SE30AFB, SE30AFD, SE30AFG, SE30AFJ Surface Mount

SE30AFB, SE30AFD, SE30AFG, SE30AFJ
www.vishay.com
Vishay General Semiconductor
Surface Mount ESD Capability Rectifiers
FEATURES
SlimSMA
• Very low profile - typical height of 0.95 mm
• Ideal for automated placement
• Oxide planar chip junction
• Low forward voltage drop, low leakage current
• ESD capability
Bottom View
Top View
• Meets MSL level 1, per J-STD-020, LF maximum
peak of 260 °C
DO-221AC
• AEC-Q101 qualified
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
PRIMARY CHARACTERISTICS
IF(AV)
3.0 A
VRRM
100 V, 200 V, 400 V, 600 V
IFSM
40 A
VF at IF = 3.0 A (TA = 125 °C)
0.86 V
MECHANICAL DATA
Case: DO-221AC (SlimSMA)
Molding compound meets UL 94 V-0 flammability rating
Base P/N-M3 - halogen-free, RoHS-compliant, and
commercial grade
IR
10 μA
TJ max.
175 °C
Package
DO-221AC (SlimSMA)
Diode variations
Single die
Base P/NHM3 - halogen-free, RoHS-compliant, and
AEC-Q101 qualified
TYPICAL APPLICATIONS
General purpose, power line polarity protection, in both
consumer and automotive applications.
Terminals: Matte tin plated leads, solderable per
J-STD-002 and JESD 22-B102
M3 suffix meets JESD 201 class 2 whisker test, HM3 suffix
meets JESD 201 class 2 whisker test
Polarity: Color band denotes the cathode end
MAXIMUM RATINGS (TA = 25 °C unless otherwise noted)
PARAMETER
SYMBOL
Device marking code
Maximum repetitive peak reverse voltage
VRRM
IF (1)
IF (2)
Maximum DC forward current
SE30AFB
SE30AFD
SE30AFG
SE30AFJ
UNIT
S3B
100
S3D
200
S3G
400
S3J
600
V
Peak forward surge current 10 ms single half
IFSM
sine-wave superimposed on rated load
Operating junction and storage temperature range
TJ, TSTG
Notes
(1) Mounted on 15 mm x 15 mm pad areas, 2 oz. FR4 PCB
(2) Free air, mounted on recommended copper pad area

3.0
1.4
A
40
A
-55 to +175
°C
ELECTRICAL CHARACTERISTICS (TA = 25 °C unless otherwise noted)
PARAMETER
Instantaneous forward voltage
Reverse current
TEST CONDITIONS
IF = 1.5 A
IF = 3.0 A
IF = 1.5 A
IF = 3.0 A
TA = 25 °C
VF (1)
TA = 125 °C
TA = 25 °C
TA = 125 °C
IF = 0.5 A, IR = 1.0 A, Irr = 0.25 A
4.0 V, 1 MHz
Rated VR
Typical reverse recovery time
Typical junction capacitance
Notes
(1) Pulse test: 300 μs pulse width, 1 % duty cycle
(2) Pulse test: Pulse width  40 ms
SYMBOL
IR (2)
trr
CJ
TYP.
MAX.
0.91
0.97
0.79
0.86
13
1.5
19
1.1
0.98
10
100
-
UNIT
V
μA
μs
pF
Revision: 27-Jul-15
Document Number: 89955
1
For technical questions within your region: [email protected], [email protected], [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SE30AFB, SE30AFD, SE30AFG, SE30AFJ
www.vishay.com
Vishay General Semiconductor
THERMAL CHARACTERISTICS (TA = 25 °C unless otherwise noted)
PARAMETER
SYMBOL
Typical thermal resistance
SE30AFB
SE30AFD
SE30AFG
RJA (1)
125
RJM (2)
12
SE30AFJ
UNIT
°C/W
Notes
(1) Free air, mounted on recommended PCB, 1 oz. pad area; thermal resistance R
JA - junction to ambient
(2) Mounted on 15 mm x 15 mm pad areas, 2 oz. FR4 PCB; R
JM - junction to mount
IMMUNITY TO ELECTRICAL STATIC DISCHARGE TO THE FOLLOWING STANDARDS 
(TA = 25 °C unless otherwise noted)
STANDARD
TEST TYPE
AEC-Q101-001
TEST CONDITIONS
Human body model (contact mode)
SYMBOL
CLASS
VALUE
VC
H3B
> 8 kV
C = 100 pF, R = 1.5 k
ORDERING INFORMATION (Example)
PREFERRED P/N
UNIT WEIGHT (g)
PREFERRED PACKAGE CODE
BASE QUANTITY
DELIVERY MODE
0.032
6A
3500
7" diameter plastic tape and reel
SE30AFJ-M3/6B
0.032
6B
14 000
13" diameter plastic tape and reel
SE30AFJHM3/6A (1)
0.032
6A
3500
7" diameter plastic tape and reel
SE30AFJHM3/6B (1)
0.032
6B
14 000
13" diameter plastic tape and reel
SE30AFJ-M3/6A
Note
AEC-Q101 qualified
(1)
3.5
3.6
D = 0.8
TM = 141 °C, RthM = 12 °C/W
3.2
2.8
2.4
2
1.6
T A = 25 °C
1.2
0.8
0.4
TM measured at cathode band
terminal PCB mount
0
0
25
50
75
100
3.0
Average Power Loss (W)
DC Forward Rectified Current (A)
RATINGS AND CHARACTERISTICS CURVES (TA = 25 C unless otherwise noted)
D = 0.5
D = 0.3
2.5
D = 0.2
D = 1.0
D = 0.1
2.0
1.5
T
1.0
0.5
D = tp/T
tp
2.5
3
0.0
125
150
175
Mount Temperature (°C)
Fig. 1 - Maximum Forward Current Derating Curve
0
0.5
1
1.5
2
3.5
Average Forward Current (A)
Fig. 2 - Forward Power Loss Characteristics
Revision: 27-Jul-15
Document Number: 89955
2
For technical questions within your region: [email protected], [email protected], [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SE30AFB, SE30AFD, SE30AFG, SE30AFJ
www.vishay.com
Vishay General Semiconductor
100
10
TA = 175 °C
TA = 125 °C
TA = 150 °C
TA = 75 °C
1
TJ = 25 °C
f = 1.0 MHz
Vsig = 50 mVp-p
Junction Capacitance (pF)
Instantaneous Forward Current (A)
100
TA = 25 °C
10
1
0.1
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.2
0.1
1.3
1
Fig. 5 - Typical Junction Capacitance
1000
Transient Thermal Impedance (°C/W)
Instantaneous Reverse Current (μA)
Fig. 3 - Typical Instantaneous Forward Characteristics
TA = 175 °C
TA = 150 °C
10
TA = 125 °C
1
TA = 75 °C
0.1
TA = 25 °C
0.01
1000
Junction to Ambient
100
10
1
0.01
0.001
10
20
30
40
50
60
70
80
90
100
Reverse Voltage (V)
Instantaneous Forward Voltage (V)
100
10
100
0.1
1
10
100
t - Pulse Duration (s)
Percent of Rated Peak Reverse Voltage (%)
Fig. 4 - Typical Reverse Leakage Characteristics
Fig. 6 - Typical Junction Capacitance
Thermal Resistance (°C/W)
140
Epoxy printed
circiut board FR4
copper
thickness = 70 μm
120
100
80
60
40
20
Scu (cm2)
0
0.0
2.0
4.0
6.0
8.0
10.0
Copper Pad Areas (cm2)
Fig. 7 - Thermal Resistance Junction to Ambient vs. Copper Pad Areas
Revision: 27-Jul-15
Document Number: 89955
3
For technical questions within your region: [email protected], [email protected], [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SE30AFB, SE30AFD, SE30AFG, SE30AFJ
www.vishay.com
Vishay General Semiconductor
PACKAGE OUTLINE DIMENSIONS in inches (millimeters)
DO-221AC (SlimSMA)
Cathode Band
0.057 (1.45)
0.049 (1.25)
0.106 (2.70)
0.098 (2.50)
0.171 (4.35)
0.163 (4.15)
0.211 (5.35)
0.199 (5.05)
0.047 (1.20)
0.030 (0.75)
Typ.: 0.019 (0.48)
Mounting Pad Layout
0.039 (1.00)
0.035 (0.90)
0.060 (1.52)
MIN.
0.012 (0.30)
0.006 (0.15)
0.047 (1.20)
MIN.
0.123 (3.12) MAX.
0.217 (5.52) REF.
0.047 (1.20)
MIN.
Revision: 27-Jul-15
Document Number: 89955
4
For technical questions within your region: [email protected], [email protected], [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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www.vishay.com
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Revision: 02-Oct-12
1
Document Number: 91000