ROHM BU7485G-TR

Datasheet
Operational Amplifiers Series
Ground Sense
High Speed Low Voltage CMOS Operational
Amplifiers
BU7485G
BU7485SG BU7486xxx
BU7486Sxxx
General Description
BU7487Sxx
Key Specifications
BU7485G/BU7486xxx/BU7487xx are CMOS operational
amplifiers with input ground sense and full swing output.
This series has extended operational amplifiers
BU7485SG/BU7486Sxxx/BU7487Sxx which can operate
over a wider temperature range (-40°C to +105°C).
These ICs have wide band, high slew rate, low voltage
operation and low input bias current, making the
operational amplifiers suitable for portable equipment
and sensor application.
Features




BU7487xx
High Slew Rate
Wide Bandwidth
Low Input Bias Current
Output Full Swing
 Operating Power Supply Voltage Range
(Single Supply):
+3.0V to +5.5V
 Slew Rate:
i10.0V/µs
 Temperature Range:
BU7485G
-40°C to +85°C
BU7486xxx
-40°C to +85°C
BU7487xx
-40°C to +85°C
BU7485S
-40°C to +105°C
BU7486Sxxx
-40°C to +105°C
BU7487Sxx
-40°C to +105°C
 Input Bias Current:
1pA (Typ)
 Input Offset Current:
1pA (Typ)
Package
SSOP5
SOP8
SSOP-B8
MSOP8
SOP14
SSOP-B14
Application
 Battery-powered Equipment
 General Purpose Electronics
W(Typ) x D(Typ) x H(Max)
2.90mm x 2.80mm x 1.25mm
5.00mm x 6.20mm x 1.71mm
3.00mm x 6.40mm x 1.35mm
2.90mm x 4.00mm x 0.90mm
8.70mm x 6.20mm x 1.71mm
5.00mm x 6.40mm x 1.35mm
Simplified schematic
VDD
Vbias
Class
+IN
AB control
OUT
-IN
Vbias
VSS
Figure 1. Simplified schematic (1 channel only)
○Product structure：Silicon monolithic integrated circuit
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BU7485G
BU7485SG
BU7486xxx
BU7486Sxxx
BU7487xx
BU7487Sxx
Datasheet
Pin Configuration
BU7485G, BU7485SG : SSOP5
+IN
VSS
Pin No.
Pin Name
1
+IN
2
VSS
3
-IN
4
OUT
5
VDD
Pin No.
Pin Name
1
OUT1
2
-IN1
3
+IN1
VDD
5
1
2
-IN
3
OUT
4
BU7486F, BU7486SF : SOP8
BU7486FV, BU7486SFV : SSOP-B8
BU7486FVM, BU7486SFVM : MSOP8
OUT1 1
8 VDD
2
-IN1
7 OUT2
CH1
- +
+IN1 3
CH2
+ -
VSS 4
6 -IN2
5 +IN2
4
VSS
5
+IN2
6
-IN2
7
OUT2
8
VDD
BU7487F, BU7487SF : SOP14
BU7487FV, BU7487SFV : SSOP-B14
Pin No.
Pin Name
14 OUT4
1
OUT1
13 -IN4
2
-IN1
3
+IN1
4
VDD
5
+IN2
OUT1
1
-IN1
2
+IN1
3
12 +IN4
VDD
4
11 VSS
+IN2
5
10 +IN3
-IN2
6
OUT2
7
CH1
－
- ＋
+
- ＋
+
－
CH2
CH4
＋
+ －
＋
+ －CH3
9
-IN3
8
OUT3
6
-IN2
7
OUT2
8
OUT3
9
-IN3
10
+IN3
11
VSS
12
+IN4
13
-IN4
14
OUT4
Package
SSOP5
SOP8
SSOP-B8
MSOP8
SOP14
SSOP-B14
BU7485G
BU7485SG
BU7486F
BU7486SF
BU7486FV
BU7486SFV
BU7486FVM
BU7486SFVM
BU7487F
BU7487SF
BU7487FV
BU7487SFV
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BU7485G
BU7485SG
BU7486xxx
BU7486Sxxx
BU7487xx
BU7487Sxx
Datasheet
Ordering Information
B
U
7
4
8
x
x
x
x
x
-
xx
Packaging and forming specification
E2: Embossed tape and reel
(SOP8/SSOP-B8/SOP14/ SSOP-B14)
TR: Embossed tape and reel
(SSOP5/MSOP8)
Package
G:FVMIISSOP5
F:FVMESOP8
SOP14
FV:FMVSSOP-B8
SSOP-B14
FVM:FFMSOP8
Part Number
BU7485G
BU7485SG
BU7486xxx
BU7486Sxxx
BU7487xx
BU7487Sxx
Line-up
Topr
Package
SSOP5
-40°C to +85°C
-40°C to +105°C
Operable Part Number
Reel of 3000
BU7485G-TR
SOP8
Reel of 2500
BU7486F-E2
SSOP-B8
Reel of 2500
BU7486FV-E2
MSOP8
Reel of 3000
BU7486FVM-TR
SOP14
Reel of 2500
BU7487F-E2
SSOP-B14
Reel of 2500
BU7487FV-E2
SSOP5
Reel of 3000
BU7485SG-TR
SOP8
Reel of 2500
BU7486SF-E2
SSOP-B8
Reel of 2500
BU7486SFV-E2
MSOP8
Reel of 3000
BU7486SFVM-TR
SOP14
Reel of 2500
BU7487SF-E2
SSOP-B14
Reel of 2500
BU7487SFV-E2
Absolute Maximum Ratings(Ta=25C)
Parameter
Supply Voltage
Power dissipation
Differential Input Voltage *8
Input Common-mode
Voltage Range
Input Current *9
Operating Supply Voltage
Operating Temperature
Storage Temperature
Maximum Junction Temperature
Symbol
Ratings
BU7485Sx/BU7486Sxxx
/BU7487Sxx
+7
0.54*1*7
0.55*2*7
0.50*3*7
0.47*4*7
0.70*5*7
0.45*6*7
VDD – VSS
BU7485G/BU7486xxx
/BU7487xx
VDD-VSS
SSOP5
SOP8
SSOP-B8
Pd
MSOP8
SOP14
SSOP-B14
Vid
Unit
V
W
V
Vicm
(VSS - 0.3) to VDD + 0.3
V
Ii
Vopr
Topr
Tstg
±10
+3.0 to +5.5
-55 to +125
mA
V
C
C
+125
C
-40 to +85
Tjmax
-40 to +105
Note: Absolute maximum rating item indicates the condition which must not be exceeded.
Application of voltage in excess of absolute maximum rating or use out absolute maximum rated
temperature environment may cause deterioration of characteristics.
*1
To use at temperature above Ta＝25C reduce 5.4mW.
*2
To use at temperature above Ta＝25C reduce 5.5mW.
*3
To use at temperature above Ta＝25C reduce 5.0mW.
*4
To use at temperature above Ta＝25C reduce 4.7mW.
*5
To use at temperature above Ta＝25C reduce 7.0mW.
*6
To use at temperature above Ta＝25C reduce 4.5mW.
*7
Mounted on a FR4 glass epoxy PCB(70mm×70mm×1.6mm).
*8
The voltage difference between inverting input and non-inverting input is the differential input voltage.
Then input pin voltage is set to more than VSS.
*9
An excessive input current will flow when input voltages of more than VDD+0.6V or lesser than VSS-0.6V are applied.
The input current can be set to less than the rated current by adding a limiting resistor.
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TSZ02201-0RAR1G200380-1-2
12.JUL.2013 Rev.001
BU7485G
BU7485SG
BU7486xxx
BU7486Sxxx
BU7487xx
BU7487Sxx
Datasheet
Electrical Characteristics
○BU7485G, BU7485SG（Unless otherwise specified VDD=+3V, VSS=0V, Ta=25C）
Limits
Temperature
Parameter
Symbol
Range
Min
Typ
Max
Unit
Condition
Input Offset Voltage *10
Vio
25C
-
1
9.5
mV
-
Input Offset Current *10
Iio
25C
-
1
-
pA
-
Input Bias Current *10
Ib
25C
-
1
-
pA
-
Supply Current *11
Maximum Output Voltage
(High)
Maximum Output Voltage
(Low)
Large Signal Voltage Gain
25C
-
1500
2000
Full range
-
-
2400
VOH
25C
VDD-0.1
-
VOL
25C
-
Av
25C
IDD
μA
RL=∞
Av=0dB, IN=0.8V
-
V
RL=10kΩ
-
VSS+0.1
V
RL=10kΩ
70
105
-
dB
RL=10kΩ
VSS to VDD-1.4V
Input Common-mode
Voltage Range
Common-mode Rejection
Ratio
Power Supply Rejection
Ratio
Vicm
25C
0
-
1.6
V
CMRR
25C
45
60
-
dB
-
PSRR
25C
60
80
-
dB
-
Output Source Current *12
Isource
25C
4
8
-
mA
VDD-0.4V
Isink
25C
7
12
-
mA
VSS+0.4V
SR
25C
-
10
-
V/μs
CL=25pF
Unity Gain Frequency
fT
25C
-
10
-
MHz
CL=25pF, Av=40dB
Phase Margin
θ
25C
-
50
-
deg
CL=25pF, Av=40dB
THD+N
25C
-
0.03
-
%
Output Sink Current *12
Slew Rate
Total Harmonic Distortion
+Noise
*10
*11
*12
OUT=0.7VP-P, f=1kHz
Absolute value
Full range BU7485G: Ta=-40C to +85C BU7485SG: Ta=-40C to +105C
Under the high temperature environment, consider the power dissipation of IC when selecting the output current.
When the terminal short circuits are continuously output, the output current is reduced to climb to the temperature inside IC.
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TSZ02201-0RAR1G200380-1-2
12.JUL.2013 Rev.001
BU7485G
BU7485SG
BU7486xxx
BU7486Sxxx
BU7487xx
BU7487Sxx
○BU7486xxx, BU7486Sxxx（Unless otherwise specified VDD=+3V, VSS=0V, Ta=25C）
Limits
Temperature
Unit
Parameter
Symbol
Range
Min
Typ
Max
Datasheet
Condition
Input Offset Voltage *13
Vio
25C
-
1
9.5
mV
-
Input Offset Current *13
Iio
25C
-
1
-
pA
-
Input Bias Current *13
Ib
25C
-
1
-
pA
-
25C
-
3000
4000
Full range
-
-
4500
VOH
25C
VDD-0.1
-
VOL
25C
-
Av
25C
Supply Current *14
Maximum Output Voltage
(High)
Maximum Output Voltage
(Low)
Large Signal Voltage Gain
IDD
μA
RL=∞, All Op-Amps
Av=0dB, IN=0.8V
-
V
RL=10kΩ
-
VSS+0.1
V
RL=10kΩ
70
105
-
dB
RL=10kΩ
VSS to VDD-1.4V
Input Common-mode
Voltage Range
Common-mode Rejection
Ratio
Power Supply Rejection
Ratio
Vicm
25C
0
-
1.6
V
CMRR
25C
45
60
-
dB
-
PSRR
25C
60
80
-
dB
-
Output Source Current *15
Isource
25C
4
8
-
mA
VDD-0.4V
Isink
25C
7
12
-
mA
VSS+0.4V
SR
25C
-
10
-
V/μs
CL=25pF
Unity Gain Frequency
fT
25C
-
10
-
MHz
CL=25pF, Av=40dB
Phase Margin
θ
25C
-
50
-
deg
CL=25pF, Av=40dB
THD+N
25C
-
0.03
-
%
OUT=0.7VP-P, f=1kHz
CS
25C
-
100
-
dB
Av=40dB
Output Sink Current *15
Slew Rate
Total Harmonic Distortion
+Noise
Channel Separation
*13
*14
*15
Absolute value
Full range BU7486xxx: Ta=-40C to +85C BU7486Sxxx: Ta=-40C to +105C
Under the high temperature environment, consider the power dissipation of IC when selecting the output current.
When the terminal short circuits are continuously output, the output current is reduced to climb to the temperature inside IC.
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TSZ02201-0RAR1G200380-1-2
12.JUL.2013 Rev.001
BU7485G
BU7485SG
BU7486xxx
BU7486Sxxx
BU7487xx
BU7487Sxx
○BU7487xx, BU7487Sxx（Unless otherwise specified VDD=+3V, VSS=0V, Ta=25C）
Limits
Temperature
Unit
Parameter
Symbol
Range
Min
Typ
Max
Datasheet
Condition
Input Offset Voltage *16
Vio
25C
-
1
9.5
mV
-
Input Offset Current *16
Iio
25C
-
1
-
pA
-
Input Bias Current *16
Ib
25C
-
1
-
pA
-
Supply Current *17
Maximum Output Voltage
(High)
Maximum Output Voltage
(Low)
Large Signal Voltage Gain
25C
-
6000
8000
Full range
-
-
9000
VOH
25C
VDD-0.1
-
VOL
25C
-
Av
25C
IDD
μA
RL=∞, All Op-Amps
Av=0dB, IN=0.8V
-
V
RL=10kΩ
-
VSS+0.1
V
RL=10kΩ
70
105
-
dB
RL=10kΩ
VSS to VDD-1.4V
Input Common-mode
Voltage Range
Common-mode Rejection
Ratio
Power Supply Rejection
Ratio
Vicm
25C
0
-
1.6
V
CMRR
25C
45
60
-
dB
-
PSRR
25C
60
80
-
dB
-
Output Source Current *18
Isource
25C
4
8
-
mA
VDD-0.4V
Isink
25C
7
12
-
mA
VSS+0.4V
SR
25C
-
10
-
V/μs
CL=25pF
Unity Gain Frequency
fT
25C
-
10
-
MHz
CL=25pF, Av=40dB
Phase Margin
θ
25C
-
50
-
deg
CL=25pF, Av=40dB
THD+N
25C
-
0.03
-
%
OUT=0.7VP-P, f=1kHz
CS
25C
-
100
-
dB
Av=40dB
Output Sink Current *18
Slew Rate
Total Harmonic Distortion
+Noise
Channel Separation
*16
*17
*18
Absolute value
Full range BU7487xx: Ta=-40C to +85C BU7487Sxx: Ta=-40C to +105C
Under the high temperature environment, consider the power dissipation of IC when selecting the output current.
When the terminal short circuits are continuously output, the output current is reduced to climb to the temperature inside IC.
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TSZ02201-0RAR1G200380-1-2
12.JUL.2013 Rev.001
BU7485G
BU7485SG
BU7486xxx
BU7486Sxxx
BU7487xx
BU7487Sxx
Datasheet
Description of Electrical Characteristics
Described below are descriptions of the relevant electrical terms used in this datasheet. Items and symbols used are also
shown. Note that item name and symbol and their meaning may differ from those on another manufacturer’s document or
general document.
1. Absolute maximum ratings
Absolute maximum rating items indicate the condition which must not be exceeded. Application of voltage in excess of absolute
maximum rating or use out of absolute maximum rated temperature environment may cause deterioration of characteristics.
1.1 Supply Voltage (VDD/VSS)
Indicates the maximum voltage that can be applied between the VDD terminal and VSS terminal without
deterioration or destruction of characteristics of internal circuit.
1.2 Differential Input Voltage (Vid)
Indicates the maximum voltage that can be applied between non-inverting and inverting terminals without damaging
the IC.
1.3 Input Common-mode Voltage Range (Vicm)
Indicates the maximum voltage that can be applied to the non-inverting and inverting terminals without deterioration
or destruction of electrical characteristics. Input common-mode voltage range of the maximum ratings does not assure
normal operation of IC. For normal operation, use the IC within the input common-mode voltage range characteristics.
1.4 Power dissipation (Pd)
Indicates the power that can be consumed by the IC when mounted on a specific board at the ambient temperature 25C
(normal temperature). As for package product, Pd is determined by the temperature that can be permitted by the IC in
the package (maximum junction temperature) and the thermal resistance of the package.
2. Electrical characteristics
2.1 Input Offset Voltage (Vio)
Indicates the voltage difference between non-inverting terminal and inverting terminals. It can be translated into the
input voltage difference required for setting the output voltage at 0 V.
2.2 Input Offset Current (Iio)
Indicates the difference of input bias current between the non-inverting and inverting terminals.
2.3 Input Bias Current (Ib)
Indicates the current that flows into or out of the input terminal. It is defined by the average of input bias currents at
the non-inverting and inverting terminals.
2.4 Supply Current (IDD)
Indicates the current that flows within the IC under specified no-load conditions.
2.5 Maximum Output Voltage(High) / Maximum Output Voltage(Low) (VOH/VOL)
Indicates the voltage range of the output under specified load condition. It is typically divided into maximum output
voltage High and low. Maximum output voltage high indicates the upper limit of output voltage. Maximum output
voltage low indicates the lower limit.
2.6 Large Signal Voltage Gain (Av)
Indicates the amplifying rate (gain) of output voltage against the voltage difference between non-inverting terminal
and inverting terminal. It is normally the amplifying rate (gain) with reference to DC voltage.
Av = (Output voltage) / (Differential Input voltage)
2.7 Input Common-mode Voltage Range (Vicm)
Indicates the input voltage range where IC normally operates.
2.8 Common-mode Rejection Ratio (CMRR)
Indicates the ratio of fluctuation of input offset voltage when the input common mode voltage is changed. It is
normally the fluctuation of DC.
CMRR = (Change of Input common-mode voltage)/(Input offset fluctuation)
2.9 Power Supply Rejection Ratio (PSRR)
Indicates the ratio of fluctuation of input offset voltage when supply voltage is changed.
It is normally the fluctuation of DC.
PSRR= (Change of power supply voltage)/(Input offset fluctuation)
2.10 Output Source Current/ Output Sink Current (Isource / Isink)
The maximum current that can be output from the IC under specific output conditions. The output source current
indicates the current flowing out from the IC, and the output sink current indicates the current flowing into the IC.
2.11 Slew Rate (SR)
Indicates the ratio of the change in output voltage with time when a step input signal is applied.
2.12 Unity Gain Frequency (fT)
Indicates a frequency where the voltage gain of operational amplifier is 1.
2.13 Phase Margin (θ)
Indicates the margin of phase from 180 degree phase lag at unity gain frequency.
2.14 Total Harmonic Distortion+Noise (THD+N)
Indicates the fluctuation of input offset voltage or that of output voltage with reference to the change of output voltage
of driven channel.
2.15 Channel Separation (CS)
Indicates the fluctuation in the output voltage of the driven channel with reference to the change of output voltage of
the channel which is not driven.
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TSZ02201-0RAR1G200380-1-2
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BU7485G
BU7485SG
BU7486xxx
BU7486Sxxx
BU7487xx
BU7487Sxx
Datasheet
Typical Performance Curves
○BU7485G, BU7485SG
0.8
POWER DISSIPATION [W] .
POWER DISSIPATION [W] .
0.8
0.6
BU7485G
0.4
0.2
0
85
25
50
75
100
AMBIENT TEMPERATURE [°C]
0
0.6
BU7485SG
0.4
0.2
0
105
25
50
75
100
AMBIENT TEMPERATURE [°C]
0
125
Figure 3.
Derating curve
4
4
3
3
SUPPLY CURRENT [mA]
SUPPLY CURRENT [mA]
Figure 2.
Derating curve
85C
105C
2
25C
1
125
-40C
0
5.5V
4.0V
2
3.0V
1
0
2.5
3
3.5
4
4.5
5
SUPPLY VOLTAGE [V]
5.5
6
-50
Figure 4.
Supply Current – Supply Voltage
-25
0
25
50
75
100
AMBIENT TEMPERATURE [°C]
125
Figure 5.
Supply Current – Ambient Temperature
(*)The above characteristics are measurements of typical sample, they are not guaranteed.
BU7485G: -40C to +85C BU7485SG: -40C to +105C
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TSZ02201-0RAR1G200380-1-2
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BU7485G
BU7485SG
BU7486xxx
BU7486Sxxx
BU7487xx
Datasheet
BU7487Sxx
Typical Performance Curves - Continued
○BU7485G, BU7485SG
6
6
85C
4
25C
-40C
3
5.5V
5
105C
OUTPUT VOLTAGE HIGH [V]
OUTPUT VOLTAGE HIGH [V]
5
2
1
4.0V
4
3.0V
3
2
1
0
0
2
3
4
5
SUPPLY VOLTAGE [V]
-50
6
-25
Figure 6.
Maximum Output Voltage High –
Supply Voltage
(RL=10kΩ)
125
Figure 7.
Maximum Output Voltage High –
Ambient Temperature
(RL=10kΩ)
20
OUTPUT VOLTAGE LOW [mV]
20
OUTPUT VOLTAGE LOW [mV]
0
25
50
75
100
AMBIENT TEMPERATURE [°C]
15
10
85C
25C
105C
5
15
10
5.5V
4.0V
5
3.0V
-40C
0
0
2.5
3
3.5
4
4.5
5
SUPPLY VOLTAGE [V]
5.5
-50
6
-25
0
25
50
75
100
AMBIENT TEMPERATURE [°C]
125
Figure 9.
Maximum Output Voltage Low –
Ambient Temperature
(RL=10kΩ)
Figure 8.
Maximum Output Voltage Low –
Supply Voltage
(RL=10kΩ)
(*)The above characteristics are measurements of typical sample, they are not guaranteed.
BU7485G: -40C to +85C BU7485SG: -40C to +105C
www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111･15･001
9/39
TSZ02201-0RAR1G200380-1-2
12.JUL.2013 Rev.001
BU7485G
BU7485SG
BU7486xxx
BU7486Sxxx
BU7487xx
Datasheet
BU7487Sxx
Typical Performance Curves - Continued
○BU7485G, BU7485SG
20
OUTPUT SOURCE CURRENT [mA]
OUTPUT SOURCE CURRENT [mA]
50
40
-40C
30
25C
20
10
105C
85C
15
5.5V
4.0V
10
5
3.0V
0
0
0
0.5
1
1.5
2
2.5
-50
3
-25
0
25
50
75
100
125
AMBIENT TEMPERATURE [°C]
OUTPUT VOLTAGE [V]
Figure 11.
Output Source Current – Ambient Temperature
(OUT=VDD-0.4V)
Figure 10.
Output Source Current – Output Voltage
(VDD=3V)
40
80
OUTPUT SINK CURRENT [mA]
OUTPUT SINK CURRENT [mA]
70
60
-40C
25C
50
40
30
20
85C
105C
30
4.0V
5.5V
20
10
3.0V
10
0
0
0.0
0.5
1.0
1.5
2.0
2.5
-50
3.0
-25
0
25
50
75
100
OUTPUT VOLTAGE [V]
AMBIENT TEMPERATURE [°C]
Figure 12.
Output Sink Current – Output Voltage
(VDD=3V)
Figure 13.
Output Sink Current – Ambient Temperature
(OUT=VSS+0.4V)
125
(*)The above characteristics are measurements of typical sample, they are not guaranteed.
BU7485G: -40C to +85C BU7485SG: -40C to +105C
www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111･15･001
10/39
TSZ02201-0RAR1G200380-1-2
12.JUL.2013 Rev.001
BU7485G
BU7485SG
BU7486xxx
BU7486Sxxx
BU7487xx
BU7487Sxx
Datasheet
Typical Performance Curves - Continued
○BU7485G, BU7485SG
7.5
7.5
INPUT OFFSET VOLTAGE [mV]
10.0
INPUT OFFSET VOLTAGE [mV]
10.0
5.0
2.5
105C
85C
0.0
25C
-2.5
-40C
-5.0
-7.5
5.0
2.5
5.5V
0.0
3.0V
-2.5
-5.0
-7.5
-10.0
-10.0
2
3
4
5
6
-50
-25
SUPPLY VOLTAGE [V]
Figure 14.
Input Offset Voltage – Supply Voltage
(Vicm=VDD-1.4V, OUT=1.5V)
0
25
50
75
100
AMBIENT TEMPERATURE [°C]
125
Figure 15.
Input Offset Voltage – Ambient Temperature
(Vicm=VDD-1.4V, OUT=1.5V)
140
LARGE SIGNAL VOLTAGE GAIN [dB] L
15
INPUT OFFSET VOLTAGE [mV]
4.0V
10
5
85C
105C
0
25C
-40C
-5
-10
120
-40C
100
80
105C
25C
85C
60
40
20
-15
0
-1
0
1
2
COMMON MODE INPUT VOLTAGE [V]
3
2
Figure 16.
Input Offset Voltage – Common Mode
Input Voltage
(VDD=3V)
3
4
5
SUPPLY VOLTAGE [V]
6
Figure 17.
Large Signal Voltage Gain – Supply Voltage
(*)The above characteristics are measurements of typical sample, they are not guaranteed.
BU7485G: -40C to +85C BU7485SG: -40C to +105C
www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111･15･001
11/39
TSZ02201-0RAR1G200380-1-2
12.JUL.2013 Rev.001
BU7485G
BU7485SG
BU7486xxx
BU7486Sxxx
BU7487xx
BU7487Sxx
Datasheet
Typical Performance Curves - Continued
○BU7485G, BU7485SG
120
COMMON MODE REJECTION RATIO [dB]L
LARGE SIGNAL VOLTAGE GAIN [dB] L
160
140
120
5.5V
4.0V
3.0V
100
80
100
80
25C
85C
105C
60
40
20
60
0
-50
-25
0
25
50
75
100
AMBIENT TEMPERATURE [°C]
125
2
Figure 18
Large Signal Voltage Gain – Ambient Temperature
3
4
5
SUPPLY VOLTAGE [V]
6
Figure 19.
Common Mode Rejection Ratio – Supply Voltage
120
POWER SUPPLY REJECTION RATIO [dB]
120
COMMON MODE REJECTION RATIO [dB]L
-40C
3.0V
100
80
4.0V
5.5V
60
40
20
100
80
60
40
20
0
0
-50
-25
0
25
50
75
100
AMBIENT TEMPERATURE [°C]
125
-50
-25
Figure 20.
Common Mode Rejection Ratio –
Ambient Temperature
0
25
50
75
100
AMBIENT TEMPERATURE [°C]
125
Figure 21.
Power Supply Rejection Ratio –
Ambient Temperature
(*)The above characteristics are measurements of typical sample, they are not guaranteed.
BU7485G: -40C to +85C BU7485SG: -40C to +105C
www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111･15･001
12/39
TSZ02201-0RAR1G200380-1-2
12.JUL.2013 Rev.001
BU7485G
BU7485SG
BU7486xxx
BU7486Sxxx
BU7487xx
BU7487Sxx
Datasheet
Typical Performance Curves - Continued
○BU7485G, BU7485SG
12.0
30.0
5.5V
25.0
4.0V
3.0V
8.0
SLEW RATE H-L [V/μs]
SLEW RATE L-H [V/μs]
10.0
6.0
4.0
2.0
5.5V
20.0
4.0V
15.0
3.0V
10.0
5.0
0.0
0.0
-50
-25
0
25
50
75
100
AMBIENT TEMPERATURE [°C]
125
-50
Figure 22.
Slew Rate L-H – Ambient Temperature
-25
0
25
50
75
100
AMBIENT TEMPERATURE [°C]
125
Figure 23.
Slew Rate H-L – Ambient Temperature
200
100
Phase
80
60
100
40
Gain
PHASE [deg]
GAIN[dB]
150
50
20
0
1.E+00
1
0
1.E+01
101
1.E+02
102
1.E+03
103
1.E+04
104
1.E+05
105
FREQUENCY [kHz]
Figure 24.
Voltage Gain・Phase－Frequency
(*)The above characteristics are measurements of typical sample, they are not guaranteed.
BU7485G: -40C to +85C BU7485SG: -40C to +105C
www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111･15･001
13/39
TSZ02201-0RAR1G200380-1-2
12.JUL.2013 Rev.001
BU7485G
BU7485SG
BU7486xxx
BU7486Sxxx
BU7487xx
Datasheet
BU7487Sxx
Typical Performance Curves - Continued
○BU7486xxx, BU7486Sxxx
0.8
0.6
POWER DISSIPATION [W] .
POWER DISSIPATION [W] .
0.8
BU7486F
BU7486FV
0.4
0.2
0.6
BU7486SF
BU7486SFV
0.4
0.2
BU7486FVM
0
BU7486SFVM
0
85
0
25
50
75
100
AMBIENT TEMPERATURE [°C]
125
105
0
25
50
75
100
AMBIENT TEMPERATURE [°C]
Figure 25.
Derating curve
125
Figure 26.
Derating curve
5.0
5.0
4.5
4.5
105C
85C
3.5
3.0
2.5
2.0
25C
-40C
1.5
1.0
4.0V
3.5
3.0
2.5
1.5
1.0
0.5
0.0
0.0
3
4
5
SUPPLY VOLTAGE [V]
3.0V
2.0
0.5
2
5.5V
4.0
SUPPLY CURRENT [mA]
SUPPLY CURRENT [mA]
4.0
-50
6
Figure 27.
Supply Current – Supply Voltage
-25
0
25
50
75
100
AMBIENT TEMPERATURE [°C]
125
Figure 28.
Supply Current – Ambient Temperature
(*)The above characteristics are measurements of typical sample, they are not guaranteed.
BU7486xxx: -40C to +85C BU7486Sxxx: -40C to +105C
www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111･15･001
14/39
TSZ02201-0RAR1G200380-1-2
12.JUL.2013 Rev.001
BU7485G
BU7485SG
BU7486xxx
BU7486Sxxx
BU7487xx
BU7487Sxx
Datasheet
Typical Performance Curves - Continued
○BU7486xxx, BU7486Sxxx
6
6
105C
5
OUTPUT VOLTAGE HIGH [V]
OUTPUT VOLTAGE HIGH [V]
5
25C
85C
4
-40C
3
2
1
5.5V
4.0V
4
3
3.0V
2
1
0
0
2
3
4
5
SUPPLY VOLTAGE [V]
6
-50
10
10
9
9
8
105C
7
85C
6
5
4
25C
3
-40C
2
8
4.0V
5
4
3
3.0V
2
0
0
4
5
SUPPLY VOLTAGE [V]
5.5V
6
1
3
125
7
1
2
0
25
50
75
100
AMBIENT TEMPERATURE [°C]
Figure 30.
Maximum Output Voltage High –
Ambient Temperature
(RL=10kΩ)
OUTPUT VOLTAGE LOW [mV]
OUTPUT VOLTAGE LOW [mV]
Figure 29.
Maximum Output Voltage High –
Supply Voltage
(RL=10kΩ)
-25
-50
6
Figure 31.
Maximum Output Voltage Low –
Supply Voltage
(RL=10kΩ)
-25
0
25
50
75
100
AMBIENT TEMPERATURE [°C]
125
Figure 32.
Maximum Output Voltage Low –
Ambient Temperature
(RL=10kΩ)
(*)The above characteristics are measurements of typical sample, they are not guaranteed.
BU7486xxx: -40C to +85C BU7486Sxxx: -40C to +105C
www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111･15･001
15/39
TSZ02201-0RAR1G200380-1-2
12.JUL.2013 Rev.001
BU7485G
BU7485SG
BU7486xxx
BU7486Sxxx
BU7487xx
Datasheet
BU7487Sxx
Typical Performance Curves - Continued
○BU7486xxx, BU7486Sxxx
40
35
OUTPUT SOURCE CURRENT [mA]
OUTPUT SOURCE CURRENT [mA]
40
30
-40C
25
25C
20
15
85C
105C
10
5
30
20
4.0V
5.5V
10
3.0V
0
0
0
1
2
OUTPUT VOLTAGE [V]
-50
3
0
25
50
75
100
125
AMBIENT TEMPERATURE [°C]
Figure 33.
Output Source Current – Output Voltage
(VDD=3V)
Figure 34.
Output Source Current –Ambient Temperature
(OUT=VDD-0.4V)
40
60
-40C
OUTPUT SINK CURRENT [mA]
OUTPUT SINK CURRENT [mA]
-25
25C
40
105C
85C
20
30
4.0V
5.5V
20
10
0
3.0V
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
-50
OUTPUT VOLTAGE [V]
-25
0
25
50
75
100
125
AMBIENT TEMPERATURE [°C]
Figure 36.
Output Sink Current – Ambient Temperature
(OUT=VSS+0.4V)
Figure 35.
Output Sink Current – Output Voltage
(VDD=3V)
(*)The above characteristics are measurements of typical sample, they are not guaranteed.
BU7486xxx: -40C to +85C BU7486Sxxx: -40C to +105C
www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111･15･001
16/39
TSZ02201-0RAR1G200380-1-2
12.JUL.2013 Rev.001
BU7485G
BU7485SG
BU7486xxx
BU7486Sxxx
BU7487xx
BU7487Sxx
Datasheet
Typical Performance Curves - Continued
10
10.0
8
7.5
INPUT OFFSET VOLTAGE [mV]
INPUT OFFSET VOLTAGE [mV]
○BU7486xxx, BU7486Sxxx
5
25℃
-40℃
3
0
85℃
105℃
-3
-5
5.0
3.0V
-2.5
-5.0
-7.5
-10
-10.0
3
4
5
SUPPLY VOLTAGE [V]
6
-50
Figure 37.
Input Offset Voltage – Supply Voltage
-25
0
25
50
75
100
AMBIENT TEMPERATURE [°C]
125
Figure 38.
Input Offset Voltage – Ambient Temperature
15
140
LARGE SIGNAL VOLTAGE GAIN [dB] L
INPUT OFFSET VOLTAGE [mV]
5.5V
0.0
-8
2
4.0V
2.5
10
-40℃
5
25℃
0
105℃
85℃
-5
-10
-40℃
120
25℃
100
80
105℃
85℃
60
40
20
-15
0
-1
0
1
2
INPUT VOLTAGE [V]
3
2
Figure 39.
Input Offset Voltage – Common Mode
Input Voltage
(VDD=3V)
3
4
5
SUPPLY VOLTAGE [V]
6
Figure 40.
Large Signal Voltage Gain – Supply Voltage
(*)The above characteristics are measurements of typical sample, they are not guaranteed.
BU7486xxx: -40C to +85C BU7486Sxxx: -40C to +105C
www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111･15･001
17/39
TSZ02201-0RAR1G200380-1-2
12.JUL.2013 Rev.001
BU7485G
BU7485SG
BU7486xxx
BU7486Sxxx
BU7487xx
BU7487Sxx
Datasheet
Typical Performance Curves - Continued
○BU7486xxx, BU7486Sxxx
120
COMMON MODE REJECTION RATIO [dB].
LARGE SIGNAL VOLTAGE GAIN [dB] .
120
110
4.0V
100
5.5V
90
3.0V
80
70
110
-40℃
25℃
100
90
105℃
80
70
60
60
-50
-25
0
25
50
75
100
AMBIENT TEMPERATURE [°C]
2
125
3
4
5
SUPPLY VOLTAGE [V]
6
Figure 42.
Common Mode Rejection Ratio – Supply Voltage
Figure 41.
Large Signal Voltage Gain –
Ambient Temperature
120
120
POWER SUPPLY REJECTION RATIO [dB]
COMMON MODE REJECTION RATIO [dB].
85℃
110
3.0V
4.0V
100
90
5.5V
80
70
100
80
60
40
20
0
60
-50
-25
0
25
50
75
100
AMBIENT TEMPERATURE [°C]
-50
125
Figure 43.
Common Mode Rejection Ratio –
-25
0
25
50
75
100
AMBIENT TEMPERATURE [°C]
125
Figure 44.
Power Supply Rejection Ratio –
Ambient Temperature
Ambient Temperature
(*)The above characteristics are measurements of typical sample, they are not guaranteed.
BU7486xxx: -40C to +85C BU7486Sxxx: -40C to +105C
www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111･15･001
18/39
TSZ02201-0RAR1G200380-1-2
12.JUL.2013 Rev.001
BU7485G
BU7485SG
BU7486xxx
BU7486Sxxx
BU7487xx
BU7487Sxx
Datasheet
Typical Performance Curves - Continued
15
25
12
20
SLEW RATE H-L [V/μs]
SLEW RATE L-H [V/μs]
○BU7486xxx, BU7486Sxxx
5.5V
9
3.0V
4.0V
6
5.5V
4.0V
15
3.0V
10
3
5
0
0
-50
-25
0
25
50
75
100
AMBIENT TEMPERATURE [°C]
125
-50
Figure 45.
Slew Rate L-H – Ambient Temperature
-25
0
25
50
75
100
AMBIENT TEMPERATURE [°C]
125
Figure 46.
Slew Rate H-L – Ambient Temperature
200
100
Phase
80
60
100
40
Gain
PHASE [deg]
GAIN[dB]
150
50
20
0
1.E+00
1
0
1.E+01
101
1.E+02
102
1.E+03
103
1.E+04
104
1.E+05
105
FREQUENCY [Hz]
Figure 47.
Voltage Gain・Phase－Frequency
(*)The above characteristics are measurements of typical sample, they are not guaranteed.
BU7486xxx: -40C to +85C BU7486Sxxx: -40C to +105C
www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111･15･001
19/39
TSZ02201-0RAR1G200380-1-2
12.JUL.2013 Rev.001
BU7485G
BU7485SG
BU7486xxx
BU7486Sxxx
BU7487xx
Datasheet
BU7487Sxx
Typical Performance Curves
○BU7487xx, BU7487Sxx
800
600
POWER DISSIPATION [mW] .
POWER DISSIPATION [mW] .
800
BU7487F
400
BU7487FV
200
0
600
BU7487SF
400
200
0
85
0
25
50
75
BU7487SFV
100
105
0
125
25
50
100
125
AMBIENT TEMPERATURE [°C ]
Figure 49.
Derating curve
AMBIENT TEMPERATURE [°C]
Figure 48.
Derating curve
10
10
105C
9
9
4.0V
85C
8
8
SUPPLY CURRENT [mA] .
SUPPLY CURRENT [mA]
75
7
6
25C
5
-40C
4
3
2
7
6
4
3
2
1
0
0
3
4
5
SUPPLY VOLTAGE [V]
6
3.0V
5
1
2
5.5V
-50
Figure 50.
Supply Current – Supply Voltage
-25
0
25
50
75
100
AMBIENT TEMPERATURE [°C]
125
Figure 51.
Supply Current – Ambient Temperature
(*)The above characteristics are measurements of typical sample, they are not guaranteed.
BU7487xx: -40C to +85C BU7487Sxx: -40C to +105C
www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111･15･001
20/39
TSZ02201-0RAR1G200380-1-2
12.JUL.2013 Rev.001
BU7485G
BU7485SG
BU7486xxx
BU7486Sxxx
BU7487xx
BU7487Sxx
Datasheet
Typical Performance Curves - Continued
○BU7487xx, BU7487Sxx
6
6
105C
5
25C
4
85C
3
5.5V
OUTPUT VOLTAGE HIGH [V]
OUTPUT VOLTAGE HIGH [V]
5
-40C
2
1
4.0V
4
3
3.0V
2
1
0
0
2
3
4
5
SUPPLY VOLTAGE [V]
6
-50
10
10
9
9
8
105C
7
85C
6
5
4
3
-40C
25C
2
7
4
3
3.0V
2
0
6
4.0V
5
0
4
5
SUPPLY VOLTAGE [V]
5.5V
6
1
3
125
8
1
2
0
25
50
75
100
AMBIENT TEMPERATURE [°C]
Figure 53.
Maximum Output Voltage High – Ambient Temperature
(RL=10kΩ)
OUTPUT VOLTAGE LOW [mV]
OUTPUT VOLTAGE LOW [mV]
Figure 52.
Maximum Output Voltage High – Supply Voltage
(RL=10kΩ)
-25
-50
Figure 54.
Maximum Output Voltage Low – Supply Voltage
(RL=10kΩ)
-25
0
25
50
75
100
AMBIENT TEMPERATURE [°C]
125
Figure 55.
Maximum Output Voltage Low – Ambient Temperature
(RL=10kΩ)
(*)The above characteristics are measurements of typical sample, they are not guaranteed.
BU7487xx: -40C to +85C BU7487Sxx: -40C to +105C
www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111･15･001
21/39
TSZ02201-0RAR1G200380-1-2
12.JUL.2013 Rev.001
BU7485G
BU7485SG
BU7486xxx
BU7486Sxxx
BU7487xx
Datasheet
BU7487Sxx
Typical Performance Curves - Continued
○BU7487xx, BU7487Sxx
40
35
OUTPUT SOURCE CURRENT [mA] .
OUTPUT SOURCE CURRENT [mA]
40
30
-40C
25
25C
20
15
85C
10
105C
5
30
20
4.0V
5.5V
10
3.0V
0
0
0
0.5
1
1.5
2
2.5
3
-50
-25
OUTPUT VOLTAGE [V]
25
50
75
100
125
AMBIENT TEMPERATURE [°C]
Figure 56.
Output Source Current – Output Voltage
(VDD=3V)
Figure 57.
Output Source Current – Ambient Temperature
(OUT=VDD-0.4V)
60
40
-40C
OUTPUT SINK CURRENT [mA]
OUTPUT SINK CURRENT [mA]
0
25C
40
85C
105C
20
30
4.0V
5.5V
20
3.0V
10
0
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
-50
OUTPUT VOLTAGE [V]
-25
0
25
50
75
100
125
AMBIENT TEMPERATURE [°C]
Figure 58.
Output Sink Current – Output Voltage
(VDD=3V)
Figure 59.
Output Sink Current – Ambient Temperature
(OUT=VSS+0.4V)
(*)The above characteristics are measurements of typical sample, they are not guaranteed.
BU7487xx: -40C to +85C BU7487Sxx: -40C to +105C
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Datasheet
Typical Performance Curves - Continued
3
3
2
2
25C
INPUT OFFSET VOLTAGE [mV] .
INPUT OFFSET VOLTAGE [mV]
○BU7487xx, BU7487Sxx
-40C
1
85C
0
105C
-1
-2
1
4.0V
0
5.5V
-1
-2
-3
-3
2
3
4
5
SUPPLY VOLTAGE [V]
-50
6
-25
0
25
50
75
100
AMBIENT TEMPERATURE [°C]
125
Figure 61.
Input Offset Voltage – Ambient Temperature
Figure 60.
Input Offset Voltage – Supply Voltage
140
LARGE SIGNAL VOLTAGE GAIN [dB] .
15
INPUT OFFSET VOLTAGE [mV]
3.0V
10
5
25℃
-40℃
0
85℃
105℃
-5
-10
-40℃
120
25℃
100
80
105℃
85℃
60
40
20
0
-15
-1
0
1
2
INPUT VOLTAGE [V]
2
3
Figure 62.
Input Offset Voltage –
Common Mode Input Voltage
(VDD=3V)
3
4
5
SUPPLY VOLTAGE [V]
6
Figure 63.
Large Signal Voltage Gain – Supply Voltage
(*)The above characteristics are measurements of typical sample, they are not guaranteed.
BU7487xx: -40C to +85C BU7487Sxx: -40C to +105C
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Datasheet
Typical Performance Curves - Continued
○BU7487xx, BU7487Sxx
120
COMMON MODE REJECTION RATIO [dB]L
LARGE SIGNAL VOLTAGE GAIN [dB] .
120
110
100
3.0V
5.5V
90
4.0V
80
70
110
-40℃
100
25℃
90
85℃
105℃
80
70
60
60
-50
2
-25
0
25
50
75
100 125
AMBIENT TEMPERATURE [°C]
Figure 64.
Large Signal Voltage Gain – Ambient Temperature
4
5
SUPPLY VOLTAGE [V]
6
Figure 65.
Common Mode Rejection Ratio – Supply Voltage
120
120
POWER SUPPLY REJECTION RATIO [dB]
COMMON MODE REJECTION RATIO [dB]L
3
110
100
3.0V
4.0V
90
5.5V
80
70
100
80
60
40
20
0
60
-50
-25
0
25
50
75
100
AMBIENT TEMPERATURE [°C]
-50
125
-25
0
25
50
75
100
AMBIENT TEMPERATURE [°C]
125
Figure 67.
Power Supply Rejection Ratio –
Ambient Temperature
Figure 66.
Common Mode Rejection Ratio –
Ambient Temperature
(*)The above characteristics are measurements of typical sample, they are not guaranteed.
BU7487xx: -40C to +85C BU7487Sxx: -40C to +105C
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Datasheet
Typical Performance Curves - Continued
○BU7487xx, BU7487Sxx
25
16
14
SLEW RATE H-L [V/μs]
SLEW RATE L-H [V/μs]
20
12
5.5V
10
4.0V
3.0V
8
6
4
5.5V
15
4.0V
3.0V
10
5
2
0
0
-50
-25
0
25
50
75
100
AMBIENT TEMPERATURE [°C]
-50
125
Figure 68.
Slew Rate L-H – Ambient Temperature
100
-25
0
25
50
75
100
AMBIENT TEMPERATURE [°C]
125
Figure 69.
Slew Rate H-L – Ambient Temperature
200
Phase
80
60
100
40
Gain
PHASE [deg]
GAIN[dB]
150
50
20
0
1.E+00
1
0
1.E+01
101
1.E+02
102
1.E+03
103
1.E+04
104
1.E+05
105
FREQUENCY [Hz]
Figure 70.
Voltage Gain・Phase－Frequency
(*)The above characteristics are measurements of typical sample, they are not guaranteed.
BU7487xx: -40C to +85C BU7487Sxx: -40C to +105C
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Datasheet
Application Information
NULL method condition for Test circuit1
VDD, VSS, EK, Vicm Unit:V
Parameter
Input Offset Voltage
VF
S1
S2
S3
VDD
VSS
EK
VF1
ON
ON
OFF
3
0
-1.5
ON
ON
ON
3
0
ON
ON
OFF
3
0
-1.5
ON
ON
OFF
0
-0.9
VF2
Large Signal Voltage Gain
VF3
VF4
Common-mode Rejection Ratio
(Input Common-mode Voltage Range)
VF5
VF6
Power Supply Rejection Ratio
VF7
3
5.5
-0.5
-2.5
Vicm Calculation
1.8
1
0.9
2
0
1.8
0
3
4
－Calculation－
|VF1|
1. Input Offset Voltage (Vio)
Vio =
2. Large Signal Voltage Gain (Av)
Av = 20Log
[V]
1+RF/RS
2 × (1+RF/RS)
[dB]
|VF2-VF3|
3. Common-mode Rejection Ratio (CMRR)
1.8 × (1+RF/RS)
CMRR= 20Log
[dB]
|VF4 - VF5|
4. Power Supply Rejection Ratio (PSRR)
2.5 × (1+ RF/RS)
PSRR = 20Log
[dB]
|VF6 - VF7|
0.1μF
RF=50kΩ
SW1
RS=50Ω
500kΩ
0.01μF
VDD
15V
EK
Ri=1MΩ
Vo
500kΩ
0.015μF 0.015μF
DUT
SW3
RS=50Ω
1000pF
Ri=1MΩ
V VF
RL
Vicm
50kΩ
NULL
NULL
VRL
SW2
-15V
VSS
Figure 71. Test circuit 1 (one channel only)
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Switch Condition for Test circuit2
SW1 SW2 SW3 SW4 SW5 SW6 SW7 SW8 SW9 SW10 SW11 SW12
SW No.
Supply Current
OFF OFF
ON
OFF
ON
OFF OFF OFF OFF OFF OFF OFF
Maximum Output Voltage RL=10kΩ
OFF
ON
OFF OFF
ON
OFF OFF
Output Current
OFF
ON
OFF OFF
ON
OFF OFF OFF OFF
Slew Rate
OFF OFF
Unity Gain Frequency
ON
ON
OFF OFF
OFF OFF OFF
ON
ON
ON
ON
OFF OFF
ON
ON
OFF
OFF OFF
OFF
ON
OFF OFF
ON
OFF OFF OFF
ON
OFF OFF
ON
SW3
R2 100kΩ
SW4
●
VDD=3V
－
SW1
SW2
＋
SW5
SW6
SW7
SW8
SW9
RL
CL
SW10
SW11 SW12
R1
1kΩ
VSS
VIN-
VIN+
Vo
Figure 72. Test circuit 2
IN [V]
OUT[V]
SR = Δ V / Δ t
1.8 V
1.8 V
ΔV
1.8 V P-P
0V
0V
t
t
Δt
Input wave
Output wave
Figure 73. Slew rate input output wave
R2=100kΩ
R2=100kΩ
VDD
VDD
R1=1kΩ
R1=1kΩ
OUT1
VIN
R1//R2
OUT2
R1//R2
VSS
VSS
100×OUT1
CS=20Log
OUT2
Figure 74. Test circuit 3 (Channel Separation)
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Datasheet
Application example
○Voltage follower
Voltage gain is 0dB.
Using this circuit, the output voltage (OUT) is configured
to be equal to the input voltage (IN). This circuit also
stabilizes the output voltage (OUT) due to high input
impedance and low output impedance. Computation for
output voltage (OUT) is shown below.
OUT=IN
VDD
OUT
IN
VSS
Figure 75. Voltage follower
○Inverting amplifier
R2
For inverting amplifier, input voltage (IN) is amplified by
a voltage gain and depends on the ratio of R1 and R2.
The out-of-phase output voltage is shown in the next
expression
OUT=-(R2/R1)・IN
This circuit has input impedance equal to R1.
VDD
R1
IN
OUT
VSS
Figure 76. Inverting amplifier circuit
○Non-inverting amplifier
R1
R2
VDD
OUT
IN
VSS
For non-inverting amplifier, input voltage (IN) is
amplified by a voltage gain, which depends on the ratio
of R1 and R2. The output voltage (OUT) is in-phase
with the input voltage (IN) and is shown in the next
expression.
OUT=(1 + R2/R1)・IN
Effectively, this circuit has high input impedance since
its input side is the same as that of the operational
amplifier.
Figure 77. Non-inverting amplifier circuit
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Power Dissipation
Power dissipation (total loss) indicates the power that the IC can consume at Ta=25C (normal temperature). As the IC
consumes power, it heats up, causing its temperature to be higher than the ambient temperature. The allowable
temperature that the IC can accept is limited. This depends on the circuit configuration, manufacturing process, and
consumable power.
Power dissipation is determined by the allowable temperature within the IC (maximum junction temperature) and the
thermal resistance of the package used (heat dissipation capability). Maximum junction temperature is typically equal to the
maximum storage temperature. The heat generated through the consumption of power by the IC radiates from the mold
resin or lead frame of the package. Thermal resistance, represented by the symbol θjaC/W, indicates this heat dissipation
capability. Similarly, the temperature of an IC inside its package can be estimated by thermal resistance.
Figure 78. (a) shows the model of the thermal resistance of a package. The equation below shows how to compute for the
Thermal resistance (θja), given the ambient temperature (Ta), maximum junction temperature (Tjmax), and power
dissipation (Pd).
θja = (Tjmax-Ta) / Pd
C /W
・・・・・ (Ⅰ)
The Derating curve in Figure 78. (b) indicates the power that the IC can consume with reference to ambient temperature.
Power consumption of the IC begins to attenuate at certain temperatures. This gradient is determined by Thermal
resistance (θja), which depends on the chip size, power consumption, package, ambient temperature, package condition,
wind velocity, etc. This may also vary even when the same of package is used. Thermal reduction curve indicates a
reference value measured at a specified condition. Figure 79. (c) to (h) shows an example of the derating curve for
BU7485G, BU7485SG, BU7486xxx, BU7486Sxxx, BU7487xx, BU7487Sxx.
Power dissipation of LSI [W]
Pd(max)
θja =
(Tjmax －Ta) / Pd C / W
P2
θja2 <θja1
Ambient temperature Ta[C ]
θja2
P1
Tj(max)
θja1
0
Chip surface temperature Tj[ C]
Power dissipation Pd [W]
25
50
75
100
125
Ambient temperature Ta[C]
(b) Derating Curve
(a) Thermal resistance
Figure 78. Thermal resistance and Derating Curve
0.8
POWER DISSIPATION [W].
POWER DISSIPATION [W].
0.8
0.6
BU7485G(*19)
0.4
0.2
0
0
25
50
75
85
BU7485SG(*19)
0.4
0.2
0
100
125
0
25
50
75
105
100
125
AMBIENT TEMPERATURE [℃ ]
AMBIENT TEMPERATURE [℃ ]
(d)BU7485SG
(c)BU7485G
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0.6
BU7486F(*20)
BU7486FV(*21)
0.4
BU7486FVM(*22)
0.2
0
0
25
50
75
85
0.6
BU7486SF(*20)
BU7486SFV(*21)
0.4
BU7486SFVM(*22)
0.2
0
100
0
125
25
50
75
105
100
125
AMBIENT TEMPERATURE [℃ ]
AMBIENT TEMPERATURE [℃]
(e)BU7486F/FV/FVM
(f)BU7486SF/SFV/SFVM
0.8
POWER DISSIPATION [W] .
0.8
POWER DISSIPATION [W].
Datasheet
BU7487Sxx
0.8
POWER DISSIPATION [W]
POWER DISSIPATION [W].
0.8
BU7487xx
BU7487F(*23)
0.6
0.4
BU7487FV(*24)
0.2
BU7487SF(*23)
0.6
0.4
BU7487SFV(*24)
0.2
0
0
0
25
50
75
85
100
0
125
25
50
75
105
100
AMBIENT TEMPERATURE [℃ ]
AMBIENT TEMPERATURE [°C]
(g)BU7487F/FV
(h)BU7487SF/SFV
(*19)
(*20)
(*21)
(*22)
(*23)
(*24)
Unit
5.4
5.5
5.0
4.7
7.0
4.5
mW/C
125
When using the unit above Ta=25C, subtract the value above per degree C. Power dissipation is the value
when FR4 glass epoxy board 70mm×70mm×1.6mm (copper foil area below 3%) is mounted.
Figure 79. Derating Curve
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Operational Notes
Datasheet
VDD
1) Unused circuits
When there are unused circuits, it is recommended that they are
connected as in Figure .56, setting the non-inverting input terminal to a
potential within the in-phase input voltage range (Vicm).
2) Input voltage
Applying VSS-0.3V to VDD+0.3V to the input terminal is possible
without causing deterioration of the electrical characteristics or
destruction, regardless of the supply voltage. However, this does not
ensure normal circuit operation. Please note that the circuit operates
normally only when the input voltage is within the common mode input
voltage range of the electric characteristics.
Connect
to Vicm
Vicm
VSS
Figure 80. Example of application
circuit for unused op-amp
3) Power supply (single / dual)
The op-amp operates when the voltage supplied is between VDD and
VSS. Therefore, the single supply op-amp can be used as dual supply
op-amp as well.
4) Power Dissipation (Pd)
Using the unit in excess of the rated power dissipation may cause deterioration in electrical characteristics including
reduced current capability due to the rise of chip temperature. Therefore, please take into consideration the power
dissipation (Pd) under actual operating conditions and apply a sufficient margin in thermal design. Refer to the thermal
derating curves for more information.
5) Short-circuit between pins and erroneous mounting
Be careful when mounting the IC on printed circuit boards. The IC may be damaged if it is mounted in a wrong orientation
or if pins are shorted together. Short circuit may be caused by conductive particles caught between the pins.
6) Operation in a strong electromagnetic field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
7) IC handling
Applying mechanical stress to the IC by deflecting or bending the board may cause fluctuations of the electrical
characteristics due to piezo resistance effects.
8) Board Inspection
Connecting a capacitor to a pin with low impedance may stress the IC. Therefore, discharging the capacitor after every
process is recommended. In addition, when attaching and detaching the jig during the inspection phase, make sure that
the power is turned OFF before inspection and removal. Furthermore, please take measures against ESD in the
assembly process as well as during transportation and storage.
9) Output capacitor
If a large capacitor is connected between the output pin and VSS pin, current from the charged capacitor will flow into the
output pin and may destroy the IC when the VCC pin is shorted to ground or pulled down to 0V. Use a capacitor smaller
than 0.1uF between output pin and VSS pin.
10) Oscillation by output capacitor
Please pay attention to the oscillation by output capacitor and in designing an application of negative feedback loop
circuit with these ICs.
11) Latch up
Be careful of input voltage that exceed the VDD and VSS. When CMOS device have sometimes occur latch up and
protect the IC from abnormaly noise.
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Datasheet
Physical Dimensions Tape and Reel Information
Package Name
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SSOP5
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BU7487Sxx
Datasheet
SOP8
(Max 5.35 (include.BURR))
(UNIT : mm)
PKG : SOP8
Drawing No. : EX112-5001-1
<Tape and Reel information>
Tape
Embossed carrier tape
Quantity
2500pcs
Direction
of feed
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
Direction of feed
1pin
Reel
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BU7487Sxx
Datasheet
SSOP-B8
<Tape and Reel information>
Tape
Embossed carrier tape
Quantity
2500pcs
Direction
of feed
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
Direction of feed
1pin
Reel
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Package Name
BU7487xx
BU7487Sxx
Datasheet
MSOP8
<Tape and Reel information>
Tape
Embossed carrier tape
Quantity
3000pcs
Direction
of feed
TR
The direction is the 1pin of product is at the upper right when you hold
( reel on the left hand and you pull out the tape on the right hand
)
1pin
Direction of feed
Reel
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Package Name
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BU7487Sxx
Datasheet
SOP14
(Max 9.05 (include.BURR))
(UNIT : mm)
PKG : SOP14
Drawing No. : EX113-5001
<Tape and Reel information>
Tape
Embossed carrier tape
Quantity
2500pcs
Direction
of feed
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
Direction of feed
1pin
Reel
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Package Name
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BU7487Sxx
Datasheet
SSOP-B14
<Tape and Reel information>
Tape
Embossed carrier tape
Quantity
2500pcs
Direction
of feed
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
Direction of feed
1pin
Reel
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Datasheet
Marking Diagram
SSOP5(TOP VIEW)
SOP8(TOP VIEW)
Part Number Marking
Part Number Marking
LOT Number
1PIN MARK
LOT Number
SSOP-B8(TOP VIEW)
MSOP8(TOP VIEW)
Part Number Marking
Part Number Marking
LOT Number
LOT Number
1PIN MARK
1PIN MARK
SOP14(TOP VIEW)
Part Number Marking
SSOP-B14(TOP VIEW)
Part Number Marking
LOT Number
LOT Number
1PIN MARK
1PIN MARK
Product Name
BU7485
BU7485S
BU7486
Package Type
G
SSOP5
F
SOP8
FV
FVM
F
BU7486S
BU7487
BU7487S
FV
SSOP-B8
Marking
D5
FC
7486
MSOP8
SOP8
7486S
SSOP-B8
486S
FVM
MSOP8
7486S
F
SOP14
BU7487F
FV
F
FV
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SSOP-B14
7487
BU7487SF
7487S
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BU7485G
BU7485SG
BU7486xxx
BU7486Sxxx
BU7487xx
BU7487Sxx
Datasheet
Land pattern data
PKG
Land pitch
e
Land space
MIE
Land length
≧ℓ 2
Unit: mm
Land width
b2
0.95
2.4
1.0
0.6
1.27
4.60
1.10
0.76
0.65
4.60
1.20
0.35
0.65
2.62
0.99
0.35
SSOP5
SOP8
SOP14
SSOP-B8
SSOP-B14
MSOP8
SOP8, SSOP-B8, MSOP8
SOP14, SSOP-B14
SSOP5
e
e
ℓ2
e
MIE
MIE
b2
b2
ℓ 2
Revision History
Date
Revision
12.JUL.2013
001
Changes
New Release
www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved.
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Datasheet
Notice
●General Precaution
1) Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2) All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
●Precaution on using ROHM Products
1) Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment, transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
2)
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3)
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4)
The Products are not subject to radiation-proof design.
5)
Please verify and confirm characteristics of the final or mounted products in using the Products.
6)
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse) is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7)
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8)
Confirm that operation temperature is within the specified range described in the product specification.
9)
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Notice - Rev.004
© 2013 ROHM Co., Ltd. All rights reserved.
Datasheet
●Precaution for Mounting / Circuit board design
1) When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2)
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
●Precautions Regarding Application Examples and External Circuits
1) If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2)
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
●Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
●Precaution for Storage / Transportation
1) Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2)
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3)
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4)
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
●Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
●Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
●Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
●Precaution Regarding Intellectual Property Rights
1) All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2)
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Notice - Rev.004
© 2013 ROHM Co., Ltd. All rights reserved.
Datasheet
●Other Precaution
1) The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
2)
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
3)
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
4)
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
5)
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice - Rev.004
© 2013 ROHM Co., Ltd. All rights reserved.