SPECIFICATION Part No. : PA.11 Specification No : PA-2400-15-10-A-02 Product Name : 2.4GHz Band Dielectric Ceramic PIFA SMT Antenna for Bluetooth/WLAN/Zigbee Applications Description : 2400-2484Mhz, 1.5dBi Peak Gain Size: 10mm*4mm*3mm Designed for the top right hand corner edge of the Component side of the board (bottom left corner edge) SMT Mount RoHS Compliant SPE-11-8-091/A 05-Sep-11 Page 1 of 1 1.0 Scope This specification covers the Dielectric PIFA Antenna for 2400-2484MHz, covering such applications as Wi-Fi, Bluetooth and Zigbee. A ceramic dielectric PIFA antenna offers smallest footprint, superior gain characteristics and improved isolation over traditional PCB based antennas. This antenna has been developed for the top right hand corner edge of the component side of the Board (bottom left corner edge), the antenna has to be positioned on a non-ground (copper/metal free) area with the feed-point matched direct to the module. Please refer to Recommended Foot print Diagram (8.0 Page 13.). 2.0 Electrical Specifications The antenna has the electrical characteristics given in Table 1 under the Taoglas standard installation conditions as shown in the Evaluation Board. figure. No. Parameter Specification 1 2 3 4 5 6 7 8 Working Frequency Dimensions Peak Gain Polarization Impedance VSWR Operating Temperature Termination 2400MHz ~ 2484MHz 10*4*3mm 1.5 dBi max Linear 50 Ω 2.0 max -40~+85°C Ag(Environmentally Friendly Lead-Free) * Data is measured on Taoglas Standard Reference PCB SPE-11-8-091/A 05-Sep-11 Page 2 of 2 3.0 S11 Response Curve * Gain is measured on test PCB (40*80*0.8) * Ant position: Right side, top corner edge, horizontal 4.0 Test Position z x SPE-11-8-091/A 05-Sep-11 y Page 3 of 3 5.0 Summary of Test Results 5.1 Gain & Efficiency 1 2 3 4 5 Frequency (GHz) 2.400 2.442 2.450 2.4835 2.500 Peak Gain(dBi) 2.78 31.2 3.27 2.76 2.34 Efficiency (%) 80.64 85.65 86.50 75.91 68.07 5.2 Power Average Gain 1 Frequency (GHz) 2.400 2 2.442 3 2.450 4 2.4835 5 2.500 SPE-11-8-091/A Plane XY plane YZ plane XZ plane XY plane YZ plane XZ plane XY plane YZ plane XZ plane XY plane YZ plane XZ plane XY plane YZ plane XZ plane 05-Sep-11 Average Gain (dBi) -1.622 -1.324 -0.561 -2.464 -0.859 -0.312 -1.424 -0.950 -0.224 -2.949 -1.548 -0.784 -2.444 -2.084 -1.258 Page 4 of 4 6.0 Antenna Pattern – Wi-Fi & Bluetooth Frequency: 2.400 GHz SPE-11-8-091/A 05-Sep-11 Page 5 of 5 Frequency: 2.442 GHz SPE-11-8-091/A 05-Sep-11 Page 6 of 6 SPE-11-8-091/A 05-Sep-11 Page 7 of 7 Frequency: 2.450 GHz SPE-11-8-091/A 05-Sep-11 Page 8 of 8 Frequency: 2.4835 GHz SPE-11-8-091/A 05-Sep-11 Page 9 of 9 SPE-11-8-091/A 05-Sep-11 Page 10 of 10 Frequency: 2.500 GHz SPE-11-8-091/A 05-Sep-11 Page 11 of 11 7.0 Drawing SPE-11-8-091/A 05-Sep-11 Page 12 of 12 Silver Copper Solder Area Ground Clearance Area SPE-11-8-091/A 05-Sep-11 Page 13 of 13 8.0 Recommended foot print for Evaluation Board SPE-11-8-091/A 05-Sep-11 Page 14 of 14 9.0 Delivery Mode 1 Blister tape to IEC 286-3，polyester 2 Pieces/tape：1000 Product code Units per Reel C (mm) D (mm) W2 (mm) PA.11 1000 330±1 62±0.5 24±1 SPE-11-8-091/A 05-Sep-11 Page 15 of 15 SPE-11-8-091/A No Index Spec. (mm) 1 2 3 4 5 6 A B P1 W F T 4.6 10.6 12 24 8.5 3.5 7 D 1.5 05-Sep-11 Page 16 of 16 10.0 Recommended Reflow Temperature Profile 1. Time shown in the above figures is measured from the point when chip surface reaches temperature. 2. Temperature difference in high temperature part should be within 110°C. 3. After soldering, do not force cool, allow the parts to cool gradually. *General attention to soldering: ●High soldering temperatures and long soldering times can cause leaching of the termination, decrease in adherence strength, and the change of characteristic may occur. ● For soldering, please refer to the soldering curves above. However, please keep exposure to temperatures exceeding 200°C to under 50 seconds. ● Please use a mild flux (containing less than 0.2wt% Cl). Also, if the flux is water soluble, be sure to wash thoroughly to remove any residue from the underside of components that could affect resistance. SPE-11-8-091/A 05-Sep-11 Page 17 of 17 Cleaning: When using ultrasonic cleaning, the board may resonate if the output power is too high. Since this vibration can cause cracking or a decrease in the adherence of the termination, we recommend that you use the conditions below. Frequency: 40kHz Output Power: 20W/liter Cleaning Time: 5 minutes max SPE-11-8-091/A 05-Sep-11 Page 18 of 18