Datasheet Operational Amplifiers Low Voltage Operation Ground Sense Operational Amplifiers TLR341G ●Key Specifications Low Operating Supply Voltage (single supply): +1.8V to +5.0V Low Supply Current: 70uA Low Shutdown Current: 0.2nA (Typ.) High voltage gain (RL=2kΩ): 105dB(Typ.) Wide Temperature Range: -40°C to +85°C Turn on time from shutdown: 5μs (Typ.) Low Input Offset Voltage: 4mV (Max.) Low Input Bias Current: 1pA (Typ.) Gain Bandwidth: 2.3MHz (Typ.) Slew Rate: 0.9V/µs (Typ.) ●General Description TLR341G is single CMOS Op-Amp with shutdown function, low supply voltage operation and output full swing. There are suitable for battery equipment. MOS-FET input stage provide low input bias current. It is capable to use for sensor applications. ●Features Low operating supply voltage Full swing Output Swing High large signal voltage gain Low input bias current Low supply current Low input offset voltage ●Package SSOP6 W(Typ.) xD(Typ.) xH(Max.) 2.90mm x 2.80mm x 1.25mm ●Applications Customer electronics Buffer Active filter Mobile equipment Battery equipment ●Simplified Schematic VDD VBI AS1 +IN Class AB Control OUT -IN SHDN Shutdown Control VBI AS 2 VSS Figure 1. Simplified Schematic (1 channel only) ○Product structure：Silicon monolithic integrated circuit www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･14･001 ○This product is not designed protection against radioactive rays. 1/18 TSZ02201-0RAR1G200620-1-2 8.FEB.2013 Rev.001 Datasheet TLR341G ●Pin Configuration TLR341G : SSOP6 +IN 1 Pin Name 1 +IN 2 VSS 6 VDD + - VSS 2 5 SHDN 3 -IN Pin No. 4 OUT 3 -IN 4 OUT 5 6 —————— SHDN VDD Package SSOP6 TLR341G ●Shutdown Pin Input condition State VSS Shutdown VDD Active —————— SHDN Note: Please refer to Electrical Characteristics regarding the turn on and off voltage. ●Ordering Information T L R 3 4 1 G - Packaging and forming specification TR: Embossed tape and reel (SSOP6) Package G:SSOP6 Part Number TLR341 TR ●Line-up Topr -40°C to +85°C Package SSOP6 Operable Part Number Reel of 3000 TLR341G-TR ●Absolute Maximum Ratings(Ta=25°C) Parameter Supply Voltage Symbol Ratings Unit VDD-VSS +5.5 V *1*2 Power dissipation Pd Differential Input Voltage*3 Input Common-mode Voltage Range Operable with low voltage Vid VDD to VSS 675 mW V Vicm (VSS – 0.3) to (VDD + 0.3 ) V Vopr +1.8 to +5.0 V Operating Temperature Topr - 40 to +85 °C Storage Temperature Maximum Junction Temperature Tstg - 55 to +150 °C Tjmax +150 °C Note: Absolute maximum rating item indicates the condition which must not be exceeded. Application of voltage in excess of absolute maximum rating or use out absolute maximum rated temperature environment may cause deterioration of characteristics. *1 To use at temperature above Ta＝25°C reduce 5.4mW/°C. *2 Mounted on a FR4 glass epoxy PCB(70mm×70mm×1.6mm). *3 The voltage difference between inverting input and non-inverting input is the differential input voltage. Then input terminal voltage is set to more than VSS. www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 2/18 TSZ02201-0RAR1G200620-1-2 8.FEB.2013 Rev.001 Datasheet TLR341G ●Electrical Characteristics: —————— ○TLR341G (Unless otherwise specified VDD=+1.8V, VSS=0V, SHDN=VDD) Limits Temperature Parameter Symbol Range Min. Typ. Max. 25°C 0.3 4 Input offset voltage*4*5 Vio Full Range 4.5 Input offset voltage drift*4 Unit Condition mV - ΔVio/ΔT 25°C - 1.9 - μV/°C - Input bias current*4 Ib 25°C - 1 - pA - Input offset current*4 Iio 25°C - 1 - pA - IDD 25°C Full Range - 70 - 150 200 μA - IDD_SD 25°C - 0.2 1000 nA Common mode rejection ratio CMRR 25°C 60 85 - dB VCM=0V to 0.7V Power supply rejection ratio PSRR 25°C 75 95 - dB VDD=1.8V to 5.0V Input common mode voltage range Vicm 25°C VSS - VDD-1.1 V CMRR ≥ 60 dB Av 25°C Maximum Output Voltage(High) VOH 25°C VOL 25°C 110 100 25 7 22 14 50 20 55 20 mV Maximum Output Voltage(Low) 70 - Isource 25°C 6 9 - mA OUT=0V, short current Isink 25°C 10 15 - mA OUT=1.8V, short current SR 25°C - 0.9 - V/μs RL=10kΩ, VIN=0.7VP-P GBW 25°C - 2.2 - MHz CL=200pF, RL=100kΩ Unit gain frequency fT 25°C - 1.5 - MHz CL=200pF, RL=100kΩ Phase margin θ 25°C - 55 - deg CL=20pF, RL=100kΩ Gain margin GM 25°C - 7 - dB CL=20pF, RL=100kΩ Input referred noise voltage Vn 25°C - 33 - nV/ Hz THD+N 25°C - 0.015 - % Ton 25°C - 5 - μs - - 1.2 - V - - 0.5 - V - Supply current Shutdown Current Large signal voltage gain Output source current*6 Output sink current*6 Slew rate Gain band width Total harmonic distortion + Noise Turn-on Time from Shutdown Turn On Voltage High VSHDN_H dB mV —————— SHDN=0V RL=10kΩ to 0.9V RL=2kΩ to 0.9V RL=2kΩ to 0.9V RL=10kΩ to 0.9V RL=2kΩ to 0.9V RL=10kΩ to 0.9V f=1kHz VIN=1VP-P, f=1kHz RL=600Ω Av=0dB, DIN-AUDIO 25°C Turn On Voltage Low *4 *5 *6 VSHDN_L Absolute value Full range: Ta=-40°C to +85°C Under the high temperature environment, consider the power dissipation of IC when selecting the output current. When the terminal short circuits are continuously output, the output current is reduced to climb to the temperature inside IC. www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 3/18 TSZ02201-0RAR1G200620-1-2 8.FEB.2013 Rev.001 Datasheet TLR341G —————— ○TLR341G (Unless otherwise specified VDD=+5V, VSS=0V, SHDN=VDD) Limits Temperature Parameter Symbol Range Min. Typ. Max. 25°C 0.3 4 *7*8 Input offset voltage Vio Full Range 4.5 Input offset voltage drift*7 Unit Condition mV - ΔVio/ΔT 25°C - 1.9 - μV/°C - Input bias current*7 Ib 25°C - 1 - pA - Input offset current*7 Iio 25°C - 1 - pA - IDD 25°C Full Range - 75 - 150 200 μA - IDD_SD 25°C - 0.2 1000 nA Common mode rejection ratio CMRR 25°C 75 90 - dB VCM=0V to 3.9V Power supply rejection ratio PSRR 25°C 75 95 - dB VDD=1.8V to 5.0V Input common mode voltage range Vicm 25°C VSS - VDD-1.1 V CMRR ≥70 dB Av 25°C Maximum Output Voltage(High) VOH 25°C VOL 25°C 110 105 25 7 40 18 60 15 60 30 mV Maximum Output Voltage(Low) 80 - Isource 25°C 60 100 - mA OUT=0V, short current Isink 25°C 80 120 - mA OUT=2.5V, short current SR 25°C - 1 - V/μs RL=10kΩ, VIN=2VP-P GBW 25°C - 2.3 - MHz CL=200pF, RL=100kΩ Unit gain frequency fT 25°C - 1.6 - MHz CL=200pF, RL=100kΩ Phase margin θ 25°C - 55 - deg CL=20pF, RL=100kΩ Gain margin GM 25°C - 7 - dB CL=20pF, RL=100kΩ Input referred noise voltage Vn 25°C - 33 - nV/ Hz THD+N 25°C - 0.012 - % Ton 25°C - 15 - μs - - 3.4 - V - - 1.2 - V - Supply current Shutdown Current Large signal voltage gain Output source current*9 Output sink current*9 Slew rate Gain band width Total harmonic distortion + Noise Turn-on Time from Shutdown Turn On Voltage High VSHDN_H dB mV —————— SHDN=0V RL=10kΩ to 2.5V RL=2kΩ to 2.5V RL=2kΩ to 2.5V RL=10kΩ to 2.5V RL=2kΩ to 2.5V RL=10kΩ to 2.5V f=1kHz VIN=1VP-P, f=1kHz RL=600Ω, Av=0dB, DIN-AUDIO 25°C Turn On Voltage Low *7 *8 *9 VSHDN_L Absolute value Full range: Ta=-40°C to +85°C Under the high temperature environment, consider the power dissipation of IC when selecting the output current. When the terminal short circuits are continuously output, the output current is reduced to climb to the temperature inside IC. www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 4/18 TSZ02201-0RAR1G200620-1-2 8.FEB.2013 Rev.001 Datasheet TLR341G Description of electrical characteristics Described here are the terms of electric characteristics used in this datasheet. Items and symbols used are also shown. Note that item name and symbol and their meaning may differ from those on another manufacture’s document or general document. 1. Absolute maximum ratings Absolute maximum rating item indicates the condition which must not be exceeded. Application of voltage in excess of absolute maximum rating or use out of absolute maximum rated temperature environment may cause deterioration of characteristics. 1.1 Power supply voltage (VDD/VSS) Indicates the maximum voltage that can be applied between the positive power supply terminal and negative power supply terminal without deterioration or destruction of characteristics of internal circuit. 1.2 Differential input voltage (Vid) Indicates the maximum voltage that can be applied between non-inverting terminal and inverting terminal without deterioration and destruction of characteristics of IC. 1.3 Input common-mode voltage range (Vicm) Indicates the maximum voltage that can be applied to non-inverting terminal and inverting terminal without deterioration or destruction of characteristics. Input common-mode voltage range of the maximum ratings not assures normal operation of IC. When normal Operation of IC is desired, the input common-mode voltage of characteristics item must be followed. 1.4 Power dissipation (Pd) Indicates the power that can be consumed by specified mounted board at the ambient temperature 25℃(normal temperature). As for package product, Pd is determined by the temperature that can be permitted by IC chip in the package (maximum junction temperature) and thermal resistance of the package. 2.Electrical characteristics item 2.1 Input offset voltage (Vio) Indicates the voltage difference between non-inverting terminal and inverting terminal. It can be translated into the input voltage difference required for setting the output voltage at 0 V. 2.2 Input offset voltage drift (△Vio/△T) Denotes the ratio of the input offset voltage fluctuation to the ambient temperature fluctuation. 2.3 Input bias current (Ib) Indicates the current that flows into or out of the input terminal. It is defined by the average of input bias current at non-inverting terminal and input bias current at inverting terminal. 2.4 Input offset current (Iio) Indicates the difference of input bias current between non-inverting terminal and inverting terminal. 2.5 Supply current (IDD) Indicates the IC current that flows under specified conditions and no-load steady status. 2.6 Shutdown current (IDD_SD) Indicates the current when the circuit is shutdown. 2.7 Common-mode rejection ratio (CMRR) Indicates the ratio of fluctuation of input offset voltage when in-phase input voltage is changed. It is normally the fluctuation of DC. CMRR = (Change of Input common-mode voltage)/(Input offset fluctuation) 2.8 Power supply rejection ratio (PSRR) Indicates the ratio of fluctuation of input offset voltage when supply voltage is changed. It is normally the fluctuation of DC. PSRR= (Change of power supply voltage)/(Input offset fluctuation) 2.9 Input common-mode voltage range (Vicm) Indicates the input voltage range where IC operates normally. 2.10 Large signal voltage gain (Av) Indicates the amplifying rate (gain) of output voltage against the voltage difference between non-inverting terminal and inverting terminal. It is normally the amplifying rate (gain) with reference to DC voltage. Av = (Output voltage) / (Differential Input voltage) 2.11 Maximum Output Voltage(High) / Maximum Output Voltage(Low) (VOH/VOL) Indicates the voltage range that can be output by the IC under specified load condition. It is typically divided into maximum output voltage High and low. Maximum output voltage high indicates the upper limit of output voltage. Maximum output voltage low indicates the lower limit. 2.12 Output source current/ output sink current (Isource / Isink) The maximum current that can be output under specific output conditions, it is divided into output source current and output sink current. The output source current indicates the current flowing out of the IC, and the output sink current the current flowing into the IC. 2.13 Slew Rate (SR) SR is a parameter that shows movement speed of operational amplifier. It indicates rate of variable output voltage as unit time. 2.14 Gain Band Width (GBW) Indicates to multiply by the frequency and the gain where the voltage gain decreases 6dB/octave. 2.15 Unity gain frequency (fT) Indicates a frequency where the voltage gain of operational amplifier is 1. www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 5/18 TSZ02201-0RAR1G200620-1-2 8.FEB.2013 Rev.001 Datasheet TLR341G 2.16 Phase Margin (θ) Indicates the margin of phase from 180 degree phase lag at unity gain frequency. 2.17 Gain Margin (GM) Indicates the difference between 0dB and the gain where operational amplifier has 180 degree phase delay. 2.18 Input referred noise voltage (Vn) Indicates a noise voltage generated inside the operational amplifier equivalent by ideal voltage source connected in series with input terminal. 2.19 Total harmonic distortion + Noise (THD+N) Indicates the fluctuation of input offset voltage or that of output voltage with reference to the change of output voltage of driven channel. 2.20 Turn On Time From Shutdown (Ton) Indicates the time from applying the voltage to shutdown terminal until the IC is active. 2.21 Turn On Voltage / Turn Off Voltage (VSHDN_H/ VSHDN_L) The IC is active if the shutdown terminal is applied more than Turn On Voltage (VSHDN_H). The IC is shutdown if the shutdown terminal is applied less than Turn Off Voltage (VSHDN_L). www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 6/18 TSZ02201-0RAR1G200620-1-2 8.FEB.2013 Rev.001 Datasheet TLR341G ●Typical Performance Curves ○TLR341G 120 SUPPLY CURRENT [μA] POWER DISSIPATION [mW] 800 600 TLR341G 400 200 100 85℃ 80 25℃ -40℃ 60 40 20 0 0 85 0 25 50 75 AMBIENT TEMPERATURE [℃] 100 1 2 3 4 5 6 SUPPLY VOLTAGE [V] Figure 3. Supply Current – Supply Voltage Figure 2. Derating curve 5.5 120 OUTPUT VOLTAGE HIGH [V] SUPPLY CURRENT [μA] 5 100 1.8V 80 5.0V 60 4.5 4 85℃ 3.5 25℃ 3 -40℃ 2.5 2 40 -50 -25 0 25 50 75 AMBIENT TEMPERATURE [℃] 1.5 100 1 Figure 4. Supply Current – Ambient Temperature 2 3 4 5 SUPPLY VOLTAGE [V] 6 Figure 5. Maximum Output Voltage High – Supply Voltage (RL=2kΩ) (*)The data above is measurement value of typical sample, it is not guaranteed. www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 7/18 TSZ02201-0RAR1G200620-1-2 8.FEB.2013 Rev.001 Datasheet TLR341G ●Typical Performance Curves (Reference data) – Continued ○TLR341G 25 5 OUTPUT VOLTAGE LOW [mV] OUTPUT VOLTAGE HIGH [V] 6 5.0V 4 3 2 1.8V 1 20 85℃ 15 10 25℃ -40℃ 5 0 -50 -25 0 25 50 75 0 100 1 AMBIENT TEMPERATURE [℃] 3 4 5 SUPPLY VOLTAGE [V] Figure 6. Figure 7. Maximum Output Voltage High – Maximum Output Voltage Low – Ambient Temperature (RL=2kΩ) Supply Voltage (RL=2kΩ) 6 14 OUTPUT SOURCE CURRENT [mA] 25 OUTPUT VOLTAGE LOW [mV] 2 20 5.0V 15 10 1.8V 5 12 25℃ -40℃ 10 8 85℃ 6 4 2 0 0 -50 -25 0 25 50 75 AMBIENT TEMPERATURE [℃] 0 100 Figure 8. 0.5 1 1.5 OUTPUT VOLTAGE [V] 2 Figure 9. Output Source Current – Output Voltage (VDD=1.8V) Maximum Output Voltage Low – Ambient Temperature (RL=2kΩ) (*)The data above is measurement value of typical sample, it is not guaranteed. www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 8/18 TSZ02201-0RAR1G200620-1-2 8.FEB.2013 Rev.001 Datasheet TLR341G ●Typical Performance Curves (Reference data) – Continued ○TLR341G 25 -40℃ 100 OUTPUT SINK CURRENT [mA] OUTPUT SOURCE CURRENT [mA] 110 90 80 5.0V 70 60 50 40 30 1.8V 20 25℃ 20 15 85℃ 10 5 10 0 0 -50 -25 0 25 50 75 0.0 100 Figure 10. Output Source Current –Ambient Temperature (OUT=0V) 1.5 2.0 Figure 11. Output Sink Current – Output Voltage (VDD=1.8V) 140 4 120 3 INPUT OFFSET VOLTAGE [mV] OUTPUT SINK CURRENT [mA] 1.0 OUTPUT VOLTAGE [V] AMBIENT TEMPERATURE [℃] 5.0V 100 0.5 80 60 40 1.8V 20 2 85℃ 1 0 25℃ -1 -40℃ -2 -3 -4 0 -50 -25 0 25 50 75 1 100 2 3 4 5 6 SUPPLY VOLTAGE [V] AMBIENT TEMPERATURE [℃] Figure 12. Output Sink Current – Ambient Temperature (OUT=VDD) Figure 13. Input Offset Voltage – Supply Voltage (*)The data above is measurement value of typical sample, it is not guaranteed. www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 9/18 TSZ02201-0RAR1G200620-1-2 8.FEB.2013 Rev.001 Datasheet TLR341G 4 4 3 3 INPUT OFFSET VOLTAGE [mV] INPUT OFFSET VOLTAGE [mV] ●Typical Performance Curves (Reference data) - Continued ○TLR341G 2 5.0V 1 0 1.8V -1 -2 -3 2 25℃ 85℃ 1 0 -1 -40℃ -2 -3 -4 -50 -25 0 25 50 75 -4 100 -1.0 AMBIENT TEMPERATURE [℃] Figure 14. Input Offset Voltage – Ambient Temperature 0.0 0.5 1.0 1.5 INPUT VOLTAGE [V] 2.0 Figure 15. Input Offset Voltage – Input Voltage (VDD=1.8V) 140 140 LARGE SIGNAL VOLTAGE GAIN [dB] . LARGE SIGNAL VOLTAGE GAIN [dB] . -0.5 85℃ 130 120 -40℃ 110 25℃ 100 90 80 70 5.0V 130 120 110 1.8V 100 60 90 80 70 60 1 2 3 4 5 SUPPLY VOLTAGE [V] 6 -50 Figure 16. Large Signal Voltage Gain – Supply Voltage (RL=2 kΩ) -25 0 25 50 75 AMBIENT TEMPERATURE [℃] 100 Figure 17. Large Signal Voltage Gain – Ambient Temperature (RL=2 kΩ) (*)The data above is measurement value of typical sample, it is not guaranteed. www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 10/18 TSZ02201-0RAR1G200620-1-2 8.FEB.2013 Rev.001 Datasheet TLR341G ●Typical Performance Curves (Reference data) – Continued ○TLR341G COMMON MODE REJECTION RATIO [dB] COMMON MODE REJECTION RATIO [dB] 140 130 -40℃ 120 110 25℃ 100 85℃ 90 80 70 60 1 2 3 4 5 SUPPLY VOLTAGE [V] 130 5.0V 120 110 100 1.8V 90 80 70 60 6 -50 Figure 18. Common Mode Rejection Ratio – Supply Voltage (VDD=1.8V) -25 0 25 50 75 AMBIENT TEMPERATURE [℃] 100 Figure 19. Common Mode Rejection Ratio – Ambient Temperature 2.0 120 SLEW RATE L-H [V/μs] POWER SUPPLY REJECTION RATIO [dB] 140 100 80 1.8 1.6 5.0V 1.4 1.2 1.8V 1.0 60 -50 -25 0 25 50 75 AMBIENT TEMPERATURE [℃] -50 100 Figure 20. Power Supply Rejection Ratio – Ambient Temperature -25 0 25 50 75 AMBIENT TEMPERATURE [℃] 100 Figure 21. Slew Rate L-H – Ambient Temperature (VDD=1.8V ~ 5.0V) (*)The data above is measurement value of typical sample, it is not guaranteed. www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 11/18 TSZ02201-0RAR1G200620-1-2 8.FEB.2013 Rev.001 Datasheet TLR341G ●Typical Performance Curves (Reference data) - Continued ○TLR341G 2.0 100 200 80 5.0V 1.6 1.8V 1.4 60 40 20 1.0 0 -25 0 25 50 75 AMBIENT TEMPERATURE [℃] 100 Gain 1.2 -50 150 50 0 3 100 4 5 6 7 8 10 10 10 10 10 10 1.E+01 1.E+00 1.E+02 1.E+03 1.E+04 1.E+05 FREQUENCY [Hz] Figure 22. Slew Rate H-L – Ambient Temperature Figure 23. Voltage Gain, Phase – Frequency (VDD=1.8V, 25℃) 4 0.8 OUTPUT VOLTAGE [V] OUTPUT VOLTAGE [V] 0.7 0.6 0.5 0.4 0.3 VSHDN_L VSHDN_H 0.2 3 2 1 VSHDN_L VSHDN_H 0.1 0 0 0 0.5 1 1.5 SHUTDOWN VOLTAGE [V] Figure 24. Turn On/Off Voltage – Supply Voltage (VDD=1.8V, Av=0dB, VIN=0.5V) 0 2 1 2 3 4 5 SHUTDOWN VOLTAGE [V] Figure 25. Turn On/Off Voltage – Supply Voltage (VDD=5V, Av=0dB, VIN=2.5V) 6 (*)The data above is measurement value of typical sample, it is not guaranteed. www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 12/18 TSZ02201-0RAR1G200620-1-2 8.FEB.2013 Rev.001 PHASE [deg] 1.8 GAIN[dB] SLEW RATE H-L [V/μs] Phase Datasheet TLR341G ●Application Information NULL method condition for Test Circuit 1 VDD, VSS, EK, Vicm Unit:V Parameter Input Offset Voltage VF S1 S2 S3 VDD VSS EK VF1 ON ON OFF 2.4 0 -1.2 ON ON ON 5 0 VF2 VF3 1 2.5 2 -3.5 VF4 0 ON ON OFF 6 0 -3 VF5 3 5 VF6 Power Supply Rejection Ratio 0.5 -0.5 Large Signal Voltage Gain Common-mode Rejection Ratio (Input Common-mode Voltage Range) Vicm Calculation ON ON 2.4 OFF VF7 0 -1.2 0.5 4 6.0 － Calculation－ Vio = 1. Input Offset Voltage (Vio) 2. Large Signal Voltage Gain(Av) |VF1| [V] 1+RF/RS 2 × (1+RF/RS) Av = 20Log [dB] |VF2-VF3| 3. Common-mode Rejection Ratio (CMRR) 3 × (1+RF/RS) CMRR=20Log [dB] |VF4 - VF5| 4. Power Supply Rejection Ratio (PSRR) 3.2 × (1+ RF/RS) PSRR = 20Log [dB] |VF6 - VF7| 0.1µF RF=50kΩ 0.01µF 500kΩ SW1 VDD EK RS=50Ω Ri=10kΩ 15V Vo 500kΩ 0.1µF 0.1µF DUT NULL SW3 RS=50Ω Ri=10kΩ 1000pF Vicm 50kΩ VF RL VRL -15V VSS Figure 26. Test circuit 1 www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 13/18 TSZ02201-0RAR1G200620-1-2 8.FEB.2013 Rev.001 Datasheet TLR341G Switch Condition for Test Circuit 2 SW No. SW1 SW2 SW3 SW4 SW5 SW6 SW7 SW8 SW9 SW10 SW11 SW12 Supply Current OFF OFF ON OFF ON OFF OFF OFF OFF OFF OFF OFF Maximum Output Voltage RL=10kΩ OFF ON OFF OFF ON OFF OFF Output Current OFF ON OFF OFF ON OFF OFF OFF OFF Slew Rate OFF OFF Unit gain frequency ON ON OFF OFF OFF OFF OFF ON ON ON ON OFF OFF ON ON OFF OFF OFF OFF ON OFF OFF ON OFF OFF OFF ON OFF OFF ON SW３ SW4 R2 100kΩ ● ● VDD=3V － SW1 SW2 ＋ SW6 SW7 SW8 SW9 RL CL SW10 SW11 SW12 R1 1kΩ VSS VIN- VIN+ Vo Figure 27. Test circuit 2 Input voltage VH VL t Input wave Output voltage 90% SR=ΔV/Δt VH ΔV 10% VL Δt t Output wave Figure 28. Slew rate input output wave www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 14/18 TSZ02201-0RAR1G200620-1-2 8.FEB.2013 Rev.001 Datasheet TLR341G ●Application example ○Voltage follower VDD Voltage gain is 0 dB. This circuit controls output voltage (OUT) equal input voltage (IN), and keeps OUT with stable because of high input impedance and low output impedance. OUT is shown next expression. OUT=IN OUT IN VSS Figure 29. Voltage follower ○Inverting amplifier R2 For inverting amplifier, Vi(b) Derating curve voltage gain decided R1 and R2, and phase reversed voltage is output. OUT is shown next expression. OUT=-(R2/R1)・IN Input impedance is R1. VDD IN R1 OUT R1//R2 VSS Figure 30. Inverting amplifier circuit ○Non-inverting amplifier For non-inverting amplifier, IN is amplified by voltage gain decided R1 and R2, and phase is same with IN. OUT is shown next expression. OUT=(1 + R2/R1)・IN This circuit performes high input impedance because Input impedance is operational amplifier’s input Impedance. Figure 31. Non-inverting amplifier circuit www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 15/18 TSZ02201-0RAR1G200620-1-2 8.FEB.2013 Rev.001 Datasheet TLR341G ●Power Dissipation Power dissipation (total loss) indicates the power that can be consumed by IC at Ta=25 (normal temperature).IC is heated when it consumed power, and the temperature of IC ship becomes higher than ambient temperature. The temperature that can be accepted by IC chip depends on circuit configuration, manufacturing process, and consumable power is limited. Power dissipation is determined by the temperature allowed in IC chip (maximum junction temperature) and thermal resistance of package (heat dissipation capability). The maximum junction temperature is typically equal to the maximum value in the storage package (heat dissipation capability). The maximum junction temperature is typically equal to the maximum value in the storage temperature range. Heat generated by consumed power of IC radiates from the mold resin or lead frame of the package. The parameter which indicates this heat dissipation capability (hardness of heat release) is called thermal resistance, represented by the symbol θja℃/W. The temperature of IC inside the package can be estimated by this thermal resistance. Figure 32.(a) shows the model of thermal resistance of the package. Thermal resistance θja, ambient temperature Ta, maximum junction temperature Tjmax, and power dissipation Pd can be calculated by the equation below: θja = (Tjmax－Ta) / Pd ℃/W ・・・・・ (Ⅰ) Derating curve in Figure 32.(b) indicates power that can be consumed by IC with reference to ambient temperature. Power that can be consumed by IC begins to attenuate at certain ambient temperature. This gradient is determined by thermal resistance θja. Thermal resistance θja depends on chip size, power consumption, package, ambient temperature, package condition, wind velocity, etc even when the same of package is used. Thermal reduction curve indicates a reference value measured at a specified condition. Figure 33.(c) show a derating curve for an example of TLR341G. LSIの 消 費 力 [W] Power dissipation of 電 LSI Pd (max) θja=(Tjmax-Ta)/Pd ℃/W θja2 < θja1 P2 Ambient temperature Ta[ ℃ ] Package face temperature θ' ja2 P1 θ ja2 Tj ' (max) Tj (max) θ' ja1 Chip surface temperature Tj[ ℃ ] 0 25 50 θ ja1 75 100 125 150 Ambient temperature 周 囲 温 度 Ta [℃ ] (a) Thermal resistance (b) Derating curve Figure 32.Thermal resistance and derating POWER DISSIPATION [mW] . 800 600 TLR341G 400 200 0 0 25 50 75 100 125 AMBIENT TEMPERATURE [℃] (c) TLR341G 5.4 mW/℃ When using the unit above Ta=25℃, subtract the value above per degree℃. Permissible dissipation is the value when FR4 glass epoxy board 70mm×70mm×1.6mm (cooper foil area below 3%) is mounted Figure 33. Derating Curve www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 16/18 TSZ02201-0RAR1G200620-1-2 8.FEB.2013 Rev.001 Datasheet TLR341G ●Operational Notes 1) Unused circuits When there are unused circuits it is recommended that they are connected as in Figure 34., setting the non-inverting input terminal to a potential within input common-mode voltage range (Vicm). VDD + Connect to Vicm Vicm - 2) Applied voltage to the input terminal VSS For normal circuit operation of voltage comparator, please input voltage for its input terminal within input common mode voltage VDD + 0.3V. Then, regardless of Figure. 34. The example of application power supply voltage, VSS-0.3V can be applied to input terminals without deterioration circuit for unused op-amp or destruction of its characteristics. 3) Power supply (single / dual) The op-amp operates when the specified voltage supplied is between VDD and VSS. Therefore, the single supply op-amp can be used as dual supply op-amp as well. 4) Power dissipation Pd Using the unit in excess of the rated power dissipation may cause deterioration in electrical characteristics due to a rise in chip temperature, including reduced current capability. Therefore, please take into consideration the power dissipation (Pd) under actual operating conditions and apply a sufficient margin in thermal design. Refer to the thermal derating curves for more information. 5) Short-circuit between pins and erroneous mounting Incorrect mounting may damage the IC. In addition, the presence of foreign particles between the outputs, the output and the power supply, or the output and GND may result in IC destruction. 6) Operation in a strong electromagnetic field Operation in a strong electromagnetic field may cause malfunctions. 7) IC handling Applying mechanical stress to the IC by deflecting or bending the board may cause fluctuations in the electrical characteristics due to piezo resistance effects. 8) Board inspection Connecting a capacitor to a pin with low impedance may stress the IC. Therefore, discharging the capacitor after every process is recommended. In addition, when attaching and detaching the jig during the inspection phase, ensure that the power is turned OFF before inspection and removal. Furthermore, please take measures against ESD in the assembly process as well as during transportation and storage. 9) Output capacitor Discharge of the external output capacitor to VCC is possible via internal parasitic elements when VCC is shorted to VEE, causing damage to the internal circuitry due to thermal stress. Therefore, when using this IC in circuits where oscillation due to output capacitive load does not occur, such as in voltage comparators, use an output capacitor with a capacitance less than 0.1µF. Designed negative feedback circuit using this IC, verify output oscillation caused by capacitive load. 10) Latch up Be careful of input voltage that exceed the VDD and VSS. When CMOS device have sometimes occur latch up operation. And protect the IC from abnormaly noise 11) Decupling capacitor Insert the decupling capacitance between VDD and VSS, for stable operation of operational amplifier. 12) Shutdown Terminal The shutdown terminal can’t be left unconnected. In case shutdown operation is not needed, the shutdown pin should be connected to VDD when the IC is used. Leaving the shutdown pin floating will result in an undefined operation mode, either shutdown or active, or even oscillating between the two modes. www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 17/18 TSZ02201-0RAR1G200620-1-2 8.FEB.2013 Rev.001 Datasheet TLR341G ●Physical Dimensions Tape and Reel Information SSOP6 5 4 0.2Min. +0.2 1.6 −0.1 2.8±0.2 6 2 Tape Embossed carrier tape Quantity 3000pcs Direction of feed TR The direction is the 1pin of product is at the upper right when you hold ( reel on the left hand and you pull out the tape on the right hand ) 3 1.1±0.05 1 1.25Max. <Tape and Reel information> +6° 4° −4° 2.9±0.2 +0.05 0.13 −0.03 1pin S 0.05±0.05 +0.05 0.42 −0.04 0.95 0.1 S Direction of feed Reel (Unit : mm) ∗ Order quantity needs to be multiple of the minimum quantity. ●Marking Diagram SSOP6(TOP VIEW) LOT Number Part Number Marking Product Name TLR341 G Package Type Marking SSOP6 BC ●Land Pattern data SSOP6 0.95 1.0 2.4 0.95 0.6 PKG Land Pitch e Land Space MIE Land Length ≧ℓ 2 SSOP6 0.95 2.4 1.0 Unit：mm Land Width b2 0.6 ●Revision History Date 2013.2.8 Revision 001 Changes New Release www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 18/18 TSZ02201-0RAR1G200620-1-2 8.FEB.2013 Rev.001 Datasheet Notice ●General Precaution 1) Before you use our Products, you are requested to carefully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any ROHM’s Products against warning, caution or note contained in this document. 2) All information contained in this document is current as of the issuing date and subject to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales representative. ●Precaution on using ROHM Products 1) Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment, transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. 2) ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3) Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4) The Products are not subject to radiation-proof design. 5) Please verify and confirm characteristics of the final or mounted products in using the Products. 6) In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse) is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7) De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8) Confirm that operation temperature is within the specified range described in the product specification. 9) ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Notice - Rev.004 © 2013 ROHM Co., Ltd. All rights reserved. Datasheet ●Precaution for Mounting / Circuit board design 1) When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2) In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification ●Precautions Regarding Application Examples and External Circuits 1) If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2) You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. 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It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3) Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4) Use Products within the specified time after opening a humidity barrier bag. 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ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information. 2) This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 3) The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 4) In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 5) The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice - Rev.004 © 2013 ROHM Co., Ltd. All rights reserved.