NSC LM2459

LM2459
Monolithic Single Channel 15 MHz DTV CRT Driver
General Description
Features
The LM2459 is a single channel high voltage CRT driver
circuit designed for use in DTV applications. The IC contains
a high input impedance, wide band amplifier which directly
drives the cathode of a CRT. The amplifier has its gain
internally set to −51 and can drive CRT capacitive loads as
well as resistive loads present in other applications, limited
only by the package’s power dissipation.
15MHz bandwith at 130VPP output swing
0V to 4V input range
Greater than 130VPP output swing capability
Stable with 0–20 pF capacitive loads and inductive
peaking networks
n Transient response improvement option via pin 6 (EM)
The IC is packaged in a staggered 7-lead TO-220 molded
plastic power package designed specifically to meet high
voltage spacing requirements. See Thermal Considerations
section.
Applications
Connection Diagram
Schematic Diagram
n
n
n
n
n AC coupled DTV applications using the 480p format as
well as standard NTSC and PAL formats.
20067802
Note: Tab is at GND
Top View
Order Number LM2459TE
20067801
FIGURE 1. Simplified Connection and Pinout Diagram
FIGURE 2. Simplified Schematic Diagram
© 2004 National Semiconductor Corporation
DS200678
www.national.com
LM2459 Monolithic Single Channel 15 MHz DTV CRT Driver
May 2004
LM2459
Absolute Maximum Ratings
Operating Ranges (Note 2)
(Notes 1,
3)
VCC
+130V to +180V
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
VBB
+7V to +13V
VIN
+0V to +4V
Supply Voltage (VCC)
Bias Voltage (VBB)
+15V
Input Voltage (VIN)
-0.5V to VBB +0.5V
Storage Temperature Range (TSTG)
VOUT
+200V
+25V to +178V
Case Temperature
Refer to Figure 11
Do not operate the part without a heat sink.
−65˚C to +150˚C
Lead Temperature
(Soldering, < 10 sec.)
300˚C
ESD Tolerance,
Human Body Model
2kV
Machine Model
200V
Junction Temperature
θJC (typ)
150˚C
4.2˚C/W
Electrical Characteristics (See Figure 3 for Test Circuit)
Unless otherwise noted: VCC = +180V, VBB = +8V, CL = 10pF, TC = 30˚C, Pin 6 floating.
DC Tests: VIN = 2.5VDC
AC Tests: Output = 130VPP (35V - 165V) at 1MHz
Symbol
Parameter
ICC
Supply Current
IBB
Bias Current
VOUT, 1
DC Output Voltage
VOUT, 2
AV
Conditions
LM2459
Min
No AC Input Signal, No Output Load
Units
Typical
Max
6
12
4
7
mA
104
109
VDC
VDC
mA
No AC Input Signal, VIN = 2.5VDC
99
DC Output Voltage
No AC Input Signal, VIN = 1.2VDC
165
170
175
DC Voltage Gain
No AC Input Signal
-48
−51
-54
LE
Linearity Error
(Note 4), No AC Input Signal
5
%
tR
Rise Time
(Note 5), 10% to 90%
26
ns
tF
Fall Time
(Note 5), 90% to 10%
30
ns
OS
Overshoot
(Note 5)
5
%
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur.
Note 2: Operating ratings indicate conditions for which the device is functional, but do not guarantee specific performance limits. For guaranteed specifications and
test conditions, see the Electrical Characteristics. Datasheet min/max specification limits are guaranteed by design, test, or statistical analysis. The guaranteed
specifications apply only for the test conditions listed. Some performance characteristics may change when the device is not operated under the listed test
conditions.
Note 3: All voltages are measured with respect to GND, unless otherwise specified.
Note 4: Linearity Error is the variation in DC gain from VIN = 1.1V to VIN = 3.8V.
Note 5: Input from signal generator: tr, tf < 1 ns.
www.national.com
2
LM2459
AC Test Circuit
20067803
Note: 10pF load includes parasitic capacitance.
FIGURE 3. Test Circuit
Figure 3 shows a typical test circuit for evaluation of the LM2459. This circuit is designed to allow testing of the LM2459 in a 50Ω
environment without the use of an expensive FET probe. The two 4990Ω resistors form a 400:1 divider with the 50Ω resistor and
the oscilloscope. A test point is included for easy use of an oscilloscope probe.The compensation capacitor is used to
compensate the network to achieve a flat frequency response.
3
www.national.com
LM2459
Typical Performance Characteristics
(VCC = +180VDC, VBB = +8VDC, CL = 10pF, VOUT = 130VPP
(35V − 165V), Test Circuit - Figure 3, Pin 6 floating, unless otherwise specified)
20067805
20067804
FIGURE 7. Speed vs Load Capacitance
FIGURE 4. VOUT vs VIN
20067806
20067808
FIGURE 5. LM2459 Pulse Response
FIGURE 8. Speed vs Offset
20067818
20067809
FIGURE 6. Bandwidth
www.national.com
FIGURE 9. Speed vs Case Temperature
4
(35V − 165V), Test Circuit - Figure 3, Pin 6 floating, unless otherwise specified) (Continued)
20067807
FIGURE 10. Power Dissipation vs Frequency
20067816
FIGURE 11. Power Derating Curve
20067819
FIGURE 12. Cathode Pulse Response
5
www.national.com
LM2459
Typical Performance Characteristics (VCC = +180VDC, VBB = +8VDC, CL = 10pF, VOUT = 130VPP
LM2459
Typical Performance Characteristics (VCC = +180VDC, VBB = +8VDC, CL = 10pF, VOUT = 130VPP
(35V − 165V), Test Circuit - Figure 3, Pin 6 floating, unless otherwise specified) (Continued)
TABLE 1. Power Dissipation for Various Video Patterns
Power Dissipation (W)
Pattern
Format
Raster
480i
480p
0.5
0.5
Full White Field
1.2
1.2
White Box, 75% Screen Size
0.9
0.9
Gray Bars
1.0
1.0
Color Bars 75% Amplitude
0.8
0.8
Color Bars 100% Amplitude
0.9
0.9
SMPTE Color Bars
0.8
0.8
SMPTE 133
1.0
1.1
Cross Hatch 16x12
0.7
0.7
Resolution Chart
1.1
1.2
Multiburst
1.4
1.9
White Text on Black Background
1.5
2.2
Windows Pattern
0.9
1.2
Windows Pattern
0.9
1.2
Windows Pattern
1.4
1.7
Vertical Lines 5 On 5 Off
1.3
1.7
Vertical Lines 4 On 4 Off
1.3
1.8
Vertical Lines 3 On 3 Off
1.5
2.2
Vertical Lines 2 On 2 Off
1.8
2.8
Vertical Lines 1 On 1 Off
2.8
3.8
Note: Input from signal generator: tr, tf < 2 ns.
lowing information is provided in order to support this commitment. The reader should be aware that the optimization of
performance was done using a specific printed circuit board
designed at NSC. Variations in performance can be realized
due to physical changes in the printed circuit board and the
application. Therefore, the designer should know that component value changes may be required in order to optimize
performance in a given application. The values shown in this
document can be used as a starting point for evaluation
purposes. When working with high bandwidth circuits, good
layout practices are also critical to achieving maximum performance.
Theory of Operation
The LM2459 is a high voltage monolithic single channel CRT
driver suitable for HDTV applications. The LM2459 operates
with 180V and 8V power supplies. The part is housed in a
staggered 7-lead TO-220 molded plastic power package.
The circuit diagram of the LM2459 is shown in Figure 2. The
PNP emitter follower, Q5, provides input buffering. Q1 and
Q2 form a fixed gain cascode amplifier with resistors R1 and
R2 setting the gain at −51. Emitter followers Q3 and Q4
isolate the high output impedance of the cascode stage from
the capacitance of the CRT cathode which decreases the
sensitivity of the device to load capacitance. Q6 provides
biasing to the output emitter follower stage to reduce crossover distortion at low signal levels.
Figure 3 shows a typical test circuit for evaluation of the
LM2459. This circuit is designed to allow testing of the
LM2459 in a 50Ω environment without the use of an expensive FET probe. In this test circuit, the two 4.99kΩ resistors
form a 400:1 wideband, low capacitance probe when connected to a 50Ω coaxial cable and a 50Ω load (such as a
50Ω oscilloscope input). The input signal from the generator
is ac coupled to the base of Q5.
IMPORTANT INFORMATION
The LM2459 performance is targeted for the HDTV market.
The application circuits shown in this document to optimize
performance and to protect against damage from CRT arcover are designed specifically for the LM2459. If another
member of the LM245X family is used, please refer to its
datasheet.
POWER SUPPLY BYPASS
Since the LM2459 is a wide bandwidth amplifier, proper
power supply bypassing is critical for optimum performance.
Improper power supply bypassing can result in large overshoot, ringing or oscillation. 0.1µF capacitors should be connected from the supply pins, VCC and VBB, to ground, as
close to the LM2459 as is practical. Additionally, a 22µF or
larger electrolytic capacitor should be connected from both
supply pins to ground reasonably close to the LM2459.
Application Hints
INTRODUCTION
National Semiconductor (NSC) is committed to provide application information that assists our customers in obtaining
the best performance possible from our products. The folwww.national.com
6
tor (C3 in Figure 13). The ground connection of D2 and the
decoupling capacitor should be very close to the LM2459
ground. This will significantly reduce the high frequency
voltage transients that the LM2459 would be subjected to
during an arcover condition. Resistor R2 limits the arcover
current that is seen by the diodes while R1 limits the current
into the LM2459 as well as the voltage stress at the outputs
of the device. R2 should be a 1⁄2W solid carbon type resistor.
R1 can be a 1⁄4W metal or carbon film type resistor. Having
large value resistors for R1 and R2 would be desirable, but
this has the effect of increasing rise and fall times. Inductor
L1 is critical to reduce the initial high frequency voltage
levels that the LM2459 would be subjected to. The inductor
will not only help protect the device but it will also help
minimize rise and fall times as well as minimize EMI. For
proper arc protection, it is important to not omit any of the arc
protection components shown in Figure 13.
(Continued)
ARC PROTECTION
During normal CRT operation, internal arcing may occasionally occur. Spark gaps, in the range of 300V, connected from
the CRT cathodes to CRT ground will limit the maximum
voltage, but to a value that is much higher than allowable on
the LM2459. This fast, high voltage, high energy pulse can
damage the LM2459 output stage. The application circuit
shown in Figure 13 is designed to help clamp the voltage at
the output of the LM2459 to a safe level. The clamp diodes,
D1 and D2, should have a fast transient response, high peak
current rating, low series impedance and low shunt capacitance. 1SS83 or equivalent diodes are recommended. D1
and D2 should have short, low impedance connections to
VCC and ground respectively. The cathode of D1 should be
located very close to a separately decoupled bypass capaci-
20067810
FIGURE 13. Recommended Application Circuit
Figure 10, Figure 11, and Table 1 give the designer the
information needed to determine the heatsink requirement
for the LM2459. For example, if an HDTV application uses
the 480p format and "Vertical Lines 1 On 1 Off" is assumed
to be the worst-case pattern to be displayed, then the power
dissipated will be 3.8W (from Table 1). Figure 11 shows that
the maximum allowed case temperature is 134˚C when
3.8W is dissipated. If the maximum expected ambient temperature is 70˚C, then a maximum heatsink thermal resistance can be calculated:
EFFECT OF LOAD CAPACITANCE
Figure 7 shows the effect of increased load capacitance on
the speed of the device. This demonstrates the importance
of knowing the load capacitance in the application.
EFFECT OF OFFSET
Figure 8 shows the variation in rise and fall times when the
output offset of the device is varied from 95 to 105VDC. The
rise time shows a variation of less than 7% relative to the
center data point (100VDC). The fall time shows a variation of
18% relative to the center data point.
THERMAL CONSIDERATIONS
Figure 9 shows the performance of the LM2459 in the test
circuit shown in Figure 3 as a function of case temperature.
The figure shows that the rise and fall times of the LM2459
increase by approximately 18% and 29%, respectively, as
the case temperature increases from 50˚C to 90˚C. This
corresponds to a speed degradation of 5% and 7% for every
10˚C rise in case temperature.
Figure 10 shows the maximum power dissipation of the
LM2459 vs. frequency when the device is driving a 10pF
load with a 130VPP alternating one pixel on, one pixel off
signal. The graph assumes a 77% active time (device operating at the specified frequency), which is typical in a TV
application. The other 23% of the time the device is assumed
to be sitting at the black level (165V in this case). Table 1
also shows the typical power dissipation of the LM2459 for
various video patterns in the 480i and 480p video formats.
This example assumes a capacitive load of 10pF and no
resistive load. The designer should note that if the load
capacitance is increased, then the AC component of the total
power dissipation will also increase.
Note: An LM126X preamplifier, with rise and fall times of
about 2 ns, was used to drive the LM2459 for these power
measurements. Using a preamplifier with rise and fall times
slower than the LM126X will cause the LM2459 to dissipate
less power than shown in Table 1.
OPTIMIZING TRANSIENT RESPONSE
Referring to Figure 13, there are three components (R1, R2
and L1) that can be adjusted to optimize the transient response of the application circuit. Increasing the values of R1
and R2 will slow the circuit down while decreasing overshoot. Increasing the value of L1 will speed up the circuit as
7
www.national.com
LM2459
Application Hints
LM2459
Application Hints
channel from input to CRT cathode can be achieved. Performance is ideal for DTV applications. The NSC demonstration
board can be used to evaluate the LM2459 in a TV.
(Continued)
well as increase overshoot. It is very important to use inductors with very high self-resonant frequencies, preferably
above 300 MHz. Ferrite core inductors from J.W. Miller
Magnetics (part # 78FR_ _k) were used for optimizing the
performance of the device in the NSC application board. The
values shown in Figure 14 can be used as a good starting
point for the evaluation of the LM2459. Using a variable
resistor for R1 will simplify finding the value needed for
optimum performance in a given application. Once the optimum value is determined, the variable resistor can be replaced with a fixed value.
NSC DEMONSTRATION BOARD
Figure 15 shows the routing and component placement on
the NSC LM2459 demonstration board. This board provides
a good example of a layout that can be used as a guide for
future layouts. Note the location of the following components:
• C7203 — VCC bypass capacitor, located very close to pin
1 and ground pins
• C7205 — VBB bypass capacitor, located close to pin 4
and ground
• C7207 — VCC bypass capacitor, near LM2459 and VCC
clamp diodes. Very important for arc protection.
Figure 12 shows the typical cathode pulse response with an
output swing of 110VPP using a LM1269 preamplifier.
The transient response can also be improved by adding a
capacitor from pin 6 to the ground plane used by the
LM2459. A small capacitor, such as a 22pF ceramic, will
notably improve the fall time and only increase the overshoots and settling times slightly. Note that increasing the
capacitance beyond 22pF will only improve the fall time
marginally, but will increase the settling times significantly.
This option allows for better matching between the rise and
fall time.
The routing of the LM2459 output to the CRT is very critical
to achieving optimum performance. Figure 16 shows the
routing and component placement from pin 2 (VOUT) of the
LM2459 to the cathode. Note that the components are
placed so that they almost line up from the output pin of the
LM2459 to the cathode pin of the CRT connector. This is
done to minimize the length of the video path between these
two components. Note also that D7204, D7205, R7251 and
D7214 are placed to minimize the size of the video nodes
that they are attached to. This minimizes parasitic capacitance in the video path and also enhances the effectiveness
of the protection diodes. The anode of protection diode
D7204 is connected directly to a section of the the ground
plane that has a short and direct path to the LM2459 ground
pins. The cathode of D7205 is connected to VCC very close
to decoupling capacitor C7207 (see Figure 16) which is
connected to the same section of the ground plane as
D7204. The diode placement and routing is very important
for minimizing the voltage stress on the LM2459 during an
arcover event. Lastly, notice that SG7202 is placed very
close to the cathode and is tied directly to CRT ground.
This demonstration board uses medium-sized PCB holes to
accommodate socket pins, which function to allow for multiple insertions of the LM2459 in a convenient manner. To
benefit from the enhanced LM2459 package with thin leads,
the device should be secured in small PCB holes to optimize
the metal-to-metal spacing between the leads.
PC BOARD LAYOUT CONSIDERATIONS
For optimum performance, an adequate ground plane, isolation between channels, good supply bypassing and minimizing unwanted feedback are necessary. Also, the length of
the signal traces from the preamplifier to the LM2459 and
from the LM2459 to the CRT cathode should be as short as
possible. The following references are recommended:
Ott, Henry W., “Noise Reduction Techniques in Electronic
Systems”, John Wiley & Sons, New York, 1976.
“Video Amplifier Design for Computer Monitors”, National
Semiconductor Application Note 1013.
Pease, Robert A., “Troubleshooting Analog Circuits”,
Butterworth-Heinemann, 1991.
Because of its high small signal bandwidth, the part may
oscillate in a TV if feedback occurs around the video channel
through the chassis wiring. To prevent this, leads to the video
amplifier input circuit should be shielded, and input circuit
wiring should be spaced as far as possible from output circuit
wiring.
TYPICAL APPLICATION
A typical application of the LM2459 is shown in the schematic for the NSC demonstration board in Figure 14. Used in
conjunction with an LM126X preamplifier, a complete video
www.national.com
8
Application Hints
(Continued)
FIGURE 14. LM2459 Demonstration Board Schematic
20067811
LM2459
9
www.national.com
LM2459
Application Hints
(Continued)
20067813
FIGURE 15. LM2459 Demonstration Board Layout
20067814
FIGURE 16. Trace Routing and Component Placement from LM2459 Output to Cathode
www.national.com
10
LM2459 Monolithic Single Channel 15 MHz DTV CRT Driver
Physical Dimensions
inches (millimeters)
unless otherwise noted
NS Package Number TE07A
Order Number LM2459TE
LIFE SUPPORT POLICY
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL
COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical implant
into the body, or (b) support or sustain life, and
whose failure to perform when properly used in
accordance with instructions for use provided in the
labeling, can be reasonably expected to result in a
significant injury to the user.
2. A critical component is any component of a life
support device or system whose failure to perform
can be reasonably expected to cause the failure of
the life support device or system, or to affect its
safety or effectiveness.
BANNED SUBSTANCE COMPLIANCE
National Semiconductor certifies that the products and packing materials meet the provisions of the Customer Products
Stewardship Specification (CSP-9-111C2) and the Banned Substances and Materials of Interest Specification
(CSP-9-111S2) and contain no ‘‘Banned Substances’’ as defined in CSP-9-111S2.
National Semiconductor
Americas Customer
Support Center
Email: [email protected]
Tel: 1-800-272-9959
www.national.com
National Semiconductor
Europe Customer Support Center
Fax: +49 (0) 180-530 85 86
Email: [email protected]
Deutsch Tel: +49 (0) 69 9508 6208
English Tel: +44 (0) 870 24 0 2171
Français Tel: +33 (0) 1 41 91 8790
National Semiconductor
Asia Pacific Customer
Support Center
Email: [email protected]
National Semiconductor
Japan Customer Support Center
Fax: 81-3-5639-7507
Email: [email protected]
Tel: 81-3-5639-7560
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.