LCC Series - HolyStone International

LCC Series - Large Size Multilayer Ceramic Chip Capacitors
Holy Stone
Multilayer Ceramic Chip Capacitors
[ Large Size Ceramic Chip Capacitors ]
LCC Series
Features
Applications
Voltage Multipliers
Power Supplies
DC-DC Converters
Surge protection
Industrial control circuits
Isolation
Ballast
Snubber
Custom applications
Optimized internal designs offers the highest
voltage rating (up to 8KVdc)
Capacitance range from 100pF to 47uF and sizes
from 1515 to 3640
Available with proprietary surface coating for arc
prevention
Available with flexible termination (Super Term) to
minimize the effects of mechanical stress
RoHS compliant
Summary of Specifications
℃ ~ +125 ℃
Operation Temperature
-55
Rated Voltage
50Vdc to 8KVdc
Temperature Coefficient
NP0 : ≤
Capacitance Range
NP0 : 100pF to 220nF , X7R : 1000pF to 47uF
Dissipation Factor
NP0 : Q 1000 , X7R : D.F.
Insulation Resistance
10G
Aging
NP0 : 0% , X7R : 2.5 % per decade of time
Dielectric Strength
V ≤ 500V
: 200% Rated Voltage
500V ≤ V < 1000V
: 150% Rated Voltage
V ≥1000V
: 120% Rated Voltage
± 30ppm/ ℃
X7R : ≤ ± 15%
℃ (EIA Class Ι)
-55~+125 ℃ (EIA Class Ⅱ )
, -55~+125
,
≧
≦2.5%
Ω or 500/CΩ whichever is smaller (C in Farad )
How To Order
CC
Product
Code
C: MLCC
(Multilayer
Ceramic
Chip of
Capacitor)
2520
2520
XX
Chip Size
Dielectric
EX.:
1515
2520
3530
3640
Ex.:
N : NP0
X : X7R
103
103
Capacitance
Unit : pF
Ex.:
100 : 10×100
471 : 47×101
102 : 10×102
KK
102
102
Tolerance
Ex.:
J : +/- 5%
K : +/-10%
M : +/-20%
Rated
Voltage
Ex.:
050:50Vdc
251:250Vdc
631:630Vdc
102:1000Vdc
TT
Packaging
Ex.:
T : T&R
W : Waffle
B : Bulk
NN
SS
XX
Termination Testing
Special
Requirement Requirement
EX:
Ex.:
Ex.:
N:
S:
O: Arc
Ni Barrier/Sn Standard
Prevention
Plate
Electrical
Coating
P: Pd/Ag
H:
X: Cushion
Hi-Reliability Termination
(Super Term)
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LCC Series - Large Size Multilayer Ceramic Chip Capacitors
Holy Stone
Dimensions
BW
TYPE
B
L
±
6.35±0.50
[.25±.020]
8.90±0.50
[.35±.020]
9.20±0.50
[.36±.020]
3.80 0.50
1515
T
[.15±.020]
2520
3530
W
3640
L
W
T (max)
3.80 0.50
[.15 ±.020]
[.126]
±
5.00±0.50
[.20±.020]
7.60±0.50
[.30±.020]
10.2±0.50
[.40±.020]
Unit : mm [inches]
B (min)
BW (min)
3.20
1.60
[.059]
0.30
[.012]
3.20
4.00
0.30
[.126]
[.157]
[.012]
5.00
5.50
0.30
[.200]
[.217]
[.012]
5.00
6.00
[.200]
[.236]
0.30
[.012]
Capacitance Range
size
1515
2520
3530
3640
Dieletric
50V
100V
250V
NP0
473
393
333
X7R
395
275
225
X7R
475
335
475
NP0
823
683
563
X7R
226
106
475
X7R
396
276
685
NP0
224
184
104
X7R
336
226
685
X7R
476
396
106
NP0
224
184
104
X7R
336
396
725
X7R
476
526
156
Capacitance (pF) maximum
500V
1KV
2KV
3KV
103
474
222
104
473
103
125
274
823
473
225
474
823
473
275
524
821
471
333
103
473
223
392
222
823
183
224
393
103
472
154
333
334
104
123
562
184
393
394
154
4KV
5KV
8KV
221
680
一
472
222
102
102
471
101
123
562
182
332
102
251
223
103
392
392
122
561
273
183
472
Under development, please contact Holy Stone
All values are capacitance EIA codes.
Other dimensions, capacitance values and voltages rating are available. Please contact Holy Stone.
Soldering And Handling Precautions:
Large ceramic capacitors are more prone to thermal and mechanical cracks. To minimize mechanical cracks, capacitors have to be
handled carefully in the original waffle pack container, carrier tape or other suitable container. Care must be taken that these capacitors
do not come into contact with each other which can cause chip outs, cracks or other mechanical damage.
The recommended method for soldering large chips is reflow soldering. Wave soldering and manual soldering with Iron is not
recommended. Ceramic capacitors must be preheated with less than 2ºC/second rate to about 50ºC below the reflow temperature. Any
sudden increase or decrease in temperature more than the recommended rate, during soldering, may cause internal thermal cracks.
Options:
• HEC offers polymer termination (Super Term) for very large chips to minimize mechanical cracks due to board flexing.
• To minimize the potential for surface arcing in higher voltage applications, HEC offers the option of a proprietary surface coating.
• Pd/Ag termination is also offered as a standard option for Hybrid circuits and other applications.
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