ETC R124681000

TECHNICAL DATA SHEET
1/4
RIGHT ANGLE JACK RECEPTACLE FOR PCB
R124.681.000
Series : SMA-COM
SMT TYPE
All dimensions are in mm.
.
pn
.
ao
COMPONENTS
BODY
CENTER CONTACT
OUTER CONTACT
INSULATOR
GASKET
OTHERS PARTS
-
PLATINGS (µm)
MATERIALS
BRASS
BERYLLIUM COPPER
PTFE
-
GOLD 0.2 OVER NICKEL 2
GOLD 0.5 OVER NICKEL 2
-
-
Issue : 0430 B
In the effort to improve our products, we reserve the right to make changes judged to be
necessary.
TECHNICAL DATA SHEET
2/4
R124.681.000
RIGHT ANGLE JACK RECEPTACLE FOR PCB
Series : SMA-COM
SMT TYPE
PACKAGING
Standard
100
SPECIFICATION
Unit
‘W’ option
Other
Contact us
ELECTRICAL CHARACTERISTICS
Impedance
Frequency
VSWR
1.16 +
Insertion loss
RF leakage
-(
Voltage rating
Dielectric withstanding voltage
Insulation resistance
50
0-6
0.000
0.07
60
500
1000
5000
Ω
GHz
x F(GHz) Maxi
ENVIRONMENTAL
Operating temperature
Hermetic seal
Panel leakage
√F(GHz) dB Maxi
- F(GHz)) dB Maxi
Veff Maxi
Veff mini
MΩ mini
OTHERS CHARACTERISTICS
Assembly instruction
Others :
-
MECHANICAL CHARACTERISTICS
Center contact retention
Axial force – Mating end
Axial force – Opposite end
Torque
Recommended torque
Mating
Panel nut
Mating life
Weight
-65/+165 ° C
NA Atm.cm3/s
NA
15 N mini
15 N mini
1 N.cm mini
40 N.cm
NA N.cm
100 Cycles mini
3.000 g
Issue : 0430 B
In the effort to improve our products, we reserve the right to make changes judged to be
necessary.
NA
TECHNICAL DATA SHEET
RIGHT ANGLE JACK RECEPTACLE FOR PCB
SMT TYPE
3/4
R124.681.000
Series : SMA-COM
SERIE SMA - INFORMATION
COPLANAR LINE
Pattern and signal are on the same side Thickness of PCB : .063 (1.6 mm)
The material of PCB : epoxy resin (Er=4.8)
The solder resist should be printed except for the land pattern on the PCB
SHADOW OF RECEPTACLE FOR VIDEO CAMERA
Issue : 0430 B
In the effort to improve our products, we reserve the right to make changes judged to be
necessary.
TECHNICAL DATA SHEET
4/4
RIGHT ANGLE JACK RECEPTACLE FOR PCB
R124.681.000
Series : SMA-COM
SMT TYPE
SOLDER PROCEDURE
1.
Deposition of solder paste ‘Sn Ag4 Cu0.5’ on mounting zone by screen printing application. We recommend a low
residue flux.
We advise a thickness of 150 microns ( 5.850 microinch ). Verify that the edges of the zone are clean.
2.
Placement of the receptacle on the mounting zone with an automatic machine of ‘pick and place’ type.
Video camera is recommended for the positioning of the component. Adhesive agents must not be used on the
receptacle.
3.
Soldering by infra-red reflow.
Below, please find the typical profile to use.
4.
Cleaning of printed circuit boards.
5.
Checking of solder joints and position of the component by visual inspection.
TEMPERATURE PROFILE
Parameter
Temperature rising Area
Max Peak Temperature
Max dwell time @260°C
Min dwell time @235°C
Max dwell time @235°C
Temperature drop in cooling Area
Max dwell time above 100°C
Value
1 -4
260
10
20
60
-1 to - 4
420
Issue : 0430 B
In the effort to improve our products, we reserve the right to make changes judged to be
necessary.
Unit
°C/sec
°C
sec
sec
sec
°C/sec
sec