ALTERA EPM570G100C5N

1. Introduction
MII51001-1.9
Introduction
The MAX® II family of instant-on, non-volatile CPLDs is based on a 0.18-µm,
6-layer-metal-flash process, with densities from 240 to 2,210 logic elements (LEs) (128
to 2,210 equivalent macrocells) and non-volatile storage of 8 Kbits. MAX II devices
offer high I/O counts, fast performance, and reliable fitting versus other CPLD
architectures. Featuring MultiVolt core, a user flash memory (UFM) block, and
enhanced in-system programmability (ISP), MAX II devices are designed to reduce
cost and power while providing programmable solutions for applications such as bus
bridging, I/O expansion, power-on reset (POR) and sequencing control, and device
configuration control.
Features
The MAX II CPLD has the following features:
© August 2009
■
Low-cost, low-power CPLD
■
Instant-on, non-volatile architecture
■
Standby current as low as 25 µA
■
Provides fast propagation delay and clock-to-output times
■
Provides four global clocks with two clocks available per logic array block (LAB)
■
UFM block up to 8 Kbits for non-volatile storage
■
MultiVolt core enabling external supply voltages to the device of either
3.3 V/2.5 V or 1.8 V
■
MultiVolt I/O interface supporting 3.3-V, 2.5-V, 1.8-V, and 1.5-V logic levels
■
Bus-friendly architecture including programmable slew rate, drive strength,
bus-hold, and programmable pull-up resistors
■
Schmitt triggers enabling noise tolerant inputs (programmable per pin)
■
I/Os are fully compliant with the Peripheral Component Interconnect Special
Interest Group (PCI SIG) PCI Local Bus Specification, Revision 2.2 for 3.3-V
operation at 66 MHz
■
Supports hot-socketing
■
Built-in Joint Test Action Group (JTAG) boundary-scan test (BST) circuitry
compliant with IEEE Std. 1149.1-1990
■
ISP circuitry compliant with IEEE Std. 1532
Altera Corporation
MAX II Device Handbook
1–2
Chapter 1: Introduction
Features
Table 1–1 shows the MAX II family features.
Table 1–1. MAX II Family Features
Feature
EPM240
EPM240G
EPM570
EPM570G
EPM1270
EPM1270G
EPM2210
EPM2210G
EPM240Z
EPM570Z
240
570
1,270
2,210
240
570
LEs
Typical Equivalent Macrocells
192
440
980
1,700
192
440
128 to 240
240 to 570
570 to 1,270
1,270 to 2,210
128 to 240
240 to 570
8,192
8,192
8,192
8,192
8,192
8,192
Maximum User I/O pins
80
160
212
272
80
160
tPD1 (ns) (1)
4.7
5.4
6.2
7.0
7.5
9.0
fCNT (MHz) (2)
304
304
304
304
152
152
tSU (ns)
1.7
1.2
1.2
1.2
2.3
2.2
tCO (ns)
4.3
4.5
4.6
4.6
6.5
6.7
Equivalent Macrocell Range
UFM Size (bits)
Notes to Table 1–1:
(1) tP D1 represents a pin-to-pin delay for the worst case I/O placement with a full diagonal path across the device and combinational logic
implemented in a single LUT and LAB that is adjacent to the output pin.
(2) The maximum frequency is limited by the I/O standard on the clock input pin. The 16-bit counter critical delay will run faster than this number.
f
For more information about equivalent macrocells, refer to the MAX II Logic Element to
Macrocell Conversion Methodology white paper.
MAX II and MAX IIG devices are available in three speed grades: –3, –4, and –5, with
–3 being the fastest. Similarly, MAX IIZ devices are available in three speed grades: –6,
–7, and –8, with –6 being the fastest. These speed grades represent the overall relative
performance, not any specific timing parameter. For propagation delay timing
numbers within each speed grade and density, refer to the DC and Switching
Characteristics chapter in the MAX II Device Handbook.
Table 1–2 shows MAX II device speed-grade offerings.
Table 1–2. MAX II Speed Grades
Speed Grade
Device
EPM240
–3
–4
–5
–6
–7
–8
v
v
v
—
—
—
v
v
v
—
—
—
v
v
v
—
—
—
v
v
v
—
—
—
EPM240G
EPM570
EPM570G
EPM1270
EPM1270G
EPM2210
EPM2210G
MAX II Device Handbook
EPM240Z
—
—
—
v
v
v
EPM570Z
—
—
—
v
v
v
© August 2009
Altera Corporation
Chapter 1: Introduction
Features
1–3
MAX II devices are available in space-saving FineLine BGA, Micro FineLine BGA,
and thin quad flat pack (TQFP) packages (refer to Table 1–3 and Table 1–4). MAX II
devices support vertical migration within the same package (for example, you can
migrate between the EPM570, EPM1270, and EPM2210 devices in the 256-pin
FineLine BGA package). Vertical migration means that you can migrate to devices
whose dedicated pins and JTAG pins are the same and power pins are subsets or
supersets for a given package across device densities. The largest density in any
package has the highest number of power pins; you must lay out for the largest
planned density in a package to provide the necessary power pins for migration. For
I/O pin migration across densities, cross reference the available I/O pins using the
device pin-outs for all planned densities of a given package type to identify which
I/O pins can be migrated. The Quartus ® II software can automatically cross-reference
and place all pins for you when given a device migration list.
Table 1–3. MAX II Packages and User I/O Pins
144-Pin
TQFP
144-Pin
Micro
FineLine
BGA (1)
256-Pin
Micro
FineLine
BGA (1)
256-Pin
FineLine
BGA
324-Pin
FineLine
BGA
80
—
—
—
—
—
76
76
116
—
160
160
—
—
—
—
116
—
212
212
—
—
—
—
—
—
—
—
204
272
EPM240Z
54
80
—
—
—
—
—
—
—
EPM570Z
—
76
—
—
—
116
160
—
—
256-Pin
Micro
FineLine
BGA
256-Pin
FineLine
BGA
324-Pin
FineLine
BGA
Device
68-Pin
Micro
FineLine
BGA (1)
100-Pin
Micro
FineLine
BGA (1)
100-Pin
FineLine
BGA
100-Pin
TQFP
—
80
80
—
76
—
EPM240
EPM240G
EPM570
EPM570G
EPM1270
EPM1270G
EPM2210
EPM2210G
Note to Table 1–3:
(1) Packages available in lead-free versions only.
Table 1–4. MAX II TQFP, FineLine BGA, and Micro FineLine BGA Package Sizes
68-Pin
Micro
FineLine
BGA
100-Pin
Micro
FineLine
BGA
100-Pin
FineLine
BGA
100-Pin
TQFP
144-Pin
TQFP
144-Pin
Micro
FineLine
BGA
Pitch (mm)
0.5
0.5
1
0.5
0.5
0.5
0.5
1
1
Area (mm2)
25
36
121
256
484
49
121
289
361
5×5
6×6
11 × 11
16 × 16
22 × 22
7×7
11 × 11
17 × 17
19 × 19
Package
Length × width
(mm × mm)
© August 2009
Altera Corporation
MAX II Device Handbook
1–4
Chapter 1: Introduction
Referenced Documents
MAX II devices have an internal linear voltage regulator which supports external
supply voltages of 3.3 V or 2.5 V, regulating the supply down to the internal operating
voltage of 1.8 V. MAX IIG and MAX IIZ devices only accept 1.8 V as the external
supply voltage. MAX IIZ devices are pin-compatible with MAX IIG devices in the
100-pin Micro FineLine BGA and 256-pin Micro FineLine BGA packages. Except for
external supply voltage requirements, MAX II and MAX II G devices have identical
pin-outs and timing specifications. Table 1–5 shows the external supply voltages
supported by the MAX II family.
Table 1–5. MAX II External Supply Voltages
EPM240
EPM570
EPM1270
EPM2210
EPM240G
EPM570G
EPM1270G
EPM2210G
EPM240Z
EPM570Z (1)
3.3 V, 2.5 V
1.8 V
1.5 V, 1.8 V, 2.5 V, 3.3 V
1.5 V, 1.8 V, 2.5 V, 3.3 V
Devices
MultiVolt core external supply voltage (VC CINT) (2)
MultiVolt I/O interface voltage levels (VC CIO)
Notes to Table 1–5:
(1) MAX IIG and MAX IIZ devices only accept 1.8 V on their VCCINT pins. The 1.8-V VCC INT external supply powers the device core directly.
(2) MAX II devices operate internally at 1.8 V.
Referenced Documents
This chapter references the following documents:
■
DC and Switching Characteristics chapter in the MAX II Device Handbook
■
MAX II Logic Element to Macrocell Conversion Methodology white paper
Document Revision History
Table 1–6 shows the revision history for this chapter.
Table 1–6. Document Revision History
Date and Revision
Changes Made
Summary of Changes
August 2009,
version 1.9
■
Updated Table 1–2.
October 2008,
version 1.8
■
Updated “Introduction” section.
■
Updated new Document Format.
December 2007,
version1.7
■
Updated Table 1–1 through Table 1–5.
■
Added “Referenced Documents” section.
December 2006,
version 1.6
■
Added document revision history.
—
August 2006,
version 1.5
■
Minor update to features list.
—
July 2006,
version 1.4
■
Minor updates to tables.
—
MAX II Device Handbook
Added information for speed grade –8
—
Updated document with MAX IIZ information.
© August 2009
Altera Corporation
Chapter 1: Introduction
Document Revision History
1–5
Table 1–6. Document Revision History
Date and Revision
Changes Made
Summary of Changes
June 2005,
version 1.3
■
Updated timing numbers in Table 1-1.
—
December 2004,
version 1.2
■
Updated timing numbers in Table 1-1.
—
June 2004,
version 1.1
■
Updated timing numbers in Table 1-1.
—
© August 2009
Altera Corporation
MAX II Device Handbook
1–6
MAX II Device Handbook
Chapter 1: Introduction
Document Revision History
© August 2009
Altera Corporation