MATERIAL DECLARATION SHEET Material Number CD214B-F Serial Product Line Semiconductor Products Compliance Date RoHS Compliant No. Construction Element(subpart) 2005/03/02 Yes MSL Homogeneous Material 1 Material weight [mg] 1 Solder wafer Metal 1.552 2 Dice Metal 25.986 3 Molding compound Plastic 62.807 4 Lead Wire Metal 29.555 5 Plating Metal 0.1 Total weight Headquarters Riverside CA Homogeneous Material\ Substances Lead *2 Tin Silver Silicon Nickel Aluminum Lead*3 Phosphorus Boron Trace metals Silica Epoxy Resin Phenol Resin Antimony trioxide Copper Misc., not to declare Tin Misc., not to declare CASRN if applicable Materials Mass % 7439-92-1 7440-31-5 7440-22-4 7440-21-3 7440-02-0 7429-90-5 7439-92-1 7723-14-0 7440-42-8 14808-60-7 29690-82-2 9003-35-4 1309-64-4 7440-50-8 92.5 5 2.5 73.54 1.99 0.56 14.80 0.249 0.874 7.987 70 20 8 2 >99.0 - <1.0 7440-31-5 >99.0 - <1.0 Material Mass % of total unit wt. 1.196 0.065 0.032 15.929 0.431 0.121 3.205 0.054 0.189 1.730 36.637 10.468 4.187 1.047 24.383 0.246 0.083 0.001 Subpart mass of total wt. (%) 1.29 21.66 52.34 24.63 0.08 120.0 www.bourns.com CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society page 1 of 2 MATERIAL DECLARATION SHEET This Document was updated on: 2015/11/03 Important remarks: 1. It is the responsibility of the user to verify they are accessing the latest version. 2. *：Excepted for RoHS 7(a)-Lead in high melting temperature type solders (i.e. lead- based alloys containing 85% by weight or more lead)； 3. *：Excepted for RoHS 7(c) I-Electrical and electronic components containing lead in a glass or ceramic other then dielectric ceramic in capacitors,e.g.piezoelectronic devices, or in a glass or ceramic matrix compound； Headquarters Riverside CA www.bourns.com CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society page 2 of 2