TCK106G/TCK107G/TCK108G
TOSHIBA CMOS Linear Integrated Circuit Silicon Monolithic
TCK106G, TCK107G, TCK108G
1.0 A Load Switch IC with Slew Rate Control Driver in Ultra Small Package
The TCK106G, TCK107G and TCK108G are load switch ICs for a
general power management with slew rate control driver, featuring
low switch ON resistance and wide input voltage operation from 1.1
to 5.5 V.
Switch ON resistance is only 49 mΩ typical at 5.0 V, 500 mA
condition and output current is available on 1.0 A . TCK107G and
TCK108G feature output auto-discharge function.
These devices are available in 0.4 mm pitch ultra small package
WCSP4 (0.79 mm x 0.79 mm, t: 0.5 mm) .Thus this devices is ideal
for portable applications that require high-density board assembly
such as cellular phone.
WCSP4
Weight : 0.7 mg ( typ.)
Feature
•
Wide input voltage operation: VIN = 1.1 to 5.5 V
•
High output current: IOUT = 1.0 A
•
Low ON resistance :
RON = 49 mΩ (typ) at VIN = 5.0 V, 500 mA
RON = 57 mΩ (typ) at VIN = 3.3 V, 500 mA
RON = 83 mΩ (typ) at VIN = 1.8 V, 500 mA
RON = 143 mΩ (typ) at VIN = 1.2 V, 200 mA
RON = 176 mΩ (typ) at VIN = 1.1 V, 200 mA
•
Built in Slew rate control driver
•
Built in Auto-discharge (TCK107G and TCK108G)
•
Active High and Pull down connection between CONTROL and GND (TCK106G and TCK107G)
•
Active Low (TCK108G)
•
Ultra small package : WCSP4 (0.79 mm x 0.79 mm, t: 0.5 mm)
Pin Assignment(Top view)
VIN
(A2)
Top marking
CONTROL
(B2)
6K: TCK106G
7K: TCK107G
8K: TCK108G
VOUT
(A1)
GND
(B1)
Index
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TCK106G/TCK107G/TCK108G
Absolute Maximum Ratings (Ta = 25°C)
Characteristics
Symbol
Rating
Unit
Input voltage
VIN
6.0
V
Control voltage
VCT
-0.3 to 6.0
V
Output voltage
VOUT
-0.3 to VIN +0.3
V
Output current
IOUT
1.0
A
DC
Power dissipation
PD
Operating temperature range
Topr
−40 to 85
°C
Tj
150
°C
Tstg
−55 to 150
°C
Junction temeperature
Storage temperature
800 (Note 1)
mW
Note : Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if
the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings and the operating ranges. Please design the appropriate reliability upon reviewing the Toshiba
Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and Methods”) and individual
reliability data (i.e. reliability test report and estimated failure rate, etc).
Note1: Rating at mounting on a board
(Glass epoxy board dimension : 40mm x 40mm, both sides of board
Metal pattern ratio : a surface approximately 50%, the reverse side approximately 50%
Through hole hall : diameter 0.5mm x 28)
Block Diagram
TCK106G, TCK107G
TCK108G
VOUT
V
IN
IN
Slew Rate
Control Driver
CONTROL
VOUT
V
Slew Rate
Control Driver
Control
Logic
CONTROL
Control
Logic
Output
Discharge (Note 2)
Pull
Down
GND
GND
Note 2: TCK107G only
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TCK106G/TCK107G/TCK108G
Electrical Characteristics
DC Characteristics (Ta = -40 to 85°C)
Characteristics
Symbol
Test Condition
Min.
Typ.
Max.
Unit
Input voltage
VIN
⎯
1.1
⎯
5.5
V
CONTROL High-level input voltage
VIH
VIN = 1.1 to 5.5 V
0.9
⎯
⎯
V
CONTROL Low-level input voltage
VIL
⎯
⎯
0.4
V
⎯
80
200
nA
⎯
50
135
nA
⎯
14
1000
nA
VIN = 5.0 V, IOUT = -0.5 A
⎯
49
73
VIN = 3.3 V, IOUT = -0.5 A
⎯
57
84
VIN = 1.8 V, IOUT = -0.5 A
⎯
83
123
VIN = 1.2 V, IOUT = -0.2 A
⎯
143
225
VIN = 1.1 V, IOUT = -0.2 A
⎯
176
⎯
⎯ (TCK107G and TCK108G)
⎯
100
⎯
Quiescent current (ON state)
Standby current (OFF state)
OFF-state switch current
On resistance
Discharge on resistance
IQ
IQ(OFF)
ISD(OFF)
RON
RSD
VIN = 1.1 to 5.5 V
VIN = VCT = 5.5 V,
IOUT = 0 mA
TCK106G
TCK107G
VIN = 5.5 V, VCT = 0 V,
IOUT = 0 mA
TCK108G
TCK106G
VIN = 5.5 V, VCT = 0 V,
(Note 3) TCK107G
VOUT = OPEN
VIN = VCT = 5.5 V,
TCK108G
(Note 3)
VOUT = OPEN
VIN = 5.5 V, VCT = 0 V,
VOUT = GND
TCK106G
TCK107G
VIN = VCT = 5.5 V,
VOUT = GND
TCK108G
mΩ
Ω
Note 3 ： Except ISD(OFF) OFF-state switch current
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TCK106G/TCK107G/TCK108G
AC Characteristics (Ta = 25°C)
VIN = 1.2 V
Characteristics
Symbol
Test Condition(Figure 1)
VOUT rise time
tr
RL=500Ω , CL=0.1μF
VOUT fall time
tf
RL=500Ω , CL=0.1μF
Min.
Typ.
Max.
Unit
⎯
290
⎯
μs
TCK107G
TCK108G
⎯
30
⎯
TCK106G
⎯
104
⎯
μs
Turn on delay
tON
RL=500Ω , CL=0.1μF
⎯
305
⎯
μs
Turn off delay
tOFF
RL=500Ω , CL=0.1μF
⎯
5
⎯
μs
Min.
Typ.
Max.
Unit
⎯
130
⎯
μs
TCK107G
TCK108G
⎯
25
⎯
TCK106G
⎯
110
⎯
VIN = 3.3 V
Characteristics
Symbol
Test Condition(Figure 1)
VOUT rise time
tr
RL=500Ω , CL=0.1μF
VOUT fall time
tf
RL=500Ω , CL=0.1μF
μs
Turn on delay
tON
RL=500Ω , CL=0.1μF
⎯
100
⎯
μs
Turn off delay
tOFF
RL=500Ω , CL=0.1μF
⎯
10
⎯
μs
AC Waveform
tr
tf
VOUT
90%
10%
TCK106G, TCK107G
10%
TCK108G
VIH
VCT
90%
50%
VIH
VCT
50%
50%
50%
VIL
VIL
90%
VOUT
10%
tON
tOFF
VOH
90%
VOUT
VOL
10%
tON
tOFF
Figure 1 tr, tf, tON, tOFF Waveforms
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VOH
VOL
TCK106G/TCK107G/TCK108G
Application Note
1.
Application circuit example (top view)
The figure below shows the recommended configuration for TCK106G, TCK107G and TCK108G.
CONTROL
GND
Part number
VIN
CIN
LOAD
VOUT
CL
RL
TCK106G
TCK107G
TCK108G
Control
voltage
IC
Operation
HIGH
ON
LOW
OFF
OPEN
OFF
HIGH
OFF
LOW
ON
1) Input capacitor
An input capacitor (CIN) is not necessary for the guaranteed operation of TCK106G, TCK107G and TCK108G.
However, it is recommended to use input capacitors to reduce voltage drop due to sharp changes in output current
and also for improved stability of the power supply. When used, place CIN as close to VIN pin to improve stability of
the power supply. Also, due to the CIN selected, VIN < VOUT may occur, causing a reverse current to flow through
the body diode of the pass-through p-ch MOSFET of the load switch IC. In this case, a higher value for CIN as
compared to CL is recommended.
2) Output capacitor
An output capacitor (COUT) is not necessary for the guaranteed operation of TCK106G, TCK107G and TCK108G.
However, there is a possibility of overshoot or undershoot caused by output load transient response, board layout
and parasitic components of load switch IC. In this case, an output capacitor with COUT more than 0.1μF us
recommended.
3) Control pin
A control pins for TCK106G and TCK107G are both Active High and TCK108G is Active Low. These controls
both the pass-through p-ch MOSFET and the discharge n-ch MOSFET (except TCK106G), operated by the
control voltage and Schmitt trigger. When the control voltage level is High (Low; TCK108G), p-ch MOSFET is ON
state and n-ch MOSFET is OFF state. When control voltage level is Low (High; TCK108G), and the state of the
MOSFETs is reversed. Also, pull down resistance equivalent to a few MΩis connected between CONTROL and
GND, thus the load switch IC is in OFF state even when CONTROL pin is OPEN(except TCK108G). In addition,
CONTROL pin has a tolerant function such that it can be used even if the control voltage is higher than the input
voltage.
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TCK106G/TCK107G/TCK108G
2. Power Dissipation
Power dissipation is measured on the board condition shown below.
[The Board Condition]
Board material: Glass epoxy (FR4)
Board dimension: 40mm x 40mm (both sides of board)，t=1.8mm
Metal pattern ratio: a surface approximately 50%, the reverse side approximately 50%
Through hole: diameter 0.5mm x 28
PD - Ta
Power Dissipation PD (mW)
1000
800
600
400
200
0
-40
0
40
80
Ambient Temperature Ta (℃)
120
Please allow sufficient margin when designing a board pattern to fit the expected power dissipation. Also take into
consideration the ambient temperature, input voltage, output current etc and applying the appropriate derating for
allowable power dissipation during operation.
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TCK106G/TCK107G/TCK108G
Representative Common Characteristics
RON - VIN
RON - IOUT
IOUT = 200mA
(mΩ)
(mΩ)
ON resistance RON
ON resistance RON
Ta = 25℃
Ta = 25℃
85℃
-40℃
Input voltage VIN (V)
VIN = 1.2V
1.8V
3.3V
5.0V
Output current IOUT (mA)
Quiescent current (ON state) IQ (nA)
RON - Ta
ON resistance RON
(mΩ)
IOUT = 200mA
VIN = 1.2V
1.8V
3.3V
5.0V
Ambient temperature Ta
IQ - VIN
85℃
-40℃
Ta = 25℃
IOUT = 0mA VCT = 5.5 V
Input voltage VIN (V)
(℃)
IQ(OFF) - VIN
Ta = 25℃
OFF-state switch current ISDOFF
Standby current IQ(OFF)
(nA)
(nA)
ISD(OFF) - VIN
85℃
-40℃
VCT = 0 V VOUT = GND
Ta = 85℃
25℃
-40℃
VCT = 0 V VOUT = GND
Input voltage VIN (V)
Input voltage VIN (V)
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TCK106G/TCK107G/TCK108G
tON Response
4.0
CL = 0.1μF
2.0
1.0μF
0
4.7μF
10
0
VOUT (V)
0
4.0
100
RL = 500Ω
0
4.0
100
CL = 0.1μF
2.0
1.0μF
0
4.7μF
0
time
(200μs/div)
t
(200μs/div)
VIN = 5.0V tON Response
RL = 500Ω
1.0
IOUT (mA)
CL = 0.1μF
2.0
1.0μF
4.7μF
0
0
time
2.0
(200μs/div)
tOFF Response
VIN = 1.2V tOFF Response
VCT (V)
TCK106G
t
RL = 500Ω
1.0
VOUT (V)
4.0
IOUT (mA)
0
10
2.0
CL = 0.1μF
1.0μF
4.7μF
0
0
time
t
2.0
VIN = 3.3V t Response
RL = 500Ω
1.0
0
VOUT (V)
VCT (V)
2.0
t
VIN = 3.3V tON Response
1.0
VOUT (V)
0
2.0
IOUT (mA)
RL = 500Ω
1.0
time
VCT (V)
VCT (V)
VIN = 1.2V tON Response
2.0
4.0
IOUT (mA)
IOUT (mA)
VOUT (V)
VCT (V)
TCK107G
100
CL = 0.1μF
1.0μF
2.0
0
0
time
(1ms/div)
8
4.7μF
t
(1ms/div)
2012-12-11
TCK106G/TCK107G/TCK108G
VCT (V)
2.0
VIN = 5.0V tOFF Response
RL = 500Ω
1.0
VOUT (V)
4.0
IOUT (mA)
0
100
CL = 0.1μF
1.0μF
2.0
0
time
(1ms/div)
tOFF Response
RL = 500Ω
1.0
VOUT (V)
0
4.0
CL = 0.1μF
2.0
1.0μF
10
4.7μF
0
0
time
2.0
t
2.0
VIN = 3.3V tOFF Response
RL = 500Ω
1.0
0
VOUT (V)
VCT (V)
VIN = 1.2V tOFF Response
4.0
IOUT (mA)
2.0
t
IOUT (mA)
VCT (V)
TCK107G
100
CL = 0.1μF
1.0μF
2.0
4.7μF
0
0
time
(200μs/div)
t
(200μs/div)
VIN = 5.0V tOFF Response
RL = 500Ω
1.0
VOUT (V)
0
4.0
IOUT (mA)
VCT (V)
4.7μF
0
100
CL = 0.1μF
1.0μF
2.0
4.7μF
0
0
time
t
(200μs/div)
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TCK106G/TCK107G/TCK108G
Package Dimensions
WCSP4
Unit : mm
Weight : 0.7 mg ( typ.)
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TCK106G/TCK107G/TCK108G
RESTRICTIONS ON PRODUCT USE
• Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively "Product") without notice.
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TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission.
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responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the
Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of
all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes
for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the
instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their
own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such
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