GSDC209ADC 209-Bump BGA (14 mm x 22 mm) DummyDie™ Daisy Chain Package Description This mechanical daisy chain test vehicle is designed to represent the 209-Bump BGA package. It is used for second level interconnect assembly test and continuity verification. The DummyDie™ incorporates a 10 mm x 15 mm die, which is not electrically connected. 209 BGA Package Drawing (Package C) 14 mm x 22 mm Body, 1.0 mm Bump Pitch, 11 x 19 Bump Array C A1 A Side View D aaa D1 ∅b E E1 e Bottom View e Symbol Min Typ Max Units Symbol Min Typ Max Units A — — 1.70 mm D1 — 18.0 (BSC) — mm A1 0.40 0.50 0.60 mm E 13.9 14.0 14.1 mm ∅b 0.50 0.60 0.70 mm E1 — 10.0 (BSC) — mm c 0.31 0.36 0.38 mm e — 1.00 (BSC) — mm D 21.9 22.0 22.1 mm aaa — 0.15 — mm Rev 1.0 Rev: 1.00 12/2005 1/3 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 2004, GSI Technology GSDC209ADC 209 BGA Interconnection Diagram 1 2 3 4 5 6 7 8 9 10 11 A B C D E F G H J K L M N P R T U V W Rev: 1.00 12/2005 2/3 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 2004, GSI Technology GSDC209ADC Ordering Information 209-Bump BGA (14 mm x 22 mm) Daisy Chain Package GSDC209ADC Package Designator DummyDie™ Designator Revision Designator Ball Count Daisy Chain GSI Technology 209-Bump BGA (14 mm x 22 mm) Daisy Chain Package RoHS-compliant Option GSDC209ADGC Package Designator RoHS-compliance designator DummyDie™ Designator Revision Designator Ball Count Daisy Chain GSI Technology Rev: 1.00 12/2005 3/3 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. © 2004, GSI Technology