MATERIAL DECLARATION SHEET Material Number CDDFN10 Series Product Line Diode Products Compliance Date 1 July 2008 RoHS Compliant Yes No. Construction Element(subpart) 1 Die 2 Lead Frame 3 Bond Wire Die Attach Adhesive 4 5 Mold Compound MSL 1 Homogeneous Material Material weight [g] Silicon Chip Base Metal Base Metal Base Metal Base Metal Plating Plating Plating Impurity Gold Metal Others Conductive Material Filler Filler Hardener Filler Filler 0.052 Total weight 1.24 0.02 0.06 1.68 Homogeneous Material\ Substances Doped Silicon Copper Iron Phosphorus Zinc Nickel Palladium Gold Lead Gold Others Silver Epoxy resin Phenol resin Silica Carbon Black Others CASRN if applicable 7440-21-3 744-50-8 7439-89-6 7723-14-0 7440-66-6 7440-02-0 744-05-3 7440-57-5 7439-92-1 7440-57-5 7440-22-4 68928-70-1 29690-82-2 60676-86-0 1333-86-4 - Materials Mass % 100 96.75 2.33 0.073 0.098 0.663 0.039 0.0095 0.03 68.59 39.61 59.97 5.47 3.44 80.169 0.238 10.468 Material Mass % of total unit wt. 1.707 39.39 0.95 0.03 0.04 0.27 0.0160 .0039 0.0124 0.45 0.78 1.181 3.02 1.9 44.189 0.131 5.77 Subpart mass of total wt. (%) 1.707 40.709 0.656 1.969 55.12 3.046 This Document was updated on: 18-march 2009 Important remarks: 1. It is the responsibility of the user to verify they are accessing the latest version. Headquarters Riverside CA www.bourns.com CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society page 1 of 1