74LVC1G08SE-7 - Diodes Incorporated

74LVC1G08
SINGLE 2 INPUT POSITIVE AND GATE
Description
Pin Assignments
The 74LVC1G08 is a single 2-input positive AND gate with a standard
push-pull output. The device is designed for operation with a power
supply range of 1.65V to 5.5V. The inputs are tolerant to 5.5V allowing
this device to be used in a mixed voltage environment. The device is
fully specified for partial power down applications using IOFF. The IOFF
circuitry disables the output preventing damaging current backflow
when the device is powered down.
The gate performs the positive Boolean function:
Y = A •B
or
Y = A +B
Features
•
Wide Supply Voltage Range from 1.65 to 5.5V
•
± 24mA Output Drive at 3.3V
•
•
CMOS Low Power Consumption
IOFF Supports Partial-Power-Down Mode Operation
•
Inputs Accept Up to 5.5V
•
ESD Protection Tested per JESD 22
ƒ
Exceeds 200-V Machine Model (A115)
ƒ
Exceeds 2000-V Human Body Model (A114)
ƒ
Exceeds 1000-V Charged Device Model (C101)
•
Latch-Up Exceeds 100mA per JESD 78, Class I
•
Range of Package Options
•
Direct Interface with TTL Levels
•
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
•
Halogen and Antimony Free. “Green” Device (Note 3)
Applications
•
Voltage Level Shifting
•
General Purpose Logic
•
Power Down Signal Isolation
•
Notes:
Wide Array of Products Such as.
ƒ
PCs, Networking, Notebooks, Netbooks, PDAs
ƒ
Tablet Computers, E-readers
ƒ
Computer Peripherals, Hard Drives, CD/DVD ROM
ƒ
TV, DVD, DVR, set top box
ƒ
Cell Phones, Personal Navigation / GPS
ƒ
MP3 players ,Cameras, Video Recorders
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
74LVC1G08
Document number: DS32199 Rev. 8 - 2
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74LVC1G08
Ordering Information
74 LVC1G 08 XXX -7
Logic Device
Function
74 : Logic Prefix
LVC : 1.65 to 5.5 V
Logic Family
1G : One Gate
Part Number
08 :
Package
Code
Package
2-Input
AND Gate
Packing
W5 : SOT25
SE : SOT353
Z : SOT553
FS3 : X2-DFN0808-4
FW5 : X1-DFN1010-6
FW4 :X2-DFN1010-6
FX4 : X2- DFN1409-6
FZ4 : X2- DFN1410-6
Package
(Notes 4 & 5)
Package
Size
3.0mm X 2.8mm X 1.2mm
0.95mm lead pitch
-7 : 7” Tape & Reel
7” Tape and Reel
Quantity
Part Number Suffix
3000/Tape & Reel
-7
3000/Tape & Reel
-7
4000/Tape & Reel
-7
5000/Tape & Reel
-7
5000/Tape & Reel
-7
5000/Tape & Reel
-7
74LVC1G08W5-7
W5
SOT25
74LVC1G08SE-7
SE
SOT353
74LVC1G08Z-7
Z
SOT553
74LVC1G08FS3-7
FS3
X2-DFN0808-4
74LVC1G08FW5-7
FW5
X1-DFN1010-6
74LVC1G08FW4-7
FW4
X2-DFN1010-6
74LVC1G08FX4-7
FX4
X2-DFN1409-6
(Chip scale alternative)
1.4mm X 0.9mm X 0.4mm
0.5mm pad pitch
5000/Tape & Reel
-7
74LVC1G08FZ4-7
FZ4
X2-DFN1410-6
1.4mm X 1.0mm X 0.4mm
0.5mm pad pitch
5000/Tape & Reel
-7
Notes:
2.0mm X 2.0mm X 1.1mm
0.65mm lead pitch
1.6mm X 1.6 mm X 0.62mm
0.5mm lead pitch
0.9mm X 0.9 mm X 0.35mm
0.5mm pad pitch (diamond)
1.0mm X 1.0mm X 0.5mm
0.35mm pad pitch
1.0mm X 1.0mm X 0.4mm
0.35mm pad pitch
4. Pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which can be found on our website at
http://www.diodes.com/datasheets/ap02001.pdf.
5. The taping orientation is located on our website at http://www.diodes.com/datasheets/ap02007.pdf
Pin Descriptions
Logic Diagram
Pin Name
A
B
GND
Y
Description
Data Input
Data Input
Ground
Data Output
VCC
NC
Supply Voltage
No Connection
A
B
1
2
4
Y
Function Table
Inputs
A
H
L
X
B
H
X
L
74LVC1G08
Document number: DS32199 Rev. 8 - 2
Output
Y
H
L
L
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74LVC1G08
Absolute Maximum Ratings (Notes 6, 7) (@TA = +25°C, unless otherwise specified.)
Symbol
ESD HBM
Description
Human Body Model ESD Protection
ESD CDM
ESD MM
Charged Device Model ESD Protection
Machine Model ESD Protection
Unit
kV
1
200
kV
V
Supply Voltage Range
-0.5 to 6.5
V
VI
Input Voltage Range
-0.5 to 6.5
V
VO
Voltage Applied to Output in High Impedance or IOFF State
-0.5 to 6.5
V
VO
Voltage Applied to Output in High or Low State.
-0.5 to VCC +0.5
V
VCC
IIK
Input Clamp Current VI < 0
-50
mA
IOK
Output Clamp Current
-50
mA
IO
Continuous Output Current
±50
mA
Continuous Current Through VCC or GND
±100
mA
Operating Junction Temperature
-40 to +150
°C
Storage Temperature
-65 to +150
°C
ICC, IGN
TJ
TSTG
Notes:
Rating
2
6. Stresses beyond the absolute maximum may result in immediate failure or reduced reliability. These are stress values and device
operation should be within recommend values.
7. Forcing the maximum allowed voltage could cause a condition exceeding the maximum current or conversely forcing the maximum current could
cause a condition exceeding the maximum voltage. The ratings of both current and voltage must be maintained within the controlled range..
Recommended Operating Conditions (Note 8) (@TA = +25°C, unless otherwise specified.)
Symbol
VCC
Operating Voltage
Parameter
Operating
Data Retention Only
VCC = 1.65V to 1.95V
VIH
High-Level Input Voltage
Min
1.65
1.5
Max
5.5
—
0.65 X VCC
—
VCC = 2.3V to 2.7
1.7
—
VCC = 3 V to 3.6V
2
—
VCC = 4.5V to 5.5V
0.7 X VCC
—
VCC = 1.65V to 1.95V
—
0.35 X VCC
VCC = 2.3V to 2.7V
—
0.7
VCC = 3V to 3.6V
—
0.8
VCC = 4.5V to 5.5V
—
0.3 X VCC
Unit
V
V
V
V
VIL
Low-Level Input Voltage
VI
Input Voltage
0
5.5
V
VO
Output Voltage
0
VCC
V
-4
IOH
IOL
∆t/∆V
TA
Note:
High-Level Output Current
Low-Level Output Current
Input Transition Rise or Fall Rate
VCC = 1.65V
—
VCC = 2.3V
—
-8
VCC = 2.7V
—
-12
VCC = 3V
—
—
-16
-24
VCC = 4.5V
—
-32
VCC = 1.65V
—
4
VCC = 2.3V
—
8
VCC = 2.7V
—
12
VCC = 3V
—
—
16
24
VCC = 4.5V
—
32
VCC = 1.8V ± 0.15V, 2.5V ± 0.2V
—
20
VCC = 3.3V ± 0.3V
—
10
VCC = 5V ± 0.5V
—
5
-40
+125
Operating Free-Air Temperature
mA
mA
ns/V
°C
8. Unused inputs should be held at VCC or Ground.
74LVC1G08
Document number: DS32199 Rev. 8 - 2
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74LVC1G08
Electrical Characteristics (All typical values are at VCC = 3.3V, TA = +25°C)
Symbol
Parameter
Test Conditions
VCC
VOH
Low Level
Output Voltage
VCC – 0.1
—
—
VCC – 0.1
—
1.2
—
—
0.95
—
IOH = -8mA
2.3V
1.9
—
—
1.7
—
IOH = -12mA
2.7V
2.2
—
—
1.9
—
2.4
—
—
2.2
—
2.3
—
—
2.0
—
IOH = -16mA
3V
IOH = -32mA
4.5V
3.8
—
—
3.4
—
IOL = 100μA
1.65V to 5.5V
—
—
0.1
—
0.1
IOL = 4mA
1.65V
—
—
0.45
—
0.7
IOL = 8mA
2.3V
—
—
0.3
—
0.45
IOL = 12mA
2.7V
—
—
0.4
—
0.6
—
—
0.4
—
0.6
IOL = 16mA
3V
IOL = 32mA
II
Input Current
VI = 5.5V or GND
IOFF
Power Down
Leakage
Current
VI or VO = 5.5V
ICC
Supply Current
VI = 5.5V or GND, IO = 0
Additional
Supply Current
One input at VCC -0.6V
Other inputs at VCC or
GND
Input
Capacitance
Vi = VCC — or GND
Ci
-40°C to +125°C
Min
Max
1.65V
IOL = 24mA
∆ICC
Max
1.65V to 5.5V
IOH = -24mA
VOL
-40°C to +85°C
Typ.
IOH = -4mA
IOH = -100μA
High Level
Output Voltage
Min
Unit
V
V
—
—
0.55
—
0.8
4.5V
—
—
0.55
—
.8
0 to 5.5V
—
± 0.1
±5
—
± 100
μA
0V
—
—
±10
—
±200
μA
5.5V
—
0.1
10
—
200
μA
3V to 5.5V
—
—
500
—
5000
μA
3.3V
—
5
—
—
—
pF
Package Characteristics (All typical values are at VCC = 3.3V, TA = +25°C)
Symbol
θJA
Parameter
Test Conditions
Thermal Resistance
Junction-to-Ambient
SOT25
SOT353
SOT553
X2-DFN0808-4
X1-DFN1010-6
VCC
(Note 9)
X2-DFN1010-6
X2-DFN1409-6
X2-DFN1410-6
SOT25
SOT353
SOT553
Thermal Resistance
Junction-to-Case
θJC
Note:
X2-DFN0808-4
X1-DFN1010-6
X2-DFN1010-6
X2-DFN1409-6
X2-DFN1410-6
(Note 9)
Min
Typ
Max
—
—
—
—
—
204
371
231
400
435
—
—
—
—
—
—
—
—
—
—
—
445
470
460
52
143
105
—
—
—
—
—
—
—
—
—
—
—
225
250
250
275
265
—
—
—
—
—
Unit
°C/W
°C/W
9. Test condition for each of the 8 package types: Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.
74LVC1G08
Document number: DS32199 Rev. 8 - 2
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July 2014
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74LVC1G08
Switching Characteristics
Figure 1 Typical Values at TA = +25°C and nominal voltages 1.8V, 2.5V, 2.7V, 3.3V, and 5.0V.
Parameter
tpd
From
Input
A or B
To
Output
Y
VCC
TA = -40°C to +85°C
TA = -40°C to +125°C
1.8V ± 0.15V
2.5V ± 0.2V
2.7V
3.3V ± 0.3V
Min
1.0
0.5
0.5
0.5
Typ.
3.4
2.2
2.5
2.1
Max
8.0
5.5
5.5
4.5
Min
1.0
0.5
0.5
0.5
Max
10.5
7.0
7.0
6.0
5.0V ± 0.5V
0.5
1.7
4.0
0.5
5.5
Test
Conditions
VCC = 1.8V
VCC = 2.5V
VCC = 3.3V
VCC = 5V
Typ
Typ
Typ
Typ
f = 10MHz
16
16
16
16
Unit
ns
Operating Characteristics
TA = +25°C
Parameter
Cpd
Power Dissipation
Capacitance
74LVC1G08
Document number: DS32199 Rev. 8 - 2
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Unit
pF
July 2014
© Diodes Incorporated
74LVC1G08
Parameter Measurement Information
Inputs
VCC
VM
CL
RL
≤2ns
VCC/2
30pF
1KΩ
VCC
≤2ns
VCC/2
30pF
500Ω
VCC
≤2.5ns
1.5V
50pF
500Ω
3.3V ± 0.3V
3.0V
VCC
≤2.5ns
≤2.5ns
1.5V
5.0V ± 0.5V
VCC/2
50pF
50pF
500Ω
500Ω
VI
tr/tf
1.8V ± 0.15V
VCC
2.5V ± 0.2V
2.7V
Voltage Waveform Pulse Duration
Voltage Waveform Propagation Delay Times
Inverting and Non Inverting Outputs
Figure 1 Load Circuit and Voltage Waveforms
Notes:
A. Includes test lead and test apparatus capacitance.
B. All pulses are supplied at pulse repetition rate ≤ 10MHz.
C. Inputs are measured separately one transition per measurement.
D. tPLH and tPHL are the same as tPD.
74LVC1G08
Document number: DS32199 Rev. 8 - 2
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© Diodes Incorporated
74LVC1G08
Marking Information
7
SOT25, SOT353 and SOT553
7
(1)
Part Number
74LVC1G08W5-7
74LVC1G08SE-7
74LVC1G08Z-7
(2)
Package
SOT25
SOT353
SOT553
Identification Code
UV
UV
UV
DFN Packages
(Top View)
XX
YWX
Part Number
74LVC1G08FS3-7
74LVC1G08FW5-7
74LVC1G08FW4-7
74LVC1G08FX4-7
74LVC1G08FZ4-7
74LVC1G08
Document number: DS32199 Rev. 8 - 2
XX : Identification Code
Y : Year 0~9
W : Week : A~Z : 1~26 week;
a~z : 27~52 week;
z represents 52 and 53 week
X : A~Z : Internal Code
Package
X2-DFN0808-4
X1-DFN1010-6
X2-DFN1010-6
X2-DFN1409-6
X2-DFN1410-6
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Identification Code
WV
V7
UV
MF
UV
July 2014
© Diodes Incorporated
74LVC1G08
Package Outline Dimensions (All dimensions in mm.)
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.
(1)
SOT25
A
SOT25
Dim Min Max Typ
A
0.35 0.50 0.38
B
1.50 1.70 1.60
C
2.70 3.00 2.80
D
⎯
⎯ 0.95
H
2.90 3.10 3.00
J
0.013 0.10 0.05
K
1.00 1.30 1.10
L
0.35 0.55 0.40
M
0.10 0.20 0.15
N
0.70 0.80 0.75
0°
8°
α
⎯
All Dimensions in mm
B C
H
K
J
(2)
M
N
L
D
SOT353
A
SOT353
Dim
Min
Max
A
0.10
0.30
B
1.15
1.35
C
2.00
2.20
D
0.65 Typ
F
0.40
0.45
H
1.80
2.20
J
0
0.10
K
0.90
1.00
L
0.25
0.40
M
0.10
0.22
0°
8°
α
All Dimensions in mm
B C
H
K
M
J
(3)
D
F
L
SOT553
D
e1
E1/2
e
E/2
E1
E
L (5x)
F
R0.1 MAX.
TYP.
b (5x)
c
a
7°
A
SOT553
Dim Min
Max
Typ
A
0.55 0.62 0.60
b
0.15 0.30 0.20
c
0.10 0.18 0.15
D
1.50 1.70 1.60
E
1.55 1.70 1.60
E1
1.10 1.25 1.20
e
0.50 BSC
e1
1.00 BSC
F
0.00 0.10
––
L
0.10 0.30 0.20
a
6°
8°
7°
All Dimensions in mm
TYP.
74LVC1G08
Document number: DS32199 Rev. 8 - 2
8 of 14
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July 2014
© Diodes Incorporated
74LVC1G08
Package Outline Dimensions (cont.) (All dimensions in mm.)
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.
(4)
X2-DFN0808-4
3
A
1
A
A
e
n
a
l
P
g
n
i
t
a
e
S
D e
D
I
1
#
n
i
P
P
Y
T
5
0
.
0
R
K
2
D
2
E
E
x
4
L
x
4
1
L
︵ ︶
︵ ︶
x
4
b
x
4
Z
︵ ︶
(5)
X2-DFN0808-4
Dim
Min
Max
Typ
A
0.25 0.35 0.30
A1
0
0.04 0.02
A3
0.13
b
0.17 0.27 0.22
D
0.75 0.85 0.80
D2
0.15 0.35 0.25
E
0.75 0.85 0.80
E2
0.15 0.35 0.25
e
0.48
K
0.20
L
0.17 0.27 0.22
L1
0.02 0.12 0.07
Z
0.05
All Dimensions in mm
︵ ︶
X1-DFN1010-6
1
A
A
e
n
a
l
P
g
n
i
t
a
e
S
x
5
L
D
1
L
1
e
︵ ︶
e
E
D
I
1
#
n
i
P
︵
︶
X1-DFN1010-6
Dim Min Max Typ
A
0.50 0.39
A1
0.04
b
0.12 0.20 0.15
D
0.95 1.050 1.00
E
0.95 1.050 1.00
e
0.55 BSC
e1
0.35 BSC
L
0.27 0.35 0.30
L1
0.32 0.40 0.35
All Dimensions in mm
b
74LVC1G08
Document number: DS32199 Rev. 8 - 2
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July 2014
© Diodes Incorporated
74LVC1G08
Package Outline Dimensions (cont.) (All dimensions in mm.)
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.
(6)
X2-DFN1010-6
A1
A
A3
D
(Pin #1 ID)
e
b1
E
K
L(6x)
b(6x)
Z(4x)
(7)
X2-DFN1409-6
CHIP SCALE ALTERNATIVE
3
A
1
A
A
e
n
a
l
P
g
n
i
t
a
e
S
D
x
6
2
Ø e
1
e
︵ ︶
D
I
1
#
n
i
P
︵
︶
E
X2-DFN1409-6
Dim Min
Max
Typ
A
0.40 0.39
A1
0
0.05 0.02
A3
0.13
Ø
0.20 0.30 0.25
D
1.35 1.45 1.40
E
0.85 0.95 0.90
e1
0.50
e2
0.50
Z1
0.075
Z2
0.075
All Dimensions in mm
x
4
2
Z
x
4
1
Z
︵ ︶
(8)
X2-DFN1010-6
Dim Min
Max
Typ
A
––
0.40 0.39
A1
0.00 0.05 0.02
A3
––
––
0.13
b
0.14 0.20 0.17
b1
0.05 0.15 0.10
D
0.95 1.05 1.00
E
0.95 1.05 1.00
e
––
––
0.35
L
0.35 0.45 0.40
K
0.15
––
––
Z
––
––
0.065
All Dimensions in mm
︵ ︶
X2-DFN1410-6
A1
A3
X2-DFN1410-6
Dim Min
Max
Typ
A
––
0.40 0.39
A1
0.00 0.05 0.02
A3
––
––
0.13
b
0.15 0.25 0.20
D
1.35 1.45 1.40
E
0.95 1.05 1.00
e
––
––
0.50
L
0.25 0.35 0.30
Z
––
––
0.10
Z1 0.045 0.105 0.075
All Dimensions in mm
A
Seating Plane
D
e
(Pin #1 ID)
L(6x)
E
Z1(4x)
Z(4x)
74LVC1G08
Document number: DS32199 Rev. 8 - 2
b(6x)
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74LVC1G08
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
(1) SOT25
C2
Z
C2
Dimensions Value (in mm)
Z
3.20
G
1.60
X
0.55
Y
0.80
C1
G
C1
C2
2.40
0.95
Y
X
(2) SOT353
C2
Z
C2
Dimensions Value (in mm)
Z
2.5
G
1.3
X
0.42
Y
0.6
C1
1.9
C2
0.65
C1
G
Y
X
(3) SOT553
C2
Z
C2
C1
G
Y
Dimensions Value (in mm)
Z
2.2
G
1.2
X
0.375
Y
0.5
C1
1.7
C2
0.5
X
74LVC1G08
Document number: DS32199 Rev. 8 - 2
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© Diodes Incorporated
74LVC1G08
Suggested Pad Layout (cont.)
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
(4) X2-DFN0808-4
2
X C
Dimensions
2
Y
C
X
X1
X2
Y
Y1
Y2
1
Y
x
4
Y
︵
︶
Value
(in mm)
0.480
0.320
0.300
0.800
0.320
0.300
0.900
1
X
x
4
X
︵ ︶
(5) X1-DFN1010-6
1
X
x
5
Y
C
︵ ︶
Dimensions
2
Y
C
G
G1
X
X1
Y
Y1
Y2
Y3
3
Y
1
G
1
Y
G
Document number: DS32199 Rev. 8 - 2
X
1
n
i
P
74LVC1G08
Value
(in mm)
0.350
0.150
0.150
0.200
0.900
0.500
0.525
0.475
1.150
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© Diodes Incorporated
74LVC1G08
Suggested Pad Layout (cont.)
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
(6) X2-DFN1010-6
X1
C
C
Value
(in mm)
0.350
G
0.150
X
0.200
Dimensions
Y (6x)
Y1
X1
0.900
Y
0.550
Y1
1.250
1
G(4x)
X(6x)
(7) X2-DFN1409-6
C
D (6x)
Y
C1
G1
Pin 1
X
Dimensions
Value
(in mm)
C
C1
D
G
G1
X
Y
1.000
0.500
0.300
0.200
0.200
0.400
0.150
G
(8) X2-DFN1410-6
X1
C
Y(6x)
Y1
1
74LVC1G08
Document number: DS32199 Rev. 8 - 2
G(4x)
Dimensions
Value
(in mm)
C
0.500
G
0.250
X
0.250
X1
1.250
Y
0.525
Y1
1.250
X(6x)
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© Diodes Incorporated
74LVC1G08
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INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
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without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
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final and determinative format released by Diodes Incorporated.
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written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
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representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or
systems.
Copyright © 2014, Diodes Incorporated
www.diodes.com
74LVC1G08
Document number: DS32199 Rev. 8 - 2
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© Diodes Incorporated