Guideline for CIS [ Wafer handling] Quality Assurance Guideline for CIS wafer handling 1. Dress code Carbon sealed bunny suit Breath mask Carbon sealed one-piece ESD shielding Latex glove Conductive bunny shoes <10 class> <100 class> [1] Guideline for CIS wafer handling - Glove 入室 者 入室 者 - Head cap [2] Guideline for CIS wafer handling - Mask & Dust free cap - Conductive bunny shoes [3] Guideline for CIS wafer handling 2. Entrance process - ESD Check - Smock Check [4] Guideline for CIS wafer handling - Air shower (1) Head (2) Shoulder (3) Pit (4) Chest (5) Leg (6) Spin [5] Guideline for CIS wafer handling - Washing hands [6] Guideline for CIS wafer handling 3. Regulations of control temperature and humidity Working area Temp.(ºC) Humidity(%) ACT STOP ACT STOP Store room Die room IQA 20~27 18~29 42~68 40~70 10 Class 100 Class 1000 Class 21~27 19~29 42~58 40~60 Packing 17~27 14~30 42~58 40~60 4. Control procedure of sticky mat -Replacement frequency : 3times/day or in case of contamination [7] Frequency 3times/day Guideline for CIS wafer handling 5. Example of wafer scratch and Jig for preventing wafer scratch - Example of wafer scratch Scratch occurred on the 11 o’clock direction and that is caused when take out wafer from Monsanto box [8] Guideline for CIS wafer handling - Reappearance experiment of wafer scratch . Scratch type without Monsanto packing Jig Due to absent of side guide, scratch can be occurred by improper wafer handling as below picture. [Type 1] [Type 2] [Type 3] [9] Guideline for CIS wafer handling . Scratch type without wafer cassette Jig Due to absent of side guide, scratch can be occurred by improper wafer handling as below picture. [Type 1] [Type 2] [ 10 ] Guideline for CIS wafer handling - Scratch prevention JIG concept . Adjust total height higher by using JIG, prevent interference between wafers when take/insert wafer from/to Monsanto box. In case of using scratch prevention Jig, even if ring frame bended, wafer does not contact each other. [ 11 ] Guideline for CIS wafer handling ※ Wafer cassette JIG usage during SK hynix process Photo Process applied Wafer IQA Lamination B/G SAW D/T AVI MONSANTO PACK Wafer scratch prevention JIG when handling wafer in line. BOX PACK [ 12 ] Guideline for CIS wafer handling ※ Monsanto Packing JIG usage during SK hynix process Photo Process applied Wafer IQA Lamination B/G SAW D/T AVI MONSANTO PACK Wafer scratch prevention JIG when packing Monsanto box. [ 13 ] BOX PACK Guideline for CIS wafer handling ※ Guide jig drawing [ 14 ] Guideline for CIS wafer handling [ 15 ] Guideline for CIS wafer handling 6. Wafer Storage Method and Period Guide - Purpose . To keep quality maximum allowable wafer shelf-hold time after vacuum-packing in the good store - Wafer storage period Item Customer shelf-hold time Maximum shelf hold time 6 months ※ shelf hold time : from wafer shipping date in SK Hynix to assembly date in customer site. ※ Vacuum-packing unopened condition. / Un-packed Wafer has to be used within 48hrs. - Wafer storage condition . Humidity and temperature should be maintained below storage condition Wafer Storage Condition Temperature Humidity N2 Flow Rate FGS (Vacuum packing) 17~29℃ 30~70% - N2 Box (Unpacked Vacuum bag) < 28℃ < 40% Min 11.8 ℓ/min(25scfh) [ 16 ]