RENESAS PS9308L2-E3

Preliminary Data Sheet
PS9308L,PS9308L2
R08DS0048EJ0100
Rev.1.00
Aug 31, 2011
2.0 A OUTPUT CURRENT, HIGH CMR, IGBT GATE DRIVE, 6-PIN SDIP PHOTOCOUPLER
DESCRIPTION
The PS9308L and PS9308L2 are optical coupled isolators containing a GaAlAs LED on the input side and a photo
diode, a signal processing circuit and a power output transistor on the output side on one chip.
The PS9308L and PS9308L2 are in 6-pin plastic SDIP (Shrink Dual In-line Package). The PS9308L2 has 8 mm
creepage distance. The mount area of 6-pin plastic SDIP is half size of 8-pin DIP.
The PS9308L and PS9308L2 are designed specifically for high common mode transient immunity (CMR) and high
switching speed. It is suitable for driving IGBTs and MOS FETs.
The PS9308L is lead bending type (Gull-wing) for surface mounting.
The PS9308L2 is lead bending type for long creepage distance (Gull-wing) for surface mount.
FEATURES
Long creepage distance (8 mm MIN.: PS9308L2)
Half size of 8-pin DIP
Peak output current (2.0 A MAX., 1.0 A MIN.)
High speed switching (tPLH, tPHL = 0.25 μs MAX.)
UVLO (Under Voltage Lock Out) protection with hysteresis
High common mode transient immunity (CMH, CML = ±25 kV/μs MIN.)
Embossed tape product : PS9308L-E3, PS9308L2-E3 : 2 000 pcs/reel
Pb-Free product
Safety standards
• UL approved: No. E72422
• CSA approved: No. CA 101391 (CA5A, CAN/CSA-C22.2 60065, 60950)
• SEMKO approved: No. 1115598
• DIN EN60747-5-2 (VDE0884 Part2) approved: No. 40024069 (Option)
PIN CONNECTION
(Top View)
6
5
4
SHIELD
•
•
•
•
•
•
•
•
•
1
2
1. Anode
2. NC
3. Cathode
4. VEE
5. VO
6. VCC
3
APPLICATIONS
• IGBT, Power MOS FET Gate Driver
• Industrial inverter
• IH (Induction Heating)
R08DS0048EJ0100 Rev.1.00
Aug 31, 2011
Page 1 of 16
PS9308L,PS9308L2
Chapter Title
PACKAGE DIMENSIONS (UNIT: mm)
Lead Bending Type (Gull-wing) For Surface Mount
PS9308L
4.58±0.3
6.8±0.25
(0.82)
9.7±0.3
0.25±0.15
0.2±0.15
3.5±0.2
3.7±0.25
7.62
1.27
0.4±0.1
0.8±0.25
0.25 M
Lead Bending Type (Gull-wing) For Long Creepage Distance (Surface Mount)
PS9308L2
4.58±0.3
6.8±0.25
(0.82)
11.5±0.3
1.27
0.4±0.1
R08DS0048EJ0100 Rev.1.00
Aug 31, 2011
0.25±0.15
0.2±0.15
3.5±0.2
3.7±0.25
7.62
0.75±0.25
0.25 M
Page 2 of 16
PS9308L,PS9308L2
Chapter Title
PHOTOCOUPLER CONSTRUCTION
Parameter
Air Distance (MIN.)
Outer Creepage Distance (MIN.)
Isolation Distance (MIN.)
PS9308L
7 mm
7 mm
0.4 mm
PS9308L2
8 mm
8 mm
0.4 mm
MARKING EXAMPLE
R
9308
N131
Company Initial
Type Number
Assembly Lot
No. 1 pin Mark
N
1 31
Week Assembled
Year Assembled
(Last 1 Digit)
Rank Code
R08DS0048EJ0100 Rev.1.00
Aug 31, 2011
Page 3 of 16
PS9308L,PS9308L2
Chapter Title
ORDERING INFORMATION
Part Number
Order Number
PS9308L
PS9308L-E3
PS9308L-AX
PS9308L-E3-AX
PS9308L2
PS9308L2-E3
PS9308L2-AX
PS9308L2-E3-AX
PS9308L-V
PS9308L-V-E3
PS9308L-V-AX
PS9308L-V-E3-AX
PS9308L2-V
PS9308L2-V-AX
PS9308L2-V-E3 PS9308L2-V-E3-AX
Note:
Solder Plating
Specification
Pb-Free
(Ni/Pd/Au)
Packing Style
20 pcs (Tape 20 pcs cut)
Embossed Tape 2 000
pcs/reel
20 pcs (Tape 20 pcs cut)
Embossed Tape 2 000
pcs/reel
20 pcs (Tape 20 pcs cut)
Embossed Tape 2 000
pcs/reel
20 pcs (Tape 20 pcs cut)
Embossed Tape 2 000
pcs/reel
Safety Standard
Approval
Standard
products
(UL, CSA,
SEMKO
approved)
Application
*1
Part Number
PS9308L
PS9308L2
DIN EN60747-5-2 PS9308L
(VDE0884 Part2)
approved
(Option)
PS9308L2
*1. For the application of the Safety Standard, following part number should be used.
R08DS0048EJ0100 Rev.1.00
Aug 31, 2011
Page 4 of 16
PS9308L,PS9308L2
Chapter Title
ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise specified)
Diode
Parameter
Forward Current
Peak Transient
Forward Current
(Pulse Width < 1 μs)
Reverse Voltage
Detector
High Level Peak
*1
Output Current
Low Level Peak
*1
Output Current
Supply Voltage
Output Voltage
Power Dissipation *2
Isolation Voltage *3
Total Power Dissipation *4
Operating Frequency *5
Operating Ambient Temperature
Storage Temperature
Symbol
IF
IF (TRAN)
Ratings
25
1.0
Unit
mA
A
VR
IOH (PEAK)
5
2.0
V
A
IOL (PEAK)
2.0
A
(VCC−VEE)
VO
PC
BV
PT
f
TA
Tstg
0 to 35
0 to VCC
250
5 000
300
50
−40 to +110
−55 to +125
V
V
mW
Vr.m.s.
mW
kHz
°C
°C
Notes: *1. Maximum pulse width = 10 μs, Maximum duty cycle = 0.2%
*2. Reduced to 4.8 mW/°C at TA = 70°C or more.
*3. AC voltage for 1 minute at TA = 25°C, RH = 60% between input and output.
Pins 1-3 shorted together, 4-6 shorted together.
*4. Reduced to 5.4 mW/°C at TA = 70°C or more.
*5. IOH (PEAK) ≤ 2.0 A (≤ 0.3 μs), IOL (PEAK) ≤ 2.0 A (≤ 0.3 μs)
RECOMMENDED OPERATING CONDITIONS
Parameter
Supply Voltage
Forward Current (ON)
Forward Voltage (OFF)
Operating Ambient Temperature
R08DS0048EJ0100 Rev.1.00
Aug 31, 2011
Symbol
(VCC−VEE)
IF (ON)
VF (OFF)
TA
MIN.
15
7
−2
−40
TYP.
10
MAX.
30
16
0.8
110
Unit
V
mA
V
°C
Page 5 of 16
PS9308L,PS9308L2
Chapter Title
ELECTRICAL CHARACTERISTICS (at RECOMMENDED OPERATING CONDITIONS,
VEE = GND, unless otherwise specified)
Diode
Detector
Threshold Input Current
(L → H)
IFLH
Conditions
MIN.
TYP.*1
MAX.
IF = 10 mA, TA = 25°C
1.2
1.56
1.8
VR = 3 V, TA = 25°C
10
f = 1 MHz, VF = 0 V, TA = 25°C
30
VO = (VCC − 4 V) *2
1.0
1.5
*3
VO = (VCC − 15 V)
1.5
VO = (VEE + 2.5 V) *2
1.0
1.5
*3
VO = (VEE + 15 V)
1.5
IO = −100 mA *4
VCC-3.0 VCC-1.3
IO = 100 mA
0.1
0.5
IF = 10 mA, VO = open
1.2
2.0
VF = 0 to 0.8 V, VO = open
1.2
2.0
Vo > 5V, IF = 10 mA
10.8
12.3
13.4
9.5
11.0
12.5
0.4
1.3
IO = 0 mA, VO > 5 V
1.8
5.0
Threshold Input Voltage
(H → L)
VFHL
IO = 0 mA, VO < 5 V
Parameter
Forward Voltage
Reverse Current
Input Capacitance
High Level Output Current
Symbol
VF
IR
CIN
IOH
Low Level Output Current
IOL
High Level Output Voltage
Low Level Output Voltage
High Level Supply Current
Low Level Supply Current
UVLO Threshold
VOH
VOL
ICCH
ICCL
VUVLO+
VUVLOUVLOHYS
UVLO Hysteresis
Coupled
Notes: *1.
*2.
*3.
*4.
0.8
Unit
V
μA
pF
A
A
V
V
mA
mA
V
mA
V
Typical values at TA = 25°C.
Maximum pulse width = 50 μs, Maximum duty cycle = 0.5%.
Maximum pulse width = 10 μs, Maximum duty cycle = 0.2%.
VOH is measured with the DC load current in this testing. (Maximum pulse width = 2 ms, Maximum duty cycle
= 20%)
R08DS0048EJ0100 Rev.1.00
Aug 31, 2011
Page 6 of 16
PS9308L,PS9308L2
Chapter Title
SWITCHING CHARACTERISTICS (at RECOMMENDED OPERATING CONDITIONS,
VEE = GND, unless otherwise specified)
Parameter
Symbol
Propagation Delay Time (L → H)
tPLH
Propagation Delay Time (H → L)
tPHL
Pulse Width Distortion (PWD)
|tPHL−tPLH|
tPHL−tPLH
Propagation Delay Time
(Difference Between Any Two
Products)
Rise Time
tr
Fall Time
tf
|CMH|
Common Mode Transient
Immunity at High Level Output
Common Mode Transient
Immunity at Low Level Output
|CML|
Conditions
Rg = 10 Ω, Cg = 10 nF,
f = 10 kHz,
Duty Cycle = 50%*2,
IF = 10 mA
MIN.
TYP.*1
0.08
0.10
0.02
-0.1
50
50
MAX.
0.25
0.25
0.1
0.1
Unit
μs
μs
μs
μs
TA = 25°C, IF = 10 mA,
VCC = 30 V, VCM = 1.5 kV,
VO (MIN.) = 26 V
25
ns
ns
kV/μs
TA = 25°C, IF = 0 mA,
VCC = 30 V, VCM = 1.5 kV,
VO (MAX.) = 1 V
25
kV/μs
Notes: *1. Typical values at TA = 25°C.
*2. This load condition is equivalent to the IGBT load at 1 200 V/25 A.
R08DS0048EJ0100 Rev.1.00
Aug 31, 2011
Page 7 of 16
PS9308L,PS9308L2
Chapter Title
TEST CIRCUIT
Fig. 1 IOH Test Circuit
1
6
2
5
3
IF =
7 to 16 mA
4
Fig. 2 IOL Test Circuit
IOH
6
2
5
3
4
1.0 μF
4V
1.0 μF
1
VCC =
15 to 30 V
SHIELD
1
6
2
5
2.5 V
Fig. 4 VOL Test Circuit
1.0 μF
VOH
VCC =
15 to 30 V
4
IF =
7 to 16 mA
1
6
2
5
3
4
1.0 μF
VOL
100 mA
SHIELD
Fig. 5 UVLO Test Circuit
IF = 10 mA 1
6
2
5
3
4
Fig. 6 IFLH Test Circuit
1.0 μF
VCC
IF
1
6
2
5
3
4
1.0 μF
VO > 5 V
VO > 5 V
R08DS0048EJ0100 Rev.1.00
Aug 31, 2011
VCC = 15 to 30 V
100 mA
SHIELD
SHIELD
VCC = 15 to 30 V
SHIELD
Fig. 3 VOH Test Circuit
3
IOL
VCC =
15 to 30 V
SHIELD
Page 8 of 16
PS9308L,PS9308L2
Chapter Title
Fig. 7 tPLH, tPHL, tr, tf Test Circuit and Wave Forms
IF = 10 mA
1
6
2
5
IF
1.0 μF
VO
10 kHz
50% DUTY
CYCLE
3
tr
VCC = 15 to 30 V
90%
50%
10%
10 Ω
10 nF
4
VOUT
tPLH
SHIELD
tf
tPHL
Fig. 8 CMR Test Circuit and Wave Forms
IF A
B
1
6
2
5
3
4
SHIELD
VCM = 1.5 kV
R08DS0048EJ0100 Rev.1.00
Aug 31, 2011
VCM
VCM
δV
=
Δt
δt
1.0 μF
VCC = 30 V
VO
0V
VO
(Switch A: IF = 10 mA)
VO
(Switch B: IF = 0 mA)
Δt
VOH
26 V
1V
VOL
Page 9 of 16
PS9308L,PS9308L2
Chapter Title
TAPING SPECIFICATIONS (UNIT: mm)
7.5±0.1
1.5 +0.1
–0
4.5 MAX.
10.2±0.1
4.0±0.1
16.0±0.3
2.0±0.1
1.75±0.1
Outline and Dimensions (Tape)
1.5 +0.1
–0
0.35
8.0±0.1
4.05±0.1
5.08±0.1
Tape Direction
PS9308L-E3
Outline and Dimensions (Reel)
R 1.0
100±1.0
2.0±0.5
13.0±0.2
330±2.0
2.0±0.5
21.0±0.8
17.5±1.0
21.5±1.0
Packing: 2 000 pcs/reel
R08DS0048EJ0100 Rev.1.00
Aug 31, 2011
15.9 to 19.4
Outer edge of
flange
Page 10 of 16
PS9308L,PS9308L2
Chapter Title
11.5±0.1
1.5 +0.1
–0
4.5 MAX.
12.0±0.1
4.0±0.1
24.0±0.3
2.0±0.1
1.75±0.1
Outline and Dimensions (Tape)
2.0 +0.1
–0
8.0±0.1
0.35
4.05±0.1
5.08±0.1
Tape Direction
PS9308L2-E3
Outline and Dimensions (Reel)
R 1.0
100±1.0
2.0±0.5
13.0±0.2
330±2.0
2.0±0.5
21.0±0.8
25.5±1.0
29.5±1.0
Packing: 2 000 pcs/reel
R08DS0048EJ0100 Rev.1.00
Aug 31, 2011
23.9 to 27.4
Outer edge of
flange
Page 11 of 16
PS9308L,PS9308L2
Chapter Title
RECOMMENDED MOUNT PAD DIMENSIONS (UNIT: mm)
B
C
D
A
Part Number
Lead Bending
A
B
C
D
PS9308L
lead bending type (Gull-wing)
for surface mount
9.2
1.27
0.8
2.2
PS9308L2
lead bending type (Gull-wing)
for long creepage distance (surface mount)
10.2
1.27
0.8
2.2
R08DS0048EJ0100 Rev.1.00
Aug 31, 2011
Page 12 of 16
PS9308L,PS9308L2
Chapter Title
NOTES ON HANDLING (UNIT: mm)
1. Recommended soldering conditions
(1) Infrared reflow soldering
• Peak reflow temperature
• Time of peak reflow temperature
• Time of temperature higher than 220°C
• Time to preheat temperature from 120 to 180°C
• Number of reflows
• Flux
260°C or below (package surface temperature)
10 seconds or less
60 seconds or less
120 ± 30 s
Three
Rosin flux containing small amount of chlorine (The flux
with a maximum chlorine content of 0.2 Wt% is
recommended.)
Package Surface Temperature T (°C)
Recommended Temperature Profile of Infrared Reflow
(heating)
to 10 s
260°C MAX.
220°C
to 60 s
180°C
120°C
120±30 s
(preheating)
Time (s)
(2) Wave soldering
• Temperature
• Time
• Preheating conditions
• Number of times
• Flux
260°C or below (molten solder temperature)
10 seconds or less
120°C or below (package surface temperature)
One (Allowed to be dipped in solder including plastic mold portion.)
Rosin flux containing small amount of chlorine (The flux with a maximum chlorine
content of 0.2 Wt% is recommended.)
(3) Soldering by Soldering Iron
• Peak Temperature (lead part temperature) 350°C or below
• Time (each pins)
3 seconds or less
• Flux
Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
(a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead
(4) Cautions
• Fluxes
Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent.
2. Cautions regarding noise
Be aware that when voltage is applied suddenly between the photocoupler’s input and output at startup, the output
transistor may enter the on state, even if the voltage is within the absolute maximum ratings.
R08DS0048EJ0100 Rev.1.00
Aug 31, 2011
Page 13 of 16
PS9308L,PS9308L2
Chapter Title
USAGE CAUTIONS
1. This product is weak for static electricity by designed with high-speed integrated circuit so protect against static
electricity when handling.
2. Board designing
(1) By-pass capacitor of more than 1.0 μF is used between VCC and GND near device. Also, ensure that the distance
between the leads of the photocoupler and capacitor is no more than 10 mm.
(2) When designing the printed wiring board, ensure that the pattern of the IGBT collectors/emitters is not too close
to the input block pattern of the photocoupler.
If the pattern is too close to the input block and coupling occurs, a sudden fluctuation in the voltage on the IGBT
output side might affect the photocoupler’s LED input, leading to malfunction or degradation of characteristics.
(If the pattern needs to be close to the input block, to prevent the LED from lighting during the off state due to
the abovementioned coupling, design the input-side circuit so that the bias of the LED is reversed, within the
range of the recommended operating conditions, and be sure to thoroughly evaluate operation.)
(3) Pin 2 (which is an NC*1 pin) can either be connected directly to the GND pin on the LED side or left open.
Unconnected pins should not be used as a bypass for signals or for any other similar purpose because this may
degrade the internal noise environment of the device.
Note: *1. NC: Non-Connection (No Connection).
3. Make sure the rise/fall time of the forward current is 0.5 μs or less.
4. In order to avoid malfunctions, make sure the rise/fall slope of the supply voltage is 3 V/μs or less.
5. Avoid storage at a high temperature and high humidity.
R08DS0048EJ0100 Rev.1.00
Aug 31, 2011
Page 14 of 16
PS9308L,PS9308L2
Chapter Title
SPECIFICATION OF VDE MARKS LICENSE DOCUMENT
Parameter
Symbol
Climatic test class (IEC 60068-1/DIN EN 60068-1)
Dielectric strength
maximum operating isolation voltage
Test voltage (partial discharge test, procedure a for type test and random test)
Upr = 1.5 × UIORM., Pd < 5 pC
Spec.
Unit
40/110/21
UIORM
Upr
1 130
1 695
Vpeak
Vpeak
Test voltage (partial discharge test, procedure b for all devices)
Upr = 1.875 × UIORM., Pd < 5 pC
Upr
2 119
Vpeak
Highest permissible overvoltage
UTR
8 000
Vpeak
CTI
175
Degree of pollution (DIN EN 60664-1 VDE0110 Part 1)
Comparative tracking index (IEC 60112/DIN EN 60112 (VDE 0303 Part 11))
2
Material group (DIN EN 60664-1 VDE0110 Part 1)
III a
Storage temperature range
Tstg
–55 to +125
°C
Operating temperature range
TA
–40 to +110
°C
Ris MIN.
Ris MIN.
1012
11
10
Ω
Ω
Tsi
Isi
Psi
175
400
700
°C
mA
mW
Ris MIN.
109
Ω
Isolation resistance, minimum value
VIO = 500 V dc at TA = 25°C
VIO = 500 V dc at TA MAX. at least 100°C
Safety maximum ratings (maximum permissible in case of fault, see thermal
derating curve)
Package temperature
Current (input current IF, Psi = 0)
Power (output or total power dissipation)
Isolation resistance
VIO = 500 V dc at TA = Tsi
R08DS0048EJ0100 Rev.1.00
Aug 31, 2011
Page 15 of 16
PS9308L,PS9308L2
Caution
GaAs Products
Chapter Title
This product uses gallium arsenide (GaAs).
GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe
the following points.
• Follow related laws and ordinances when disposing of the product. If there are no applicable laws
and/or ordinances, dispose of the product as recommended below.
1. Commission a disposal company able to (with a license to) collect, transport and dispose of
materials that contain arsenic and other such industrial waste materials.
2. Exclude the product from general industrial waste and household garbage, and ensure that the
product is controlled (as industrial waste subject to special control) up until final disposal.
• Do not burn, destroy, cut, crush, or chemically dissolve the product.
• Do not lick the product or in any way allow it to enter the mouth.
R08DS0048EJ0100 Rev.1.00
Aug 31, 2011
Page 16 of 16
Revision History
PS9308L,PS9308L2 Data Sheet
Rev.
Date
Page
1.00
Aug 31, 2011
−
Description
Summary
First edition issued
All trademarks and registered trademarks are the property of their respective owners.
C-1
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redundancy, fire control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures. Because the evaluation of microcomputer software alone is very difficult,
please evaluate the safety of the final products or system manufactured by you.
10. Please contact a Renesas Electronics sales office for details as to environmental matters such as the environmental compatibility of each Renesas Electronics product. Please use Renesas Electronics
products in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. Renesas Electronics assumes
no liability for damages or losses occurring as a result of your noncompliance with applicable laws and regulations.
11. This document may not be reproduced or duplicated, in any form, in whole or in part, without prior written consent of Renesas Electronics.
12. Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this document or Renesas Electronics products, or if you have any other inquiries.
(Note 1)
"Renesas Electronics" as used in this document means Renesas Electronics Corporation and also includes its majority-owned subsidiaries.
(Note 2)
"Renesas Electronics product(s)" means any product developed or manufactured by or for Renesas Electronics.
http://www.renesas.com
SALES OFFICES
Refer to "http://www.renesas.com/" for the latest and detailed information.
Renesas Electronics America Inc.
2880 Scott Boulevard Santa Clara, CA 95050-2554, U.S.A.
Tel: +1-408-588-6000, Fax: +1-408-588-6130
Renesas Electronics Canada Limited
1101 Nicholson Road, Newmarket, Ontario L3Y 9C3, Canada
Tel: +1-905-898-5441, Fax: +1-905-898-3220
Renesas Electronics Europe Limited
Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K
Tel: +44-1628-585-100, Fax: +44-1628-585-900
Renesas Electronics Europe GmbH
Arcadiastrasse 10, 40472 Düsseldorf, Germany
Tel: +49-211-65030, Fax: +49-211-6503-1327
Renesas Electronics (China) Co., Ltd.
7th Floor, Quantum Plaza, No.27 ZhiChunLu Haidian District, Beijing 100083, P.R.China
Tel: +86-10-8235-1155, Fax: +86-10-8235-7679
Renesas Electronics (Shanghai) Co., Ltd.
Unit 204, 205, AZIA Center, No.1233 Lujiazui Ring Rd., Pudong District, Shanghai 200120, China
Tel: +86-21-5877-1818, Fax: +86-21-6887-7858 / -7898
Renesas Electronics Hong Kong Limited
Unit 1601-1613, 16/F., Tower 2, Grand Century Place, 193 Prince Edward Road West, Mongkok, Kowloon, Hong Kong
Tel: +852-2886-9318, Fax: +852 2886-9022/9044
Renesas Electronics Taiwan Co., Ltd.
13F, No. 363, Fu Shing North Road, Taipei, Taiwan
Tel: +886-2-8175-9600, Fax: +886 2-8175-9670
Renesas Electronics Singapore Pte. Ltd.
1 harbourFront Avenue, #06-10, keppel Bay Tower, Singapore 098632
Tel: +65-6213-0200, Fax: +65-6278-8001
Renesas Electronics Malaysia Sdn.Bhd.
Unit 906, Block B, Menara Amcorp, Amcorp Trade Centre, No. 18, Jln Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, Malaysia
Tel: +60-3-7955-9390, Fax: +60-3-7955-9510
Renesas Electronics Korea Co., Ltd.
11F., Samik Lavied' or Bldg., 720-2 Yeoksam-Dong, Kangnam-Ku, Seoul 135-080, Korea
Tel: +82-2-558-3737, Fax: +82-2-558-5141
© 2011 Renesas Electronics Corporation. All rights reserved.
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