
BA2902YFV-CE2
●Absolute Maximum Ratings(Ta=25℃)
Parameter
Symbol
Supply Voltage
Power Dissipation
VCC-VEE
Pd
Differential Input Voltage *7
Ratings
Unit
+36
V
*1*6
SOP8
775
SSOP-B8
625*2*6
MSOP8
600*3*6
mW
*4*6
SOP14
560
SSOP-B14
870*5*6
Vid
+36
V
Input Common-mode Voltage Range
Vicm
V
Operating Supply Voltage
Vopr
Operating Temperature Range
Topr
(VEE-0.3) to (VEE+36)
+3.0 to +36
(±1.5 to ±18)
-40 to +125
℃
Storage Temperature Range
Tstg
-55 to +150
℃
Tjmax
+150
℃
Maximum Junction Temperature
V
Note: Absolute maximum rating item indicates the condition which must not be exceeded.
Application if voltage in excess of absolute maximum rating or use out of absolute maximum rated temperature
environment may cause deterioration of characteristics.
*1 To use at temperature above Ta=25℃ reduce 6.2mW/℃.
*2 To use at temperature above Ta=25℃ reduce 5.0mW/℃.
*3 To use at temperature above Ta=25℃ reduce 4.8mW/℃.
*4 To use at temperature above Ta=25℃ reduce 4.5mW/℃.
*5 To use at temperature above Ta=25℃ reduce 7.0mW/℃.
*6 Mounted on a FR4 glass epoxy PCB(70mm×70mm×1.6mm).
*7 The voltage difference between inverting input and non-inverting input is the differential input voltage.
Then input terminal voltage is set to more than VEE.
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TSZ02201-0RAR1G200110-1-2
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Datasheet
BA2904Yxxx-C, BA2902Yxx-C
●Electrical Characteristics
○BA2904Yxxx-C (Unless otherwise specified VCC=+5V, VEE=0V)
Parameter
Input Offset Voltage *8
Input Offset Current *8
Input Bias Current *8
Symbol
Temperature
Range
25℃
Limits
Unit
Min.
Typ.
Max.
-
2
4
Vio
OUT=1.4V
mV
Full range
-
-
4
25℃
-
2
50
Full range
-
-
50
25℃
-
20
60
Full range
-
-
100
25℃
-
0.5
1.2
Full range
-
-
1.2
25℃
3.5
-
-
3.2
-
-
27
28
-
Full range
-
5
20
25℃
25
100
-
Iio
Ib
Supply Current
Conditions
ICC
VCC=5 to 30V,OUT=1.4V
nA
OUT=1.4V
nA
OUT=1.4V
mA
RL=∞,All Op-Amps
RL=2kΩ
Maximum Output
Voltage (High)
VOH
V
Full range
Maximum Output Voltage(Low)
Large Signal Voltage Gain
Input Common-mode
Voltage range
VOL
Av
Full range
25
-
-
25℃
0
-
VCC-1.5
Full range
0
-
VCC-2.0
Vicm
VCC=30V,RL=10kΩ
mV
RL=∞,All Op-Amps
V/mV
RL≧2kΩ,VCC=15V
OUT=1.4 to 11.4V
V
(VCC-VEE)=5V,
OUT=VEE+1.4V
Common-mode Rejection
Ratio
CMRR
25℃
65
80
-
dB
OUT=1.4V
Power Supply Rejection Ratio
PSRR
25℃
65
100
-
dB
VCC=5~30V
Output Source Current *9
25℃
20
30
-
Isource
mA
VIN+=1V,VIN-=0V
OUT=0V
1CH is short circuit
mA
VIN+=0V,VIN-=1V
OUT=5V
1CH is short circuit
Output Sink Current
*9
Slew Rate
Gain bandwidth product
Channel Separation
Full range
10
-
-
25℃
10
20
-
Full range
2
-
-
25℃
12
40
-
SR
25℃
-
0.2
-
GBW
25℃
-
0.5
-
CS
25℃
-
120
-
Isink
VIN+=0V,VIN-=1V
OUT=200mV
VCC=15V, Av=0dB
V/μs
RL=2kΩ, CL=100pF
VCC=30V, RL=2kΩ
MHz
CL=100pF
μA
dB
f=1kHz, input referred
*8 Absolute value
*9 Under high temperatures, please consider the power dissipation when selecting the output current.
When the output terminal is continuously shorted the output current reduces the internal temperature by flushing.
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TSZ02201-0RAR1G200110-1-2
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Datasheet
BA2904Yxxx-C, BA2902Yxx-C
●Electrical Characteristics
○BA2902Yxx-C (Unless otherwise specified VCC=+5V, VEE=0V)
Parameter
Input Offset Voltage *10
Input Offset Current *10
Input Bias Current *10
Supply Current
Symbol
Temperature
Range
25℃
Limits
Unit
Min.
Typ.
Max.
-
2
4
Vio
Conditions
OUT=1.4V
mV
Full range
-
-
4
25℃
-
2
50
Full range
-
-
50
25℃
-
20
60
Full range
-
-
100
25℃
-
0.7
2
Full range
-
-
3
25℃
3.5
-
-
3.2
-
-
27
28
-
Full range
-
5
20
25℃
25
100
-
Iio
Ib
ICC
VCC=5 to 30V,OUT=1.4V
nA
OUT=1.4V
nA
OUT=1.4V
mA
RL=∞,All Op-Amps
RL=2kΩ
Maximum Output
Voltage (High)
VOH
V
Full range
Maximum Output Voltage(Low)
Large Signal Voltage Gain
Input Common-mode
Voltage range
VOL
Av
Full range
25
-
-
25℃
0
-
VCC-1.5
Full range
0
-
VCC-2.0
Vicm
VCC=30V,RL=10kΩ
mV
RL=∞,All Op-Amps
V/mV
RL≧2kΩ,VCC=15V
OUT=1.4 to 11.4V
V
(VCC-VEE)=5V,
OUT=VEE+1.4V
Common-mode Rejection
Ratio
CMRR
25℃
65
80
-
dB
OUT=1.4V
Power Supply Rejection Ratio
PSRR
25℃
65
100
-
dB
VCC=5~30V
Output Source Current *11
25℃
20
30
-
Isource
mA
VIN+=1V,VIN-=0V
OUT=0V
1CH is short circuit
mA
VIN+=0V,VIN-=1V
OUT=5V
1CH is short circuit
Output Sink Current
*11
Slew Rate
Gain bandwidth product
Channel Separation
Full range
10
-
-
25℃
10
20
-
Full range
2
-
-
25℃
12
40
-
SR
25℃
-
0.2
-
GBW
25℃
-
0.5
-
CS
25℃
-
120
-
Isink
VIN+=0V,VIN-=1V
OUT=200mV
VCC=15V, Av=0dB
V/μs
RL=2kΩ, CL=100pF
VCC=30V, RL=2kΩ
MHz
CL=100pF
μA
dB
f=1kHz, input referred
*10 Absolute value
*11 Under high temperatures, please consider the power dissipation when selecting the output current.
When the output terminal is continuously shorted the output current reduces the internal temperature by flushing.
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TSZ02201-0RAR1G200110-1-2
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Datasheet
BA2904Yxxx-C, BA2902Yxx-C
Description of Electrical Characteristics
Described below are descriptions of the relevant electrical terms used in this datasheet. Items and symbols used are also
shown. Note that item name and symbol and their meaning may differ from those on another manufacturer’s document or
general document.
1. Absolute maximum ratings
Absolute maximum rating items indicate the condition which must not be exceeded. Application of voltage in excess of absolute
maximum rating or use out of absolute maximum rated temperature environment may cause deterioration of characteristics.
1.1 Power supply voltage (VCC-VEE)
Indicates the maximum voltage that can be applied between the positive power supply terminal and negative power
supply terminal without deterioration or destruction of characteristics of internal circuit.
1.2 Differential input voltage (Vid)
Indicates the maximum voltage that can be applied between non-inverting and inverting terminals without damaging
the IC.
1.3 Input common-mode voltage range (Vicm)
Indicates the maximum voltage that can be applied to the non-inverting and inverting terminals without deterioration
or destruction of electrical characteristics. Input common-mode voltage range of the maximum ratings does not assure
normal operation of IC. For normal operation, use the IC within the input common-mode voltage range characteristics.
1.4 Operating and storage temperature ranges (Topr,Tstg)
The operating temperature range indicates the temperature range within which the IC can operate. The higher the
ambient temperature, the lower the power consumption of the IC. The storage temperature range denotes the range
of temperatures the IC can be stored under without causing excessive deterioration of the electrical characteristics.
1.5 Power dissipation (Pd)
Indicates the power that can be consumed by the IC when mounted on a specific board at the ambient temperature 25℃
(normal temperature). As for package product, Pd is determined by the temperature that can be permitted by the IC in
the package (maximum junction temperature) and the thermal resistance of the package.
2. Electrical characteristics
2.1 Input offset voltage (Vio)
Indicates the voltage difference between non-inverting terminal and inverting terminals. It can be translated into the
input voltage difference required for setting the output voltage at 0 V.
2.2 Input offset current (Iio)
Indicates the difference of input bias current between the non-inverting and inverting terminals.
2.3 Input bias current (Ib)
Indicates the current that flows into or out of the input terminal. It is defined by the average of input bias currents at
the non-inverting and inverting terminals.
2.4 Circuit current (ICC)
Indicates the current that flows within the IC under specified no-load conditions.
2.5 Maximum output voltage (High) / Maximum output voltage (low) (VOH/VOL)
Indicates the voltage range of the output under specified load condition. It is typically divided into high-level output
voltage and low-level output voltage. High-level output voltage indicates the upper limit of output voltage while
Low-level output voltage indicates the lower limit.
2.6 Large signal voltage gain (Av)
Indicates the amplifying rate (gain) of output voltage against the voltage difference between non-inverting terminal
and inverting terminal. It is normally the amplifying rate (gain) with reference to DC voltage.
Av = (Output voltage) / (Differential Input voltage)
2.7 Input common-mode voltage range (Vicm)
Indicates the input voltage range where IC normally operates.
2.8 Common-mode rejection ratio (CMRR)
Indicates the ratio of fluctuation of input offset voltage when the input common mode voltage is changed. It is
normally the fluctuation of DC.
CMRR = (Change of Input common-mode voltage)/(Input offset fluctuation)
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TSZ02201-0RAR1G200110-1-2
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Datasheet
BA2904Yxxx-C, BA2902Yxx-C
2.9 Power supply rejection ratio (PSRR)
Indicates the ratio of fluctuation of input offset voltage when supply voltage is changed. It is normally the fluctuation of
DC.
PSRR= (Change of power supply voltage)/(Input offset fluctuation)
2.10 Output source current/ output sink current (Isource/Isink)
The maximum current that can be output from the IC under specific output conditions. The output source current
indicates the current flowing out from the IC, and the output sink current indicates the current flowing into the IC.
2.11 Slew rate (SR)
Indicates the ratio of the change in output voltage with time when a step input signal is applied.
2.12 Gain Band Width (GBW)
The product of the open-loop voltage gain and the frequency at which the voltage gain decreases 6dB/octave.
2.13 Channel separation (CS)
Indicates the fluctuation in the output voltage of the driven channel with reference to the change of output voltage of
the channel which is not driven.
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Datasheet
BA2904Yxxx-C, BA2902Yxx-C
●Typical Performance Curves
○BA2904Yxxx-C
1000
1.0
SUPPLY CURRENT [mA]
POWER DISSIPATION [mW]
BA2904YF-C
800
BA2904YFV-C
600
BA2904YFVM-C
400
200
0
0
25
50
75
100
125
0.8
0.6
-40℃
0.4
25℃
125℃
0.2
0.0
150
0
AMBIENT TEMPERATURE [℃]
10
20
30
40
SUPPLY VOLTAGE [V]
Figure 3.
Supply Current – Supply Voltage
.
Figure 2.
Derating Curve
MAXIMUM OUTPUT VOLTAGE [V]
SUPPLY CURRENT [mA]
1.0
0.8
0.6
32V
32V
36V
5V
0.4
3V
0.2
0.0
-50 -25
0
25
50
75
40
30
-40℃
20
125℃
25℃
10
0
100 125 150
AMBIENT TEMPERATURE [℃]
20
30
40
Figure 5.
Maximum Output Voltage – Supply Voltage
(RL=10kΩ)
typical sample, it is not guaranteed.
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TSZ22111・15・001
10
SUPPLY VOLTAGE [V]
Figure 4.
Supply Current – Ambient Temperature
(*)The above data is measurement value of
0
8/27
TSZ02201-0RAR1G200110-1-2
21.Jan.2013 Rev.002
Datasheet
BA2904Yxxx-C, BA2902Yxx-C
5
OUTPUT SOURCE CURRENT [mA]
MAXIMUM OUTPUT VOLTAGE [V]
.
○BA2904Yxxx-C
4
3
2
1
0
-50 -25
0
25
50
50
-40℃
40
25℃
30
20
125℃
10
0
75 100 125 150
0
AMBIENT TEMPERATURE [℃]
2
3
4
5
OUTPUT VOLTAGE [V]
Figure 6.
Maximum Output Voltage – Ambient Temperature
(VCC=5V, RL=2kΩ)
Figure 7.
Output Source Current – Output Voltage
(VCC=5V)
100
50
OUTPUT SINK CURRENT [mA]
OUTPUT SOURCE CURRENT [mA]
1
40
3V
5V
30
15V
20
10
10
125℃
1
-40℃
0.1
25℃
0.01
0.001
0
-50 -25
0
25
50
75
0
100 125 150
1.2
1.6
2
Figure 9.
Output Sink Current – Output Voltage
(VCC=5V)
Figure 8.
Output Source Current – Ambient Temperature
(OUT=0V)
typical sample, it is not guaranteed.
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TSZ22111・15・001
0.8
OUTPUT VOLTAGE [V]
AMBIENT TEMPERATURE [℃]
(*)The above data is measurement value of
0.4
9/27
TSZ02201-0RAR1G200110-1-2
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Datasheet
BA2904Yxxx-C, BA2902Yxx-C
○BA2904Yxxx-C
LOW-LEVEL SINK CURRENT [μA]
OUTPUT SINK CURRENT [mA]
30
15V
20
5V
3V
10
0
-50 -25
0
25
50
75
80
70
-40℃
25℃
60
50
40
125℃
30
20
10
0
100 125 150
0
5
AMBIENT TEMPERATURE [℃]
15
20
25
30
35
SUPPLY VOLTAGE [V]
Figure 11.
Low Level Sink Current – Supply Voltage
(OUT=0.2V)
Figure 10.
Output Sink Current – Ambient Temperature
(OUT=VCC)
8
80
70
INPUT OFFSET VOLTAGE [mV]
LOW-LEVEL SINK CURRENT [μA]
10
32V
32V
36V
60
5V
50
40
3V
30
20
10
6
4
-40℃
25℃
2
0
125℃
-2
-4
-6
-8
0
-50 -25
0
25
50
75
0
100 125 150
Figure 12.
Low Level Sink Current – Ambient Temperature
(OUT=0.2V)
15
20
25
30
35
Figure 13.
Input Offset Voltage – Supply Voltage
(Vicm=0V, OUT=1.4V)
typical sample, it is not guaranteed.
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TSZ22111・15・001
10
SUPPLY VOLTAGE [V]
AMBIENT TEMPERATURE [℃]
(*)The above data is measurement value of
5
10/27
TSZ02201-0RAR1G200110-1-2
21.Jan.2013 Rev.002
Datasheet
BA2904Yxxx-C, BA2902Yxx-C
○BA2904Yxxx-C
50
6
INPUT BIAS CURRENT [nA]
INPUT OFFSET VOLTAGE [mV]
8
4
2
3V
0
5V
32V
32V
36V
-2
-4
-6
40
30
25℃
-40℃
20
10
125℃
0
-8
-50 -25
0
25
50
75
0
100 125 150
5
15
20
25
30
35
SUPPLY VOLTAGE [V]
AMBIENT TEMPERATURE [℃]
Figure 15.
Input Bias Current – Supply Voltage
(Vicm=0V, OUT=1.4V)
Figure 14.
Input Offset Voltage – Ambient Temperature
(Vicm=0V, OUT=1.4V)
50
INPUT BIAS CURRENT [nA]
50
INPUT BIAS CURRENT [nA]
10
40
30
32V
32V
36V
20
3V
5V
10
40
30
20
10
0
-10
0
-50 -25
0
25
50
75
100 125 150
25
50
75
100 125 150
Figure 17.
Input Bias Current – Ambient Temperature
(VCC=30V, Vicm=28V, OUT=1.4V)
Figure 16.
Input Bias Current – Ambient Temperature
(Vicm=0V, OUT=1.4V)
typical sample, it is not guaranteed.
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TSZ22111・15・001
0
AMBIENT TEMPERATURE [℃]
AMBIENT TEMPERATURE [℃]
(*)The above data is measurement value of
-50 -25
11/27
TSZ02201-0RAR1G200110-1-2
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Datasheet
BA2904Yxxx-C, BA2902Yxx-C
○BA2904Yxxx-C
10
INPUT OFFSET CURRENT [nA]
INPUT OFFSET VOLTAGE [mV]
8
6
-40℃
4
125℃
25℃
2
0
-2
-4
-6
-8
5
-40℃
0
125℃
-5
-10
-1
0
1
2
3
4
5
0
5
10
20
25
30
35
Figure 19.
Input Offset Current – Supply Voltage
(Vicm=0V, OUT=1.4V)
Figure 18.
Input Offset Voltage – Input Voltage
(VCC=5V)
LARGE SIGNAL VOLTAGE GAIN
[dB]
10
5
3V
0
5V
15
SUPPLY VOLTAGE [V]
INPUT VOLTAGE [V]
INPUT OFFSET CURRENT [nA]
25℃
32V
32V
36V
-5
140
130
-40℃
120
25℃
110
100
125℃
90
80
70
60
-10
-50 -25
0
25
50
75
100 125 150
8
10
12
14
16
Figure 21.
Large Signal Voltage Gain – Supply Voltage
(RL=2kΩ)
Figure 20.
Input Offset Current – Ambient Temperature
(Vicm=0V, OUT=1.4V)
typical sample, it is not guaranteed.
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TSZ22111・15・001
6
SUPPLY VOLTAGE [V]
AMBIENT TEMPERATURE [℃]
(*)The above data is measurement value of
4
12/27
TSZ02201-0RAR1G200110-1-2
21.Jan.2013 Rev.002
Datasheet
BA2904Yxxx-C, BA2902Yxx-C
○BA2904Yxxx-C
140
COMMON MODE REJECTION RATIO
[dB]
LARGE SIGNAL VOLTAGE GAIN
[dB]
140
130
120
15V
120
110
-40℃
100
5V
100
90
80
70
60
-50 -25
0
25
50
75 100 125 150
125℃
80
60
40
0
10
AMBIENT TEMPERATURE [℃]
100
5V
3V
60
40
-50 -25
0
25
50
75
100 125 150
POWER SUPPLY REJECTION RATIO
[dB]
32V
32V
36V
80
AMBIENT TEMPERATURE [℃]
140
130
120
110
100
90
80
70
60
-50 -25
0
25
50
75
100 125 150
Figure 25.
Power Supply Rejection Ratio
– Ambient Temperature
typical sample, it is not guaranteed.
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TSZ22111・15・001
40
AMBIENT TEMPERATURE [℃]
Figure 24.
Common Mode Rejection Ratio
– Ambient Temperature
(*)The above data is measurement value of
30
Figure 23.
Common Mode Rejection Ratio
– Supply Voltage
140
120
20
SUPPLY VOLTAGE [V]
Figure 22.
Large Signal Voltage Gain – Ambient Temperature
(RL=2kΩ)
COMMON MODE REJECTION RATIO
[dB]
25℃
13/27
TSZ02201-0RAR1G200110-1-2
21.Jan.2013 Rev.002
Datasheet
BA2904Yxxx-C, BA2902Yxx-C
○BA2902Yxx-C
2.0
SUPPLY CURRENT [mA]
POWER DISSIPATION [mW]
1000
800
BA2902YF-C
BA2902YFV-C
600
400
200
0
0
25
50
75
100
125
150
1.6
1.2
-40℃
0.8
125℃
25℃
0.4
0.0
0
AMBIENT TEMPERATURE [℃]
10
20
30
40
SUPPLY VOLTAGE [V]
Figure 27.
Supply Current – Supply Voltage
.
Figure 26.
Derating Curve
MAXIMUM OUTPUT VOLTAGE [V]
SUPPLY CURRENT [mA]
2.0
1.6
1.2
5V
32V
32V
36V
0.8
3V
0.4
0.0
-50
0
50
100
40
30
-40℃
20
125℃
25℃
10
150
Figure 28.
Supply Current – Ambient Temperature
10
20
30
40
Figure 29.
Maximum Output Voltage – Supply Voltage
(RL=10kΩ)
typical sample, it is not guaranteed.
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TSZ22111・15・001
0
SUPPLY VOLTAGE [V]
AMBIENT TEMPERATURE [℃]
(*)The above data is measurement value of
0
14/27
TSZ02201-0RAR1G200110-1-2
21.Jan.2013 Rev.002
Datasheet
BA2904Yxxx-C, BA2902Yxx-C
5
OUTPUT SOURCE CURRENT [mA]
MAXIMUM OUTPUT VOLTAGE [V]
.
○BA2902Yxx-C
4
3
2
1
0
-50 -25
0
25
50
50
-40℃
40
25℃
30
20
125℃
10
0
75 100 125 150
0
AMBIENT TEMPERATURE [℃]
2
3
4
5
OUTPUT VOLTAGE [V]
Figure 30.
Maximum Output Voltage – Ambient Temperature
(VCC=5V, RL=2kΩ)
Figure 31.
Output Source Current – Output Voltage
(VCC=5V)
100
50
OUTPUT SINK CURRENT [mA]
OUTPUT SOURCE CURRENT [mA]
1
40
3V
5V
30
15V
20
10
10
125℃
1
-40℃
0.1
25℃
0.01
0.001
0
-50 -25
0
25
50
75
0
100 125 150
1.2
1.6
2
Figure 33.
Output Sink Current – Output Voltage
(VCC=5V)
Figure 32.
Output Source Current – Ambient Temperature
(OUT=0V)
typical sample, it is not guaranteed.
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TSZ22111・15・001
0.8
OUTPUT VOLTAGE [V]
AMBIENT TEMPERATURE [℃]
(*)The above data is measurement value of
0.4
15/27
TSZ02201-0RAR1G200110-1-2
21.Jan.2013 Rev.002
Datasheet
BA2904Yxxx-C, BA2902Yxx-C
○BA2902Yxx-C
LOW-LEVEL SINK CURRENT [μA]
OUTPUT SINK CURRENT [mA]
30
15V
20
5V
3V
10
0
-50 -25
0
25
50
75
80
70
-40℃
25℃
60
50
40
125℃
30
20
10
0
100 125 150
0
5
AMBIENT TEMPERATURE [℃]
15
20
25
30
35
SUPPLY VOLTAGE [V]
Figure 35.
Low Level Sink Current – Supply Voltage
(OUT=0.2V)
Figure 34.
Output Sink Current – Ambient Temperature
(OUT=VCC)
8
80
70
INPUT OFFSET VOLTAGE [mV]
LOW-LEVEL SINK CURRENT [μA]
10
32V
36V
60
5V
50
40
3V
30
20
10
6
4
-40℃
25℃
2
0
125℃
-2
-4
-6
-8
0
-50 -25
0
25
50
75
0
100 125 150
Figure 36.
Low Level Sink Current – Ambient Temperature
(OUT=0.2V)
15
20
25
30
35
Figure 37.
Input Offset Voltage – Supply Voltage
(Vicm=0V, OUT=1.4V)
typical sample, it is not guaranteed.
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TSZ22111・15・001
10
SUPPLY VOLTAGE [V]
AMBIENT TEMPERATURE [℃]
(*)The above data is measurement value of
5
16/27
TSZ02201-0RAR1G200110-1-2
21.Jan.2013 Rev.002
Datasheet
BA2904Yxxx-C, BA2902Yxx-C
○BA2902Yxx-C
50
6
INPUT BIAS CURRENT [nA]
INPUT OFFSET VOLTAGE [mV]
8
4
2
3V
0
5V
32V
32V
36V
-2
-4
-6
40
30
25℃
-40℃
20
10
125℃
0
-8
-50 -25
0
25
50
75
0
100 125 150
5
15
20
25
30
35
SUPPLY VOLTAGE [V]
AMBIENT TEMPERATURE [℃]
Figure 39.
Input Bias Current – Supply Voltage
(Vicm=0V, OUT=1.4V)
Figure 38.
Input Offset Voltage – Ambient Temperature
(Vicm=0V, OUT=1.4V)
50
INPUT BIAS CURRENT [nA]
50
INPUT BIAS CURRENT [nA]
10
40
30
32V
32V
36V
20
3V
5V
10
40
30
20
10
0
-10
0
-50 -25
0
25
50
75
100 125 150
25
50
75
100 125 150
Figure 41.
Input Bias Current – Ambient Temperature
(VCC=30V, Vicm=28V, OUT=1.4V)
Figure 40.
Input Bias Current – Ambient Temperature
(Vicm=0V, OUT=1.4V)
typical sample, it is not guaranteed.
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TSZ22111・15・001
0
AMBIENT TEMPERATURE [℃]
AMBIENT TEMPERATURE [℃]
(*)The above data is measurement value of
-50 -25
17/27
TSZ02201-0RAR1G200110-1-2
21.Jan.2013 Rev.002
Datasheet
BA2904Yxxx-C, BA2902Yxx-C
○BA2902Yxx-C
10
INPUT OFFSET CURRENT [nA]
INPUT OFFSET VOLTAGE [mV]
8
6
-40℃
4
125℃
25℃
2
0
-2
-4
-6
-8
5
-40℃
0
125℃
-5
-10
-1
0
1
2
3
4
5
0
5
10
INPUT VOLTAGE [V]
20
25
30
35
Figure 43.
Input Offset Current – Supply Voltage
(Vicm=0V, OUT=1.4V)
LARGE SIGNAL VOLTAGE GAIN
[dB]
10
5
3V
0
5V
15
SUPPLY VOLTAGE [V]
Figure 42.
Input Offset Voltage – Input Voltage
(VCC=5V)
INPUT OFFSET CURRENT [nA]
25℃
32V
32V
36V
-5
140
130
-40℃
120
25℃
110
100
125℃
90
80
70
60
-10
-50 -25
0
25
50
75
100 125 150
8
10
12
14
16
Figure 45.
Large Signal Voltage Gain – Supply Voltage
(RL=2kΩ)
Figure 44.
Input Offset Current – Ambient Temperature
(Vicm=0V, OUT=1.4V)
typical sample, it is not guaranteed.
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TSZ22111・15・001
6
SUPPLY VOLTAGE [V]
AMBIENT TEMPERATURE [℃]
(*)The above data is measurement value of
4
18/27
TSZ02201-0RAR1G200110-1-2
21.Jan.2013 Rev.002
Datasheet
BA2904Yxxx-C, BA2902Yxx-C
○BA2902Yxx-C
140
COMMON MODE REJECTION RATIO
[dB]
LARGE SIGNAL VOLTAGE GAIN
[dB]
140
130
120
15V
120
110
-40℃
100
5V
100
90
80
70
60
-50 -25
0
25
50
75 100 125 150
125℃
80
60
40
0
10
AMBIENT TEMPERATURE [℃]
100
5V
3V
60
40
-50 -25
0
25
50
75
100 125 150
POWER SUPPLY REJECTION RATIO
[dB]
32V
32V
36V
80
AMBIENT TEMPERATURE [℃]
140
130
120
110
100
90
80
70
60
-50 -25
0
25
50
75
100 125 150
Figure 49.
Power Supply Rejection Ratio
– Ambient Temperature
typical sample, it is not guaranteed.
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TSZ22111・15・001
40
AMBIENT TEMPERATURE [℃]
Figure 48.
Common Mode Rejection Ratio
– Ambient Temperature
(*)The above data is measurement value of
30
Figure 47.
Common Mode Rejection Ratio
– Supply Voltage
140
120
20
SUPPLY VOLTAGE [V]
Figure 46.
Large Signal Voltage Gain – Ambient Temperature
(RL=2kΩ)
COMMON MODE REJECTION RATIO
[dB]
25℃
19/27
TSZ02201-0RAR1G200110-1-2
21.Jan.2013 Rev.002
Datasheet
BA2904Yxxx-C, BA2902Yxx-C
●Power Dissipation
Power dissipation (total loss) indicates the power that the IC can consume at Ta=25°C (normal temperature). As the IC
consumes power, it heats up, causing its temperature to be higher than the ambient temperature. The allowable
temperature that the IC can accept is limited. This depends on the circuit configuration, manufacturing process, and
consumable power.
Power dissipation is determined by the allowable temperature within the IC (maximum junction temperature) and the
thermal resistance of the package used (heat dissipation capability). Maximum junction temperature is typically equal to the
maximum storage temperature. The heat generated through the consumption of power by the IC radiates from the mold
resin or lead frame of the package. Thermal resistance, represented by the symbol θja°C/W, indicates this heat dissipation
capability. Similarly, the temperature of an IC inside its package can be estimated by thermal resistance.
Figure 50. (a) shows the model of the thermal resistance of the package. The equation below shows how to compute for the
Thermal resistance (θja), given the ambient temperature (Ta), junction temperature (Tj), and power dissipation (Pd).
θja = (Tjmax - Ta) / Pd
℃/W
・・・・・
(Ⅰ)
The Derating curve in Figure 50. (b) indicates the power that the IC can consume with reference to ambient temperature.
Power consumption of the IC begins to attenuate at certain temperatures. This gradient is determined by Thermal
resistance (θja), which depends on the chip size, power consumption, package, ambient temperature, package condition,
wind velocity, etc. This may also vary even when the same of package is used. Thermal reduction curve indicates a
reference value measured at a specified condition. Figure 51. (c),(d) shows an example of the derating curve for
BA2904Yxxx-C, BA2902Yxx-C.
LSIの 消 費
力 [W]
Power dissipation
of電LSI
Pd (max)
θja = ( Tjmax - Ta) / Pd
Ambient temperature
℃ /W
θja2 < θja1
P2
Ta ℃
θ' ja2
P1
θ ja2
Tj ' (max) Tj (max)
θ' ja1
Chip surface temperature Tj [℃]
0
25
50
θ ja1
75
100
125
150
周 囲 温 度 Ta [℃ ]
Ambient temperature
Power dissipation Pd[W]
(b) Derating curve
(a) Thermal resistance
Figure 50. Thermal resistance and derating
1000
1000
POWER DISSIPATION [mW]
POWER DISSIPATION [mW]
BA2904YF-C(12)
800
BA2904YFV-C(13)
600
BA2904YFVM-C(14)
400
200
0
BA2902YFV-C(15)
800
600
BA2902YF-C(16)
400
200
0
0
25
50
75
100
125
150
0
AMBIENT TEMPERATURE [℃]
25
50
75
100
125
150
AMBIENT TEMPERATURE [℃]
(c) BA2904Yxxx-C
(d) BA2902Yxx-C
(12)
(13)
(14)
(15)
(16)
Unit
6.2
5.0
4.8
7.0
4.5
mW/℃
When using the unit above Ta=25℃, subtract the value above per Celsius degree .
Mounted on a FR4 glass epoxy board 70mm×70mm×1.6mm(cooper foil area below 3%)
Figure 51. Derating curve
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20/27
TSZ02201-0RAR1G200110-1-2
21.Jan.2013 Rev.002
Datasheet
BA2904Yxxx-C, BA2902Yxx-C
●Application Information
NULL method condition for Test circuit1
VCC, VEE, EK, Vicm Unit: V
Parameter
VF
S1
S2
Input Offset Voltage
VF1
ON
ON
Input Offset Current
VF2
OFF
OFF
VF3
OFF
ON
VF4
ON
OFF
ON
ON
ON
ON
ON
OFF
ON
ON
OFF
Input Bias Current
VF5
Large Signal Voltage Gain
VF6
VF7
Common-mode Rejection Ratio
(Input common-mode Voltage Range)
VF8
VF9
Power Supply Rejection Ratio
VF10
S3
VCC
VEE
EK
Vicm
calculation
OFF 5 to 30
0
-1.4
0
1
OFF
5
0
-1.4
0
2
OFF
5
0
-1.4
0
3
15
0
-1.4
0
15
0
-11.4
0
5
0
-1.4
0
5
0
-1.4
3.5
5
0
-1.4
0
30
0
-1.4
0
4
5
6
- Calculation 1. Input Offset Voltage (Vio)
Vio 
VF1
[V]
1+ RF / RS
2. Input Offset Current (Iio)
Iio 
VF2 - VF1
Ri × (1 + RF / RS)
[A]
0.1µF
3. Input Bias Current (Ib)
Ib 
VF4 - VF3
2 × Ri × (1 + RF / RS)
RF=50kΩ
SW1
VCC
15V
EK
4. Large Signal Voltage Gain (Av)
Av  20 × Log
ΔEK × (1+ RF/RS)
VF5 - VF6
RS=50Ω
Vo
Ri=10kΩ
500kΩ
DUT
[dB]
5. Common-mode Rejection Ration (CMRR)
CMRR  20 × Log
0.1µF
500kΩ
[A]
ΔVicm × (1+ RF/RS)
[dB]
VF8 - VF7
NULL
SW3
RS=50Ω
1000pF
Ri=10kΩ
RL
VF
Vicm
SW2
50kΩ
-15V
VEE
6. Power supply rejection ratio (PSRR)
PSRR  20 × Log
Figure . 52 Test circuit1 (one channel only)
ΔVcc × (1+ RF/RS)
[dB]
VF10 - VF9
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TSZ02201-0RAR1G200110-1-2
21.Jan.2013 Rev.002
Datasheet
BA2904Yxxx-C, BA2902Yxx-C
Test Circuit 2 Switch Condition
SW
1
SW
3
SW
4
SW
5
SW
6
Supply Current
OFF OFF OFF
ON
OFF
ON OFF OFF OFF OFF OFF OFF OFF OFF
Maximum Output Voltage (high)
OFF OFF
ON OFF OFF
ON OFF OFF
ON
OFF OFF OFF
ON
OFF
Maximum Output Voltage (Low)
OFF OFF
ON OFF OFF
ON OFF OFF
ON
OFF OFF OFF
ON
OFF
Output Source Current
OFF OFF
ON OFF OFF
ON OFF OFF OFF OFF OFF OFF OFF
ON
Output Sink Current
OFF OFF
ON OFF OFF
ON OFF OFF OFF OFF OFF OFF OFF
ON
Slew Rate
OFF OFF OFF
Gain Bandwidth Product
OFF
ON OFF OFF
Equivalent Input Noise Voltage
ON
OFF OFF OFF
SW No.
SW
2
ON
SW
7
OFF OFF OFF
SW
8
SW
9
SW
10
SW
11
ON
SW
12
SW
13
SW
14
ON
ON
ON
OFF OFF OFF
ON
ON OFF OFF
ON
ON
ON
OFF OFF OFF
ON
ON OFF OFF OFF OFF
ON
OFF OFF OFF
Input voltage
SW4
VH
R2
SW5
VCC
VL
A
-
SW1
SW2
RS
R1
Input wave
Output voltage
+
SW3
SW6
SW7
t
SR=ΔV/Δt
SW8
SW9
SW10
SW11
SW12
SW13
SW14
90%
VH
VEE
ΔV
C
A
~
VIN-
VIN+
~
RL
CL
V
~
V
VL
OUT
10%
Δt
Output wave
Figure . 54 Slew Rate Input Waveform
Figure . 53 Test Circuit 2 (each Op-Amp)
VCC
VCC
R1//R2
OTHER
CH
R1//R2
VEE
R1
VEE
R2
V
VIN
t
40dB amplifier
OUT1
=0.5[Vrms]
R1
R2
V
OUT2
40dB amplifier
CS=20×log
100×OUT1
OUT2
(R1=1kΩ, R2=100kΩ)
Figure . 55 Test Circuit 3(Channel Separation)
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TSZ02201-0RAR1G200110-1-2
21.Jan.2013 Rev.002
Datasheet
BA2904Yxxx-C, BA2902Yxx-C
●Operational Notes
1) Unused circuits
When there are unused circuits, it is recommended that they are
connected as in Figure .56, setting the non-inverting input terminal to a
potential within the in-phase input voltage range (Vicm).
2) Input voltage
Applying VEE +36V to the input terminal is possible without causing
deterioration of the electrical characteristics or destruction, regardless of
the supply voltage. However, this does not ensure normal circuit operation.
Please note that the circuit operates normally only when the input voltage is
within the common mode input voltage range of the electric characteristics.
VCC
+
Connect
to Vicm
Vicm
VEE
Figure 56. Example of
application circuit for unused op-amp
3) Power supply (single / dual)
The op-amp operates when the voltage supplied is between VCC and VEE.
Therefore, the single supply op-amp can be used as dual supply op-amp as
well.
4) Power dissipation Pd
Using the unit in excess of the rated power dissipation may cause deterioration in electrical characteristics including
reduced current capability due to the rise of chip temperature. Therefore, please take into consideration the power
dissipation (Pd) under actual operating conditions and apply a sufficient margin in thermal design. Refer to the thermal
derating curves for more information.
5) Short-circuit between pins and erroneous mounting
Be careful when mounting the IC on printed circuit boards. The IC may be damaged if it is mounted in a wrong orientation
or if pins are shorted together. Short circuit may be caused by conductive particles caught between the pins.
6) Operation in a strong electromagnetic field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
7) Radioactive rays
This IC is not designed protection against radioactive rays.
8) IC handling
Applying mechanical stress to the IC by deflecting or bending the board may cause fluctuations of the electrical
characteristics due to piezo resistance effects.
9) IC operation
The output stage of the IC is configured using Class C push-pull circuits. Therefore, when the load resistor is connected
to the middle potential of VCC and VEE, crossover distortion occurs at the changeover between discharging and
charging of the output current. Connecting a resistor between the output terminal and GND, and increasing the bias
current for Class A operation will suppress crossover distortion.
10) Board inspection
Connecting a capacitor to a pin with low impedance may stress the IC. Therefore, discharging the capacitor after every
process is recommended. In addition, when attaching and detaching the jig during the inspection phase, make sure that
the power is turned OFF before inspection and removal. Furthermore, please take measures against ESD in the
assembly process as well as during transportation and storage.
11) Output capacitor
If a large capacitor is connected between the output pin and GND pin, current from the charged capacitor will flow into the
output pin and may destroy the IC when the VCC or VIN pin is shorted to ground or pulled down to 0V. Use a capacitor
smaller than 0.1uF between output and GND.
12) Oscillation by output capacitor
Please pay attention to the oscillation by output capacitor and in designing an application of negative feedback loop
circuit with these ICs.
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TSZ02201-0RAR1G200110-1-2
21.Jan.2013 Rev.002
Datasheet
BA2904Yxxx-C, BA2902Yxx-C
●Physical Dimensions Tape and Reel Information
SOP8
<Tape and Reel information>
7
6
5
6.2±0.3
4.4±0.2
0.3MIN
8
+6°
4° −4°
1 2
3
0.9±0.15
5.0±0.2
(MAX 5.35 include BURR)
Tape
Embossed carrier tape
Quantity
2500pcs
Direction
of feed
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
4
0.595
1.5±0.1
+0.1
0.17 -0.05
S
S
0.11
0.1
1.27
1pin
0.42±0.1
Reel
(Unit : mm)
Direction of feed
∗ Order quantity needs to be multiple of the minimum quantity.
SOP14
<Tape and Reel information>
8.7 ± 0.2
(MAX 9.05 include BURR)
8
Tape
Embossed carrier tape
Quantity
2500pcs
Direction
of feed
0.3MIN
4.4±0.2
6.2±0.3
14
1
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
7
1.5±0.1
0.15 ± 0.1
0.11
1.27
0.4 ± 0.1
0.1
1pin
Reel
(Unit : mm)
Direction of feed
∗ Order quantity needs to be multiple of the minimum quantity.
SSOP-B8
<Tape and Reel information>
3.0±0.2
(MAX 3.35 include BURR)
0.3MIN
4.4 ± 0.2
6.4 ± 0.3
876 5
Tape
Embossed carrier tape
Quantity
2500pcs
Direction
of feed
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
1.15 ± 0.1
1 23 4
0.15±0.1
0.1
S
0.1
0.22±0.10
(0.52)
0.08
M
0.65
1pin
Reel
(Unit : mm)
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TSZ22111・15・001
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Direction of feed
∗ Order quantity needs to be multiple of the minimum quantity.
TSZ02201-0RAR1G200110-1-2
21.Jan.2013 Rev.002
Datasheet
BA2904Yxxx-C, BA2902Yxx-C
SSOP-B14
<Tape and Reel information>
5.0 ± 0.2
8
1
Tape
Embossed carrier tape
Quantity
2500pcs
Direction
of feed
0.3Min.
4.4 ± 0.2
6.4 ± 0.3
14
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
7
0.10
1.15 ± 0.1
0.15 ± 0.1
0.1
0.65
0.22 ± 0.1
Direction of feed
1pin
Reel
(Unit : mm)
∗ Order quantity needs to be multiple of the minimum quantity.
MSOP8
<Tape and Reel information>
2.8±0.1
4.0±0.2
8 7 6 5
0.6±0.2
+6°
4° −4°
0.29±0.15
2.9±0.1
(MAX 3.25 include BURR)
Tape
Embossed carrier tape
Quantity
3000pcs
Direction
of feed
TR
The direction is the 1pin of product is at the upper right when you hold
( reel on the left hand and you pull out the tape on the right hand
)
1 2 3 4
1PIN MARK
1pin
+0.05
0.145 −0.03
0.475
0.08±0.05
0.75±0.05
0.9MAX
S
+0.05
0.22 −0.04
0.08 S
Direction of feed
0.65
Reel
(Unit : mm)
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TSZ22111・15・001
25/27
∗ Order quantity needs to be multiple of the minimum quantity.
TSZ02201-0RAR1G200110-1-2
21.Jan.2013 Rev.002
Datasheet
BA2904Yxxx-C, BA2902Yxx-C
●Marking Diagram
SOP8(TOP VIEW)
SOP14(TOP VIEW)
Part Number Marking
Part Number Marking
LOT Number
LOT Number
1PIN MARK
1PIN MARK
SSOP-B8(TOP VIEW)
SSOP-B14(TOP VIEW)
Part Number Marking
Part Number Marking
LOT Number
LOT Number
1PIN MARK
1PIN MARK
MSOP8(TOP VIEW)
Part Number Marking
LOT Number
Product Name
BA2904Y
Marking
F-C
SOP8
2904Y
FV-C
SSOP-B8
MSOP8
2904Y
FVM-C
BA2902Y
Package Type
F-C
SOP14
FV-C
SSOP-B14
04Y
BA2902YF
2902Y
1PIN MARK
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TSZ22111・15・001
26/27
TSZ02201-0RAR1G200110-1-2
21.Jan.2013 Rev.002
Datasheet
BA2904Yxxx-C, BA2902Yxx-C
●Land pattern data
SOP8, SSOP-B8, MSOP8, SOP14, SSOP-B14
b2
e
MIE
ℓ2
PKG
SOP8
SOP14
SSOP-B8
SSOP-B14
MSOP8
All dimensions in mm
Land length
Land width
≧ℓ 2
b2
Land pitch
e
Land space
MIE
1.27
4.60
1.10
0.76
0.65
4.60
1.20
0.35
0.65
2.62
0.99
0.35
●Revision History
Date
Revision
Changes
5.Mar.2012
001
New Release
21.Jan.2013
002
Land pattern data inserted.
www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
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TSZ02201-0RAR1G200110-1-2
21.Jan.2013 Rev.002
Datasheet
Notice
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
Precaution on using ROHM Products
1.
If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment,
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Notice - Rev.004
© 2013 ROHM Co., Ltd. All rights reserved.
Datasheet
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Notice - Rev.004
© 2013 ROHM Co., Ltd. All rights reserved.
Datasheet
Other Precaution
1.
The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
2.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
3.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
4.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
5.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice - Rev.004
© 2013 ROHM Co., Ltd. All rights reserved.