APL5603 Low Dropout 600mA Fixed Voltage Linear Regulator Features General Description • Low Dropout Voltage: 220mV (Typical) @600mA • Wide 2.9V~6V Input Voltage The APL5603 is a low-power and low dropout linear regulators which operates from 2.9V to 6V input voltage and • Low Quiescent Current: 140µA (Typical) • Fixed Output Voltage with ±2% Accuracy • Stable with Ceramic, 2.2µF Output Capacitor • Short-Circuit Current-Limit • Over-Temperature Protection • Current-Limit Protection • Internal Soft-Start • SOT-23-5, TSOT-23-5, SOP-8, and DFN3x3-8 delivers up to 600mA output current. Typical dropout voltage is only 220mV (typical) at 600mA output. The APL5603 regulators with low 140µA quiescent current are ideal for battery-powered system appliances. The APL5603 regulators are stable with a 2.2µF ceramic capacitor. The features of current-limit, short-circuit current-limit, and overtemperature protections can prevent the device against currnet overload and over-temperature. The APL5603 regulators are availabe in SOT-23-5, TSOT-23-5, SOP-8, and DFN3x3-8 packages. Packages • Lead Free and Green Devices Available Pin Configurations (RoHS Compliant) Applications APL5603 • CD/DVD-ROM, CD-R/W • Networking System, LAN Card, ADSL/Cable Modem • Set-Top Box • PC Peripherals • Battery-Powered System VIN 1 GND 2 EN 3 5 VOUT 4 NC SOT-23-5/TSOT-23-5 (Top View) APL5603 EN VIN VOUT NC 1 2 3 4 8 7 6 5 GND GND GND GND SOP-8 (Top View) APL5603 8 EN VIN 1 VIN 2 7 NC VOUT 3 6 GND VOUT 4 5 NC DFN3x3-8 (Top View) ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise customers to obtain the latest version of relevant information to verify before placing orders. Copyright ANPEC Electronics Corp. Rev. A.6 - Mar., 2011 1 www.anpec.com.tw APL5603 Ordering and Marking Information Voltage Code (Note 1) 12 : 1.2V 15 : 1.5V 18 : 1.8V 25 : 2.5V 28 : 2.8V 30 : 3.0V 33 : 3.3V Package Code B : SOT-23-5 BT : TSOT-23-5 K : SOP-8 QA : DFN3x3-8 Operating Ambient Temperature Range I : -40 to 85 oC Handling Code TR : Tape & Reel Assembly Material G : Halogen and Lead Free Device APL5603 Assembly Material Handling Code Temperature Range Package Code Voltage Code APL5603-18 K : APL5603 XXXXX 18 XXXXX - Date Code ; 18 - Voltage Code APL5603-18 QA : L5603 18 XXXXX XXXXX - Date Code ; 18 - Voltage Code Note : ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020D for MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by weight). Note 1: For other voltage versions please contact ANPEC for details. Marking for SOT-23-5 package Product Name Marking Product Name Marking Product Name APL5603-12B 635X APL5603-25B 63JX APL5603-33B 63RX Marking APL5603-15B 639X APL5603-18B 63CX APL5603-28B 63MX APL5603-30B 63OX * “X” in the marking indicates data code. Marking for TSOT-23-5 package Product Name Marking Product Name Marking Product Name Marking APL5603-12BT 635X APL5603-15BT 639X APL5603-18BT 63CX APL5603-25BT 63JX APL5603-28BT 63MX APL5603-30BT 63OX APL5603-33BT 63RX * “X” in the marking indicates data code. Absolute Maximum Ratings Symbol VIN (Note 2) Parameter Rating VIN Supply Voltage (VIN to GND) Unit -0.3 to 6.5 V o TJ Maximum Junction Temperature 150 VOUT Output Voltage (VOUT to GND) -0.3 to VIN+0.3 VEN EN Pin Voltage (VEN to GND) -0.3 to 6.5 TSTG TSDR PD Storage Temperature Range Maximum Lead Soldering Temperature, 10 Seconds Power Dissipation C V V -65 to 150 o 260 o C C Internally Limited Note 2: Absolute Maximum Ratings are those values beyond which the life of a device may be impaired. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Copyright ANPEC Electronics Corp. Rev. A.6 - Mar., 2011 2 www.anpec.com.tw APL5603 Thermal Characteristics (Note 3, 4) Symbol Parameter Typical Value Unit Junction to Air Thermal Resistance SOT-23-5 TSOT-23-5 SOP-8 DFN3x3-8 θJA 260 260 150 110 °C/W Note 3: At elevated temperatures, device power dissipation must be derated based on package thermal resistance and heatsink values. The junction-to-ambient thermal resistance is measured on a PC board mounting with the device soldered down to minimum copper area. If power dissipation causes the junction temperature to exceed specified limits, the device will go into thermal shutdown. Note 4: The maximum allowable power dissipation at any TA (ambient temperature) is calculated using: PD (max) = (TJ - TA) / θJA; TJ = 125°C. Exceeding the maximum allowable power dissipation will result in excessive die temperature. Recommended Operating Conditions Parameter Symbol Range Unit VIN VIN to GND 2.9 to 6 V IOUT Output Current 0 to 0.6 A CIN Input Capacitor 0.82 to 470 µF 1 to 330 µF TJ Junction Temperature -40 to 125 °C TA Ambient Temperature -40 to 85 °C COUT Output Capacitor Electrical Characteristics Refer to the typical application circuit. VIN = VOUT+1V or 2.9V (minimum), whichever is great, VEN = VIN, IOUT = 1mA, TJ = -40 to 125 °C, TA = -40 to 85°C, unless otherwise specified. Typical values are at TA = 25°C. Symbol Parameter APL5603 Test Conditions Unit Min. Typ. Max. VEN = 0V - - 1 µA VIN=VEN=5V, IOUT=0mA - 140 200 µA 2.1 2.5 2.9 V - 0.15 - V TA = 25°C -1 - +1 TA = -40 to 85°C (TJ = -40 to 125°C) -2 - +2 Line Regulation VIN = VOUT + 1V to 6V - 0.03 0.19 %/V Load Regulation IOUT = 1mA to 600mA - 0.6 1.5 %/A VOUT=2.8V, IOUT=600mA - 240 500 VOUT=3.3V, IOUT=600mA - 220 450 VOUT=5V, IOUT=600mA - 200 420 VIN = VOUT + 2V, f = 1kHz - 55 - SUPPLY CURRENT IQ Quiescent Current UNDER-VOLTAGE-LOCKOUT VIN UVLO Threshold VIN rising VIN UVLO Hysteresis OUTPUT VOLTAGE VOUT VDROP PSRR Output Voltage Dropout Voltage Power Supply Ripple Rejection Copyright ANPEC Electronics Corp. Rev. A.6 - Mar., 2011 3 %VOUT mV dB www.anpec.com.tw APL5603 Electrical Characteristics (Cont.) Refer to the typical application circuit. VIN = VOUT+1V or 2.9V (minimum), whichever is great, VEN = VIN, IOUT = 1mA, TJ = -40 to 125 °C, TA = -40 to 85°C, unless otherwise specified. Typical values are at TA = 25°C. Symbol Parameter APL5603 Test Conditions Unit Min. Typ. Max. 700 - - mA Thermal Shutdown Temperature - 150 - °C Thermal Shutdown Hysteresis - 40 - °C - 250 - mA - 130 300 µs EN Logic Input-High Level 1.6 - - V EN Logic Input-Low Level - - 0.4 V - 2 - MΩ SOFT-START AND PROTECTION ILIM Output Current-Limit Short-Circuit Current-Limit TSS VOUT < 0.6V Soft-Start Time LOGIC INPUT EN Pull-Low Resistance Copyright ANPEC Electronics Corp. Rev. A.6 - Mar., 2011 VEN<3V 4 www.anpec.com.tw APL5603 Typical Operating Characteristics (Refer to the application circuit 1 in the section “Typical Application Circuits,” VIN=5V, VOUT=3.3V, COUT=2.2µF, unless otherwise specified.) EN Threshold vs. Input Voltage Quiescent Current vs. Input Voltage 200 1.6 IOUT=0mA Quiescent Current (µA) EN Threshold, VHT-EN (V) 1.5 1.4 1.3 1.2 1.1 1 160 120 80 40 0.9 0 0.8 3 3.5 4 4.5 5 5.5 6 0 6.5 1 2 350 VIN to VOUT Dropout, VDROP (V) VIN to VOUT Dropout, VDROP (V) 5 6 VIN to VOUT Dropout vs. Junction Temperature VOUT=3.3V 300 250 200 IOUT=600mA 150 IOUT=400mA 300 VOUT=5V 250 200 IOUT=600mA 150 100 IOUT=400mA 50 50 IOUT=200mA 0 -50 -25 0 25 IOUT=200mA 50 75 100 125 0 -50 150 -25 o 0 25 50 75 100 125 150 o Junction Temperature, TJ ( C) Junction Temperature, TJ ( C) Current-Limit vs. Junction Temperature Power Supply Ripple Rejection 1.8 0 VIN=5V 1.6 -10 1.4 VIN=3.3V, VOUT=1.8V, CIN=1µF, COUT=2.2µF, IOUT=500mA -20 1.2 PSRR (dB) Current-Limit, ILIM (A) 4 Input Voltage, VIN (V) Input Voltage, VIN (V) VIN to VOUT Dropout vs. Junction Temperature 100 3 1 0.8 -30 -40 -50 0.6 VIN=3.3V 0.4 -60 0.2 -70 -80 0 -50 -25 0 25 50 75 100 125 150 1000 o Copyright ANPEC Electronics Corp. Rev. A.6 - Mar., 2011 10000 100000 Frequency (Hz) Junction Temperature, TJ ( C) 5 www.anpec.com.tw APL5603 Operating Waveforms (Refer to the application circuit 1 in the section “Typical Application Circuits,” VIN=5V, VOUT=3.3V, COUT=2.2µF, unless otherwise specified.) Power Off Power On VVININ VIN 1 1 VSET VOUT VOUT 2 2 VOUT IOUT IOUT IOUT 3 3 CH1 : VIN , 2V/div CH3 : VOUT , 2V/div CH4 : IOUT , 500mA/div Time : 1ms/div CH1 : VIN , 2V/div CH2 : VOUT , 2V/div CH3 : IOUT , 500mA/div Time : 200ms/div Enable Shutdown VEN 1 1 VEN VOUT VOUT 2 2 3 IOUT IOUT 3 CH1 : VEN , 5V/div CH2 : VOUT , 2V/div CH3 : IOUT , 500mA/div Time : 20µs/div CH1 : VEN , 5V/div CH2 : VOUT , 2V/div CH3 : IOUT , 500mA/div Time : 100µs/div Copyright ANPEC Electronics Corp. Rev. A.6 - Mar., 2011 6 www.anpec.com.tw APL5603 Operating Waveforms (Cont.) (Refer to the application circuit 1 in the section “Typical Application Circuits,” VIN=5V, VOUT=3.3V, COUT=2.2µF, unless otherwise specified.) Load Transient Line Transient VIN=5V, VOUT=3.3V CIN=1µF, COUT=2.2µF, IOUT rising/ falling time=1µs VIN=4.5~6V, VIN rising/falling=10µs, IOUT=300mA VOUT 1 VIN IOUT 1 2 VOUT 2 CH1 : VOUT , 100mV/div (offset=3.3V) CH2 : IOUT , 200mV/div Time : 200µs/div CH1 : VIN , 2V/div CH2 : VOUT , 20mV/div (offset=3.3V) Time : 200µs/div Thermal Shutdown Current-Limit and Short-Circuit Current-Limit VIN 1 VIN VOUT 1 VOUT 2 2 IOUT IOUT 3 3 CH1 : VIN , 5V/div CH2 : VOUT , 2V/div CH3 : IOUT , 500mA/div Time : 500ms/div Copyright ANPEC Electronics Corp. Rev. A.6 - Mar., 2011 CH1 : VIN , 5V/div CH2 : VOUT , 2V/div CH3 : IOUT , 1A/div Time : 2ms/div 7 www.anpec.com.tw APL5603 Pin Description PIN NAME VIN FUNCTION Input Supply Pin. Supply voltage can range from 2.9V to 6V. Bypass with a 1µF capacitor to GND. VOUT Regulator Output. Sources up to 600mA. A small capacitor (2.2µF, typical) is needed from this pin to ground to assure stability. EN Shutdown Control Input. Driving the EN high turns on the regulator. Driving the EN pin low puts the regulator into shutdown mode. The EN pin is pulled low by an internal resistor. GND Ground. Block Diagram VIN Current-Limit UVLO and Soft-Start EN VREF =0.8V VOUT Thermal Shutdown Short-Circuit Current-Limit GND Typical Application Circuit APL5603 VIN VOUT VIN C1 1µF VOUT C2 2.2µF EN GND Enable VEN Shutdown Copyright ANPEC Electronics Corp. Rev. A.6 - Mar., 2011 8 www.anpec.com.tw APL5603 Function Description Under-Voltage Lockout (UVLO) Thermal Shutdown The APL5603 regulator has a built-in under-voltage lock- A thermal shutdown circuit limits the junction tempera- out circuit to keep the output shut off until internal circuitry is operating properly. The UVLO function initiates a soft- ture of APL5603. When the junction temperature exceeds +150 oC, the thermal shutdown circuitry disables the start process after input voltage exceeds its rising UVLO threshold during power on. Typical UVLO threshold is output, which allows the device to cool down. The output circuitry is enabled again after the junction temperature 2.4V with 0.15V hysteresis. cools down by 40oC, resulting in a pulsed output during continuous thermal overload conditions. Thermal pro- Soft-Start tection is designed to protect the IC in the event of overtemperature conditions. For reliable operation, the junc- The APL5603 provides an internal soft-start circuitry to control rise rate of the output voltage and limit the current tion temperature cannot exceed TJ=+125 oC. surge during start-up. Approximate 20µs delay time after the VIN is over the UVLO threshold, the output voltage starts the soft-start. The typical soft-start interval is about 130µs. Current-Limit The APL5603 provides a current-limit circuitry, which monitors and controls P-MOS’s gate voltage, limiting the output current to 700mA. For reliable operation, the device should not be operated in current-limit for extended period. Short-Circuit Current-Limit When the output voltage drops below 0.6V due to overload or short-circuit, the internal short-circuit current-limit circuitry limits the output current down to 250mA. The short-circuit current-limit is used to reduce the power dissipation during short-circuit condition. In some high VINVOUT conditions, if the junction temperature is over the thermal shutdown temperature, the device will enter the thermal shutdown. Please refer to the section on thermal considerations for power dissipation calculations. The short-circuit current-limit has featured with blanking time after the UVLO threshold is reached, so that it will avoid the output causing short-circuit current-limit protection during start-up; the blanking time is about 600µs. Enable and Shutdown Driving the EN high turns on the regulator, driving the EN low puts the regulator into shutdown mode. A logic low also causes the output voltage to discharge to the GND. The EN is pulled low by an internal resistor. Copyright ANPEC Electronics Corp. Rev. A.6 - Mar., 2011 9 www.anpec.com.tw APL5603 Application Information Layout Consideration Input Capacitor Figure 1 illustrates the layout. Below is a checklist for The APL5603 requires proper input capacitors to supply surge current during stepping load transients to prevent your layout: 1. Please place the input capacitors close to the VIN. the input rail from dropping. Because the parasitic inductor from the voltage sources or other bulk capacitors to 2. Ceramic capacitors for load must be placed near the load as close as possible. the VIN limits the slew rate of the surge current, it is necessary to place the input capacitors near VIN as close as 3. To place APL5603 and output capacitors near the load is good for performance. possible. Input capacitors should be larger than 0.82µF. 4. Large current paths, the bold lines in figure 1, must have wide tracks. Output Capacitor The APL5603 needs a proper output capacitor to maintain circuit stability and to improve transient response APL5603 VIN over-temperature and current. In order to insure the circuit stability, the proper output capacitor value should be VOUT VIN VOUT CIN larger than 1µF. With X5R and X7R dielectrics, 2.2µF is sufficient at all operating temperatures. Maximum output COUT EN VEN capacitor should be less than 330µF to insure the system can be powered on effectively. GND Operation Region and Power Dissipation Figure 1. The APL5603 maximum power dissipation depends on the thermal resistance and temperature difference be- Large ground plane is good for heating. Optimum performance can only be achieved when the device is mounted on a PC board according to the Board layout diagrams tween the die junction and ambient air. The power dissipation PD across the device is: which are shown as Figure2, 3, and 4. PD = (TJ - TA) / θJA SOT-23-5 where (TJ-TA) is the temperature difference between the DFN3X3-8 For dissipating heat GND VOUT junction and ambient air. θJA is the thermal resistance between junction and ambient air. Assuming the TA=25oC CIN COUT COUT CIN and maximum TJ=150oC (typical thermal limit threshold), the maximum power dissipation is calculated as: GND VOUT VIN Figure 2. PD(max)=(150-25)/260 Figure 3. = 0.48(W) For dissipating heat For normal operation, do not exceed the maximum operGND ating junction temperature of TJ = 125 oC. The calculated power dissipation should be less than: COUT SOP-8 PD =(125-25)/260 = 0.38(W) The GND provides an electrical connection to ground and channels heat away. Connect the GND to the ground by VIN CIN VOUT GND using a large pad or ground plane. Figure 4. Copyright ANPEC Electronics Corp. Rev. A.6 - Mar., 2011 10 www.anpec.com.tw APL5603 Package Information SOT-23-5 D e E E1 SEE VIEW A b c 0.25 A L 0 GAUGE PLANE SEATING PLANE A1 A2 e1 VIEW A S Y M B O L SOT-23-5 INCHES MILLIMETERS MIN. MIN. MAX. A MAX. 1.45 0.057 A1 0.00 0.15 0.000 0.006 A2 0.90 1.30 0.035 0.051 b 0.30 0.50 0.012 0.020 c 0.08 0.22 0.003 0.009 D 2.70 3.10 0.106 0.122 E 2.60 3.00 0.102 0.118 E1 1.40 1.80 0.055 0.071 e 0.95 BSC 0.037 BSC e1 1.90 BSC 0.075 BSC L 0.30 0.60 0 0° 8° 0.012 0° 0.024 8° Note : 1. Follow JEDEC TO-178 AA. 2. Dimension D and E1 do not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 10 mil per side. Copyright ANPEC Electronics Corp. Rev. A.6 - Mar., 2011 11 www.anpec.com.tw APL5603 Package Information TSOT-23-5 D e E E1 SEE VIEW A c b 0.25 A GAUGE PLANE SEATING PLANE A1 A2 e1 L VIEW A S Y M B O L TSOT-23-5 MILLIMETERS INCHES MIN. MAX. MIN. MAX. A 0.70 1.00 0.028 0.039 A1 0.01 0.10 0.000 0.004 A2 0.70 0.90 0.028 0.035 b 0.30 0.50 0.012 0.020 c 0.08 0.22 0.003 0.009 D 2.70 3.10 0.106 0.122 E 2.60 3.00 0.102 0.118 E1 1.40 1.80 0.055 e 0.95 BSC e1 0.071 0.037 BSC 1.90BSC 0.075 BSC L 0.30 0.60 0 0° 8° 0.012 0° 0.024 8° Note : 1. Followed from JEDEC TO-178 AA. 2. Dimension D and E1 do not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 10 mil per side. Copyright ANPEC Electronics Corp. Rev. A.6 - Mar., 2011 12 www.anpec.com.tw APL5603 Package Information SOP-8 -T- SEATING PLANE < 4 mils D E E1 SEE VIEW A h X 45 ° c A 0.25 b GAUGE PLANE SEATING PLANE A1 A2 e L VIEW A S Y M B O L SOP-8 INCHES MILLIMETERS MIN. MAX. A MIN. MAX. 1.75 0.069 0.010 0.004 0.25 A1 0.10 A2 1.25 b 0.31 0.51 0.012 0.020 c 0.17 0.25 0.007 0.010 D 4.80 5.00 0.189 0.197 5.80 6.20 0.228 0.244 3.80 4.00 0.150 0.157 h 0.25 0.50 0.010 0.020 L 0.40 1.27 0.016 0.050 0 0° 8° 0° E E1 e 0.049 1.27 BSC 0.050 BSC 8° Note: 1. Follow JEDEC MS-012 AA. 2. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side. 3. Dimension “E” does not include inter-lead flash or protrusions. Inter-lead flash and protrusions shall not exceed 10 mil per side. Copyright ANPEC Electronics Corp. Rev. A.6 - Mar., 2011 13 www.anpec.com.tw APL5603 Package Information DFN3x3-8 D b E A Pin 1 A1 D2 A3 L K E2 Pin 1 Corner e S Y M B O L DFN3x3-8 MILLIMETERS INCHES MIN. MAX. MIN. MAX. A 0.80 1.00 0.031 0.039 A1 0.00 0.05 0.000 0.002 A3 0.20 REF 0.008 REF b 0.25 0.35 0.010 0.014 D 2.90 3.10 0.114 0.122 D2 1.90 2.40 0.075 0.094 E 2.90 3.10 0.114 0.122 E2 1.40 1.75 0.055 0.069 0.50 0.012 e 0.65 BSC L 0.30 K 0.20 Copyright ANPEC Electronics Corp. Rev. A.6 - Mar., 2011 0.026 BSC 0.020 0.008 14 www.anpec.com.tw APL5603 Carrier Tape & Reel Dimensions P0 P2 P1 A B0 W F E1 OD0 K0 A0 OD1 B A B T SECTION A-A SECTION B-B H A d T1 Application SOT-23-5 Application TSOT-23-5 Application SOP- 8 A H T1 C d D W E1 F 178.0±2.00 50 MIN. 8.4+2.00 -0.00 13.0+0.50 -0.20 1.5 MIN. 20.2 MIN. 8.0±0.30 1.75±0.10 3.5±0.05 P0 P1 P2 D0 D1 T A0 B0 K0 2.0±0.05 1.5+0.10 -0.00 1.0 MIN. 0.6+0.00 -0.40 3.20±0.20 3.10±0.20 1.50± 0.20 4.0±0.10 4.0±0.10 A H T1 C d D W E1 F 178.0±2.00 50 MIN. 8.4+2.00 -0.00 13.0+0.50 -0.20 1.5 MIN. 20.2 MIN. 8.0±0.30 1.75±0.10 3.5±0.05 P0 P1 P2 D0 D1 T A0 B0 K0 2.0±0.05 1.5+0.10 -0.00 1.0 MIN. 0.6+0.00 -0.40 3.20±0.20 3.10±0.20 1.50± 0.20 4.0±0.10 4.0±0.10 A H T1 C d D W E1 F 330.0±2.00 50 MIN. 12.4+2.00 -0.00 13.0+0.50 -0.20 1.5 MIN. 20.2 MIN. 12.0±0.30 1.75±0.10 5.5±0.05 P0 P1 P2 D0 D1 T A0 B0 K0 4.0±0.10 8.0±0.10 2.0±0.05 1.5+0.10 -0.00 1.5 MIN. 0.6+0.00 -0.40 6.40±0.20 5.20±0.20 2.10± 0.20 (mm) Copyright ANPEC Electronics Corp. Rev. A.6 - Mar., 2011 15 www.anpec.com.tw APL5603 Carrier Tape & Reel Dimensions (Cont.) Application A H T1 C d D W E1 F 178.0±2.00 50 MIN. 12.4+2.00 -0.00 13.0+0.50 -0.20 1.5 MIN. 20.2 MIN. 12.0±0.30 1.75±0.10 5.5±0.05 P0 P1 P2 D0 D1 T A0 B0 K0 2.0±0.05 1.5+0.10 -0.00 1.5 MIN. 0.6+0.00 -0.40 3.30±0.20 3.30±0.20 1.30±0.20 DFN3x3-8 4.0±0.10 8.0±0.10 (mm) Devices Per Unit Package Type Unit Quantity SOT-23-5 Tape & Reel 3000 TSOT-23-5 Tape & Reel 3000 SOP-8 Tape & Reel 2500 DFN3x3-8 Tape & Reel 3000 Taping Direction Information (T)SOT-23-5 USER DIRECTION OF FEED SOP-8 USER DIRECTION OF FEED Copyright ANPEC Electronics Corp. Rev. A.6 - Mar., 2011 16 www.anpec.com.tw APL5603 Taping Direction Information (Cont.) DFN3x3-8 USER DIRECTION OF FEED Classification Profile Copyright ANPEC Electronics Corp. Rev. A.6 - Mar., 2011 17 www.anpec.com.tw APL5603 Classification Reflow Profiles Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly 100 °C 150 °C 60-120 seconds 150 °C 200 °C 60-120 seconds 3 °C/second max. 3 °C/second max. 183 °C 60-150 seconds 217 °C 60-150 seconds See Classification Temp in table 1 See Classification Temp in table 2 Time (tP)** within 5°C of the specified classification temperature (Tc) 20** seconds 30** seconds Average ramp-down rate (Tp to Tsmax) 6 °C/second max. 6 °C/second max. 6 minutes max. 8 minutes max. Preheat & Soak Temperature min (Tsmin) Temperature max (Tsmax) Time (Tsmin to Tsmax) (ts) Average ramp-up rate (Tsmax to TP) Liquidous temperature (TL) Time at liquidous (tL) Peak package body Temperature (Tp)* Time 25°C to peak temperature * Tolerance for peak profile Temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. Table 1. SnPb Eutectic Process – Classification Temperatures (Tc) Package Thickness <2.5 mm ≥2.5 mm Volume mm <350 235 °C 220 °C 3 Volume mm ≥350 220 °C 220 °C 3 Table 2. Pb-free Process – Classification Temperatures (Tc) Package Thickness <1.6 mm 1.6 mm – 2.5 mm ≥2.5 mm Volume mm <350 260 °C 260 °C 250 °C 3 Volume mm 350-2000 260 °C 250 °C 245 °C 3 Volume mm >2000 260 °C 245 °C 245 °C 3 Reliability Test Program Test item SOLDERABILITY HOLT PCT TCT HBM MM Latch-Up Method JESD-22, B102 JESD-22, A108 JESD-22, A102 JESD-22, A104 MIL-STD-883-3015.7 JESD-22, A115 JESD 78 Copyright ANPEC Electronics Corp. Rev. A.6 - Mar., 2011 18 Description 5 Sec, 245°C 1000 Hrs, Bias @ Tj=125°C 168 Hrs, 100%RH, 2atm, 121°C 500 Cycles, -65°C~150°C VHBM≧2KV VMM≧200V 10ms, 1tr≧100mA www.anpec.com.tw APL5603 Customer Service Anpec Electronics Corp. Head Office : No.6, Dusing 1st Road, SBIP, Hsin-Chu, Taiwan, R.O.C. Tel : 886-3-5642000 Fax : 886-3-5642050 Taipei Branch : 2F, No. 11, Lane 218, Sec 2 Jhongsing Rd., Sindian City, Taipei County 23146, Taiwan Tel : 886-2-2910-3838 Fax : 886-2-2917-3838 Copyright ANPEC Electronics Corp. Rev. A.6 - Mar., 2011 19 www.anpec.com.tw