APL5315 Selectable Adjustable/Fixed Low dropout 300mA Linear Regulator Features General Description • • The APL5315 is a P-channel low dropout linear regulator which needs only one input voltage from 2.7~6V, and Wide Operating Voltage: 2.7~6V Low Dropout Voltage: delivers current up to 300mA to set output voltage. It also can work with low ESR ceramic capacitors and is ideal for 230mV(typical) @ 300mA • • • • • • • • Guaranteed 300mA Output Current Two Modes for Setting Output Voltage using in the battery-powered applications such as notebook computers, cellular phones. Typical dropout voltage - Fixed Output Voltage: 1~5V - Adjustable Output Voltage: 0.8~5.5V is only 230mV at 300mA loading. Current Limit Protection with Foldback Current The APL5315 provides two kinds of output voltage operation modes for setting the output voltage. Fixed Internal Soft-Start output voltage mode senses the output voltage on VOUT, adjustable output voltage mode needs two Over Temperature Protection Stable with Low ESR Ceriamic Capacitor resistors as a voltage divider. Current limit with current foldback and thermal shutdown functions protect the SOT-23-5 Package Lead Free Available (RoHS Compliant) device against current over-loads and over temperature. The APL5315 is available in a SOT-23-5 package. Simplified Application Circuit Applications APL5315 VIN 3 CIN 1 VIN VOUT SHDN SET 4 VOUT • • • 5 GND COUT 2 Cellular Phones Portable and Battery-powered Equipment Notebook and Personal Computers Ordering and Marking Information APL5315 Lead Free Code Handling Code Temperature Range Package Code Voltage Code Package Code B : SOT- 23-5 Operating Junction Temperature Range I : -40 to 85°C Handling Code TR : Tape & Reel Voltage Code 12 : 1.2V Blank: Adjustable Lead Free Code L : Lead Free Device Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which are fully compliant with RoHS and compatible with both SnPb and lead-free soldering operations. ANPEC lead-free products meet or exceed the leadfree requirements of IPC/JEDEC J STD-020C for MSL classification at lead-free peak reflow temperature. ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise customers to obtain the latest version of relevant information to verify before placing orders. Copyright ANPEC Electronics Corp. Rev. A.2 - Mar., 2007 1 www.anpec.com.tw APL5315 Product Name Marking Product Name Marking Product Name Marking APL5315 35RX APL5315-12 355X APL5315-15 359X APL5315-18 35CX APL5315-25 35JX APL5315- 33 35RX (Note2) Note1 : Other voltage version please contact ANPEC for detail. Note2 : Because APL5315 and APL5315-33 are identical, the marking of APL5315 is same as APL5315-33. Pin Configuration SHDN 1 GND 2 VIN 3 5 SET 4 VOUT SOT-23-5 Absolute Maximum Ratings Symbol VIN VSHND PD Rating Unit VIN Supply Voltage (VIN to GND) Parameter -0.3 ~ 6.5 V SHND Input Voltage (SHND to GND) -0.3 ~ 6.5 V Power Dissipation Internally Limited W TJ Junction Temperature -40 ~ 150 °C TSTG Storage Temperature -65 ~ 150 °C TSDR Soldering Temperature, 10 Seconds 260 °C Thermal Characteristics Symbol θJA Parameter Typical Value Thermal Resistance-Junction to Ambient (Note 3) Unit o 240 C/W Note3 : θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. Recommended Operating Conditions Symbol VIN Parameter Range 2.7 ~ 6 V VOUT Output Voltage 0.8 ~ 5.5 V IOUT VOUT Output Current 0 ~ 300 mA COUT Output Capacitor 1.5 ~ 33 µF Junction Temperature -40 ~ 125 TJ VIN Supply Voltage Unit Copyright ANPEC Electronics Corp. Rev. A.2 - Mar., 2007 2 o C www.anpec.com.tw APL5315 Electrical Characteristics Unless otherwise specified, these specifications apply over VIN = VOUT+1V (min VIN=2.7V), IOUT=0~300mA, CIN = 1µF, COUT = 2.2µF, TA = -40 to 85oC. Typical values are at TA = 25oC. Symbol VIN VOUT Parameter APL5315 Test Condition Unit Min. Typ. Max. Input Voltage 2.7 --- 6 V Output Voltage Range 0.8 --- 5.5 V UVLO Threshold 1.5 2.3 2.6 V UVLO Hysteresis --- 0.8 --- V --- 120 160 µA 0.784 0.8 0.816 V -2 --- +2 % IQ Quiescent Current IOUT =10mA ~300mA VREF Reference Voltage Measured on SET, VIN=2.7V, IOUT=10mA Output Voltage Accuracy Fixed output voltage, IOUT=10mA REGLINE Line Regulation ΔVOUT%/ΔVIN, IOUT=10mA -0.06 --- +0.06 %/V REGLOAD Load Regulation ΔVOUT%/ΔIOUT -0.2 --- +0.2 %/A VOUT = 2.5V, IOUT = 300mA --- 230 360 VOUT = 3.3V, IOUT = 300mA --- 170 300 f = 10kHz, IOUT = 300mA --- 45 --- dB f = 80Hz to 100KHz, IOUT = 300mA --- 160 --- µVRMS 400 500 650 mA mA VDROP PSRR Dropout Voltage Power Supply Ripple Rejection Ratio Noise ILIMIT Current Limit ISHORT Foldback Current mV --- 80 --- SHDN Input Voltage High VOUT = 0V 1.6 --- --- SHDN Input Voltage Low --- --- 0.4 --- 0.1 1 µA --- 3 --- MΩ --- 60 --- Ω Over Temperature Threshold --- 160 --- ° C Over Temperature Hysteresis --- 40 --- ° C SET Input Threshold for Fixed/Adjustable Output Voltage --- 100 --- mV -100 --- 100 nA 60 80 100 µs V Shutdown VIN Supply Current SHDN = Low, VIN = 6V SHDN Pull Low Resistance VOUT Discharge MOSFET SHDN = Low RDS(ON) Mode SET input bias current TSS VSET=0.8V Soft-Start Interval Copyright ANPEC Electronics Corp. Rev. A.2 - Mar., 2007 3 www.anpec.com.tw APL5315 Typical Operating Characteristics Quiescent Current vs. Supply Voltage Quiescent Current vs. Junction Temperature 160 114 IOUT= 0mV 112 Quiescent Current, IQ (µA) Quiescent Current, IQ (µA) 140 120 100 80 60 40 110 108 106 104 20 102 0 0 1 2 3 4 5 6 7 -50 -25 Supply Voltage, VIN (V) Quiescent Current vs. Output Current 50 75 100 125 PSRR vs. Frequency -10 140 -20 PSRR (dB) 160 VIN=5.5V 120 100 VIN=3.3V, VOUT=1.2V CIN=1µF, COUT=2.2µF IOUT=300mA -30 -40 VIN=4.5V -50 80 -60 60 0 50 100 150 200 250 1000 300 10000 100000 1000000 Frequency (Hz) Output Current, I OUT (mA) Dropout Voltage vs. Output Current Dropout Voltage vs. Output Current 300 250 250 TJ=25° C TJ=75° C TJ=125° C 200 150 100 TJ=25° C VOUT=3.3V Dropout Voltage, VDROP (mV) VOUT=2.5V Dropout Voltage, VDROP (mV) 25 0 180 Quiescent Current, IQ (µA) 0 Junction Temperature, T J (° C) TJ=0° C TJ=-50° C 50 0 TJ=75° C 200 TJ=125° C 150 100 TJ=0° C 50 TJ=-50° C 0 0 100 200 Output Current, I OUT (mA) Copyright ANPEC Electronics Corp. Rev. A.2 - Mar., 2007 0 300 4 100 200 Output Current, IOUT (mA) 300 www.anpec.com.tw APL5315 Typical Operating Characteristics (Cont.) Loop Gain vs. Frequency Phase vs. Frequency 160 50 VIN=3.3V, VOUT=1.2V, CIN=1µF, COUT=2.2µF 40 30 140 IOUT=100mA IOUT=300mA Phase (degree) 120 20 Loop Gain (dB) VIN=3.3V, VOUT=1.2V, CIN=1µF, C OUT=2.2µF 10 0 100 80 60 -10 40 IOUT=300mA -20 IOUT=100mA 20 -30 0 -40 1000 10000 100000 1000 1000000 Frequency (Hz) 10000 100000 1000000 Frequency (Hz) Current Limit vs. Junction Temperature 600 Current Limit, ILIMIT (mA) VIN=5V 550 500 450 400 -50 -25 0 25 50 75 Junction Temperature, T J (° C) Copyright ANPEC Electronics Corp. Rev. A.2 - Mar., 2007 100 125 5 www.anpec.com.tw APL5315 Operating Waveforms Load Transient Line Transient VIN=3.3V, CIN=1µF, COUT=2.2µF, TR=1µs CIN=1µF, COUT=2.2µF, TR=10µs, IOUT=10mA V OUT V IN V OUT IOUT CH1 : VOUT, 50mV/div, AC CH2 : IOUT, 100mA/div, DC Time : 100µs/div CH1 : VIN, 1V/div, DC CH2 : VOUT, 20mV/div, AC Time : 100µs/div Enable Shutdown V OUT V OUT V SHDN V SHDN I OUT I OUT CH1 : VOUT, 500mV/div CH2 : VSHDN, 5V/div CH3 : IOUT, 200mA/div Time : 50µs/div Copyright ANPEC Electronics Corp. Rev. A.2 - Mar., 2007 CH1 : VOUT, 500mV/Div CH2 : V , 5V/Div SHDN CH3 : IOUT, 200mA/Div DC Time : 10µs/Div 6 www.anpec.com.tw APL5315 Operating Waveforms (Cont.) Power on Power off V IN V IN V OUT V OUT I OUT I OUT CH1 : VIN, 2V/div CH2 : VOUT, 500mV/div CH3 : IOUT, 100mA/div Time : 200µs/Div CH1 : VIN, 2V/div CH2 : VOUT,, 500mV/div, CH3 : IOUT, 100mA/div Time : 50ms/Div Pin Descriptions PIN I/O No NAME 1 2 3 4 SHDN GND VIN VOUT I O 5 SET I I FUNCTION Shutdown control pin, logic high: enable; logic low: shutdown Ground pin Voltage supply input pin Regulator output pin Connect this pin to ground for fixed output voltage operation. Connect this pin to an external resistor divider for adjustable output voltage mode operation. Copyright ANPEC Electronics Corp. Rev. A.2 - Mar., 2007 7 www.anpec.com.tw APL5315 Block Diagram UVLO & Shutdown Logic SHDN VIN Foldback current limit Thermal Shutdown + VOUT Low 3MΩ SET High + V REF GND 100mV Typical Application Circuits 1. Fixed Output Voltage Mode APL5315 VIN 3 CIN 1µF 1 VIN VOUT SHDN SET 4 VOUT 5 GND COUT 2.2µF 2 Enable Shutdown 2.2µF/GRM155R60J225M Murata Copyright ANPEC Electronics Corp. Rev. A.2 - Mar., 2007 8 www.anpec.com.tw APL5315 Typical Application Circuits (Cont.) 2. Adjustable Output Voltage Mode APL5315 VIN 3 CIN 1µF 1 VOUT VIN SET SHDN VOUT 4 5 R1 GND COUT 2.2µF 2 Enable R2 Shutdown R1 VOUT = 0.8 ⋅ 1 + R2 Functional Descriptions Internal Soft-Start ture of APL5315. When the junction temperature exceeds +160οC, a thermal sensor turns off the output PMOS, An internal soft-start function controls rising rate of the output voltage to limit the surge current at start-up. The allowing the device to cool down. The regulator regulates the output again through initiation of a new soft- typical soft-start interval is about 80µs. start cycle after the junction temperature cools by 40οC. The thermal shutdown designed with a 40οC hysteresis Output Voltage Regulation The APL5315 can works in either fixed or adjustable mode lowers the average junction temperature during continuous thermal overload conditions, extending life time of by connecting the SET to GND or a resistor-divider which receives the feedback voltage of the regulator. The output the device. For normal operation, device power dissipation should voltage set by the resistor-divider is determined by: R1 VOUT = 0.8 ⋅ 1 + R2 be externally limited so that junction temperature will not exceed 125οC. Where R1 is connected from VOUT to SET with Kelvin sensing and R2 is connected from SET to GND. The Under-Voltage Lock Out (UVLO) The APL5315 monitors the input voltage to prevent wrong logic control. The UVLO function initiates a soft- recommended value of R2 is in the range of 100~100KΩ. An error amplifier working with a temperature compen- start process after input voltage exceeds its rising UVLO threshold during power on. The UVLO function sated 0.8V reference and an output PMOS regulates the output to the presetting voltage. The error amplifier also shuts off the output when the input voltage falls below it’s falling threshold. Typical UVLO hysteresis designed with high bandwidth and DC gain provides very fast transient response and less load regulation. voltage is 0.8V. It compares the reference with the feedback voltage and amplifies the difference to drive the output PMOS which Shutdown Control provides load current from VIN to VOUT. The APL5315 has an active-low shutdown function. Force SHDN high (>1.6V) enables the VOUT; force SHDN low Thermal Shutdown (<0.4V) disables the VOUT. SHDN is internally pulled low by a resistor (3MΩ typical). If it is not used, connect to VIN A thermal shutdown circuit limits the junction tempera- Copyright ANPEC Electronics Corp. Rev. A.2 - Mar., 2007 for normal operation. 9 www.anpec.com.tw APL5315 Application Information Input Capacitor The APL5315 requires proper input capacitors to supply Operation Region and Power dissipation The APL5315 maximum power dissipation depends surge current during stepping load transients to prevent the input rail from dropping . Because the parasitic induc- on the thermal resistance and temperature difference between the die junction and ambient air. The power dis- tor from the voltage sources or other bulk capacitors to the VIN limit the slew rate of the surge current. Place the sipation PD across the device is: PD = (TJ - TA) / θJA Input capacitors near VIN as close as possible. Input capacitors should be larger than 1µF and a minimum where (TJ-TA) is the temperature difference between the junction and ambient air. θ JA is the thermal resistance ceramic capacitor of 1µF is necessary. Output Capacitor between Junction and ambient air. Assuming the TA=25 oC and maximum TJ=160 oC (typical thermal limit The APL5315 needs a proper output capacitor to maintain circuit stability and to improve transient response over threshold), the maximum power dissipation is calculated as: temperature and current. In order to insure the circuit stability, the proper output capacitor value should be larger PD(max)=(160-25)/240 = 0.56(W) than 2.2µF. With X5R and X7R dielectrics, 2.2µF is sufficient at all operating temperatures. Large output capaci- For normal operation, do not exceed the maximum junction temperature rating of TJ = 125 oC. The calculated power tor value can reduce noise and improve load-transient response and PSRR, however it also affects power on dissipation should less than: issue. Equation (1) shows the relationship between the maximum COUT value and VOUT. PD =(125-25)/240 = 0.41(W) 0.1155 ..................(1) COUT(max) = 87 ⋅ 0.55 VOUT The GND provides an electrical connection to ground and channels heat away. Connect the GND to ground by using a large pad or ground plane. Where the unit of COUT is µF and VOUT is V. Figure 1 shows the curve of maximum output capacitor over the output Layout Considerations Figure 2 illustrates the layout. Below is a checklist for voltage. The output voltage range is from 0.8 to 5.5V and the output capacitor value should be under the line. Out- yours layout: 1. Please place the input capacitors close to the VIN. put capacitors must be placed at the load and ground pin as close as possible and the impedance of the layout 2. Ceramic capacitors for load must be placed near the load as close as possible. Output Capacitor (uF) must be minimized. 3. To place APL5315 and output capacitors near the load is good for performance. 48 45 4. Large current paths, the bold lines in figure 2, must have wide tracks. 42 39 5. Divider resistor R1 and R2 must be placed near 36 the SET as close as possible. 33 30 0 1 2 3 4 5 6 Output voltage (V) Figure 1 Copyright ANPEC Electronics Corp. Rev. A.2 - Mar., 2007 10 www.anpec.com.tw APL5315 Application Information (Cont.) PCB Layout Consideration( Cont.) CIN APL5315 VIN VOUT SET VIN 3 VOUT 4 5 R1 COUT GND 2 LOAD R2 Figure 2 Copyright ANPEC Electronics Corp. Rev. A.2 - Mar., 2007 11 www.anpec.com.tw APL5315 Package Information SOT23-5 D e E E1 SEE VIEW A b c 0.25 A L 0 GAUGE PLANE SEATING PLANE A1 A2 e1 VIEW A S Y M B O L SOT23-5 INCHES MILLIMETERS MIN. MAX. A MAX. 1.45 0.057 0.000 0.006 1.30 0.035 0.051 0.50 0.012 0.020 0.22 0.003 0.009 0.00 0.15 A2 0.90 b 0.30 c 0.08 A1 MIN. D 2.90 BSC 0.114 BSC E 2.80 BSC 0.110 BSC E1 1.60 BSC 0.063 BSC e 0.95 BSC 0.037 BSC e1 1.90 BSC 0.075 BSC L 0.30 0.60 0 0° 8° Copyright ANPEC Electronics Corp. Rev. A.2 - Mar., 2007 0.012 0° 12 0.024 8° www.anpec.com.tw APL5315 Carrier Tape & Reel Dimensions t D P Po E P1 Bo F W Ko Ao D1 T2 J C A B T1 Application A 178 ±1 SOT-23-5 B C J 72 ± 1.0 13.0 + 0.2 2.5 ± 0.15 F D D1 Po 3.5 ± 0.05 1.5± 0.1 1.5± 0.1 4.0 ± 0.1 T1 T2 W P E 8.4 ± 2 1.5 ± 0.3 8.0 ± 0.3 4 ± 0.1 1.75± 0.1 P1 Ao Bo Ko 2.0 ± 0.1 3.15 ± 0.1 3.2± 0.1 t (mm) 1.4± 0.1 0.2±0.033 Cover Tape Dimensions Application Carrier Width Cover Tape Width Devices Per Reel SOT23-5 8 5.3 3000 Copyright ANPEC Electronics Corp. Rev. A.2 - Mar., 2007 13 www.anpec.com.tw APL5315 Physical Specifications Terminal Material Lead Solderability Solder-Plated Copper (Solder Material: 90/10 or 63/37 SnPb), 100%Sn Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3. Reflow Condition (IR/Convection or VPR Reflow) tp TP Critical Zone TL to TP Ramp-up Temperature TL tL Tsmax Tsmin Ramp-down ts Preheat 25 t 25°C to Peak Time Classification Reflow Profiles Profile Feature Average ramp-up rate (TL to TP) Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts) Time maintained above: - Temperature (TL) - Time (tL) Peak/Classification Temperature (Tp) Time within 5°C of actual Peak Temperature (tp) Ramp-down Rate Time 25°C to Peak Temperature Sn-Pb Eutectic Assembly Pb-Free Assembly 3°C/second max. 3°C/second max. 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds 183°C 60-150 seconds 217°C 60-150 seconds See table 1 See table 2 10-30 seconds 20-40 seconds 6°C/second max. 6°C/second max. 6 minutes max. 8 minutes max. Notes: All temperatures refer to topside of the package. Measured on the body surface. Copyright ANPEC Electronics Corp. Rev. A.2 - Mar., 2007 14 www.anpec.com.tw APL5315 Classification Reflow Profiles (Cont.) Table 1. SnPb Entectic Process – Package Peak Reflow Temperatures 3 3 Volume mm ≥350 225 +0/-5°C 225 +0/-5°C Volume mm <350 240 +0/-5°C 225 +0/-5°C Package Thickness <2.5 mm ≥2.5 mm Table 2. Pb-free Process – Package Classification Reflow Temperatures 3 3 3 Volume mm Volume mm Volume mm <350 350-2000 >2000 <1.6 mm 260 +0°C* 260 +0°C* 260 +0°C* 1.6 mm – 2.5 mm 260 +0°C* 250 +0°C* 245 +0°C* ≥2.5 mm 250 +0°C* 245 +0°C* 245 +0°C* * Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature (this means Peak reflow temperature +0°C. For example 260°C+0°C) at the rated MSL level. Package Thickness Reliability Test Program Test item SOLDERABILITY HOLT PCT TST ESD Latch-Up Method MIL-STD-883D-2003 MIL-STD-883D-1005.7 JESD-22-B,A102 MIL-STD-883D-1011.9 MIL-STD-883D-3015.7 JESD 78 Description 245°C, 5 SEC 1000 Hrs Bias @125°C 168 Hrs, 100%RH, 121°C -65°C~150°C, 200 Cycles VHBM > 2KV, VMM > 200V 10ms, 1tr > 100mA Customer Service Anpec Electronics Corp. Head Office : No.6, Dusing 1st Road, SBIP, Hsin-Chu, Taiwan, R.O.C. Tel : 886-3-5642000 Fax : 886-3-5642050 Taipei Branch : 7F, No. 137, Lane 235, Pao Chiao Rd., Hsin Tien City, Taipei Hsien, Taiwan, R. O. C. Tel : 886-2-89191368 Fax : 886-2-89191369 Copyright ANPEC Electronics Corp. Rev. A.2 - Mar., 2007 15 www.anpec.com.tw