Data Sheet SIXTEEN-CHANNEL, 75mA CURRENT SINK WITH CURRENT MATCH General Description Features The AP3616 is an sixteen-channel constant current sink with current match used for LED driver. It uses an external resistor to set the current for sixteen LED strings with an accuracy of ±1.5%. The full scale LED current can be adjusted from 20mA to 75mA for each channel. The LED lightness can be adjusted by PWM dimming function. · · · · · · · · · · The device can keep working normally without any damage when LEDs are short or open. It features under voltage lockout protection and over temperature protection. The AP3616 has three interface terminals (FB, SYN and FBX pins). The FB and SYN pins allow the device to work with a DC/DC converter to drive LED arrays for good performance. And the FBX pin enables the device to be connected in parallel. AP3616 Input Voltage Range: 4.2V to 27V Maximum Output Current: Typical 1.2A (75mA per Channel) Current Match Accuracy (Typical): ±1.5% PWM / Linear Dimming Control Open LED Self-check and Protection Flexible Short LED Protection Under Voltage Lockout Protection Over Temperature Protection FBX and SYN Pins Enable Parallel Application Over Voltage Protection Applications · · · LCD Display Modules LCD Monitor LCD TV The AP3616 is available in SOIC-28 and HSOP-28 packages. SOIC-28 HSOP-28 Figure 1. Package Types of AP3616 Jul. 2012 Rev. 1. 2 BCD Semiconductor Manufacturing Limited 1 Data Sheet SIXTEEN-CHANNEL, 75mA CURRENT SINK WITH CURRENT MATCH AP3616 Pin Configuration M Package (SOIC-28) M28 Package (HSOP-28) CH1 CH2 CH3 CH4 CH5 CH6 1 28 2 27 3 26 CH7 CH8 FLAG FB FBX EN VIN GND 4 25 5 24 6 23 7 22 8 21 9 20 10 19 11 18 12 17 13 16 14 15 CH9 CH10 CH11 CH12 CH13 CH14 CH1 CH2 CH3 CH4 CH5 CH6 CH7 CH15 CH16 OVP SCP SYN SYNF DIM ISET CH8 CH9 CH10 CH11 CH12 CH13 CH14 1 28 2 27 3 26 4 25 5 24 6 23 7 22 8 21 9 20 10 19 11 18 12 17 13 16 14 15 CH16 OVP SCP SYN SYNF DIM ISET GND VIN EN FBX FB FLAG CH15 Figure 2. Pin Configuration of AP3616 (Top View) Jul. 2012 Rev. 1. 2 BCD Semiconductor Manufacturing Limited 2 Data Sheet SIXTEEN-CHANNEL, 75mA CURRENT SINK WITH CURRENT MATCH AP3616 Pin Description Pin Number Pin Name Function SOIC-28 HSOP-28 1 to 8 28 to 21 1 to 8 9 to 15 & 28 9 16 FLAG Error flag pin. When LED load goes to error (short or open ), the flag open drain output will close 10 17 FB Feedback pin. This pin is an interface terminal, which samples the voltage of each channel, and outputs the lowest voltage of the string to DC/DC converter 11 18 FBX This pin is an interface terminal. Connect it to FB pin can achieve parallel application. If not used, leave it unconnected 12 19 EN Enable pin. Logic high enables the IC and logic low disables the IC 13 20 VIN Input voltage pin 14 21 GND Ground pin 15 22 ISET LED current setting pin. An external resistor is connected to this pin. Current on each channel can be expressed by ICHANNEL=1.194*1560/RISET 16 23 DIM Dimming control pin. Adding a PWM signal or DC signal to this pin to control LED dimming. Connect it to high voltage level if not used 17 24 SYNF Synchronous PWM frequency setting pin. A nF level of capacitor should be connected to this pin to set PWM frequency at about 80Hz to 25kHz 18 25 SYN PWM dimming synchronous pin, this pin outputs DC transformed PWM signal to synchronize parallel AP3616 and power converter, if not used, leave it unconnected 19 26 SCP LED short trigger voltage setting pin. This pin is used to set the LED short circuit protection voltage level 20 27 OVP This pin is used to trigger OVP condition. OVP triggering voltage should be lower than the OVP voltage of its cascade chip, such as , AP3039A in Figure 19 CH1 to CH8 White LED cathode connection pins. If not used, leave them unconCH9 to CH16 nected Jul. 2012 Rev. 1. 2 BCD Semiconductor Manufacturing Limited 3 Data Sheet SIXTEEN-CHANNEL, 75mA CURRENT SINK WITH CURRENT MATCH AP3616 Functional Block Diagram CH1_IREF x3120 1 1 2µA COMP ( SCP 200mV COMP x1 AGND Short Detection COMP x7 COMP 21 15 & 28 _ VDD 19(26) + + _ 0.26V VREF SCP SCP Open Detection 18(25) SYN Open Detection 16(23) PWM Latch Block DIM 13µA 9(16) Open LED COMP 10(17) SET RS RESET COMP Q_BAR SEL LOW 11(18) FBX 2.2V 17(24) + _ 13µA x1 Bandgap x4 x4 AMP EN SYNF 0.5V VDD Regulator 12(19) VIN 13(20) 14(21) + _ VREF UVLO GND VDD=5V COMP VDD VCH 16 to 1 EN OVP 1.194V SCP Short LED FB VREF AGND VDS1 VDS1=VDD FLAG COMP AMP x1 8 8 28 9 CH16 OVP_EN ( CH1 20(27) PGND CH_IREF 1 to 16 15(22) ISET AGND PGND A(B) A for SOIC-28 B fro HSOP-28 Figure 3. Functional Block Diagram of AP3616 Jul. 2012 Rev. 1. 2 BCD Semiconductor Manufacturing Limited 4 Data Sheet SIXTEEN-CHANNEL, 75mA CURRENT SINK WITH CURRENT MATCH AP3616 Ordering Information AP3616 - Circuit Type G1: Green Package M: SOIC-28 M28:HSOP-28 Package Blank: Tube Temperature Range SOIC-28 HSOP-28 -40 to 85oC Part Number Marking ID Packing Type AP3616M-G1 AP3616M-G1 Tube AP3616M28-G1 AP3616M28-G1 Tube BCD Semiconductor's Pb-free products, as designated with "G1" suffix in the part number, are RoHS compliant and green. Absolute Maximum Ratings (Note 1) Parameter Symbol Value Unit VIN 30 V VFLAG 30 V VEN 30 V VCHX -0.3 to 60 V Input Voltage FLAG Pin Voltage EN Pin Voltage Voltage on Each Channel Voltage on Other Seperate Pins Thermal Resistance (Junction to Ambient, No Heat Sink) SOIC-28 θJA HSOP-28 Operating Junction Temperature Lead Temperature (Soldering, 10sec) ESD (Human Body Model) ESD (Machine Model) -0.3 to 6 V 72 oC/W 59 o TJ 150 TSTG -65 to 150 C/W oC o 2000 C V 200 V Note 1: Stresses greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "Recommended Operating Conditions" is not implied. Exposure to "Absolute Maximum Ratings" for extended periods may affect device reliability. BCD Semiconductor Manufacturing Limited Jul. 2012 Rev. 1. 2 5 Data Sheet SIXTEEN-CHANNEL, 75mA CURRENT SINK WITH CURRENT MATCH AP3616 Recommended Operating Conditions Parameter Symbol Min Max Unit Input Voltage VCC 4.2 27 V Recommended PWM Dimming Frequency fPWM 0.08 25 kHz 20 40 20 60 20 75 -40 85 Full Scale Setting Current per Channel VCHX=0.5V ICHX VCHX=0.8V VCHX=1.2V TA Operating Temperature Range mA oC Electrical Characteristics VIN=24V, VEN=5V, TA=25oC, unless otherwise specified. Boldface type apply over the full operating tempera- ture range (TA=-40oC to 85oC). Parameter Symbol Conditions Min Typ Max Unit VCC SECTION Quiescent Current IQ ISET, SYN and FB Pin Floating 2 4 mA Shutdown Supply Current ISTBY 0.1 1 µA Under Voltage Lockout Threshold VUVLO VEN=0V, ISET,SYN and FB Pin Floating VIN Falling Edge 3.9 4.15 V Under Voltage Lockout Hysteresis VUVLO_HYS 3.65 300 mV CHANNEL SECTION Maximum Output Current per Channel ICHX_MAX VCHX=0.8V, RISET=0 Current Sink Saturation Voltage per Channel VCHX_SAT ICHX=60mA 75 mA 0.6 V I =60mA, Current Matching Accuracy between Any ICH_MATCHING CHX Two Channels VCH=0.8V 3 % Output Current Load Regulation VCHX=0.5V to 2.8V 4 % Output Current Line Regulation (Note 2) VCHX=4.2V to 2.8V 2 %/V Note 2: Guaranteed by design (GBD). Jul. 2012 Rev. 1. 2 BCD Semiconductor Manufacturing Limited 6 Data Sheet SIXTEEN-CHANNEL, 75mA CURRENT SINK WITH CURRENT MATCH AP3616 Electrical Characteristics (Continued) VIN=24V, VEN=5V, TA=25oC, unless otherwise specified. Boldface type apply over the full operating tempera- ture range (TA=-40oC to 85oC). Parameter Symbol Conditions Min Typ Max Unit DIMMING SECTION PWM High Level Threshold Voltage VIH_PWM PWM Low Level Threshold Voltage VIL_PWM Linear Dimming Level 2.5 V 0.3 V 2.2 V VL_DIM 0.5 ISCP 10.5 12.5 14.5 µA 1.170 1.194 1.218 V LED SHORT PROTECTION SECTION SCP Current CURRENT SINK SECTION ISET Reference Voltage ICHX/ISET Current Multiplication Ratio VISET k RISET=30k, CH1 to CH16 Floating RISET=30k, VCHX=1V 1615 ENABLE SECTION EN Pin High Level Threshold VIH_EN EN Pin Low Level Threshold VIL_EN 2.0 V 0.8 V 1.250 V 0.3 V 25 kHz OVP SECTION Threshold Voltage VTHRESHOLD 1.130 1.194 FLAG SECTION Saturation Voltage VSAT ISINK=2mA SYN SECTION PWM Frequency fPWM 0.08 SYNF High Level Output Voltage VOUT_H 2.4 SYNF Low Level Output Voltage VOUT_L V 0.4 V FB SECTION Feedback Output Current IFB VFB Drop to 97% 13 17 µA TOTAL DEVICE Thermal Shutdown Temperature TOTSD Thermal Shutdown Hysteresis THYS CHX Pin Left Foating 160 o C 20 o C BCD Semiconductor Manufacturing Limited Jul. 2012 Rev. 1. 2 7 Data Sheet SIXTEEN-CHANNEL, 75mA CURRENT SINK WITH CURRENT MATCH AP3616 Typical Performance Characteristics VIN=24V, VEN=5V, RISET=30kΩ,, TA=25oC, unless otherwise specified. 200 0.56 0.54 160 0.52 140 Feedback Voltage (V) Maximum Channel Current (mA) 180 120 100 80 60 40 20 0.50 0.48 0.46 0.44 0.42 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 0.40 1.6 4 6 8 10 Channel Voltage (V) 12 14 16 18 20 Feedback Current (µA) Figure 4. Maximum Channel Current vs. Channel Voltage Figure 5. Feedback Voltage vs. Feedback Current 70 65 60 55 50 50 Current per Channel (mA) Current per Channel (mA) 60 40 30 20 10 45 40 35 30 25 20 15 f=100Hz f=20kHz 10 5 0 0 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 -5 2.2 0 Linear Dimming Voltage (V) 10 20 30 40 50 60 70 80 90 100 Duty Cycle (%) Figure 7. Current per Channel vs. Duty Cycle (PWM Dimming) Figure 6. Channel Current vs. Linear Dimming Voltage Jul. 2012 Rev. 1. 2 BCD Semiconductor Manufacturing Limited 8 Data Sheet SIXTEEN-CHANNEL, 75mA CURRENT SINK WITH CURRENT MATCH AP3616 Typical Performance Characteristics (Continued) VIN=24V, VEN=5V, RISET=30kΩ,, TA=25oC, unless otherwise specified. 65 1.4 64 1.3 ISET Reference Voltage (V) Channel Current (mA) 63 62 61 60 59 58 57 56 55 1.2 1.1 1.0 0.9 0.8 -50 -25 0 25 50 75 100 125 150 -50 o -25 0 Temperature ( C) 25 50 75 100 125 150 o Temperature ( C) Figure 9. ISET Reference Voltage vs. Temperature Figure 8. Channel Current vs. Temperature 0.8 2.2 2.1 0.7 2.0 1.9 Quiescent Current (mA) Saturation Voltage (V) 0.6 0.5 0.4 0.3 0.2 1.8 1.7 1.6 1.5 1.4 1.3 1.2 0.1 1.1 0.0 -50 -25 0 25 50 75 100 125 1.0 150 3 o Temperature ( C) 6 9 12 15 18 21 24 27 Input Voltage (V) Figure 10. Saturation Voltage vs. Temperature Figure 11. Quiescent Current vs. Input Voltage BCD Semiconductor Manufacturing Limited Jul. 2012 Rev. 1. 2 9 Data Sheet SIXTEEN-CHANNEL, 75mA CURRENT SINK WITH CURRENT MATCH AP3616 Typical Performance Characteristics (Continued) Current per Channel (mA) VIN=24V, VEN=5V, RISET=30kΩ,, TA=25oC, unless otherwise specified. 63.6 63.4 63.2 63.0 62.8 62.6 62.4 62.2 62.0 61.8 61.6 61.4 61.2 61.0 60.8 60.6 60.4 60.2 60.0 VDIM 5V/div VSYN 5V/div VGATE 10V/div o TA=-40 C o TA=125 C ICH 50mA/div o TA=25 C 0 2 4 6 8 10 12 14 16 Time 4ms/div Channel Figure 12. Current per Channel vs. Channel Figure 13. PWM Dimming (f=100Hz, Duty Cycle=50%) VSYNF 1V/div VDIM 5V/div VSYN 5V/div VSYN 5V/div VGATE 10V/div VGATE 10V/div ICH 50mA/div ICH 100mA/div Time 20µs/div Time 800µs/div Figure 14. PWM Dimming (f=20kHz, Duty Cycle=50%) Figure 15. Linear Dimming (VDIM=1.4V) Jul. 2012 Rev. 1. 2 BCD Semiconductor Manufacturing Limited 10 Data Sheet SIXTEEN-CHANNEL, 75mA CURRENT SINK WITH CURRENT MATCH AP3616 Typical Performance Characteristics (Continued) VIN=24V, VEN=5V, RISET=30kΩ,, TA=25oC, unless otherwise specified. VOVP 1V/div VSCP 1V/div ICH 50mA/div I CH 100mA/div VFB 1V/div VCH 5V/div VFLAG 5V/div VFLAG 5V/div Time 4µs/div Time 400µs/div Figure 16. LED Open Protection Figure 17. LED Short Protection VGATE 5V/div ICH 50mA/div Time 2s/div Figure 18. OTP and Recovery BCD Semiconductor Manufacturing Limited Jul. 2012 Rev. 1. 2 11 Data Sheet SIXTEEN-CHANNEL, 75mA CURRENT SINK WITH CURRENT MATCH AP3616 Function Description The AP3616 integrates an OVP circuit. The OVP pin is connected to the center tap of voltage-divider (ROV3 and ROV4) that placed between high voltage output and GND (Figure 19). If the voltage on OVP pin exceeds 1.194V, which may results from open loop or excessive output voltage, the AP3616 will start LED open protection. 1. LED Current Setting The maximum LED current per channel can be adjusted up to 75mA via ISET pin. When ≥ 75mA current is needed in application, two or more channels can be paralleled to provide larger drive current. Connect a resistor RISET between ISET pin and GND to set the reference current ISET. The LED current is determined by the following equation. I LED ( mA ) = VOVP = k ⋅ V ISET 156 0 × 1.194 = R ISET ( kΩ ) R ISET ( kΩ ) (R OV3 + R OV4 ) ×1.194V R OV4 4. LED Short-circuit Protection The AP3616 integrates an LED short-circuit protection circuit. During normal operation, any shortcircuited LED will cause the corresponding LED pin voltage to rise. If any LED pin voltage exceeds 8 times of the voltage at SCP pin, the corresponding LED current sink will be latched off, while the remaining string(s) keep normal operation. Toggle the VIN and/or EN to reset the latch. An internal current source was connected to this pin, a resistor connected here is used to set the shorting LED trigger voltage. 2. Dimming Control The AP3616 provides two dimming methods: external PWM signal or DC voltage input. Applying a PWM signal to DIM pin to adjust the LED current, that means, the LED current of all enabled channels can be adjusted at the same time and the LED brightness can be adjusted from 1%*ICHX_MAX to 100%*ICHX_MAX. During the high level period of PWM signal, the LED is turned on and 100% of the current flows through LED, while during the low level period of the PWM signal, the LED is turned off and almost no current flows through the LED, thus changing the average current through LED and finally adjusting LED brightness. The external PWM signal frequency applied to PWM pin is allowed to be 80Hz or higher. 5. LED Open-circuit Protection The AP3616 integrates an LED Open-Circuit Protection circuit. When any LED string is open, VOUT will boost up until the voltage at OVP pin reaches an approximate 1.194V threshold. The IC will automatically ignore the open string(s) whose CHX pin voltage is less than 100mV. 3.Over Voltage Protection Jul. 2012 Rev. 1. 2 BCD Semiconductor Manufacturing Limited 12 Data Sheet SIXTEEN-CHANNEL, 75mA CURRENT SINK WITH CURRENT MATCH AP3616 Typical Application R2 C1 (Optional) (Optional) R3 L +24V Css GND CS GND RT 11 10 R10 (Optional) 9 RT 8 100k U1 SYN µ R5 62k RCS1 RCS2 300mΩ 300mΩ FBX VCC=24V VIN RG C2 0.1 µ F/50V 2Ω PWM / Linear Dimming 1µF (Optional) 51Ω DIM AP3616 FB R10 PWM CH16 OUT SHDN R4 100k C3 6.8nF R7 130k R6 30k R8 51Ω OVP VCC EN 7 VIN 12x16 3.9k 10nF/16V 12 FLAG 6 CV 0.47µF/25V RUVLO_2 2.7k 5 ROV4 4.3k SYNF 4 FB ROV2 4.3k SCP 51Ω EN 22nF/16V CC CH1 EN 3 RC 13 ROV3 150k OVP2 CH2 +24V (VCC) R1 COMP OV 14 ROV1 200k OVP1 ISET 2 SS LED Arrays COUT2 10 µF/100V GND OVP1 UVLO VOUT D MBRD360 COUT1 60V/3A 10 µF/100V FQD13N06L 60V/11A C4 (Optional) 1 AP3039A 20k RUVLO_1 CIN2 CIN3 CIN1 22µF/50V (Optional) 47µH/4A R9 1k OVP2 EN +5V Single Chip Application (12S16P) R2 C1 (Optional) (Optional) (Optional) L +24V Css C2 0.1µF/50V R4 100k R6_1 30k FBX VCC=24V C2 0.1µF/50V C3_1 R7_1 6.8nF 130k U3 VIN CH16 R10 PWM DIM AP3616 FB 51Ω FBX C3 R7 R6 6.8nF 30k 130k OVP U2 SYN DIM FLAG VCC=24V VIN RG 2Ω AP3616 FB EN R5 62k RCS2 300m Ω SYNF SYN RCS1 300mΩ SCP 100k U1 CH1 R11_1 (Optional) RT CH2 RT 8 ISET GND 10 9 GND CS CH16 GND OVP OUT SHDN 12x32 3.9k 10nF/16V 11 FLAG VCC ROV4 4.3k CH2 7 VIN 12 ROV2 4.3k 60V/11A EN 6 FB 22nF/16V CC CH1 RUVLO_2 2.7k CV 0.47µF/25V 5 EN RC 13 SYNF 4 OV 14 SCP 3 51Ω SS COMP ROV3 150k OVP2 ISET EN UVLO ROV1 200k OVP1 COUT2 10µF/100V GND +24V (VCC) R1 2 LED Arrays VOUT D MBRD360 COUT1 60V/3A µ FQD13N06L 10 F/100V C4 (Optional) 1 OVP1 R3 47µH/4A AP3039A 20k CIN2 CIN3 RUVLO_1 CIN1 22µF/50V PWM / Linear Dimming 1 µF (Optional) R8 51Ω R9 1k R9_1 OVP2 1k R8_1 51Ω +5V +5V OVP2 EN Multi Chips Application (12S32P) Figure 19. Typical Applications of AP3616 BCD Semiconductor Manufacturing Limited Jul. 2012 Rev. 1. 2 13 Data Sheet SIXTEEN-CHANNEL, 75mA CURRENT SINK WITH CURRENT MATCH AP3616 Mechanical Dimensions Unit: mm(inch) SOIC-28 17.700(0.697) 18.100(0.713) 0.204(0.008) 0.330(0.013) 7.400(0.291) 7.700(0.303) 10.210(0.402) 10.610(0.418) 0° 8° 1.270(0.050) BSC 0.330(0.013) 0.510(0.020) 0.400(0.016) 1.270(0.050) 0.100(0.004) 0.300(0.012) 2.350(0.093) 2.650(0.104) 2.290(0.090) 2.500(0.098) Note: Eject hole, oriented hole and mold mark is optional. Jul. 2012 Rev. 1. 2 BCD Semiconductor Manufacturing Limited 14 Data Sheet SIXTEEN-CHANNEL, 75mA CURRENT SINK WITH CURRENT MATCH AP3616 Mechanical Dimensions (Continued) Unit: mm(inch) HSOP-28 17.890(0.704) 18.190(0.716) 0.204(0.008) 0.360(0.014) 0.400(0.016) 1.270(0.050) 10.000(0.394) 10.650(0.419) 7.400(0.291) 7.600(0.300) 0o ~8 o 0.800(0.031) TYP 5.050(0.199) 5.250(0.207) 0.230(0.009) 0.470(0.019) 0.100(0.004) 0.300(0.012) 2.180(0.086) 2.330(0.092) 2.280(0.090) 2.630(0.104) Note: Eject hole, oriented hole and mold mark is optional. Jul. 2012 Rev. 1. 2 BCD Semiconductor Manufacturing Limited 15 BCD Semiconductor Manufacturing Limited http://www.bcdsemi.com IMPORTANT NOTICE IMPORTANT NOTICE BCD Semiconductor BCD Semiconductor Manufacturing Manufacturing Limited Limited reserves reserves the the right right to to make make changes changes without without further further notice notice to to any any products products or or specifispecifications herein. cations herein. BCD BCD Semiconductor Semiconductor Manufacturing Manufacturing Limited Limited does does not not assume assume any any responsibility responsibility for for use use of of any any its its products products for for any any particular purpose, particular purpose, nor nor does does BCD BCD Semiconductor Semiconductor Manufacturing Manufacturing Limited Limited assume assume any any liability liability arising arising out out of of the the application application or or use use of any of any its its products products or or circuits. circuits. BCD BCD Semiconductor Semiconductor Manufacturing Manufacturing Limited Limited does does not not convey convey any any license license under under its its patent patent rights rights or or other rights other rights nor nor the the rights rights of of others. others. MAIN SITE SITE MAIN - Headquarters BCD Semiconductor Manufacturing Limited BCD Semiconductor Manufacturing Limited - Wafer Fab No. 1600, Zi Xing Road, Shanghai ZiZhu Science-basedLimited Industrial Park, 200241, China Shanghai SIM-BCD Semiconductor Manufacturing Tel: Fax: +86-21-24162277 800,+86-21-24162266, Yi Shan Road, Shanghai 200233, China Tel: +86-21-6485 1491, Fax: +86-21-5450 0008 REGIONAL SALES OFFICE Shenzhen OfficeSALES OFFICE REGIONAL - Wafer FabSemiconductor Manufacturing Limited BCD Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd. - IC Design Group 800 Yi Shan Road, Shanghai 200233, China Corporation Advanced Analog Circuits (Shanghai) Tel: +86-21-6485 1491,YiFax: 0008200233, China 8F, Zone B, 900, Shan+86-21-5450 Road, Shanghai Tel: +86-21-6495 9539, Fax: +86-21-6485 9673 Taiwan Office Shanghai Semiconductor Manufacturing Co., Ltd., Shenzhen Office BCD Taiwan Semiconductor Shenzhen SIM-BCD Office Office (Taiwan) Company Limited Unit A Room 1203, Skyworth Bldg., Gaoxin Ave.1.S., Nanshan Shenzhen, 4F, 298-1, Guang Road,(Taiwan) Nei-Hu District, Taipei, Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd.District, Shenzhen Office BCDRui Semiconductor Company Limited China Taiwan Advanced Analog Circuits (Shanghai) Corporation Shenzhen Office 4F, 298-1, Rui Guang Road, Nei-Hu District, Taipei, Tel: +86-755-8826 Tel: +886-2-2656 2808 Room E, 5F, Noble 7951 Center, No.1006, 3rd Fuzhong Road, Futian District, Shenzhen 518026, China Taiwan Fax: +86-755-88267951 7865 Fax: +886-2-2656 28062808 Tel: +86-755-8826 Tel: +886-2-2656 Fax: +86-755-8826 7865 Fax: +886-2-2656 2806 USA Office BCD Office Semiconductor Corp. USA 30920Semiconductor Huntwood Ave.Corporation Hayward, BCD CA 94544, USA Ave. Hayward, 30920 Huntwood Tel :94544, +1-510-324-2988 CA U.S.A Fax:: +1-510-324-2988 +1-510-324-2788 Tel Fax: +1-510-324-2788