DAC5652-EP www.ti.com SGLS341B – JUNE 2006 – REVISED OCTOBER 2006 DUAL 10-BIT 200-MSPS DIGITAL-TO-ANALOG CONVERTER FEATURES • • • • • • • • • (1) Controlled Baseline – One Assembly – One Test Site – One Fabrication Site Extended Temperature Performance of –55°C to 125°C Enhanced Diminishing Manufacturing Sources (DMS) Support Enhanced Product-Change Notification Qualification Pedigree (1) 10-Bit Dual Transmit Digital-to-Analog Converter (DAC) 200-MSPS Update Rate Single Supply: 3 V to 3.6 V High Spurious-Free Dynamic Range (SFDR): 80 dBc at 5 MHz Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits. • • • • • • • High Third-Order Two-Tone Intermodulation (IMD3): 78 dBc at 15.1 MHz and 16.1 MHz Independent or Single Resistor Gain Control Dual or Interleaved Data On-Chip 1.2-V Reference Low Power: 290 mW Power-Down Mode: 9 mW Package: 48-Pin Thin Quad Flat Pack (TQFP) APPLICATIONS • • • • • Cellular Base Transceiver Station Transmit Channel – CDMA: W-CDMA, CDMA2000, IS-95 – TDMA: GSM, IS-136, EDGE/UWC-136 Medical/Test Instrumentation Arbitrary Waveform Generators (ARB) Direct Digital Synthesis (DDS) Cable Modem Termination System (CMTS) DESCRIPTION The DAC5652 is a monolithic, dual-channel, 10-bit, high-speed digital-to-analog converter (DAC) with on-chip voltage reference. Operating with update rates of up to 200 MSPS, the DAC5652 offers exceptional dynamic performance, tight gain, and offset matching characteristics that make it suitable in either I/Q baseband or direct IF communication applications. Each DAC has a high-impedance differential-current output, suitable for single-ended or differential analog-output configurations. External resistors allow scaling of the full-scale output current for each DAC separately or together, typically between 2 mA and 20 mA. An accurate on-chip voltage reference is temperature-compensated and delivers a stable 1.2-V reference voltage. Optionally, an external reference may be used. The DAC5652 has two 10-bit parallel input ports with separate clocks and data latches. For flexibility, the DAC5652 also supports multiplexed data for each DAC on one port when operating in the interleaved mode. The DAC5652 has been specifically designed for a differential transformer-coupled output with a 50-Ω doubly-terminated load. For a 20-mA full-scale output current, both a 4:1 impedance ratio (resulting in an output power of 4 dBm) and 1:1 impedance ratio transformer (–2-dBm output power) are supported. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2006, Texas Instruments Incorporated DAC5652-EP www.ti.com SGLS341B – JUNE 2006 – REVISED OCTOBER 2006 DESCRIPTION (CONTINUED) The DAC5652 is available in a 48-pin thin quad flat pack (TQFP). Pin compatibility between family members provides 10-bit (DAC5652), 12-bit (DAC5662), and 14-bit (DAC5672) resolution. Furthermore, the DAC5652 is pin compatible to the DAC2900 and AD9763 dual DACs. The device is characterized for operation over the military temperature range of –55°C to 125°C. FUNCTIONAL BLOCK DIAGRAM WRTB WRTA CLKB CLKA DEMUX IOUTA1 Latch A 10−b DAC IOUTA2 DA[9:0] BIASJ_A IOUTB1 Latch B DB[9:0] 10−b DAC IOUTB2 MODE BIASJ_B GSET 1.2 V Reference EXTIO SLEEP DVDD DGND AVDD AGND AVAILABLE OPTIONS PACKAGED DEVICES 48-PIN TQFP TA DAC5652MPFBREP –55°C to 125°C 2 DAC5652MPFBEP Submit Documentation Feedback DAC5652-EP www.ti.com SGLS341B – JUNE 2006 – REVISED OCTOBER 2006 MODE AVDD IOUTA1 IOUTA2 BIASJ_A EXTIO GSET BIASJ_B IOUTB2 IOUTB1 AGND SLEEP DEVICE INFORMATION 1 48 47 46 45 44 43 42 41 40 39 38 37 36 2 35 3 34 4 33 5 32 Top View 48-Pin TQFP PFB Package 6 7 31 30 8 29 9 28 10 27 11 26 25 12 13 14 15 16 17 18 19 20 21 22 23 24 NC NC NC NC DB0 (LSB) DB1 DB2 DB3 DB4 DB5 DB6 DB7 NC NC DGND DVDD WRTA/WRTIQ CLKA/CLKIQ CLKB/RESETIQ WRTB/SELECTIQ DGND DVDD DB9 (MSB) DB8 DA9 (MSB) DA8 DA7 DA6 DA5 DA4 DA3 DA2 DA1 DA0 (LSB) NC NC TERMINAL FUNCTIONS TERMINAL I/O DESCRIPTION NAME NO. AGND 38 I Analog ground AVDD 47 I Analog supply voltage BIASJ_A 44 O Full-scale output current bias for DACA BIASJ_B 41 O Full-scale output current bias for DACB CLKA/CLKIQ 18 I Clock input for DACA, CLKIQ in interleaved mode CLKB/RESETIQ 19 I Clock input for DACB, RESETIQ in interleaved mode 1–10 I Data port A. DA9 is MSB and DA0 is LSB. DB[9:0] 23–32 I Data port B. DB9 is MSB and DB0 is LSB. DGND 15, 21 I Digital ground DVDD 16, 22 I Digital supply voltage EXTIO 43 I/O GSET 42 I Gain-setting mode: H = 1 resistor, L = 2 resistors. Internal pullup. IOUTA1 46 O DACA current output. Full scale with all bits of DA high. IOUTA2 45 O DACA complementary current output. Full scale with all bits of DA low. IOUTB1 39 O DACB current output. Full scale with all bits of DB high. IOUTB2 40 O DACB complementary current output. Full scale with all bits of DB low. MODE 48 I Mode select: H – dual bus, L – interleaved. Internal pullup. DA[9:0] NC 11–14, 33–36 Internal reference output (bypass with 0.1 µF to AGND) or external reference input Factory use only. Pins must be connected to DGND or left unconnected. SLEEP 37 I Sleep function control input: H = DAC in power-down mode, L = DAC in operating mode. Internal pulldown. WRTA/WRTIQ 17 I Input write signal for PORT A (WRTIQ in interleaving mode) WRTB/SELECTIQ 20 I Input write signal for PORT B (SELECTIQ in interleaving mode) Submit Documentation Feedback 3 DAC5652-EP www.ti.com SGLS341B – JUNE 2006 – REVISED OCTOBER 2006 PFB PACKAGE THERMAL CHARACTERISTICS PARAMETER POWERPAD CONNECTED TO PCB THERMAL PLANE Thermal resistance, junction to ambient 63.7°C/W Thermal resistance, junction to case 19.6°C/W 1000 Wirebond Voiding Fail Mode Years Estimated Life 100 10 Electromigration Fail Mode 1 0.1 100 110 120 130 140 Continuous TJ − 5C Figure 1. DAC5652MPFB Operating Life Derating Chart 4 Submit Documentation Feedback 150 160 DAC5652-EP www.ti.com SGLS341B – JUNE 2006 – REVISED OCTOBER 2006 ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) UNIT Supply voltage range AVDD (2) –0.5 V to 4 V DVDD (3) –0.5 V to 4 V Voltage between AGND and DGND –0.5 V to 0.5 V Voltage between AVDD and DVDD Supply voltage range –0.5 V to 0.5 V DA[9:0] and DB[9:0] (3) –0.5 V to DVDD + 0.5 V MODE, CLKA, CLKB, WRTA, WRTB (3) –0.5 V to DVDD + 0.5 V IOUTA1, IOUTA2, IOUTB1, IOUTB2 (2) –1 V to AVDD + 0.5 V EXTIO, BIASJ_A, BIASJ_B, SLEEP (2) –0.5 V to AVDD + 0.5 V Peak input current (any input) 20 mA Peak total input current (all inputs) –30 mA Operating free-air temperature range –55°C to 125°C Storage temperature range –65°C to 150°C Lead temperature 1,6 mm (1/16 in) from the case for 10 s Junction temperature, TJ (4) Junction-to-ambient temperature, θJA (5) 105°C Still air 19.88°C/W 150 lfm 14.37°C/W Junction-to-case temperature, θJC (1) (2) (3) (4) (5) 260°C 0.12°C/W Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only and functional operation of these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. Measured with respect to AGND Measured with respect to DGND Airflow or heatsinking required for sustained operation at 85°C and maximum operating conditions to maintain junction temperature. Airflow or heatsinking reduces θJA and is highly recommended. Submit Documentation Feedback 5 DAC5652-EP www.ti.com SGLS341B – JUNE 2006 – REVISED OCTOBER 2006 ELECTRICAL CHARACTERISTICS over operating free-air temperature range, AVDD = DVDD = 3.3 V, IOUTFS = 20 mA, independent gain set mode (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT DC Specifications Resolution 10 Bits DC Accuracy (1) INL Integral nonlinearity 1 LSB = IOUTFS/210, TMIN to TMAX –1 ±0.25 1 LSB DNL Differential nonlinearity 1 LSB = IOUTFS/210, TMIN to TMAX –0.5 ±0.16 0.5 LSB Analog Output Offset error Mid-scale value (internal reference) ±0.05 %FSR Offset mismatch Mid-scale value (internal reference) ±0.03 %FSR Gain error With internal reference ±0.75 %FSR current (2) 2 Maximum full-scale output current (2) 20 Minimum full-scale output Gain mismatch With internal reference Output voltage compliance range (3) RO Output resistance CO Output capacitance –2 0.2 –0.8 mA mA 2 1.25 %FSR V 300 kΩ 5 pF Reference Output Reference voltage 1.14 Reference output current (4) 1.2 1.26 100 V nA Reference Input VEXTIO Input voltage RI Input resistance CI 0.1 1.25 V 1 MΩ Small signal bandwidth 300 kHz Input capacitance 100 pF Temperature Coefficients Offset drift Gain drift 2 With external reference ±20 With internal reference ±40 ±20 Reference voltage drift (1) (2) (3) (4) 6 ppm of FSR/°C ppm of FSR/°C ppm/°C Measured differentially through 50 Ω to AGND. Nominal full-scale current, IOUTFS, equals 32× the IBIAS current. The lower limit of the output compliance is determined by the CMOS process. Exceeding this limit may result in transistor breakdown, resulting in reduced reliability of the DAC5652 device. The upper limit of the output compliance is determined by the load resistors and full-scale output current. Exceeding the upper limit adversely affects distortion performance and integral nonlinearity. Use an external buffer amplifier with high-impedance input to drive any external load. Submit Documentation Feedback DAC5652-EP www.ti.com SGLS341B – JUNE 2006 – REVISED OCTOBER 2006 ELECTRICAL CHARACTERISTICS over operating free-air temperature range, AVDD = DVDD = 3.3 V, IOUTFS = 20 mA, fDATA = 200 MSPS, fOUT = 1 MHz, independent gain set mode (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Power Supply AVDD Analog supply voltage 3 3.3 3.6 V DVDD Digital supply voltage 3 3.3 3.6 V Including output current through load resistor 75 90 IAVDD Supply current, analog Sleep mode with clock 2.5 Sleep mode without clock 2.5 IDVDD Supply current, digital Sleep mode with clock Sleep mode without clock 12 20 11.3 18 mA 0.6 290 Power dissipation mA Sleep mode with clock 360 45.5 Sleep mode without clock 9.2 fDATA = 200 MSPS, fOUT = 20 MHz 310 mW APSRR Analog power-supply rejection ratio –0.2 –0.01 0.2 %FSR/V DPSRR Digital power-supply rejection ratio –0.2 0 0.2 %FSR/V TA Operating free-air temperature –55 125 °C Submit Documentation Feedback 7 DAC5652-EP www.ti.com SGLS341B – JUNE 2006 – REVISED OCTOBER 2006 ELECTRICAL CHARACTERISTICS AC specifications over operating free-air temperature range, AVDD = DVDD = 3.3 V, IOUTFS = 20 mA, independent gain set mode, differential 1:1 impedance ratio transformer coupled output, 50-Ω doubly terminated load (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP 200 275 (1) MAX UNIT Analog Output fclk Maximum output update rate ts Output settling time to 0.1% (DAC) tr tf 20 ns Output rise time 10% to 90% (OUT) 1.4 ns Output fall time 90% to 10% (OUT) 1.5 ns Output noise Mid-scale transition MSPS IOUTFS = 20 mA 55 IOUTFS = 2 mA 30 1st Nyquist zone, TA = 25°C, fDATA = 50 MSPS, fOUT = 1 MHz, IOUTFS = 0 dB 79 1st Nyquist zone, TA = 25°C, fDATA = 50 MSPS, fOUT = 1 MHz, IOUTFS = –6 dB 78 1st Nyquist zone, TA = 25°C, fDATA = 50 MSPS, fOUT = 1 MHz, IOUTFS = –12 dB 73 1st Nyquist zone, TA = 25°C, fDATA = 100 MSPS, fOUT = 5 MHz, IOUTFS = 0 dB 80 1st Nyquist zone, TA = 25°C, fDATA = 100 MSPS, fOUT = 20 MHz, IOUTFS = 0 dB 76 pA/√Hz AC Linearity SFDR SNR IMD3 IMD Spurious-free dynamic range Signal-to-noise ratio Third-order two-tone intermodulation Four-tone intermodulation Channel isolation (1) 8 dBc 1st Nyquist zone, TA = 25°C, fDATA = 200 MSPS, fOUT = 20 MHz, IOUTFS = 0 dB 61 70 1st Nyquist zone, TA = –55°C to 125°C, fDATA = 200 MSPS, fOUT = 20 MHz, IOUTFS = 0 dB 58 67 1st Nyquist zone, TA = 25°C, fDATA = 200 MSPS, fOUT = 41 MHz, IOUTFS = 0 dB 67 1st Nyquist zone, TA = 25°C, fDATA = 100 MSPS, fOUT = 5 MHz, IOUTFS = 0 dB 63 1st Nyquist zone, TA = 25°C, fDATA = 160 MSPS, fOUT = 20 MHz, IOUTFS = 0 dB 62 Each tone at –6 dBFS, TA = 25°C, fDATA = 200 MSPS, fOUT = 45.4 MHz and 46.4 MHz 61 Each tone at –6 dBFS, TA = 25°C, fDATA = 100 MSPS, fOUT = 15.1 MHz and 16.1 MHz 78 Each tone at –12 dBFS, TA = 25°C, fDATA = 100 MSPS, fOUT = 15.6, 15.8, 16.2, and 16.4 MHz 76 Each tone at –12 dBFS, TA = 25°C, fDATA = 165 MSPS, fOUT = 19, 19.1, 19.3, and 19.4 MHz 55 Each tone at –12 dBFS, TA = 25°C, fDATA = 165 MSPS, fOUT = 68.8, 69.6, 71.2, and 72 MHz 70 TA = 25°C, fDATA = 165 MSPS, fOUT (CH1) = 20 MHz, fOUT (CH2) = 21 MHz 90 Specified by design. Not production tested. Submit Documentation Feedback dB dBc dBc dBc DAC5652-EP www.ti.com SGLS341B – JUNE 2006 – REVISED OCTOBER 2006 ELECTRICAL CHARACTERISTICS Digital specifications over operating free-air temperature range, AVDD = DVDD = 3.3 V, IOUTFS = 20 mA (unless otherwise noted) PARAMETER MIN TYP MAX UNIT Digital Input VIH High-level input voltage 2 3.3 V VIL Low-level input voltage 0 0.8 V IIH High-level input current ±50 µA IIL Low-level input current ±10 µA IIH(GSET) High-level input current, GSET pin 7 µA IIL(GSET) Low-level input current, GSET pin –80 µA IIH(MODE) High-level input current, MODE pin –30 µA IIL(MODE) Low-level input current, MODE pin –80 µA CI Input capacitance 5 pF SWITCHING CHARACTERISTICS Digital specifications over operating free-air temperature range, AVDD = DVDD = 3.3 V, IOUTFS = 20 mA (unless otherwise noted) PARAMETER MIN TYP MAX UNIT Timing – Dual Bus Mode tsu Input setup time 1 th Input hold time 1 tLPH Input clock pulse high time tLAT Clock latency (WRTA/B to tPD Propagation delay time ns ns 1 outputs) (1) 4 ns 4 clk 1.5 ns ns Timing – Single Bus Interleaved Mode tsu Input setup time 0.5 th Input hold time 0.5 tLAT Clock latency (WRTA/B to outputs) (1) tPD Propagation delay time (1) 4 ns 4 1.5 clk ns Specified by design Submit Documentation Feedback 9 DAC5652-EP www.ti.com SGLS341B – JUNE 2006 – REVISED OCTOBER 2006 INL − Integral Nonlinearity Error − LSB TYPICAL CHARACTERISTICS INTEGRAL NONLINEARITY vs INPUT CODE 0.5 0.4 0.3 0.2 0.1 0.0 −0.1 −0.2 −0.3 −0.4 −0.5 0 100 200 300 400 500 600 700 800 900 Input Code 1000 G001 DNL − Differential Nonlinearity Error − LSB Figure 2. DIFFERENTIAL NONLINEARITY vs INPUT CODE 0.25 0.20 0.15 0.10 0.05 0.00 −0.05 −0.10 −0.15 −0.20 −0.25 0 100 200 300 400 500 600 Input Code Figure 3. 10 Submit Documentation Feedback 700 800 900 1000 G002 DAC5652-EP www.ti.com SGLS341B – JUNE 2006 – REVISED OCTOBER 2006 TYPICAL CHARACTERISTICS (continued) SPURIOUS-FREE DYNAMIC RANGE vs OUTPUT FREQUENCY SPURIOUS-FREE DYNAMIC RANGE vs OUTPUT FREQUENCY 100 SFDR − Spurious-Free Dynamic Range − dBc SFDR − Spurious-Free Dynamic Range − dBc 100 fdata = 52 MSPS Dual Bus Mode 95 90 85 −6 dBfS 0 dBfS 80 75 −12 dBfS 70 65 60 90 85 −6 dBfS 80 75 −12 dBfS 70 0 dBfS 65 60 0 4 8 12 16 20 fout − Output Frequency − MHz 0 5 10 15 20 25 fout − Output Frequency − MHz G003 Figure 4. Figure 5. SPURIOUS-FREE DYNAMIC RANGE vs OUTPUT FREQUENCY SPURIOUS-FREE DYNAMIC RANGE vs OUTPUT FREQUENCY 30 G004 100 SFDR − Spurious-Free Dynamic Range − dBc 100 SFDR − Spurious-Free Dynamic Range − dBc fdata = 78 MSPS Dual Bus Mode 95 fdata = 100 MSPS Dual Bus Mode 95 90 85 −6 dBfS 80 0 dBfS 75 −12 dBfS 70 65 60 fdata = 165 MSPS Dual Bus Mode 95 90 85 80 0 dBfS −6 dBfS 75 70 −12 dBfS 65 60 0 5 10 15 20 25 30 fout − Output Frequency − MHz 35 0 5 G005 Figure 6. 10 15 20 25 30 35 40 45 50 55 60 fout − Output Frequency − MHz G006 Figure 7. Submit Documentation Feedback 11 DAC5652-EP www.ti.com SGLS341B – JUNE 2006 – REVISED OCTOBER 2006 TYPICAL CHARACTERISTICS (continued) SINGLE-TONE SPECTRUM SINGLE-TONE SPECTRUM 0 0 fdata = 78 MSPS fOUT = 15 MHz Dual Bus Mode fdata = 165 MSPS fOUT = 30.1 MHz Dual Bus Mode −20 Power − dBm Power − dBm −20 −40 −60 −80 −40 −60 −80 −100 0.0 7.8 15.6 23.4 31.2 −100 0.0 39.0 16.5 f − Frequency − MHz 33.0 49.5 66.0 82.5 f − Frequency − MHz G007 G008 Figure 8. Figure 9. TWO-TONE IMD3 vs OUTPUT FREQUENCY TWO-TONE IMD3 vs OUTPUT FREQUENCY 95 100 95 90 85 Two-Tone IMD3 − dBc Two-Tone IMD3 − dBc 90 80 75 70 85 80 75 70 65 60 fdata = 78 MSPS Dual Bus Mode fout2 = fout1 + 1 MHz 65 fdata = 165 MSPS Dual Bus Mode fout2 = fout1 + 1 MHz 55 60 50 0 5 10 15 20 25 30 fout1 − Output Frequency − MHz 35 0 G009 Figure 10. 12 10 20 30 Figure 11. Submit Documentation Feedback 40 fout1 − Output Frequency − MHz 50 G010 DAC5652-EP www.ti.com SGLS341B – JUNE 2006 – REVISED OCTOBER 2006 TYPICAL CHARACTERISTICS (continued) TWO-TONE SPECTRUM −10 TWO-TONE SPECTRUM fdata = 165 MSPS fdata = 78 MSPS fout1 = 20.1 MHz fout2 = 21.1 MHz Dual Bus Mode −10 fout1 = 30.1 MHz fout2 = 31.1 MHz Dual Bus Mode −30 Power − dBm Power − dBm −30 −50 −70 −90 −110 19.0 −50 −70 −90 19.5 20.0 20.5 21.0 21.5 −110 29.0 22.0 29.5 f − Frequency − MHz 30.0 30.5 31.0 31.5 32.0 f − Frequency − MHz G011 G012 Figure 12. Figure 13. DIGITAL INPUTS AND TIMING Digital Inputs The data input ports of the DAC5652 accept a standard positive coding with data bits DA9 and DB9 being the most significant bits (MSBs). The converter outputs are specified to support a clock rate up to 200 MSPS. The best performance is typically achieved with a symmetric duty cycle for write and clock; however, the duty cycle may vary as long as the timing specifications are met. Similarly, the setup and hold times may be chosen within their specified limits. All digital inputs of the DAC5652 are CMOS compatible. Figure 14 and Figure 15 show schematics of the equivalent CMOS digital inputs of the DAC5652. The 10-bit digital data input follows the offset positive binary coding scheme. The DAC5652 is designed to operate with a digital supply (DVDD) of 3 V to 3.6 V. DVDD DA[9:0] DB[9:0] SLEEP CLKA/B WRTA/B Internal Digital In DGND Figure 14. CMOS/TTL Digital Equivalent Input With Internal Pulldown Resistor Submit Documentation Feedback 13 DAC5652-EP www.ti.com SGLS341B – JUNE 2006 – REVISED OCTOBER 2006 DIGITAL INPUTS AND TIMING (continued) DVDD Internal Digital In GSET MODE DGND Figure 15. CMOS/TTL Digital Equivalent Input With Internal Pullup Resistor Input Interfaces The DAC5652 features two operating modes selected by the MODE pin (see Table 1). • For dual-bus input mode, the device essentially consists of two separate DACs. Each DAC has its own separate data input bus, clock input, and data write signal (data latch-in). • In single-bus interleaved mode, the data must be presented interleaved at the A-channel input bus. The B-channel input bus is not used in this mode. The clock and write input are now shared by both DACs. Table 1. Operating Modes MODE PIN MODE pin connected to DGND MODE pin connected to DVDD BUS INPUT Single-bus interleaved mode, clock and write input equal for both DACs Dual-bus mode, DACs operate independently Dual-Bus Data Interface and Timing In dual-bus mode, the MODE pin is connected to DVDD. The two converter channels within the DAC5652 consist of two independent, 10-bit, parallel data ports. Each DAC channel is controlled by its own set of write (WRTA, WRTB) and clock (CLKA, CLKB) lines. The WRTA/B lines control the channel input latches and the CLKA/B lines control the DAC latches. The data is first loaded into the input latch by a rising edge of the WRTA/B line. The internal data transfer requires a correct sequence of write and clock inputs, since essentially two clock domains having equal periods (but possibly different phases) are input to the DAC5652. This is defined by a minimum requirement of the time between the rising edge of the clock and the rising edge of the write inputs. This essentially implies that the rising edge of CLKA/B must occur at the same time or before the rising edge of the WRTA/B signal. A minimum delay of 2 ns must be maintained if the rising edge of the clock occurs after the rising edge of the write. Note that these conditions are satisfied when the clock and write inputs are connected externally. Note that all specifications were measured with the WRTA/B and CLKA/B lines connected together. 14 Submit Documentation Feedback DAC5652-EP www.ti.com SGLS341B – JUNE 2006 – REVISED OCTOBER 2006 DIGITAL INPUTS AND TIMING (continued) DA[9:0]/DB[9:0] Valid Data tsu th tLPH WRTA/WRTB CLKA/CLKB ts tPD tLAT IOUT or IOUT Figure 16. Dual-Bus-Mode Operation Single-Bus Interleaved Data Interface and Timing In single-bus interleaved mode, the MODE pin is connected to DGND. Figure 17 shows the timing diagram. In interleaved mode, the A and B channels share the write input (WRTIQ) and update clock (CLKIQ and internal CLKDACIQ). Multiplexing logic directs the input word at the A-channel input bus to either the A-channel input latch (SELECTIQ is high) or to the B-channel input latch (SELECTIQ is low). When SELECTIQ is high, the data value in the B-channel latch is retained by presenting the latch output data to its input again. When SELECTIQ is low, the data value in the A-channel latch is retained by presenting the latch output data to its input. In interleaved mode, the A-channel input data rate is twice the update rate of the DAC core. As in dual-bus mode, it is important to maintain a correct sequence of write and clock inputs. The edge-triggered flip-flops latch the A- and B-channel input words on the rising edge of the write input (WRTIQ). This data is presented to the Aand B-DAC latches on the following falling edge of the write inputs. The DAC5652 clock input is divided by a factor of two before it is presented to the DAC latches. Correct pairing of the A- and B-channel data is done by RESETIQ. In interleaved mode, the clock input CLKIQ is divided by two, which would translate to a nondeterministic relation between the rising edges of the CLKIQ and CLKDACIQ. RESETIQ ensures, however, that the correct position of the rising edge of CLKDACIQ, with respect to the data at the input of the DAC latch, is determined. CLKDACIQ is disabled (low) when RESETIQ is high. Submit Documentation Feedback 15 DAC5652-EP www.ti.com SGLS341B – JUNE 2006 – REVISED OCTOBER 2006 DIGITAL INPUTS AND TIMING (continued) DA[9:0] Valid Data tsu th SELECTIQ WRTIQ CLKIQ RESETIQ ts tPD tLAT IOUT or IOUT Figure 17. Single-Bus Interleaved-Mode Operation 16 Submit Documentation Feedback DAC5652-EP www.ti.com SGLS341B – JUNE 2006 – REVISED OCTOBER 2006 APPLICATION INFORMATION Theory of Operation The architecture of the DAC5652 uses a current steering technique to enable fast switching and high update rate. The core element within the monolithic DAC is an array of segmented current sources that are designed to deliver a full-scale output current of up to 20 mA. An internal decoder addresses the differential current switches each time the DAC is updated and a corresponding output current is formed by steering all currents to either output summing node, IOUT1 or IOUT2. The complementary outputs deliver a differential output signal, which improves the dynamic performance through reduction of even-order harmonics, common-mode signals (noise), and double the peak-to-peak output signal swing by a factor of two, as compared to single-ended operation. The segmented architecture results in a significant reduction of the glitch energy and improves the dynamic performance (SFDR) and DNL. The current outputs maintain a very high output impedance of greater than 300 kΩ. When pin 42 (GSET) is high (simultaneous gain set mode), the full-scale output current for both DACs is determined by the ratio of the internal reference voltage (1.2 V) and an external resistor (RSET) connected to BIASJ_A. When GSET is low (independent gain set mode), the full-scale output current for each DAC is determined by the ratio of the internal reference voltage (1.2 V) and separate external resistors (RSET) connected to BIASJ_A and BIASJ_B. The resulting IREF is internally multiplied by a factor of 32 to produce an effective DAC output current that can range from 2 mA to 20 mA, depending on the value of RSET. The DAC5652 is split into a digital and an analog portion, each of which is powered through its own supply pin. The digital section includes edge-triggered input latches and the decoder logic, while the analog section comprises both the current source array with its associated switches, and the reference circuitry. DAC Transfer Function Each of the DACs in the DAC5652 has a set of complementary current outputs, IOUT1 and IOUT2. The full-scale output current, IOUTFS, is the summation of the two complementary output currents: I +I )I OUTFS OUT1 OUT2 (1) The individual output currents depend on the DAC code and can be expressed as: Code I +I OUT1 OUTFS 1024 I OUT2 +I OUTFS ǒ Ǔ * CodeǓ ǒ10231024 (2) (3) where Code is the decimal representation of the DAC data input word. Additionally, IOUTFS is a function of the reference current IREF, which is determined by the reference voltage and the external setting resistor (RSET). V REF I + 32 I + 32 OUTFS REF R SET (4) In most cases, the complementary outputs drive resistive loads or a terminated transformer. A signal voltage develops at each output according to: V +I R OUT1 OUT1 LOAD (5) V +I R OUT2 OUT2 LOAD (6) The value of the load resistance is limited by the output compliance specification of the DAC5652. To maintain specified linearity performance, the voltage for IOUT1 and IOUT2 must not exceed the maximum allowable compliance range. Submit Documentation Feedback 17 DAC5652-EP www.ti.com SGLS341B – JUNE 2006 – REVISED OCTOBER 2006 APPLICATION INFORMATION (continued) The total differential output voltage is: V +V *V OUTDIFF OUT1 OUT2 (2 Code * 1023) V + I OUTDIFF OUTFS 1024 (7) R LOAD (8) Analog Outputs The DAC5652 provides two complementary current outputs, IOUT1 and IOUT2. The simplified circuit of the analog output stage representing the differential topology is shown in Figure 18. The output impedance of IOUT1 and IOUT2 results from the parallel combination of the differential switches, along with the current sources and associated parasitic capacitances. AVDD S(1) IOUT1 RLOAD S(1)C IOUT2 S(2) S(2)C S(N) S(N)C Current Source Array RLOAD Figure 18. Analog Outputs The signal voltage swing that may develop at the two outputs, IOUT1 and IOUT2, is limited by a negative and positive compliance. The negative limit of –1 V is given by the breakdown voltage of the CMOS process and exceeding it compromises the reliability of the DAC5652 (or even causes permanent damage). With the full-scale output set to 20 mA, the positive compliance equals 1.2 V. Note that the compliance range decreases to about 1 V for a selected output current of IOUTFS = 2 mA. Care must be taken that the configuration of DAC5652 does not exceed the compliance range to avoid degradation of the distortion performance and integral linearity. Best distortion performance is typically achieved with the maximum full-scale output signal limited to approximately 0.5 VPP. This is the case for a 50-Ω doubly-terminated load and a 20-mA full-scale output current. A variety of loads can be adapted to the output of the DAC5652 by selecting a suitable transformer while maintaining optimum voltage levels at IOUT1 and IOUT2. Furthermore, using the differential output configuration in combination with a transformer is instrumental for achieving excellent distortion performance. Common-mode errors, such as even-order harmonics or noise, can be substantially reduced. This is particularly the case with high output frequencies. For those applications requiring the optimum distortion and noise performance, it is recommended to select a full-scale output of 20 mA. A lower full-scale range of 2 mA may be considered for applications that require low power consumption, but can tolerate a slight reduction in performance level. 18 Submit Documentation Feedback DAC5652-EP www.ti.com SGLS341B – JUNE 2006 – REVISED OCTOBER 2006 APPLICATION INFORMATION (continued) Output Configurations The current outputs of the DAC5652 allow for a variety of configurations. As mentioned previously, utilizing the converter’s differential outputs yield the best dynamic performance. Such a differential output circuit may consist of an RF transformer or a differential amplifier configuration. The transformer configuration is ideal for most applications with ac coupling, while operational amplifiers are suitable for a dc-coupled configuration. The single-ended configuration may be considered for applications requiring a unipolar output voltage. Connecting a resistor from either one of the outputs to ground converts the output current into a ground-referenced voltage signal. To improve on the dc linearity by maintaining a virtual ground, an I-to-V or operational amplifier configuration may be considered. Differential With Transformer Using an RF transformer provides a convenient way of converting the differential output signal into a single-ended signal while achieving excellent dynamic performance. The appropriate transformer must be carefully selected based on the output frequency spectrum and impedance requirements. The differential transformer configuration has the benefit of significantly reducing common-mode signals, thus improving the dynamic performance over a wide range of frequencies. Furthermore, by selecting a suitable impedance ratio (winding ratio), the transformer can provide optimum impedance matching while controlling the compliance voltage for the converter outputs. Figure 19 and Figure 20 show 50-Ω doubly-terminated transformer configurations with 1:1 and 4:1 impedance ratios, respectively. Note that the center tap of the primary input of the transformer has to be grounded to enable a dc-current flow. Applying a 20-mA full-scale output current leads to a 0.5-VPP output for a 1:1 transformer and a 1-VPP output for a 4:1 transformer. In general, the 1:1 transformer configuration has slightly better output distortion, but the 4:1 transformer has 6-dB higher output power. 50 Ω 1:1 IOUT1 100 Ω AGND RLOAD 50 Ω IOUT2 50 Ω Figure 19. Driving a Doubly-Terminated 50-Ω Cable Using a 1:1 Impedance Ratio Transformer Submit Documentation Feedback 19 DAC5652-EP www.ti.com SGLS341B – JUNE 2006 – REVISED OCTOBER 2006 APPLICATION INFORMATION (continued) 100 Ω 4:1 IOUT1 RLOAD 50 Ω AGND IOUT2 100 Ω Figure 20. Driving a Doubly-Terminated 50-Ω Cable Using a 4:1 Impedance Ratio Transformer Single-Ended Configuration Figure 21 shows the single-ended output configuration, where the output current IOUT1 flows into an equivalent load resistance of 25 Ω. Node IOUT2 must be connected to AGND or terminated with a resistor of 25 Ω to AGND. The nominal resistor load of 25 Ω gives a differential output swing of 1 VPP when applying a 20-mA full-scale output current. IOUT1 RLOAD 50 Ω IOUT2 50 Ω 25 Ω AGND Figure 21. Driving a Doubly-Terminated 50-Ω Cable Using a Single-Ended Output 20 Submit Documentation Feedback DAC5652-EP www.ti.com SGLS341B – JUNE 2006 – REVISED OCTOBER 2006 APPLICATION INFORMATION (continued) Reference Operation Internal Reference The DAC5652 has an on-chip reference circuit which comprises a 1.2-V bandgap reference and two control amplifiers, one for each DAC. The full-scale output current, IOUTFS, of the DAC5652 is determined by the reference voltage, VREF, and the value of resistor RSET. IOUTFS can be calculated by: V REF I + 32 I + 32 OUTFS REF R SET (9) The reference control amplifier operates as a V-to-I converter producing a reference current, IREF, which is determined by the ratio of VREF and RSET (see Equation 9). The full-scale output current, IOUTFS, results from multiplying IREF by a fixed factor of 32. Using the internal reference, a 2-kΩ resistor value results in a full-scale output of approximately 20 mA. Resistors with a tolerance of 1% or better should be considered. Selecting higher values, the output current can be adjusted from 20 mA down to 2 mA. Operating the DAC5652 at lower than 20-mA output currents may be desirable for reasons of reducing the total power consumption, improving the distortion performance, or observing the output compliance voltage limitations for a given load condition. It is recommended to bypass the EXTIO pin with a ceramic chip capacitor of 0.1 µF or more. The control amplifier is internally compensated and its small signal bandwidth is approximately 300 kHz. External Reference The internal reference can be disabled by simply applying an external reference voltage into the EXTIO pin that, in this case, functions as an input. The use of an external reference may be considered for applications that require higher accuracy and drift performance or to add the ability of dynamic gain control. While a 0.1-µF capacitor is recommended to be used with the internal reference, it is optional for the external reference operation. The reference input, EXTIO, has a high input impedance (1 MΩ) and can easily be driven by various sources. Note that the voltage range of the external reference must stay within the compliance range of the reference input. Gain Setting Option The full-scale output current on the DAC5652 can be set two ways — either for each of the two DAC channels independently or for both channels simultaneously. For the independent gain set mode, the GSET pin (pin 42) must be low (that is, connected to AGND). In this mode, two external resistors are required — one RSET connected to the BIASJ_A pin (pin 44) and the other to the BIASJ_B pin (pin 41). In this configuration, the user has the flexibility to set and adjust the full-scale output current for each DAC independently, allowing for the compensation of possible gain mismatches elsewhere within the transmit signal path. Alternatively, bringing the GSET pin high (that is, connected to AVDD), the DAC5652 switches into the simultaneous gain set mode. Now the full-scale output current of both DAC channels is determined by only one external RSET resistor connected to the BIASJ_A pin. The resistor at the BIASJ_B pin may be removed; however, this is not required since this pin is not functional in this mode and the resistor has no effect on the gain equation. Sleep Mode The DAC5652 features a power-down function that can reduce the total supply current to approximately 3.1 mA over the specified supply range if no clock is present. Applying a logic high to the SLEEP pin initiates the power-down mode, while a logic low enables normal operation. When left unconnected, an internal active pulldown circuit enables the normal operation of the converter. Submit Documentation Feedback 21 PACKAGE OPTION ADDENDUM www.ti.com 18-Sep-2008 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty DAC5652MPFBEP ACTIVE TQFP PFB 48 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR DAC5652MPFBREP ACTIVE TQFP PFB 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR V62/06638-01XE ACTIVE TQFP PFB 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR V62/06638-02XE ACTIVE TQFP PFB 48 250 CU NIPDAU Level-2-260C-1 YEAR Green (RoHS & no Sb/Br) Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF DAC5652-EP : • Catalog: DAC5652 NOTE: Qualified Version Definitions: • Catalog - TI's standard catalog product Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device DAC5652MPFBREP Package Package Pins Type Drawing TQFP PFB 48 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 1000 330.0 16.4 Pack Materials-Page 1 9.6 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 9.6 1.5 12.0 16.0 Q2 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) DAC5652MPFBREP TQFP PFB 48 1000 367.0 367.0 38.0 Pack Materials-Page 2 MECHANICAL DATA MTQF019A – JANUARY 1995 – REVISED JANUARY 1998 PFB (S-PQFP-G48) PLASTIC QUAD FLATPACK 0,27 0,17 0,50 36 0,08 M 25 37 24 48 13 0,13 NOM 1 12 5,50 TYP 7,20 SQ 6,80 9,20 SQ 8,80 Gage Plane 0,25 0,05 MIN 0°– 7° 1,05 0,95 Seating Plane 0,75 0,45 0,08 1,20 MAX 4073176 / B 10/96 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Falls within JEDEC MS-026 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such components to meet such requirements. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Mobile Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2012, Texas Instruments Incorporated