TOSHIBA TLP2303

TLP2303
Photocouplers
GaAℓAs Infrared LED & Photo IC
TLP2303
1. Applications
•
Transistor Inverters
•
Communications Equipment
•
Home Electric Appliances
2. General
The Toshiba TLP2303 consists of a high-output GaAℓAs light-emitting diode coupled with a high-speed photodiodetransistor chip. It is housed in the SO6 package.
The high-speed, high-gain detector element is used, since the current transfer ratio is 900 % (@ IF = 0.5 mA)
minimum over -40 to 125 and thus is ideal for applications which require low input current and high-speed
data transmission.
TLP2303 corresponds to the transmission rate of 100 kbps, and has become a product which fills between a
general-purpose transistor coupler and IC couplers corresponding to 1 Mbps.
3. Features
(1)
Package: SO6
(2)
Operating temperature: -40 to 125 
(3)
Current transfer ratio: 900 % (min) @IF = 0.5 mA
(4)
Maximum output current: 80 mA
(5)
Propagation delay time: tpHL = 15 µs (max), tpLH = 50 µs (max) @ RL = 4.7 kΩ, IF = 0.5 mA, Ta = 25
(6)
Isolation voltage: 3750 Vrms (min)
(7)
Safety standards
UL-under application: UL1577 File No.E67349
cUL-under application: CSA Component Acceptance Service No.5A, File No.E67349
Note:
VDE-under application: Option (V4) EN60747-5-5 (Note)
When an EN60747-5-5 approved type is needed, please designate the Option (V4)
(V4).
4. Packaging and Pin Assignment
1: Anode
3: Cathode
4: GND (Emitter)
5: Output (Collector)
6: VCC
11-4L1S
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Rev.1.0
TLP2303
5. Internal Circuit
Fig. 5.1
Internal Circuit
6. Principle of Operation
6.1. Truth Table
Input
LED
Output
H
ON
L
L
OFF
H
6.2. Mechanical Parameters
Characteristics
Min
Unit
Creepage distances
5.0
mm
Clearance distances
5.0
Internal isolation thickness
0.4
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TLP2303
7. Absolute Maximum Ratings (Note) (Unless otherwise specified, Ta = 25 )
Characteristics
LED
Symbol
Input forward current
Input forward current derating
IF
20
mA
-0.2
mA/
(Ta ≥ 100 )
∆IFP/∆Ta
1
A
(Ta ≥ 100 )
∆IFPT/∆Ta
-40
mA/
PD
100
mW
∆PD/∆Ta
-4.0
mW/
VR
5
V
IFP
(Note 1)
IFPT
Input power dissipation
Input power dissipation derating
Unit
∆IF/∆Ta
Peak transient input forward current
Peak transient input forward current
derating
Rating
(Ta ≥ 100 )
Input forward current (pulsed)
Input forward current derating (pulsed)
Note
(Ta ≥ 100 )
Input reverse voltage
Detector Output current
40
mA
-1.6
mA/
(Note 2)
IO
80
mA
∆IO/∆Ta
-3.2
mA/
Output voltage
VO
-0.5 to 18
V
Supply voltage
VCC
-0.5 to 18
Output current derating
(Ta ≥ 100 )
Output power dissipation
Output power dissipation derating
(Ta ≥ 100 )
PO
100
mW
∆PO/∆Ta
-4.0
mW/
Topr
-40 to 125

Tstg
-55 to 125

Common Operating temperature
Storage temperature
Lead soldering temperature
Isolation voltage
(10 s)
Tsol
AC, 1 min., R.H. ≤ 60%
BVS
260
(Note 3)
3750
Vrms
Note:
Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: Pulse width (PW) ≤ 1 ms, duty = 50 %
Note 2: Pulse width (PW) ≤ 1 µs, 300 pps
Note 3: This device is considered as a two-terminal device: Pins 1 and 3 are shorted together, and pins 4, 5 and 6 are
shorted together.
8. Recommended Operating Conditions (Note)
Characteristics
Symbol
Input on-state current
IF(ON)
Input off-state voltage
VF(OFF)
Note
Min
Typ.
Max
Unit
0.5

15
mA
0

0.8
V
Supply voltage
VCC
(Note 1)
4.5

18
V
Operating temperature
Topr
(Note 1)
-40

125

Note:
The recommended operating conditions are given as a design guide necessary to obtain the intended
performance of the device. Each parameter is an independent value. When creating a system design using
this device, the electrical characteristics specified in this datasheet should also be considered.
Note: A ceramic capacitor (0.1 µF) should be connected between pin 4 and pin 6 to stabilize the operation of a highgain linear amplifier. Otherwise, this photocoupler may not switch properly. The bypass capacitor should be
placed within 1 cm of each pin.
Note 1: Denotes the operating range, not the recommended operating condition.
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TLP2303
9. Electrical Characteristics (Note) (Unless otherwise specified, Ta = -40 to 125 )
Characteristics
Symbol
Input forward voltage
Input forward voltage temperature
coefficient
VF
Test Condition
IF = 1.6 mA, Ta = 25 
∆VF/∆Ta IF = 1.6 mA
Input reverse current
Min
Typ.
Max
Unit
1.30
1.47
1.60
V

-2.0

mV/

10
µA
IR
VR = 5 V, Ta = 25 

Input capacitance
Ct
V = 0 V, f = 1 MHz, Ta = 25 

45

pF
High-level output current
IOH
VF = 0.8 V, VCC = VO = 18 V

0.05
100
µA
VF = 0.8 V, VCC = VO = 18 V,
Ta = 110 


50
µA
High-level supply current
ICCH
IF = 0 mA, VCC = 5 V,
VO = Open

0.01
10
µA
Low-level supply current
ICCL
IF = 1.6 mA, VCC = 5 V,
VO = Open
0.1
0.9
1.5
mA
Current transfer ratio
IO/IF
IF = 0.5 mA, VCC = 4.5 V,
VO = 0.4 V
900
4500
8000
%
IF = 1.6 mA, VCC = 4.5 V,
VO = 0.4 V
800
2800
5000
IF = 5 mA, VCC = 4.5 V,
VO = 0.4 V
500
1300

%
IF = 1.6 mA, VCC = 4.5 V,
IOL = 6.4 mA

0.07
0.3
V
IF = 5 mA, VCC = 4.5 V,
IOL = 15 mA

0.1
0.3
IF = 12 mA, VCC = 4.5 V,
IOL = 24 mA

0.13
0.3
Low-level output voltage
Note:
VOL
V
All typical values are at Ta = 25 .
10. Isolation Characteristics (Unless otherwise specified, Ta = 25 )
Characteristics
Symbol
Total capacitance (input to output)
CS
(Note 1) VS = 0 V, f = 1 MHz
Isolation resistance
RS
(Note 1) VS = 500 V, R.H. ≤ 60%
Isolation voltage
BVS
Note
Test Condition
(Note 1) AC, 1 min.
Min
Typ.
Max
Unit

0.8

pF
1 × 1012
1014

Ω
Vrms
3750


AC, 1 s in oil

10000

DC, 1 min. in oil

10000

Vdc
Note 1: This device is considered as a two-terminal device: Pins 1 and 3 are shorted together, and pins 4, 5 and 6 are
shorted together.
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TLP2303
11. Switching Characteristics
(Unless otherwise specified, Ta = -40 to 125 , VCC = 5 V)
Characteristics
Propagation delay time
(H/L)
Propagation delay time
(L/H)
Symbol
Note
tpHL
Test
Circuit
Fig.
12.1.1
tpLH
Fig.
12.1.1
Test Condition
Min
Typ.
Max
Unit
IF = 0.5 mA, RL = 4.7 kΩ,
Ta = 25 

1.4
15
µs
IF = 0.5 mA, RL = 4.7 kΩ

1.4
20
IF = 12 mA, RL = 270 Ω,
Ta = 25 

0.25
1
IF = 12 mA, RL = 270 Ω

0.25
2
IF = 1.6 mA, RL = 2.2 kΩ,
Ta = 25 

0.6
5
IF = 1.6 mA, RL = 2.2 kΩ

0.6
10
IF = 0.5 mA, RL = 4.7 kΩ,
Ta = 25 

15.5
50
IF = 0.5 mA, RL = 4.7 kΩ

15.5
90
IF = 12 mA, RL = 270 Ω,
Ta = 25 

2.5
7
IF = 12 mA, RL = 270 Ω

2.5
10
IF = 1.6 mA, RL = 2.2 kΩ,
Ta = 25 

8.5
25
IF = 1.6 mA, RL = 2.2 kΩ
µs

8.5
50
Common-mode transient
immunity at output high
CMH
(Note 1)
Fig.
12.1.2
IF = 0 mA, RL = 4.1 kΩ,
VCM = 400 V, VO(min) = 2 V
±15
±30

kV/µs
Common-mode transient
immunity at output low
CML
(Note 2)
Fig.
12.1.2
IF = 10 mA, RL = 4.1 kΩ,
VCM = 400 V, VO(max) = 0.4 V
±15
±30

kV/µs
Note 1: CMH is the maximum rate of rise of the common mode voltage that can be sustained with the output voltage
in the logic high state (VO > 2.0 V).
Note 2: CML is the maximum rate of fall of the common mode voltage that can be sustained with the output voltage in
the logic low state (VO < 0.4 V).
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TLP2303
12. Test Circuits and Characteristics Curves
12.1. Test Circuits
Fig. 12.1.1 Switching Time Test Circuit and Waveform
Fig. 12.1.2 Common-Mode Transient Immunity and Waveform
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TLP2303
12.2. Characteristics Curves (Note)
Fig. 12.2.1 IF - VF
Fig. 12.2.2 IF - Ta
Fig. 12.2.3 IOH - Ta
Fig. 12.2.4 ICCH - Ta
Fig. 12.2.5 ICCL - Ta
Fig. 12.2.6 VOL - Ta
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TLP2303
Fig. 12.2.7 IO - IF
Fig. 12.2.8 IO/IF - IF
Fig. 12.2.9 IO/IF - Ta
Fig. 12.2.10 IO/IF - Ta
Fig. 12.2.11 IO - VO
Fig. 12.2.12 tpHL,tpLH - Ta
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TLP2303
Note:
Fig. 12.2.13 tpHL,tpLH - Ta
Fig. 12.2.14 tpHL,tpLH - Ta
Fig. 12.2.15 tpHL,tpLH - Ta
Fig. 12.2.16 tpHL,tpLH - RL
Fig. 12.2.17 tpHL,tpLH - RL
Fig. 12.2.18 tpHL,tpLH - RL
The above characteristics curves are presented for reference only and not guaranteed by production test,
unless otherwise noted.
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TLP2303
13. Soldering and Storage
13.1. Precautions for Soldering
The soldering temperature should be controlled as closely as possible to the conditions shown below, irrespective
of whether a soldering iron or a reflow soldering method is used.
•
When using soldering reflow (See Fig. 13.1.1 and 13.1.2)
Reflow soldering must be performed once or twice.
The mounting should be completed with the interval from the first to the last mountings being 2 weeks.
Fig. 13.1.1 An Example of a Temperature Profile Fig. 13.1.2 An Example of a Temperature Profile
When Sn-Pb Eutectic Solder Is Used
When Lead(Pb)-Free Solder Is Used
•
When using soldering flow (Applicable to both eutectic solder and Lead(Pb)-Free solder)
Apply preheating of 150  for 60 to 120 seconds.
Mounting condition of 260  within 10 seconds is recommended.
Flow soldering must be performed once.
•
When using soldering Iron (Applicable to both eutectic solder and Lead(Pb)-Free solder)
Complete soldering within 10 seconds for lead temperature not exceeding 260  or within 3 seconds not
exceeding 350  Heating by soldering iron must be done only once per lead.
13.2. Precautions for General Storage
•
Avoid storage locations where devices may be exposed to moisture or direct sunlight.
•
Follow the precautions printed on the packing label of the device for transportation and storage.
•
Keep the storage location temperature and humidity within a range of 5  to 35  and 45% to 75%,
respectively.
•
Do not store the products in locations with poisonous gases (especially corrosive gases) or in dusty
conditions.
•
Store the products in locations with minimal temperature fluctuations. Rapid temperature changes during
storage can cause condensation, resulting in lead oxidation or corrosion, which will deteriorate the
solderability of the leads.
•
When restoring devices after removal from their packing, use anti-static containers.
•
Do not allow loads to be applied directly to devices while they are in storage.
•
If devices have been stored for more than two years under normal storage conditions, it is recommended
that you check the leads for ease of soldering prior to use.
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TLP2303
14. Land Pattern Dimensions (for reference only)
Fig. 14.1 Land Pattern Dimensions (for Reference Only) (Unit: mm)
15. Marking
Fig. 15.1
11
Marking
2012-12-26
Rev.1.0
TLP2303
Package Dimensions
Unit: mm
Weight: 0.08 g (typ.)
Package Name(s)
TOSHIBA: 11-4L1S
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TLP2303
RESTRICTIONS ON PRODUCT USE
• Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively "Product") without notice.
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written permission, reproduction is permissible only if reproduction is without alteration/omission.
• Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible
for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which
minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage
to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate
the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA
information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the
precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application
with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications,
including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating
and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample
application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications.
TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.
• PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE
EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MAY
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• GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or vapor.
Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product.
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AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.
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