PL CC6 RGBCT

Hebei I.T. (Shanghai) Co., Ltd.
SMD SPECIFICATION
型号: PL CC6 RGBCT
1、Features/特 征：
 Emitting Color/发光颜色：Red/Green/Blue/红色/绿色/蓝色
 Lens Type/封装特性：Water clear/透明
 Device Outline/外形特征：5.5×5.0×1.6（unit:mm）
 RoHS compliant/符合 RoHS 标准
2、Applications/应 用：
 Backlight for Mobile，Machine Vision， LCD Display/手机、电话、显示屏背光源
 Backlight in Dashboard and switch of Automive/汽车仪表盘、记程器背光源
3、Outline Dimensions/产品外形尺寸 (units:mm) ：
﹢
﹣
﹢
﹢
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﹣
﹣
被推荐的焊盘尺寸
Rev ：D/1
Page 1 of 13
Hebei I.T. (Shanghai) Co., Ltd.
SMD SPECIFICATION
型号: PL CC6 RGBCT
4、Absolute maximum ratings/极限参数（Ta = 25℃）：
Parameter
参数
Color
颜色
Symbol
符号
Test Condition
测试条件
Red
Power Dissipation
损耗功率
Green
Pd
——
Blue
Values 数值
Min.
Max.
——
60
——
85
——
85
Unit
单位
mW
Red
Reverse Voltage
反向电压
Green
VR
IR = 30μA
5
——
V
IFp
Duty=0.1，1kHz
——
100
mA
IFm
——
——
25
mA
Topr
——
-40
+85
℃
Tstr
——
-40
+100
℃
Blue
Red
Pulse Current
正向峰值电流
Green
Blue
Red
Forward Current
正向工作电流
Green
Blue
Red
Operating Temperature
工作温度范围
Green
Blue
Red
Storage Temperature
储存温度范围
Green
Blue
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Rev ：D/1
Page 2 of 13
Hebei I.T. (Shanghai) Co., Ltd.
SMD SPECIFICATION
型号: PL CC6 RGBCT
5、Electrical and optical characteristics/光电参数（Ta = 25℃）：
Parameter
参数
Color
颜色
Symbol
符号
Test Condition
测试条件
Min
Typ
Max
1.8
——
2.5
2.8
——
3.5
Blue
2.8
——
3.5
Red
——
——
30
——
——
30
Blue
——
——
30
Red
619
——
631
515
——
530
465
——
——
631
475
——
——
527
——
Blue
——
468
——
Red
——
20
——
——
30
——
Blue
——
30
——
Red
390
700
——
770
1400
——
200
300
——
——
120
——
Red
Forward Voltage
正向电压
Reverse Current
反向电流
Dominate Wavelength
主波长
Green
Green
Green
VF
IR
λd
IF = 20mA
VR =5V
IF = 20mA
Blue
Red
Peak Wavelength
峰值波长
Spectral Line half-width
半波长宽度
Luminous Intensity
发光强度
Values 数值
Green
Green
Green
λp
Δλ
IV
IF = 20mA
IF = 20mA
IF = 20mA
Blue
Unit
单位
V
μA
nm
nm
nm
mcd
Red
Viewing Angle
发光指向角
Green
2θ1/2
IF = 20mA
Blue
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Rev ：D/1
Page 3 of 13
Deg.
Hebei I.T. (Shanghai) Co., Ltd.
SMD SPECIFICATION
型号: PL CC6 RGBCT
Bin range of luminous intensity/发光强度档位
Bin code/档位
Iv（mcd）
Bin code/档位
Iv（mcd）
Bin code/档位
Iv（mcd）
N1
200-235
Q2
465-550
T1
1100-1290
N2
235-280
R1
550-650
T2
1290-1520
P1
280-330
R2
650-770
U1
1520-1800
P2
330-390
S1
770-920
Q1
390-465
S2
920-1100
Bin range of Forward Voltage /电压档位
Bin code/档位
Vf（v）
Bin code/档位
Vf（v）
Bin code/档位
Vf（v）
C
1.8-1.9
H
2.3-2.4
S
3.2-3.3
D
1.9-2.0
J
2.4-2.5
T
3.3-3.4
E
2.0-2.1
P
2.9-3.0
U
3.4-3.5
F
2.1-2.2
Q
3.0-3.1
G
2.2-2.3
R
3.1-3.2
Bin range of Dominate Wavelength /主波长档位
Bin code/档位
Red（nm）
Bin code/档位 Green（nm） Bin code/档位
Blue（nm）
R1
619～622
G1
520～522.5
B1
465～467.5
R2
622～625
G2
522.5～525
B2
467.5～470
R3
625~628
G3
525～527.5
B3
470～472.5
R4
628~631
G4
527.5～530
B4
472.5～475
G5
515～517.5
G6
517.5～520
Notes/备注：Tolerance/测试误差： VF：±0.10V，Iv：±15%，λd：±1nm
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Rev ：D/1
Page 4 of 13
Hebei I.T. (Shanghai) Co., Ltd.
SMD SPECIFICATION
型号: PL CC6 RGBCT
6、Typical electrical/optical characteristic curves/光电特性曲线：
Fig.1 正向电流 Vs. 正向电压
Fig.2 相对亮度 Vs. 正向电流
2.5
Luminous Intensity
Relative Value at IF=20mA
Forward Current(mA)
50
40
B
30
G
R
20
10
0
1.2
2.0 2.4 2.8 3.2
Forward Voltage(V)
1.6
Relative Luminous Intensity
Forward Current(mA)
40
30
R/G/B
10
0
20
40
60
80
R/G/B
1.0
0.5
0
10
20
30
40
IF-Forward Current (mA)
2.5
2.0
1.5
R/G/B
1.0
0.5
0
-40
100
-20
0
20
40
60
Ambient Temperature TA (℃)
Ambient Temperature TA (℃)
Fig.5 相对亮度 Vs. 波长
80 90
SPATIAL DISTRIBUTION
100
B
G
R
75
/相对亮度
Relative Luminous Intensity
50
Fig.4 相对亮度 Vs. 环境温度
50
0
1.5
0
3.6
Fig.3 正向电流 Vs. 环境温度
20
2.0
1.0
50
0.9
0.8
25
0.7
0
400
450
500
550
600
650
0.5
0.3
0.1 0
0.2
0.4
Wavelength λ(nm)/波长
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Rev ：D/1
Page 5 of 13
0.6
Hebei I.T. (Shanghai) Co., Ltd.
SMD SPECIFICATION
型号: PL CC6 RGBCT
7、Relibility Analysis/可靠性试验
7.1 Test Items And Results/测试项目和判据
Q’ty/
数量
Time/
时间
Standard/判定
20
2times
ALL PASS
20
1times
Over 95%
ALL PASS
GB/T 4937，
Ⅲ，1
20
50cycles
ALL PASS
25℃/12hr~ 55℃/12hr
95%RH
GB/T 4937，
Ⅲ，4
20
6cycles
ALL PASS
High Temperature
Storage /高温储存
Ta=100℃
GB/T 4937，
Ⅲ，2
20
1000hrs
ALL PASS
6
Low Temperature
Storage /低温储存
Ta=-40℃
GB/T 4937，
Ⅲ，2
20
1000hrs
ALL PASS
7
Steady State perating
Life /电耐久性
GB/T
18904.3
Part A
20
1000hrs
Iv decay <30%
No.
Item/项目
Test Condition/测试条件
1
IR Reflow (Reflow
Soldering) /回流焊接
Tsld=260℃，10sec
2
Solder ability/可焊性
Tsld=235±5℃，3sec
3
Temperature Cycle/
高低温循环
-40℃—— 100℃
30min ~ 30min
The cut is not more than 1 min
4
Moisture Resistance
Cyclic /湿热循环
5
Spec. /
引用标准
GB/T 4937，
Ⅱ，2.2
IF=20mA Ta=25℃
7.2 Criteria For Judging Damage/判断标准
Symbol/
符号
Test conditions
/测试条件
Luminous Intensity/亮度
Iv
Forward Voltage/正向电压
Reverse current/反向电流
Item/项目
Criteria for Judgement
/判断标准
Min./最小值
Max./最大值
IF=20mA
L.S.L *0.7
/
VF
IF=20mA
/
U.S.L*1.1
IR
VR=5v
/
U.S.L*2
*U.S.L.：Upper Standard Level / 上限
*L.S.L.：Lower Standard Level / 下限
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Rev ：D/1
Page 6 of 13
Hebei I.T. (Shanghai) Co., Ltd.
SMD SPECIFICATION
型号: PL CC6 RGBCT
8、Specification of Packing /包装规格
8.1 Taping and Orientation/编带和方向
Quantity/数量：1000 units/reel
Diameter/直径：178 mm
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Rev ：D/1
Page 7 of 13
Hebei I.T. (Shanghai) Co., Ltd.
SMD SPECIFICATION
型号: PL CC6 RGBCT
8.2 Specification of Packing/包装规格
Diameter/直径 ： 178 mm
Width/宽度 ： 17 mm
=>1000 pcs / Reel
(Anti-Static Shielding/抗静电保护袋)
Thickness/厚度： T=0.1 mm
=> 1 Reel / Bag
4 Bags / Box
195mm
=>4,000 pcs / Box
85mm
195mm
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Rev ：D/1
Page 8 of 13
Hebei I.T. (Shanghai) Co., Ltd.
SMD SPECIFICATION
型号: PL CC6 RGBCT
8.3 Label Form Specification/标签格式规范
P/N：
Rank：
Qty：
Date：
Lot No：
/
/
pcs QC：
P/N: Customer's Production Number/产品编号
Ranks：Iv / Vf / WD
Iv：Iv Rank/亮度；Vf：Vf Rank/电压；WD：Color Group/色系
Qty: Packing Quantity/包装数量
QC： Quality Control chapter/质量控制章
Date： mm / dd / yy
mm：Month/月；dd：Date/日；yy：Year/年；
Lot No：Production batch Number/生产批号
9、Notes/注意
9.1 Moisture Proof Packaging/防潮包装
9.1.1 LEDs need to package in moisture proof bag. When moisture is absorbed into the SMT
package it may vaporize and expand during soldering. There is a possibility that this can cause
exfoliation of the contacts and damage to the optical characteristics of the LEDs. For this reason,
the moisture proof bag is used to keep moisture to a minimum in the bag.
产品必须包封装在防潮包装袋中。当湿气进入防潮包装袋的时候，在焊接时，湿气会
受热汽化膨胀，从而可能影响产品的光学特性，甚至造成封装胶体的开裂剥离。因此，防
潮袋要求放置在保持低湿度的盒中。
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Rev ：D/1
Page 9 of 13
Hebei I.T. (Shanghai) Co., Ltd.
SMD SPECIFICATION
型号: PL CC6 RGBCT
9.1.2 Moisture proof function is inactive. The moisture proof bag is made of an aluminum
moisture proof bag. A package of a moisture absorbent material (silica gel) is inserted into the
aluminum moisture proof bag. The silica gel turns the smashing from the transparent circular
spherical pellet.
防潮的作用是缓慢的。防潮袋使用铝防潮袋，并在铝防潮袋中放入潮气吸收材料（硅
胶干燥剂）。当硅胶干燥剂吸收潮气后，硅胶干燥剂从透明圆形球状颗粒变成粉碎物。
9.2 Storage Method/储存方式
9.2.1 Before opening the bag: The LEDs should be used within a year and kept at 30℃ or less and
60%RH or less. The moisture proof bag with absorbent material is needed when storing the
LEDs.
拆开包装袋之前：产品可以储存一年，但要求放置在温度低于30℃,湿度低于60%的环
境中；当存放产品时，必须放置在带有干燥剂的防潮容器中。
9.2.2 After opening the bag: The LEDs should be soldered within 24 hours after opening the
package. If unused LEDs remain, they should be stored in moisture proof bags with moisture
absorbent material. It recommended that the user use the LEDs as soon as possible. If the
LEDs have exceeded the storage time or the moisture absorbent material has faded away. Baking
process should be performed by using more than 24hours baking at 60±5℃ before using LEDs.
拆开包装袋之后：产品应该在拆封后的24小时内焊接完毕；如果没用完，产品应该储
存在带有干燥剂的防潮包装袋中；建议客户尽快的使用完产品；如果产品超出了使用期限
或者干燥剂失效，那么产品在使用前必须在60±5℃中烘烤至少24小时。
√正确
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Rev ：D/1
Page 10 of 13
Hebei I.T. (Shanghai) Co., Ltd.
SMD SPECIFICATION
型号: PL CC6 RGBCT
9.3 Heat Generation/产品热量的产生
Thermal design of the end applications are of paramount importance. Please consider the
heat generation of the LED when making the system design. It is necessary to avoid intense heat
generation and operate within the maximum ratings given in this specification.
应用产品的热学设计是至关重要的。在做系统设计时，请考虑LED的散热，避免热量
的积累，必须严格的在允许的温度范围内使用。
9.4 Soldering/焊接
9.4.1 Lead Solder/回流焊接
9.4.2 Lead – Free Solder/无铅回流焊接
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Rev ：D/1
Page 11 of 13
Hebei I.T. (Shanghai) Co., Ltd.
SMD SPECIFICATION
型号: PL CC6 RGBCT
9.4.3 Notes for reflow soldering/回流焊注意事项:
1. Baking process should be performed by using more than 24hours baking at 60±5℃
before using LEDs./ 在使用前LED必须在60±5℃中烘烤至少24小时。
2. Please choose the right nozzle to avoid the damage to products due to the pressure./请
选择合适的吸嘴大小和压力，以避免对产品产生不良隐患。
3. No more than twice for reflow soldering./回流焊不可超过两次。
9.4.4 Hand Soldering（Not Recommended）/手工焊接（不推荐）
Soldering iron/烙铁焊接：300 degrees C max/不超过300℃；3 seconds max/不超过3s；
once/允许1次.
9.5 Cleaning/清洗
It is recommended that isopropyl alcohol be used as a solvent for cleaning the LEDs. It
should be confirmed beforehand whether the solvents will dissolve the package the resin or not
when using other solvents. Before cleaning, a pre-test should be done to confirm whether any
damage to the LEDs will occur. Please do not clean the LEDs by the ultrasonic.
建议使用酒精作为溶剂清洗LED。若要使用其他溶剂，应该预先证实是否能溶化封装
料。在清洗作业前，必须预先实验确认对LEDS无任何的伤害。请不要使用超声波清洗LED。
9.6 Static Electricity/静电
It is recommended that a wrist band or an anti-electrostatic glove be used when handling the
LEDs. All devices, equipment and machinery must be properly grounded. It is recommended that
precautions be taken against surge voltage to the equipment that mounts the LEDs.
在接触LED时，建议使用防静电手腕带或防静电手套。所有的器件、设备和机器必须
有可靠的接地。对所有LED接触的设备，建议采取预防措施消除冲击电压。
9.7 Others/其他
1. The LED light output is strong enough to injure human eyes. Precautions must be taken
to prevent looking directly at the LEDs with unaided eyes for more than a few seconds.
LED的光辐射足够强时，会对人眼造成伤害。若眼睛要直接看LED，并且要一定的时
间，则必须采取相应防护措施。
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Page 12 of 13
Hebei I.T. (Shanghai) Co., Ltd.
SMD SPECIFICATION
型号: PL CC6 RGBCT
2. LED operating environment and sulfur element composition cannot be over 100PPM in
the LED mating usage material.
LED工作环境及与LED适配的材料中硫元素及化合物成份不可超过100PPM。
3. Not suitable to operate in acidic environment, PH<7
LED不可用在PH<7的酸性环境。
4. When we need to use external glue for LED application products, please make sure that
the external gluematches the LED packaging glue. Additionally ,as most of LED packaging glue
is silica gel, and it has strong Oxygen permeability as well as strong moisture permeability; in
order to prevent external material from getting into the inside of LED, which may cause the
malfunction of LED, the single content of Bromine element is required to be less than
900PPM,the single content of Chlorine element is required to be less than 900PPM,the total
content of Bromine element and Chlorine element in the external glue of the application products
is required to be less than 1500PPM.
在使用外封胶涂抹LED产品时，应确保外封胶与LED封装胶水相匹配，因为大多数LED
的封装胶水为硅胶，它有较强的氧化性和较强的吸湿性，必须防止外封材质进入LED内部
以造成LED的损伤，单一的溴元素含量要求小于900PPM，单一氯元素含量要求小于
900PPM，在涂抹LED产品时要求外封胶溴元素与氯元素总含量必须小于1500PPM。
5. To ensure the quality of our LEDs, So please do not put pressure on the LEDs.
为确保LED的可靠性，在操作过程中不可施加压力在LED器件胶体表面。
√正确
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X 错误
Rev ：D/1
Page 13 of 13