FINAL PRODUCT/PROCESS CHANGE NOTIFICATION #16669 Generic Copy Issue Date: 23-Jun-2011 TITLE: Qualification of Serial I2C EEPROM devices CAT24C128 and CAT24C256 for fabrication at ON Semiconductor’s Gresham, Oregon Wafer Fab PROPOSED FIRST SHIP DATE: 01-Oct-2011 AFFECTED CHANGE CATEGORY(S): CAT24C128 and CAT24C256 (all Packages, all Temperatures) FOR ANY QUESTIONS CONCERNING THIS NOTIFICATION: Contact your local ON Semiconductor Sales Office or Denisa Stefan< [email protected] > SAMPLES: Samples available per “Affected Device List” table on Page 4. Contact your local ON Semiconductor Sales Office. ADDITIONAL RELIABILITY DATA: Available Contact your local ON Semiconductor Sales Office or Tony Luciani <[email protected]> NOTIFICATION TYPE: Final Product/Process Change Notification (FPCN) Final change notification sent to customers. implementation of the change. FPCNs are issued at least 90 days prior to ON Semiconductor will consider this change approved unless specific conditions of acceptance are provided in writing within 30 days of receipt of this notice. To do so, contact <[email protected]>. DESCRIPTION AND PURPOSE: ON Semiconductor is pleased to announce that, as part of its ongoing effort to improve product availability, the Serial I2C EEPROM devices CAT24C128 and CAT24C256 are now qualified for production in the 0.18 µm CMOS EE process at ON Semiconductor’s 8-inch Wafer Fab in Gresham, Oregon, USA. The Gresham Wafer Fab is ISO9001:2008, ISO/TS16949:2009 and ISO14001:2004 certified. Wafers for these devices will also continue to be supplied by our foundry partner OKI Semiconductor, Japan from a 6-inch line running a 0.35 µm CMOS EE process. This will provide increased die capacity to meet growing demand. In addition, the new devices will also be offered in smaller packages, enabling to support customers with space-efficient solutions. This notification and acceptance thereof, allows for the use of either Gresham or OKI die in future shipments under the same OPN. Issue Date: 23-Jun-2011 Rev. 06-Jan-2010 Page 1 of 1 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION #16669 RELIABILITY DATA SUMMARY: The qualification vehicle CAT24M01 Rev A was chosen as it has the largest array of the family. The additional products (CAT 24C512/256) have been qualified based upon similarity of the memory cell structure and technology. QTP: 100006, CAT24C256 Rev. E, CAT24C128 Rev. C, Gresham ONC18EE Product Qual Lot Number Assy Lot Wfr Lot CAT24M01 lot 1 EBR 031335 GAM28922.1_7 CAT24M01 lot 2 EBR 034455 GAM44932.4_1 CAT24M01 lot 3 EBR 035061 GAM42911.4_2 CAT24M01 lot 4 EBR 035556 GAM43923.4_8 CAT24M01 lot 5 N/A GAM43923.4_7 CAT24C512 lot 6 EBR030681 GAM21908.2_4 CAT24C256 lot 7 EBR030137 GAM21907.2_w3 CAT24C128 lot 8 EBR033621 GAM33919_w18 Package Lot Number lot 1 lot 2 HTOL 408hrs, 150C release High Temp Op Life Per JA108 lot 3 SOIC (3x77) Tritemp test before and after lot 6 lot 7 Package Lot Number Per AEC-Q100-008 lot 1 HTOL conditions, lot 2 ELFR 24hrs, 150C lot 6 SOIC Early Life Failure Rate Room/Hot testing lot 7 before and after lot 3 Package Lot Number lot 2 lot 3 SOIC lot 4 EDR NVM Endurance Package Lot Number Per JESD22-A103/ 1M Cycles Q100-005 lot 2 Room/Hot test before and after SOIC lot 3 lot 4 Lot Number Wafer Level Endurance Wafer lot 4 Data Lot Number lot 2 NVM Data Retention "00" Package Level lot 3 1000hrs, 150C EDR Cycling Precon to 100k lot 2 "FF" Per Q100-005 lot 3 Room/Hot test Wafer Level before and after Data Lot Number "00" lot 5 Bake at 225C, 100hrs Endurance Preconditioning: "FF" lot 5 1M Cycles Package Lot Number lot 4 ESD lot 6 AEC Q100-002 Human Body Model SOIC 1 lot, 3 units per level lot 7 lot 8 Package Lot Number SOIC lot 4 ESD lot 6 AEC Q100-003 Machine Model lot 7 1 lot, 3 units per level lot 8 Package Lot Number Samples 77 77 77 77 77 Samples 800 800 800 800 800 Samples 77 77 77 Samples 77 77 77 Samples 77 Samples 77 77 77 77 Samples 77 168hrs PASS PASS PASS PASS PASS 24hrs PASS PASS PASS PASS PASS 100k PASS PASS PASS 600k PASS PASS PASS 1M PASS 168hrs PASS PASS PASS PASS 100hrs PASS 77 PASS lot 4 lot 6 lot 7 lot 8 Package Lot Number lot 2 lot 3 lot 4 SOIC lot 6 lot 7 lot 8 6 6 6 6 Samples 30 30 30 30 30 30 (1 x 6) Latch Up per AEC-Q100-004 Room / Hot testing after LU test CHAR Characterization Per AEC-Q003 LU (3 x 30) Issue Date: 23-Jun-2011 SOIC Rev. 06-Jan-2010 Samples 5/level 5/level 5/level 5/level Samples 5/level 5/level 5/level 5/level Samples 408hrs PASS PASS PASS PASS PASS 1000hrs PASS PASS PASS PASS PASS 200k PASS PASS PASS 700k PASS PASS PASS 300k PASS PASS PASS 800k PASS PASS PASS 336hrs PASS PASS PASS PASS 500hrs 1000hrs PASS PASS PASS PASS PASS PASS PASS PASS 500V 1000V PASS PASS PASS PASS PASS PASS PASS PASS 100V 150V PASS PASS PASS PASS PASS PASS PASS PASS 100mA 25C 125C PASS PASS PASS PASS PASS PASS PASS PASS Result PASS PASS PASS PASS PASS PASS 1500V PASS PASS PASS PASS 200V PASS PASS PASS PASS 400k PASS PASS PASS 900k PASS PASS PASS 500k PASS PASS PASS 1M PASS PASS PASS 2000V PASS PASS PASS PASS 300V PASS FAIL PASS PASS Page 2 of 9 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION #16669 ELECTRICAL CHARACTERISTIC SUMMARY: The major features and electrical parameters of the CAT24C128 Rev C and CAT24C256 Rev E compared to the previous OKI product die revision are shown in the Table below. The new Gresham die supports both Standard (100kHz) and Fast (400kHz) I2C protocol for full VCC range of 1.8V to 5.5V and Fast-Plus (1MHz) protocol for VCC = 2.5V to 5.5V. CAT24C128 Gresham 0.18u /Rev C CAT24C128 OKI 0.35u / Rev B Power Supply Current, Read Mode 1 mA 1 mA Power Supply Current Write Mode 3 mA 3 mA I/O Leakage Current (SCL, SDA) * 1 μA 1 μA 400 KHz / 1.8V to 5.5V 400 KHz / 1.8V to 5.5V Clock Frequency / Vcc Range 1 MHz / 2.5V to 5.5V Write Cycle Time 5 ms Page Write Buffer 5 ms 64 Bytes 64 Bytes CAT24C256 Gresham 0.18u /Rev E CAT24C256 OKI 0.35u / Rev D Power Supply Current, Read Mode 1 mA 1 mA Power Supply Current Write Mode 3 mA 3 mA I/O Leakage Current (SCL, SDA)* 1 μA 1 μA 400 KHz / 1.8V to 5.5V 400 KHz / 1.8V to 5.5V 1 MHz / 2.5V to 5.5V 1 MHz / 2.5V to 5.5V 5 ms 5 ms Clock Frequency / Vcc Range Write Cycle Time Page Write Buffer 64 Bytes 64 Bytes *Notes: • When not driven, the WP, A0, A1 and A2 pins are pulled down to GND internally. • For improved noise immunity, the new Gresham die, CAT24C128 Rev C and CAT24C256 Rev E feature a relatively strong internal pull-down when VIN <VIH both for the WP pin and Address (A0, A1, A2) pins. Therefore the external driver (or the pull-up resistor) must be able to overcome the pull-down current to drive the pin “High”. As soon as the input is in the “High” state, the strong pull-down reverts to a weak current source. • For the OKI die, the variable Input characteristic is valid for the WP pin only. The Address pins have a weak internal pull-down for full Input voltage range. For detailed description of the new CAT24C128 and CAT24C256 devices, including package availability and Ordering information please consult the latest data sheet. A detailed characterization report for each product is available upon request. Issue Date: 23-Jun-2011 Rev. 06-Jan-2010 Page 3 of 9 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION #16669 CHANGED PART IDENTIFICATION: While both Gresham and OKI die will be offered under the same OPN, a new package marking will be used for Gresham die, with OKI die marking continuing unchanged. The Gresham die marking reflects the integration of former CSI (Catalyst) into ON Semiconductor, and provides for easier identification of device and die revision, especially for smaller packages with less room for marking. Die origin will also be identified on the packaging box label by the 2-digit wafer fabrication country code of CS: US for Gresham and CS: Japan for OKI. The top package marking format for the new Gresham die versus current marking for the OKI die is shown in the Appendix. List of Affected General Parts: Part Number (OPN) CAT24C128LI-G CAT24C128WI-G CAT24C128WI-GT3 CAT24C128YI-G CAT24C128YI-GT3 CAT24C128ZI-GT3 CAT24C128HU3IGT3 CAT24C128HU4IGT3 CAT24C128LE-G CAT24C128WE-G CAT24C128WE-GT3 CAT24C128YE-G CAT24C128YE-GT3 CAT24C256LI CAT24C256LI-G CAT24C256WI-G CAT24C256WI-GT3 CAT24C256XI CAT24C256XI-T2 CAT24C256YI-G CAT24C256YI-GT3 CAT24C256ZD2IGT2 CAT24C256HU4IGT3 CAT24C256ZI-GT3 CAT24C256LE-G CAT24C256WE-G CAT24C256WE-GT3 CAT24C256XE CAT24C256XE-T2 CAT24C256XA-T2 CAT24C256YE-G CAT24C256YE-GT3 Issue Date: 23-Jun-2011 Samples Availability Now Now Now Now Now Now Now Now Comments NOT Recommended for new designs New OPN/ New Package 7/20/2011 Now Now Now Now N/A Now Now Now Now Now Now Now N/A Now Now NOT Recommended for new designs NOT Recommended for new designs New OPN/ New Package New OPN/ New Package 7/20/2011 Now Now 7/30/2011 7/30/2011 N/A Now Now NOT Recommended for new designs Rev. 06-Jan-2010 Page 4 of 9 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION #16669 Appendix – PART IDENTIFICATION Package Marking – Gresham die versus actual OKI die 1) SOIC -150mil 8pin (W), SOIC – 208mil 8pin (X) Current OKI die CAT24C128 Rev B New Gresham die CAT24C128 Rev C FRONT SIDE MARK: 1-5: Device name(5 char) 6: Production Revision 7: Assembly location 8: Production Year 9: Production Month 10-12: Assembly Lot Number Current OKI die CAT24C256WI-G Rev D Issue Date: 23-Jun-2011 New Gresham die CAT24C256WI-G Rev E Rev. 06-Jan-2010 Page 5 of 9 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION #16669 2) TSSOP- 8pin (Y) Current OKI die CAT24C128YI-G New Gresham die CAT24C128YI-G Rev C Current OKI die CAT24C256YI-G New Gresham die CAT24C256YI-G Rev E Issue Date: 23-Jun-2011 Rev. 06-Jan-2010 Page 6 of 9 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION #16669 3) UDFN 2x3mm (HU3, HU4) Current OKI die CAT24C128HU3I-G New Gresham die CAT24C128HU3I-GT3 1-2: Device code 3: Product rev&package code 4: Assembly location code 5-6: Assembly lot number 7: Production Year 8: Production Month :Pb-free microdot Current Die code 1-2: OKI Device 3: Assembly location code 4-6: Assembly lot number 7: Production Year 8: Production Month Current OKI die CAT24C128HU4I-G New Gresham die CAT24C128HU4I-G NOT EXISTING Current OKI die CAT24C256HU4I-G New Gresham die CAT24C256HU4I-G NOT EXISTING Issue Date: 23-Jun-2011 Rev. 06-Jan-2010 Page 7 of 9 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION #16669 4) PDIP 8LD (L) Current OKI die CAT24C128LI-G New Gresham die CAT24C128LI-G Rev C 1: Assembly location code 2: Leadfinish (NiPdAu) 3: Product Revision 4-10: Device name 11: Temperature range 12: Production Year 13: Production Month 14-17: Assembly lot number Current OKI die CAT24C256LI-G New Gresham die CAT24C256LI-G Rev E 4 D 1 2 4 C 2 4 5 2 3 5 6 L 6 7 8 9 10 11 12 13 14 15 16 17 Issue Date: 23-Jun-2011 Rev. 06-Jan-2010 Page 8 of 9 FINAL PRODUCT/PROCESS CHANGE NOTIFICATION #16669 5) MSOP 8L (Z) Current OKI die CAT24C128ZI-G New Gresham die CAT24C128ZI-G Rev C C 7 1 2 3 4 5 6 7 1-4: Device code 5: Production Year 6: Production Month 7: Product Revision Current OKI die CAT24C256ZI-G New Gresham die CAT24C256ZI-G Rev E C 8 1 2 3 4 5 6 7 NOT EXISTING Issue Date: 23-Jun-2011 Rev. 06-Jan-2010 Page 9 of 9