Holy Stone Enterprise Co., Ltd. CERAMIC CAPACITOR CATALOGUE 2010/11 www.holystone.com.tw www.holystonecaps.com Introduction The Company Holy Stone Enterprise Company Ltd (Holy Stone) was established in June of 1981 as an agent and distributor of electronic components. In 1994, with technology and cooperation from a Japanese partner, Holy Stone began manufacturing multi-layer ceramic capacitors. Today, Holy Stone is recognized as an industry leader in application specific ceramic capacitors. Holy Stone integrates active and passive component distribution with significant manufacturing capabilities. Holy Stone’s unique business model combines the service and inventory management strengths of a broad line distributor with the technical knowledge and world class pricing of a manufacturer. Holy Stone was founded by five engineers in 1981. Since this point, Holy Stone has maintained a focus and commitment to providing customers with innovative products and exceptional service. The result of that unwavering commitment is evident in Holy Stone’s phenomenal growth (2009 revenues of US$412 million). Holy Stone also maintains a high profile on the Taiwan Stock Exchange, ranked in the top 100 companies and the leader among its peers. Manufacturing Facilities Holy Stone capacitors Are produced in a modern 40,000 square meter factory located in Lungtan, Taiwan. In addition to the Lungtan factory, Holy Stone has facilities in Dongguan and Wujiang China. The advanced materials research laboratory is located in Japan. The factory operating systems are certified to ISO-9001and ISO-14001. Sales and Support Locations Holy Stone administrative headquarters are located in Taipei, Taiwan. Holy Stone maintains sales and support offices in Kaohsiung Taiwan, Dongguan China and Shanghai China. Holy Stone Enterprise Company Ltd has subsidiary companies in North America and in Europe. Holy Stone International, located in Murrieta, California, U.S.A. is responsible for sales and technical support in the Americas. Holy Stone (Europe) Ltd, located in Norwich, England is responsible for sales and technical service for Europe. Holy Stone opened its Singapore office to service southeast Asia. Holy Stone also has a network of independent representatives, distributors and agents throughout the world. The Environment Holy Stone is committed to achieving and maintaining a healthy environment. Holy Stone is also among the first suppliers of halogen free epoxy coated capacitors. The factory is Certified to ISO-14001 and all standard products are designed and produced conforming to full RoHS compliance. Our Employees Holy Stone’s success is measured by the satisfaction of our customers and share holders. Achieving that satisfaction is the result of the sum contribution of our employees. Those contributions come from all of our employees, whether they are engaged in administrative functions, manufacturing our goods or servicing our customers. Holy Stone strives to maintain a work environment that stimulates creativity, encourages enthusiasm and rewards results. Contents CONTENTS Component Quick Reference ------------------------------------------ 2 Capacitor Availability Guide --------------------------------------------- 3-4 Products Series ----------------------------------------------------------- 5-34 Technical Specifications -------------------------------------------------- 35-41 Packing Information ------------------------------------------------------ 42-44 EIA Designations ------------------------------------------------------------ 45 Precautionary Information ---------------------------------------------- 46-49 Reducing Short Circuit Risks –Super Term ----------------------- 50-51 Coated Products for Surface Arc Prevention --------------------- 52-53 ROHS Compliant ----------------------------------------------------------- 54 ISO Certifications ---------------------------------------------------------- 55 -1- Component Quick Reference Product Series Application Page HVC series -High Voltage Capacitors For Power Circuits (Backlight Inverter, DC to DC,…) 5-8 SCC series -Safety Capacitors For Isolation and Protection Circuits (UL,EN132400 Class X2/Y3,X1/Y2) 9-11 TCX series -Trigger Capacitors For DSC Strobe Circuits 12-13 LDC series -Low Distortion Capacitors For Oscillation and Filter Circuits 14-15 NCC series -Normal Chip Capacitors For Decoupling Circuits 16-17 HCC series -High Capacitance MLCC-More than 1uF For Smoothing (DC to DC) and Decoupling Circuits 18-19 HCN series -High Capacitance NP0 For ADSL/XDSL (Replacement for Film Capacitor) 20-21 HCX series -High Capacitance X7R For Input, Output Filters (DC to DC) 22-23 SAC series -Tip & Ring Capacitors For telephone line ringer circuits 24-25 HBC series -Low-Loss High Frequency Snubber Capacitors For High Frequency Lighting Ballasts 26-27 HTC series -X8R rated to +150°C For high temperature applications 28-29 LCC series -Large Size MLCC Capacitors 1515 to 7565 For Voltage Multipliers, Power circuit (DC-DC, Ballast, Snubber), Surge protection, Industrial control, … 30-31 SMC series -Stacked MLCC Capacitors For Power Circuits (Backlight Inverter, DC to DC, Surge protection …) 32-34 -2- Capacitance Availability Guide – Standard MLCC Vdc 6.3v 10V 16V 25V 35V 50V 100V 200V 250V 500V 630V 1KV 2KV 3KV 4KV 5KV NP0 X7R X5R NP0 X7R X5R NP0 X7R X5R NP0 X7R X5R NP0 X7R X5R NP0 X7R X5R NP0 X7R X5R NP0 X7R X5R NP0 X7R X5R NP0 X7R X5R NP0 X7R X5R NP0 X7R X5R NP0 X7R X5R NP0 X7R X5R NP0 X7R X5R NP0 X7R X5R 0201 0402 0603 0805 1206 1210 100nF 1uF 2.2uF 10uF 4.7uF 22uF 47uF 100uF 2.2F 4.7uF 3.3nF 2.2uF 2.2uF 3.3nF 1uF 1uF 4.7uF 10uF 10nF 2.2uF 10uF 10nF 1uF 4.7uF 10uF 22uF 27nF 4.7uF 22uF 10nF 2.2uF 10uF 10uF 22uF 47nF 22uF 22uF 22nF 10uF 10uF 470nF 4.7uF 10uF 22nF 2.2uF 2.2uF 47nF 4.7uF 4.7uF 10uF 82nF 6.8uF 10nF 2.2uF 18nF 2.2uF 56nF 2.2uF 56nF 4.7uF 68nF 4.7uF 100nF 1uF 100nF 100nF 10nF 100nF 470pF 10nF 1808 1812 1825 2220 2225 120nF 47nF 3.3nF 100nF 10nF 330nF 270pF 18nF 1.2nF 100nF 1uF 1uF 10nF 1uF 1uF 6.8nF 470nF 270pF 1.2nF 47nF 5.6nF 100nF 8.2nF 470nF 12nF 1uF 47nF 1.5uF 47nF 2.2uF 56nF 2.2uF 270pF 1.2nF 47nF 5.6nF 100nF 8.2nF 470nF 12nF 1uF 47nF 1.5uF 47nF 2.2uF 56nF 2.2uF 680pF 22nF 2.2nF 56nF 3.9nF 100nF 1.8nF 39nF 8.2nF 220nF 39nF 270nF 39nF 470nF 47nF 470nF 2.2nF 33nF 3.9nF 1.8nF 8.2nF 27nF 27nF 33nF 1nF 10nF 1nF 27nF 1.2nF 15nF 6.8nF 47nF 12nF 100nF 12nF 100nF 15nF 100nF 390pF 1.5nF 2.7nF 680pF 3.3nF 1.2nF 10nF 18nF 18nF 18nF 1nF 1.8nF 1.2nF 2.7nF 1nF 39pF 10uF 1.2nF 1nF 27pF -3- 150pF Capacitance Availability Guide – 250Vac Safety Capacitors SMD Capacitors 1808 Vdc X2/Y3 X1/Y2 X2 250Vrms NP0 2.2pF-1nF 250Vrms X7R 150pF-2.2nF 250Vrms NP0 2.2pF-150pF 250Vrms X7R 150pF-1nF 250Vrms NP0 250Vrms X7R 1812 2208 2211 2220 2.2pF-330pF 2.2pF-680pF 2.2pF-1.2nF 36pF-1nF 68pF-2.7nF 130pF-4.7nF 2825 1nF-4.7nF 130pF-1nF 150pF-10nF Also available as Lead (Pb) free -4- 47nF-56nF HVC Series - High Voltage Capacitors HVC Series High Voltage NP0 and X7R Capacitors Up to 5KV Holy Stone high voltage products are designed and manufactured to meet the general requirements of international standards. This product offering is well suited for commercial and industrial applications and includes NP0 (C0G) and X7R characteristics in sizes 0603 to 2225 and with working voltages up to 5KV. Features Applications. Special internal electrode design offer Suitable for LAN/WLAN interface, the highest voltage rating. Surface mount suited for solder wave and reflow soldering. High reliability. RoHS compliant. Back-Lighting Inverter, DC-DC Converters, Ballast, Modems & Power Supplies. Summary of Specifications -55~+125 ℃ Operating Temperature Rated Voltage 100Vdc to 5000Vdc NP0 : ≤ ± 30ppm/ ℃ , -55~+125 ℃ (EIA Class Ι ) Temperature Coefficient X7R : ≤ ± 15% Dissipation Factor NP0: Q≧1000 ; X7R : D.F.≦2.5% Insulation Resistance 10GΩ or 500/C Ω whichever is smaller Ageing NP0:0% ; X7R: Typically 1.0% per decade of time , -55~+125 ℃ (EIA Class Ⅱ ) 100V ≦ V ＜ 500V : 200% Rated Voltage 1000V≦ V : 120% Rated Voltage 500V ≦ V ＜ 1000V : 150% Rated Voltage Dielectric Strength How To Order C 1210 X Product Code Chip Size Dielectric C : MLCC Multilayer Ceramic Capacitor EX. : 0603 0805 1206 1210 1808 1812 2220 2225 Ex. : N : NP0 X : X7R 103 K Capacitance Unit : pF Ex. : 2R0 : 2.0pF 100 : 10×100 471 : 47×101 102 : 10×102 Tolerance Ex. : C : +/-0.25pF D : +/-0.50pF J : +/- 5% K : +/-10% M : +/-20% -5- 102 Rated Voltage Ex. : 101 : 100Vdc 251 : 250Vdc 501 : 500Vdc 631 : 630Vdc 102 : 1000Vdc 202 : 2000Vdc 302 : 3000Vdc 402 : 4000Vdc 502 : 5000Vdc T Packaging T : Tape & Reel B : Bulk X Special Requirement Ex. : O : Arc Prevention Coating X : Polymer Termination (Super Term) HVC Series - High Voltage Capacitors Unit : mm [inches] Dimensions TYPE BW B T W L L 1.60±0.1 W 0.80±0.1 0603 [.063±.004] [.031 ±.004] 0805 2.00±0.20 1.25±0.20 1206 3.20±0.30 1.60±0.20 1210 3.20±0.30 2.50±0.20 1808 4.60±0.30 2.00±0.20 1812 4.60±0.30 3.20±0.30 1825 [.181±.012] 4.6±0.30 6.35±0.40 2220 [.220±.016] 5.7±0.40 5.00±0.40 2225 [.220±.016] 5.7±0.40 6.35±0.40 [.079±.008] T (max) 0.90 B (min) 0.40 1.45 0.70 [.039] [.049±.008] [.126±.012] [.057] [.059] 2.60 1.60 [.102] [.063] 2.20 [.079±.008] [.181±.012] 1.50 [.071] [.098±.008] [.181±.012] [.028] 1.80 [.063±.008] [.126±.012] [.016] 2.50 [.087] [.098] 3.00 [.126±.012] 2.50 [.118] [.098] 3.00 [.250±.016] 2.50 [.118] [.098] 3.00 [.197±.016] 3.50 [.118] [.137] 3.00 [.250±.016] 3.50 [.118] [.137] BW (min) 0.15 [.006] 0.20 [.008] 0.30 [.012] 0.30 [.012] 0.30 [.012] 0.30 [.012] 0.30 [.012] 0.30 [.012] 0.30 [.012] Capacitance Range – NP0 100Vdc to 1KVdc Size 0603 0805 1206 1210 NP0 1808 1812 2220 1825 Rated Voltage 50V 100V 200V 250V 100V 200V 250V 500V 100V 200V 250V 500V 630V 1KV 100V 200V 250V 500V 630V 1KV 500V 630V 1KV 100V 200V 250V 500V 630V 1KV 100V 200V 250V 500V 630V 1KV 100V 200V 250V 500V 630V 1KV Capacitance Range (pF) 2R0 3R3 3R9 5R0 8R2 100 120 150 180 220 270 330 390 470 560 680 820 101 121 151 181 221 271 331 391 471 561 681 821 102 122 152 182 222 272 332 392 472 562 682 822 103 123 153 183 223 273 333 393 473 563 683 Temperature Characteristic B B B B B B C B B B B B B C B B B B B B C B B B B B B C B B B B B B C B B B B B B C B B B B B B C B B B B B B C B B B B B B C B B B B B B C B B B B B B C B B B B B B C B B B B B B C B B B B B B C B B B B B B B C B B B B B B B C B B B B B B B C B B B B B B B C B B B B B B B C B B B B B B B C B B B B B B B C B B B B B B B C B B B B B B B C B B B B B B B B C B B B C B B B C B B B C CCCD CCCD CCCD C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/D B/D B/D D/E D/E D/E D/E D/E D/E D/E D/E D/E B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/D B/D B/D D/E D/E D/E D/E D/E D/E D/E D/E D/E E E C C C C C C C C C C C C C C C C C C D D D D/E D/E D/E D/E D/E C C C C C C C C C C C C C C C C C C D D D D/E D/E D/E D/E D/E DDDDDDDDDDDDDDE E E E E E E E E E E B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C CCCC CCCC CCCC DD DDDDDDDDDDDDDDDDD C C C D D C C C D E C C C D E C C C D E C C C D E CD CCCCCCCCD CCCCCCCDD CCCCCCCDD D D/E D/E D/E D/E D/E D/E D/E E E E E E E E E E D D D D D D E E D D/E D/E D/E D/E D/E E E D D/E D/E D/E D/E D/E E E E F F F E F F F E E DDDDDDDDDDDDDDDDDDE E E E E E E E E E E E F D D D D D D D D D D D D D D D D D D D/E D/E D/E D/E D/E E E E DDDDDDDDDDDDDDE E F F E/F E/F E/F F F/G F/G G DDDDDDDDDDDE DDDDDDDDDDDE E D D D D D D D D D D D D/E E F DE E E F F GG Consult HEC for thickness information -6- HVC Series - High Voltage Capacitors Capacitance Range – NP0 100Vdc to 1KVdc cont. NP0 Size Rated Voltage 2225 100V 200V 250V 500V 630V 1KV Capacitance Range (pF) 2R0 3R3 3R9 5R0 8R2 100 120 150 180 220 270 330 390 470 560 680 820 101 121 151 181 221 271 331 391 471 561 681 821 102 122 152 182 222 272 332 392 472 562 682 822 103 123 153 183 223 273 333 393 473 563 683 Temperature Characteristic DDD Capacitance Range – X7R 100Vdc to 1KVdc Size 0603 0805 1206 1210 X7R 1808 1812 2220 1825 2225 Rated Voltage 100V 100V 200V 250V 500V 1KV 100V 200V 250V 500V 630V 1KV 100V 200V 250V 500V 1KV 500V 1KV 100V 200V 250V 500V 1KV 200V 250V 500V 1KV 200V 250V 500V 1KV 200V 250V 500V 1KV Capacitance Range (pF) 151 181 221 271 331 391 471 561 681 821 102 122 152 182 222 272 332 392 472 562 682 822 103 123 153 183 223 273 333 393 473 563 683 823 104 124 154 184 224 274 334 394 474 564 684 824 105 155 225 Temperature Characteristic B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C D D D D B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C D D D D B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C C C C C C C C C C C C C C C B/C B/C B/C B/C B/C B/C B/C C C C C C C C C C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C CCCDE E E B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C C/D D/E D/E D/E B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C B/C C/D D/E D/E D/E CCCCCCCCCCCCCCCCCCCCCC DDDDDDDDDDDDDDDDDDDDD DDDDDDDDDDDDDDDDDDDDD C C C D D DDDDDDDD DDDDE E E F DDDDDDDDDDDDDDDDDDDDD DDDDDDDDDDDDDDDDDDDDD DDDDDDDDDDDDDDDDDDDDD DDDDDDDDDDDDDDDDDDDDD DDDDDDDDDDDDDDDDDDE E E E D D D D CCCCCCCCD DDDDE E C C C D D D F D D D D E E D D D D C C C D D D F D D D D E E D D D D C C C D D D C C C D D D D D D D E D D D D D/E D/E D/E D/E D/E D/E D/E D/E D/E D/E D/E D/E E D D D D D/E D/E D/E D/E D/E D/E D/E D/E D/E D/E D/E D/E E D D D D D/E D/E D/E D/E D/E D/E D/E D/E D/E D/E D/E D/E E D D D D E E E E E F F/G H H F F/G F/G F/G F/G DDDDDDDDD DDDDDDDDD E E E E E F GGH E E E/F F F G G H H DDDDDDDDDDDDDDDDE DDDDDDDDDDDDDDDDE DDDDDDDE E E E F F F F F F F F DDDDDDDDDDDDD DDDDDDDDDDDDD E E E E E E E E E F F E E E E E E D D D E C C C D E D C C C E C C C E C C C E C C C F C C C F C C C F CCCCCCCCCDE E F GG DDDDDE E E F DDDDDE E E F F DD E E E E F G E E F G E E F G DDE E F H DDE E F H E E E E E E E E DDDDEG DDDDEG Consult HEC for thickness information Thickness Specification Symbol Code Thickness(mm) S O 0.3±0.03 0.5±0.05 A 0.6±0.1 B 0.85±0.1 C D E 1.0±0.1 1.25±0.15 1.6±0.2 F 2.0±0.2 G 2.4±0.2 H 2.8±0.2 Other dimensions, capacitance values and voltage ratings are available on request. Please contact your local HEC office. -7- HVC Series - High Voltage Capacitors Capacitance Range 2KV Rated Voltage NP0 1206 1808 1812 2KV 2KV 2KV Temperature Characteristic Size Rated Voltage X7R 1206 1210 1808 1812 1825 2220 2225 2KV 2KV 2KV 2KV 2KV 2KV 2KV Capacitance Range (pF) 2R0 3R3 3R9 5R0 8R2 100 120 150 180 220 270 330 390 470 560 680 820 101 121 151 181 221 271 331 391 471 561 681 821 102 122 152 182 222 272 Size D D D D D D D D D D D D D D D/E D/E D/E E E E D D D D D D D D D D D D D D D D D D E/F E/F E/F E/F E/F E/F D D D D D D D E E F F F F F F F F Capacitance Range (pF) 151 181 221 271 331 391 471 561 681 821 102 122 152 182 222 272 332 392 472 562 682 822 103 123 153 183 223 273 333 393 473 563 683 823 104 Temperature Characteristic D D D D D D D D D D D D D D D D D D D D D D D D D D D D D D D/E E E D D E E E F G D D D D D E F F D D D D E E F F F F F F G H E E E E F F F D D D D D D E E F F F F F E/F E/F Thickness Specification Symbol Code Thickness(mm) S O 0.3±0.03 0.5±0.05 A 0.6±0.1 B 0.85±0.1 C D E 1.0±0.1 1.25±0.15 1.6±0.2 F 2.0±0.2 G 2.4±0.2 H 2.8±0.2 Other dimensions, capacitance values and voltage ratings are available on request. Please contact your local HEC office. Capacitance Range 3KVdc to 5KVdc 1206 1808 NP0 1812 2208 2211 2220 Temperature Characteristic Size X7R 1808 1812 Rated Voltage 3KV 3KV 5KV 3KV 5KV 5KV 5KV Rated Voltage 3KV 4KV 3KV Capacitance Range (pF) 2R0 3R3 3R9 5R0 8R0 8R2 100 120 150 180 220 270 330 390 470 560 680 820 101 121 151 181 221 271 331 391 471 561 681 821 102 122 152 182 222 Size D D D D D D D D D D D D D D F F F F F F F D F F F F F F F F F F F F F F F F F F F F F D D F D F F F D D F D F F F D D F D F F F D D F D F F F E D F D F F F E E D D D D D D D E E D F F F D D D D D E/F E/F E/F F F F F F F F F F F F F F E/F E/F E/F E/F E/F F F F F F E/F E/F E/F E/F E/F E/F E/F F F G Capacitance Range (pF) 151 181 221 271 331 391 471 561 681 821 102 122 152 182 222 272 332 392 472 562 682 822 103 123 153 183 223 273 333 393 473 563 683 823 104 Temperature Characteristic D D D D D D D D D D D F F F D D D D D/E D/E D/E D/F D/F D/F D/F E F F F F F F F Consult HEC for thickness information Thickness Specification Symbol Code Thickness(mm) S O 0.3±0.03 0.5±0.05 A 0.6±0.1 B 0.85±0.1 C D E 1.0±0.1 1.25±0.15 1.6±0.2 F 2.0±0.2 G 2.4±0.2 H 2.8±0.2 Other dimensions, capacitance values and voltage ratings are available on request. Please contact your local HEC office. -8- SCC Series - Safety Capacitors SCC Series Safety Capacitors rated to 250Vac X1/Y2, X2/Y3 & X2 The SCC series of X1/Y2, X2/Y3 & X2 safety capacitors are designed specifically for use in modem, facsimile, telephone and other electronic equipment. These parts are compliant to EN/IEC60384-14 and UL60950-1 standards. These capacitors are available in NP0 (C0G), SL and X7R dielectrics. Features Application Small size & high capacitance values. Specially designed for use in modem, facsimile, Suitable for reflow soldering. Surface mount. RoHS compliant and Lead (Pb) free option. Safety standard approval by EN/IEC 60384-14 and UL 60950-1. Certified to: TUV R50005234, R50103496 & UL E229738 TUV R50162550 & UL E229738 for Lead (Pb) free. telephone and other telec om m unication equipment, electronic equipment for lightning and surge protection, EMI filtering and isolation. Safety Detail of Specifications EN 60384-1: 2001 EN 60384-14: 2005 Meets the electrical requirements and certification for equipment requiring class X1/Y2 and X2/Y3 devices. IEC 60950-1 : 2005 Component certified for equipment requiring IEC 60950 compliance IEC 60384-1: 1999 IEC 60384-14: 2005 Component certified for equipment requiring IEC-384 compliance UL 60950-1: 2007 2nd edition TNV/SELV Isolation capacitors certified to UL 60950 -1 How To Order SCC 1808 X Product Code Chip Size Dielectric SCC : Safety approved MLCC Ex. : 1808 1812 2208 2211 2220 2825 Ex. : N : NP0 X : X7R L : SL 102 Capacitance Unit : pF Ex. : 2R0 : 2.0pF 100 : 10×100 471 : 47×101 182 : 18×102 K 502 T Tolerance Class Packaging Ex. : J : +/- 5% K : +/-10% M : +/-20% Ex. : 202 : X2 302 : X2/Y3 502 : X1/Y2 602 : X1/Y2 for SCC2208N, SCC2211N, SCC2220N -9- S Special Requirement T : Tape Ex. : & Reel S : Arc Prevention B : Bulk Coating X : Polymer Termination (SuperTerm) Z : Arc Prevention Coating & SuperTerm G : Lead (Pb) free SCC Series - Safety Capacitors Summary of Specifications Rated Voltage AC 250Vrms NP0 : < 30ppm/ ℃ , -55~+125 ℃ (EIA Class Ι ) SL: +350~ -1000ppm/°C -55~+85°C X7R : < ± 15% , -55~+125 ℃ (EIA Class Ⅱ) See table below NP0/SL : Q≧1000 ; X7R : D.F.≦2.5% -55/125/21 10GΩ X Capacitor : Applied Voltage 1075Vdc(4.3Ur) Y Capacitor : Applied Voltage 1500Vac Y3 : 2.5KV (Compliant to IEC 60950) ; X2 : 2.5KV / Y2 : 5KV for three times NP0 : 0 % ; SL : 1.5% ; X7R : 1.0 % per decade hr, typical Temperature Coefficient Capacitance Range Quality and Dissipation Factor Climatic Category Insulation Resistance Voltage Proof Impulse Ageing Application Example Circuit Y TNV Y 1st SELV Tip & Ring X 2nd X: Across The Line (Ex.: SCC1808N151K302T) Y : Line By Pass (Ex.: SCC2211X102K502T) Unit : mm [inches] Dimensions TYPE BW B 1808 L [.181±.012] W 2.00±0.2 [.079 ±.008] T (max) 2.20 B (min) 2.50 4.60±0.3 3.20±0.3 2.60 2.50 1812 [.181±.012] 2208 [.220±.016] 2211 [.220±.016] 2220 [.220±.016] 2825 [.280±.016] T W L 4.60±0.3 5.70±0.4 5.70±0.4 5.70±0.4 6.80±0.4 - 10 - [.126±.012] 2.00±0.2 [.079±.008] 2.80±0.3 [.087] [.102] 2.20 [.087] 3.00 [.110±.012] [.118] 5.00±0.4 3.00 [.118] 4.00 [.157] [.197±.016] 6.35±0.4 [.197±.016] [.098] [.098] 4.00 [.157] 4.00 [.157] 4.00 [.157] 4.00 [.157] BW (min) 0.20 [.008] 0.20 [.008] 0.30 [.012] 0.30 [.012] 0.30 [.012] 0.30 [.012] SCC Series - Safety Capacitors Capacitance Range Size Temperature Characteristic Rated Voltage Certificated X2/Y3 1808 1808 1812 NP0 X7R X7R 250Vrms 250Vrms 250Vrms TUV/UL TUV/UL TUV X1/Y2 1808 1808 1812 2208 2208 2211 2211 2220 2220 NP0 X7R X7R NP0 X7R NP0 X7R NP0 X7R 250Vrms 250Vrms 250Vrms 250Vrms 250Vrms 250Vrms 250Vrms 250Vrms 250Vrms TUV/UL TUV/UL TUV/UL TUV/UL TUV/UL TUV/UL TUV/UL TUV/UL TUV/UL X2 2825 X7R 250Vrms TUV Capacitance Range (pF) 2R0 5R0 6R8 8R2 100 120 150 180 220 270 330 360 390 470 560 680 820 101 121 131 151 181 221 271 331 391 471 561 681 821 102 122 152 182 222 272 332 472 473 563 Class x x x x x x x x x x x x Capacitance Range Lead (Pb) free Rated Voltage Certificated 1808 NP0 250Vrms TUV/UL 1808 SL 250Vrms TUV/UL 1808 X7R 250Vrms TUV/UL 1812 X7R 250Vrms TUV/UL 1808 NP0 250Vrms TUV/UL 1808 X7R 250Vrms TUV/UL 1812 NP0 250Vrms TUV/UL 1812 2208 2208 2211 2211 2220 2220 X7R NP0 X7R NP0 X7R NP0 X7R 250Vrms 250Vrms 250Vrms 250Vrms 250Vrms 250Vrms 250Vrms TUV/UL TUV/UL TUV/UL TUV/UL TUV/UL TUV/UL TUV/UL Class Size Temperature Characteristic Rated Voltage Certificated X2 2220 X7R 250Vrms TUV/UL X2/Y3 X1/Y2 Capacitance Range (pF) 2R0 5R0 6R8 8R2 100 120 150 180 220 270 330 360 390 470 560 680 820 101 121 131 151 181 221 271 331 391 471 561 681 821 102 122 152 182 222 272 332 472 473 563 Temperature Characteristic x x x x x x x x x x x x 101 121 131 151 181 221 271 331 391 471 561 681 821 102 122 152 182 222 272 332 392 472 562 682 822 103 123 153 183 223 273 333 393 473 563 683 823 104 124 184 Size Class ‘X’ denotes values that have been tested to a rated voltage of 305Vac TUV test report number 28208004 dated 27th May 2010 - 11 - TCX Series - Trigger Capacitors for Strobe Circuits TCX Series Trigger Capacitors for Strobe Circuits The TCX series is specifically designed with a proprietary material for discharge applications such as strobe circuit applications. The unique properties of the X7E material and the design of the TCX series makes them suitable for any discharge application which requires the capacitor to have a good damping characteristic. This series is also suitable for applications requiring a minimum change in capacitance over temperature (T/C). The TCX series is offered in sizes 0805, 1206 and 1210 and at 350Vdc and 630Vdc. Features Applications Excellent trigger characteristics. Low ESR & low tan δ. Excellent DC bias. Provide good damping characteristics results in more light. RoHS compliant. Suitable for strobe trigger circuit in digital and electric cameras. Summary of Specifications Rated Voltage -55~+125 ℃ Temperature Coefficient X7E : ≤ ± 4.7% Capacitance Range 1.0nF to 100nF Dissipation Factor 1.0% max. at 1KHz 25℃ Insulation Resistance 10GΩ or 500/C Ω whichever is smaller (C in Farad) Operating Temperature 350Vdc and 630Vdc Dielectric Strength , -55~+125 ℃ (EIA Class II ) 350Vdc : 200% Rated Voltage 650Vdc : 150% Rated Voltage Capacitance Tolerance ± 5% , ± 10% , ± 20% Ageing 1.0% per decade hr, typical How To Order TCX 1206 C Product Code Chip Size Dielectric TCX : Trigger Capacitor Ex. : 0805 1206 1210 C : X7E 223 Capacitance Unit : pF Ex. : 102 : 10×102 473 : 47×103 - 12 - K 631 T Tolerance Rated Voltage Packaging Ex. : J : +/- 5% K : +/- 10% M : +/- 20% Ex. : 351 : 350Vdc 631 : 630Vdc T : Tape & Reel B : Bulk TCX Series -Trigger Capacitors for Strobe Circuits Characteristics R-C Charge Curv e Damping (Trigger) Properties 300 4000 TCX/1206/223K/630V 3000 X7R/1206/223K/630V 250 2000 Voltage (V) Trigger Voltage (Vp) 5000 1000 0 -1000 200 150 100 TCX/1206/223K/630V -2000 50 -3000 -4000 X7R/1206/223K/630V 0 0 1 Application 2 3 4 5 6 Time (µs) 7 8 9 10 0 1 2 3 4 Time (sec.) 5 6 7 Example Circuit DSC Strobe Circuit Trigger Cap. + - Dimensions BW B Unit : mm [inches] TYPE T W 0805 L 2.00±0.2 [.079±.008] W 1.25±0.2 [.049 ±.008] T (max) 1.45 B (min) 0.70 3.20±0.3 1.60±0.2 1.80 1.50 1206 [.126±.012] 1210 [.126±.012] 3.20±0.3 [.063±.008] [.057] [.071] 2.50±0.2 1.80 [.098±.008] [.071] [.028] [.059] 1.60 [.063] L Capacitance Range X7E Size Voltage 0805 350V 1206 1210 Symbol Code Thickness(mm) Capacitance Range 102 122 152 182 222 272 332 392 472 562 682 822 103 123 153 183 223 273 333 393 473 563 683 823 104 154 224 Dielectric Characteristic C C C C C C C C C C C C C C C D D D 350V C C C C D D D E E 630V D D D D D D D E E E 630V S O 0.3±0.03 0.5±0.05 D D D D D D D E E A 0.6±0.1 B 0.85±0.1 C D E 1.0±0.1 1.25±0.15 1.6±0.2 F 2.0±0.2 Other dimensions, capacitance values and voltage ratings are available. Please contact HEC. - 13 - G 2.4±0.2 H 2.8±0.2 BW (min) 0.20 [.008] 0.30 [.012] 0.30 [.012] LDC Series - Low Distortion Capacitors LDC Series Low Distortion Capacitors NP0/X7R Hybrid Features Application Small size & high capacitance. Ultra stable T/C for a Class ll. Excellent bias, high temperature stability & low tan δ. High breakdown voltage. Replacement for film capacitors. RoHS compliant. Suitable for telecommunication (ADSL modem), power (inverter for oscillation circuit) & audio circuits. Summary of Specifications Rated Voltage -55~+125 ℃ Temperature Coefficient X7E : ≤ ± 4.7% Capacitance Range 1nF ~ 270nF Operating Temperature 25V and 50Vdc , -55~+125 ℃ (EIA Class II ) For 50V : 1.2% max. at 1KHz 25℃ Dissipation Factor For 25V : 2.0% max. at 1KHz 25℃ Insulation Resistance 10GΩ or 500/C Ω whichever is smaller Dielectric Strength 250% Rated Voltage for 5 second @ 50mA max. current Capacitance Tolerance ± 5% , ± 10% , ± 20% Ageing 1.0% per decade hr , typical How To Order LDC 1206 C Product Code Chip Size Dielectric LDC : Low Distortion Capacitor Ex. : 0603 0805 1206 1210 1812 2220 C : X7E 103 Capacitance Unit : pF Ex. : 102 : 10×102 224 : 22×104 - 14 - K 025 T Tolerance Rated Voltage Packaging Ex. : J : +/- 5% K : +/- 10% M : +/- 20% Ex. : 025 : 25Vdc 050 : 50Vdc T : Tape & Reel B : Bulk LDC Series - Low Distortion Capacitors Characteristics Temperature Capacitance Coefficient Impedance/ESR & Frequency 20.0 100 LDC 1206/103 10.0 10 5.0 (ohm) dC/C (%) Z - LDC/1206/103 Z - Film Cap 1206/103 ESR - LDC/1206/103 ESR - Film Cap /1206/103 X7R 1206/103 15.0 0.0 1 -5.0 -10.0 0.1 -15.0 -20.0 -55 -45 -35 -25 -15 -5 5 0.01 0.1 15 25 35 45 55 65 75 85 95 105 115 125 1 Temperature Temperature ℃ Application FILTER 1 50Ω 100 1000 Example Circuit 1.8nF 6.8nF 100R 4.7nF 819R 50Ω 2 10 Frequency (MHz) 316R 100R 6.8nF 1.8nF Dimensions Unit : mm [inches] BW TYPE B T W L L 1.60±0.1 W 0.80±0.1 0603 [.063±.004] [.031 ±.004] 0805 2.00±0.2 1.25±0.2 [.079±.008] 1206 [.126±.012] 1210 [.126±.012] 1812 [.181±.012] 2220 [.220±.016] 3.20±0.3 3.20±0.3 4.60±0.3 5.70±0.4 [.049 ±.008] 1.60±0.2 [.063±.008] 2.50±0.2 [.098±.008] 3.20±0.3 [.126±.012] 5.00±0.4 [.197±.016] T (max) 0.90 B (min) 0.40 1.45 0.70 [.035] [.057] 1.80 [.071] 1.80 [.071] 2.20 [.087] 2.20 [.087] [.016] [.028] 1.50 [.059] 1.60 [.063] 2.50 [.098] 3.50 [.137] BW (min) 0.15 [.006] 0.20 [.008] 0.30 [.012] 0.30 [.012] 0.30 [.012] 0.30 [.012] Capacitance Range Size 0603 0805 1206 X7E 1210 1812 2220 Symbol Code Thickness(mm) Rated Voltage 50V 50V 25V 50V 50V 50V 50V S O 0.3±0.03 0.5±0.05 Capacitance Range 102 122 152 182 222 272 332 392 472 562 682 822 103 123 153 183 223 273 333 393 473 563 683 823 104 154 224 274 Dielectric Characteristic B B B B B B B B B B B B B C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C C D D A 0.6±0.1 B 0.85±0.1 C D E 1.0±0.1 1.25±0.15 1.6±0.2 F 2.0±0.2 Other dimensions, capacitance values and voltage ratings are available. Please contact HEC. - 15 - C C C D G 2.4±0.2 C C C C C D D D D D D D H 2.8±0.2 NCC Series - Normal Chip Capacitors NCC Series Normal Chip Capacitors NP0, X7R, X5R,Y5V Standard Multilayer Ceramic Chip Capacitors (MLCCs) are available in a full range of sizes and temperature coefficients, with voltage ratings from 6.3V to 50V. Features Application Surface mount suited for wave and reflow soldering. Suitable for general electronics circuit, Small size and high reliability. Excellent in high frequency characteristic. RoHS compliant. telecommunications, personal computers and peripheral, power circuit & mobile application etc. Summary of Specifications -55°C~+125 ℃ for NP0 and X7R: -55°C ~+85°C for X5R: -30°C~+85°C for Y5V Operating Temperature Rated Voltage 6.3Vdc to 50Vdc NP0 : ≤ ± 30ppm/ ℃ X7R : ≤ ± 15% Temperature Coefficient X5R : ≤ ± 15% , -55°C~+125 ℃ (EIA Class Ι) , -55°C~+125 ℃ (EIA Class Ⅱ) , -55°C~+85 ℃ (EIA Class Ⅱ) , -30°C ~ +85°C (EIA Class Ⅱ) Y5V: +22%/-82% NP0 : More than 30pF: Q≥ 1000 (0.001) 30pF and below : Q≥400+20C (C=pF) Dissipation Factor X7R, X5R and Y5V: please see table 1 on page 39 for details Insulation Resistance 10GΩ or 500/C Ω whichever is smaller Ageing NP0:0% ; X7R/X5R: typically 1.0% and Y5V ≤ 7% per decade of time Dielectric Strength 250% rated voltage Dimensions BW TYPE B T W L L 0.60±0.03 0201 [.024±.001] 0402 1.00±0.05 0603 1.60±0.10 0805 2.00±0.20 1206 3.20±0.30 [.039±.002] [.063±.004] [.079±.008] [.126±.012] W 0.30±0.03 [.011 ±.001] 0.50±0.05 [.020 ±.002] 0.80±0.10 [.031 ±.004] 1.25±0.20 [.049 ±.008] 1.60±0.20 [.063±.008] T (max) 0.33 B (min) 0.20 0.55 0.30 [.013] [.008] [.022] [.012] 0.90 0.40 [.035] [.016] 1.45 0.70 [.057] [.028] 1.80 1.50 [.071] [.059] BW (min) 0.10 [.004] 0.15 [.006] 0.15 [.006] 0.20 [.008] 0.30 [.012] How To Order C 0402 B Product Code Chip Size Dielectric C : MLCC Multilayer Ceramic Capacitor Ex. : 0201 0402 0603 0805 1206 Ex. : N : NP0 X : X7R B : X5R Y : Y5V 104 Capacitance Unit : pF Ex. : 102 : 10×102 473 : 47×103 104 : 10×104 - 16 - M 010 T Tolerance Rated Voltage Packaging Ex. : C : +/- 0.25pF D : +/- 0.50pF F : +/- 1% G : +/- 2% J : +/- 5% K : +/- 10% M : +/- 20% Z : +80/-20% Ex. : 007 : 6.3Vdc 010 : 10Vdc 016 : 16Vdc 025 : 25Vdc 050 : 50Vdc T : Tape & Reel B : Bulk NCC Series - Normal Chip Capacitors Capacitance Range Size Rated Voltage NPO 0402 0603 0805 50V 50V 50V 0603 X7R 0805 1206 Dielectric Characteristic Size 0402 0603 Y5V 0805 1206 Symbol Code Thickness(mm) BBBBBBBBBBBBBBBBBBBBBBBB Capacitance Range (pF) Rated Voltage O 10V OOOOOOOOO O O 16V OOOOO 25V OOOOOOOOOOOOOOOOOOOOOOOO 50V BBBBBBBBBBBBBBBBBBBBBBBBBBBBBBBBBBBBBB 16V BBBBBBBBBBBBBBBBBBBBBBBBBBBBBBBBBBBB 25V BBBBBBBBBBBBBBBBBBBBBBBBBBBBBBBBBB 50V BBBBBBBBBBBBBBBBBBBBBBBBBBBBBBDDD 16V BBBBBBBBBBBBBBBBBBBBBBBBBBBBBBDD 25V BBBBBBBBBBBBBBBBBBBBBBBBBBBBBCD 50V BBBCD 16V BBBCD 25V BBBCD 50V Rated Voltage Capacitance Range 10V 16V 16V 25V 50V 16V 25V 50V 16V 25V 50V S O 0.3±0.03 0.5±0.05 Dielectric Characteristic Size 0201 OO O BBB 0402 BBB B X5R BBB BBB 0603 BBB BBB Rated Capacitance Range (pF) Voltage S 6.3V O O 6.3V O O O 10V OOOOOOOO 16V OOOOOOOO 25V BB 6.3V BBBBBB 10V B BBBBBB 16V BBBBB 25V 273 333 393 473 563 683 823 104 154 224 334 474 684 0402 BBBBBBBBBBBBBBBBBBBBBBBB 101 121 151 181 221 271 331 391 471 561 681 102 122 152 182 222 272 332 392 472 562 682 822 103 123 153 183 223 273 333 393 473 563 683 823 104 154 224 334 474 684 Size OOOOOOOOOOOOOOOOOOOOO 102 222 472 103 223 473 104 224 474 Dielectric Characteristic Capacitance Range (pF) 0R5 1R0 1R5 2R0 3R0 4R0 5R0 6R0 7R0 8R0 9R0 100 120 150 180 220 270 330 390 470 560 680 820 101 121 151 181 221 271 331 391 471 561 681 821 102 122 152 182 222 272 332 Dielectric Characteristic B BBB BBB A 0.6±0.1 B 0.85±0.1 C D E 1.0±0.1 1.25±0.15 1.6±0.2 Other dimensions, capacitance values and voltage ratings are available. Please contact HEC. -17 - F 2.0±0.2 G 2.4±0.2 H 2.8±0.2 HCC Series - High Capacitance MLCC HCC Series High Capacitance MLCC - 1uF and above Features Application Surface mount, suited for wave and reflow Ideal for smoothing and decoupling circuits Suitable f or DC- DC conver ter , per s onal soldering. High reliability. Small size and high capacitance value. Excellent high frequency characteristics. RoHS compliant. computer and peripherals, telecommunication and general electronic equipment Summary of Specifications -55°C~+125 ℃ for X7R: -55°C ~+85°C for X5R: -30°C~+85°C for Y5V Operating Temperature Rated Voltage 6.3Vdc to 50Vdc X7R : ≤ ± 15% , -55°C~+125 ℃ (EIA Class Ⅱ) X5R : ≤ ± 15% Temperature Coefficient , -55°C~+85 ℃ (EIA Class Ⅱ) , -30°C ~ +85°C (EIA Class Ⅱ) Y5V: +22%/-82% Dissipation Factor : X7R, X5R and Y5V: Please see table 1 on page 39 for details Insulation Resistance 10GΩ or 500/C Ω whichever is smaller Ageing X7R/X5R: Typically 1.0% and Y5V ≤ 7% per decade of time Dielectric Strength 250% Rated Voltage Dimensions BW TYPE B T W L 0402 L 1.00±0.05 0603 1.60±0.10 0805 2.00±0.20 1206 3.20±0.30 W 0.50±0.05 [.020 ±.002] 0.80±0.10 [.031 ±.004] 1.25±0.20 [.049 ±.008] 1.60±0.20 1210 3.20±0.30 2.50±0.20 1812 [.181±.012] [.126±.012] 2220 [.220±.016] 5.7±0.40 5.00±0.40 [.039±.002] [.063±.004] [.079±.008] [.126±.012] [.126±.012] 4.60±0.3 [.063±.0108 [.098±.008] 3.20±0.3 [.197±.016] T (max) 0.55 B (min) 0.30 0.90 0.40 [.022] [.012] [.035] [.016] 1.45 0.70 [.057] [.028] 1.80 1.50 [.071] [.059] 2.60 1.60 [.102] [.063] 3.00 2.50 [.118] [.098] 3.00 3.50 [.118] [.137] BW (min) 0.15 [.006] 0.15 [.006] 0.20 [.008] 0.30 [.012] 0.30 [.012] 0.30 [.012] 0.30 [.012] How To Order C 0805 B Product Code Chip Size Dielectric C : MLCC Multilayer Ceramic Capacitor Ex. : 0402 0603 0805 1206 1210 1812 2220 Ex. : X : X7R B : X5R Y : Y5V 106 Capacitance Unit : pF Ex. : 105 : 10×105 106 : 10×106 226 : 22×106 - 18 - M 010 Tolerance Rated Voltage Ex. : J : +/- 5% K : +/- 10% M : +/- 20% Z : +80/-20% Ex. : 007 : 6.3Vdc 010 : 10Vdc 016 : 16Vdc 025 : 25Vdc 035 : 35Vdc 050 : 50Vdc T Packaging T : Tape & Reel B : Bulk HCC Series - High Capacitance MLCC Capacitance Range X7R (X) Series Size 0603 0805 1206 1210 1812 2220 Code VDC 6.3V 10V 16V 25V 6.3V 10V 16V 25V 10V 16V 25V 35V 50V 16V 25V 35V 50V 35V 35V 105 225 475 106 1uF 2.2uF 4.7uF 10uF B B B B B B B D D D D D D D D D E E E E E D E E E D D F F F F D F D F F F F F G X5R (B) Series Size 0402 0603 0805 1210 1206 Code VDC 6.3V 10V 6.3V 10V 16V 25V 6.3V 10V 16V 25V 6.3V 10V 16V 25V 35V 50V 6.3V 10V 16V 25V 35V 50V 105 225 475 106 226 476 107 1uF 2.2uF 4.7uF 10uF 22uF 47uF 100uF O O O B B B B B B B B B B D D D D D D D D D D D D D D D D E E E E E E E E E D E E E E D E E E E E G F G E F F G E/F F F F F F D G Y5V (Y) Series Size 0402 0603 0805 1206 1210 Code VDC 6.3V 10V 6.3 10V 16V 25V 6.3V 10V 16V 25V 50V 10V 16V 25V 35V 50V 6.3V 10V 16V 25V 35V 50V 105 225 475 106 226 1uF 2.2uF 4.7uF 10uF 22uF O Symbol Code Thickness(mm) O B B B B B B B S O 0.3±0.03 0.5±0.05 B D D D A 0.6±0.1 D D D B D D D B D D D D B 0.85±0.1 D E E D E C D E 1.0±0.1 1.25±0.15 1.6±0.2 Other dimensions, capacitance values and voltage ratings are available. Please contact HEC. - 19 - F F 2.0±0.2 E F E G 2.4±0.2 E H 2.8±0.2 HCN Series - High Capacitance NP0 HCN Series High Capacitance NP0 - 1nF and above Features Application Small size & high capacitance. Suitable for wave and reflow soldering. Excellent characteristics and tight tolerance. Excellent bias, high temperature stability & low tan δ. Replace film capacitors. RoHS compliant. Suitable for ADSL filter circuits, cable modem and coupling circuits, general telecommunications use, power (inverter for oscillation circuit) and audio circuits. Summary of Specifications Operating Temperature -55~+125 ℃ Rated Voltage 16V to 50Vdc Temperature Coefficient NP0 : ≤ 30ppm/℃, Capacitance Range 1nF ~ 220nF Dissipation Factor Q ≥1000 at 1KHz 20℃ -55~+125 ℃ (EIA Class Ι ) Insulation Resistance 10GΩ or 500/C Ω whichever is smaller (C in Farad) Dielectric Strength 250% rated voltage for 5 second @ 50mA max. current Ageing 0% per decade hr How To Order C Product Code C : MLCC Multilayer Ceramic Capacitor 1206 Chip Size 0603 0805 1206 1210 1812 N Dielectric N : NP0 103 Capacitance Unit : pF Ex. : 102 : 10×102 103 : 10×103 124 : 12×104 - 20 - J 025 Tolerance Rated Voltage Ex. : F : +/- 1% G : +/- 2% J : +/- 5% Ex. : 016 : 16Vdc 025 : 25Vdc 050 : 50Vdc T Packaging T : Tape & Reel B : Bulk HCN Series - High Capacitance NP0 Characteristics Z/ESR & Frequency Temperature Capacitance Coefficient 100000 5000 ESR-MLCC NPO 1812/683 NPO-1812/683 Film-1812/683 3000 1000 2000 Z- Film Cap 1812/683 ESR- Film Cap 1812/683 100 Ohm dC/C (ppm) Z- MLCC- NPO 1812/683 10000 4000 1000 0 10 -1000 1 -2000 0.1 -3000 0.01 -4000 0.001 -5000 -55 -45 -35 -25 -15 -5 5 0.1 15 25 35 45 55 65 75 85 95 105 115 125 1 10 100 1000 10000 100000 Frequency (KHz) Temperature(℃ ) Application Rx Filter 1 Example Circuits 1.5nF 1.8nF 560pF 1.8nF 6.8nF 4.7nF 3.3nF 18nF 680uH 680uH 680uH Tx Filter 4.2KR 348R 1 4.75KR 680uH 2.7nF 1.5nF 2 1.5nF 1.8nF 1.8nF 4.2KR 680uH 2 100nF 4.75KR 348R 3.3nF 560pF Dimensions Unit : mm [inches] BW TYPE B L 1.60+/-0.1 W 0.80+/-0.1 [.063+/-.004] [.031+/-.004] 1.25±0.2 2.00±0.2 [.079±.008] [.049 ±.008] 1.60±0.2 3.20±0.3 0603 0805 T 1206 W L [.126±.012] 3.20±0.3 1210 [.126±.012] 1812 [.181±.012] 4.60±0.3 T (max) 0.90 B (min) 0.40 1.40 0.70 [.039] [.055] 1.80 [.063±.008] [.071] 2.50±0.2 2.20 [.098±.008] [.087] 3.20±0.3 2.20 [.126±.012] [.087] [.016] BW (min) 0.15 [.028] 1.50 [.059] 1.60 [.063] 4.00 [.157] [.006] 0.20 [.008] 0.30 [.012] 0.30 [.012] 0.20 [.008] Capacitance Range Capacitance Range Size 0603 0805 NPO 1206 1210 1812 Symbol Code Thickness(mm) Voltage 16V 25V 50V 16V 25V 50V 16V 25V 50V 16V 25V 50V 16V 25V 50V 102 122 152 182 222 272 332 392 472 562 682 822 103 123 153 183 223 273 333 393 473 563 683 823 104 124 154 224 Dielectric Characteristic B B B B B B B B B C C C D D D S O 0.3±0.03 0.5±0.05 B B B B B B B B B C C C D D D B B B B B B B B B C C C D D D B B B B B B B B B C C C D D D A 0.6±0.1 B B B B B B B B B C/D D D C/D D D C/D D D B B B B B B B B B C C C C C C C C C D D D D D D D D D D D D B B B C C C D D D B 0.85±0.1 D D D B B B C C C D D D D D D B C C C C C D D D D D D B D D C C C D D D D D D B D D C C C D D D D D D B D E C C C D D D D D D D E D D D D D D D E E D D D D E E D D D D F F E E E D E E E E E E F F F F F F E E E F E E E F C D E 1.0±0.1 1.25±0.15 1.6±0.2 Other dimensions, capacitance values and voltage ratings are available. Please contact HEC. - 21 - F 2.0±0.2 G 2.4±0.2 H 2.8±0.2 HCX Series - High Capacitance X7R HCX Series High Capacitance X7R - 100nF and above Features Application Rated working voltage of 50V and 100Vdc. Small size & high capacitance. Excellent bias, high temperature stability & low tan δ. Low ESR and excellent ripple current characteristics RoHS compliant DC-DC converters (filter) Industrial controls Power supplies Surge protection Summary of Specifications -55~+125 ℃ Operating Temperature 50V to 100Vdc Rated Voltage Capacitance Range X7R : ≤ ± 15% at -55~+125 ℃ (EIA Class II ) Dissipation Factor 2.5% max. at 1KHz 25℃ Insulation Resistance 10GΩ or 500/C Ω whichever is smaller (C in Farad ) Temperature Coefficient 100nF ~ 10uF 50V : 250% rated voltage for 5 second @ 50mA max. current Dielectric Strength 100V :200% rated voltage for 5 second @ 50mA max. current Capacitance Tolerance ± 10% , ± 20% Ageing 1.0% per decade hr , typical How To Order C 1210 Product Code Chip Size C : MLCC Multilayer Ceramic Capacitor Ex. : 1210 1812 1825 2220 2225 X Dielectric X : X7R 225 K Capacitance Unit : pF Ex. : 102 : 10×102 224 : 22×104 105 : 10×105 101 T Tolerance Rated Voltage Packaging Ex. : K : +/- 10% M : +/- 20% Ex. : 050 : 50Vdc 101 : 100Vdc T : Tape & Reel B : Bulk - 22 - X Special Requirement Ex. : O : Arc Prevention Coating X : Flexible Termination (Super Term) HCX Series - High Capacitance X7R Characteristics Application Example Circuit DC-DC Converter Filter Isolation Transformer Dimensions BW Unit : mm [inches] B TYPE T W L L 3.20±0.3 W 2.50±0.2 T (max) 2.60 B (min) 1.60 3.00 2.50 1210 [.126±.012] [.098±.008] 1812 4.60±0.3 [.181±.012] 3.20±0.3 1825 [. 181±.012] 2220 [.220±.016] 2225 [.220±.016] 4.60±0.3 5.70±0.4 5.70±0.4 [.126±.012] 6.35±0.4 [.250±.016] 5.00±0.4 [.197±.016] 6.35±0.4 [.250±.016] [.102] [.118] 3.00 [.118] 3.00 [.118] 3.00 [.118] [.063] [.098] 2.50 [.137] 3.50 [.137] 3.50 [.137] BW (min) 0.30 [.012] 0.30 [.012] 0.30 [.012] 0.30 [.012] 0.30 [.012] Capacitance Range Size 1210 Code WVDC 50V 100V 104 100nF C C 154 150nF C C 224 220nF C C 334 330nF C C 474 470nF C C 564 560nF D D 684 680nF D E 105 1uF D F 155 1.5uF F F 225 2.2uF G G 335 3.3uF 475 4.7uF 685 6.8uF 106 10uF Symbol Code Thickness(mm) 1812 50V 100V D D/E D D/E D D/E D D/E D E D E D E D E E F E G F H 1825 50V 100V D D D D D D D D D D D D D D D D E F E F F F S O 0.3±0.03 0.5±0.05 2220 2225 50V 100V 50V 100V A 0.6±0.1 E E E F F F F F G H E E E F F F F F B 0.85±0.1 D D D D D E E E F G D D D E F F F F C D E 1.0±0.1 1.25±0.15 1.6±0.2 F 2.0±0.2 Other dimensions, capacitance values and voltage ratings are available. Please contact HEC. - 23 - G 2.4±0.2 H 2.8±0.2 SAC Series -Tip & Ring Capacitors SAC Series Tip & Ring Capacitors Features Telephone lines use a DC voltage of 48 volts and pass the subscriber’s AC signal pulse of 15 to 25Hz at 70 to 90Vrms. These MLCC Tip & Ring capacitors replace bulky leaded film capacitors and offer excellent frequency response, low ESR and improved temperature characteristics. Ideal for telecommunication and modem applications. Small size & high capacitance. Suitable for wave and reflow soldering. Surface mount. Low ESR characteristics & improved temperature performance. RoHS compliant. Summary of Specifications Operating Temperature X7R : -55~+125 ℃ , Y5U : -30~+85 ℃ 250Vdc Rated Voltage Temperature Coefficient Y5U : ≤ +22 /-56 % X7R : ≤ ± 15% Y5U :10nF ~ 1.0uF Capacitance Range , -30~+85 ℃ (EIA Class II ) , -55~+125 ℃ (EIA Class II ) X7R :180pF ~ 2.2uF Dissipation Factor Y5U : D.F.≦4.0% ; X7R : D.F.≦2.5% Insulation Resistance 10GΩ or 500/C Ω whichever is smaller Dielectric Strength 200% rated voltage for 5 second @ 50mA max. current Ageing Y5U: 4.0 %; X7R: 1.0 % per decade hr , typical How To Order C 1812 X Product Code Chip Size Dielectric C : MLCC Multilayer Ceramic Capacitor Ex. : Ex. : X : X7R E : Y5U 0805 1206 1210 1812 2220 474 Capacitance Unit : pF Ex. : 103 : 10×103 474 : 47×104 - 24 - M 251 Tolerance Rated Voltage Ex. : K : +/- 10% M : +/- 20% Ex. : 251 : 250Vdc T Packaging T : Tape & Reel B : Bulk SAC Series - Tip & Ring Capacitors Dimensions BW B TYPE T W L L 2.00±0.2 W 1.25±0.2 0805 [.079±.008] [.049 ±.008] 1206 3.20±0.3 [.126±.012] 1.60±0.2 1210 [.126±.012] 1812 [.181±.012] 2220 [.220±.016] 3.20±0.3 4.60±0.3 5.70±0.4 T (max) 1.45 [.043] Unit : mm [inches] B (min) BW (min) 0.70 0.20 1.80 [.063±.008] 2.50±0.2 2.60 3.20±0.3 1.60 3.00 5.00±0.4 [.012] 0.30 [.063] [.012] 2.50 [.118] 0.30 [.098] 3.00 [.197±.016] 0.30 [.059] [.102] [.126±.012] [.008] 1.50 [.071] [.098±.008] [.028] [.012] 3.50 [.118] 0.30 [.137] [.012] Characteristics Temperature Capacitance Coef f icient 20 X7R Impedance/ESR & Frequency 10000 1000 X7R 1812/474 -Z X7R 1812/474 -ESR 100 Y 5U 1812/474 -Z Y 5U 1812/474 -ESR 0 -10 -20 (ohm) Capacitance Change (%) 10 -30 -40 10 1 -50 -60 X7R 1812/474 Y 5U 1812/474 -70 0.1 -80 0.01 -55 -35 Application -15 5 25 45 65 Temperature (C) 85 105 125 0.1 1 10 100 1000 Frequency (KHz) 10000 100000 Subscribers AC Signal Example Circuit Ring Ring -48Vdc 0.47uF Tip Tip 200ms/DIV Capacitance Range X7R Y5U Capacitance Range Size Voltage 0805 250V 1206 1210 1812 2220 1812 250V 250V 250V 250V 250V Symbol Code Thickness(mm) 181 221 271 331 471 681 102 152 182 222 332 472 562 682 103 153 223 273 333 393 473 563 683 823 104 154 224 334 474 564 684 824 105 155 225 Dielectric Characteristic B/CB/CB/CB/CB/CB/CB/CB/CB/CB/CB/CB/CB/CB/CB/CB/C D D D B/CB/CB/CB/CB/CB/CB/CB/CB/CB/CB/CB/CB/CB/CB/CB/CB/CB/CB/CB/CB/CC/DD/ED/ED/E S O 0.3±0.03 0.5±0.05 C C C C C C C C C C D D D D D D D D D D/ED/ED/ED/ED/ED/ED/ED/E E E E F G E E E E E E E E E F H D D D D D D D D D D D D D E E E E F G A 0.6±0.1 B 0.85±0.1 C D E 1.0±0.1 1.25±0.15 1.6±0.2 Other dimensions, capacitance values and voltage ratings are available. Please contact HEC. - 25 - F 2.0±0.2 G 2.4±0.2 H 2.8±0.2 HBC Series - Low-Loss, High Frequency Snubber Capacitors HBC Series Low-Loss, High Frequency Snubber Capacitors Features Application Low stable ESR at high frequency. Ultra stable NP0 performance. Suitable for solder wave and reflow soldering. ROHS compliant. High peak to peak voltage capability. High frequency pulse circuits. Lighting ballast snubber circuits. DC-DC converters. High dv/dt rating. Summary of Specifications Operating Temperature -55~+125 ℃ Rated Voltage 500V and 630Vdc Temperature Coefficient ≤ ± 30ppm at -55~+125 ℃ Capacitance Range 10pF ~ 2700pF Dissipation Factor 0.1% max. at 1MHz 25℃ Insulation Resistance 10GΩ Dielectric Withstanding 1.5 × WVDC for 5 sec Capacitance Tolerance F, G, J, K Ageing None Piezo Effects None dv/dt rating >6KV/µ second How To Order HBC 1206 N Product Code Chip Size Dielectric HBC : Low-loss High Frequency Capacitors Ex. : 1206 1210 Ex. : N : NP0 100 Capacitance Unit : pF Ex. : 100 : 10×100 101 : 10×101 102 : 10×102 - 26 - J Tolerance Ex. : F : ±1% G : ±2% J : ± 5% K : ±10% 501 Rated Voltage Ex. : 501 : 500Vdc 631 : 630Vdc T Packaging T : Tape & Reel B : Bulk HBC Series - Low-Loss, High Frequency Snubber Capacitors Characteristics Peak to Peak Voltage To convert a DC voltage rating to maximum peak to peak voltage a conversion factor of 1.25 : 1 should be Used. For example : 500VDC rating = 500/1.25 = 400V peak to peak voltage where peak to peak is defined as below. AC Voltage Pulsed Voltage 0V DC + AC Voltage DC + Pulsed Voltage 0V = peak to peak voltage Dimensions BW B Unit : mm [inches] T TYPE L W T (max) B (min) BW (min) 1206 3.20±0.3 1.60±0.2 1.80 1.50 0.30 1210 3.20±.30 2.50±0.2 2.60 1.60 0.30 W L Capacitance Range Size Voltage NP0 1206 1206 1210 1210 500V 630V 500V 630V 100 120 150 180 220 270 330 390 470 560 680 820 101 121 151 181 221 271 331 391 471 561 681 821 102 122 152 182 222 272 684 824 105 155 225 Capacitance Range Dielectric Characteristic Other dimensions, capacitance values and voltage ratings are available. Please contact HEC. - 27 - HTC Series- High Temperature Capacitors HTC Series High Temperature Capacitors X8R rated to +150°C Applications Features Rated voltages from 25V to 250V. Stable temperature coefficient at temperatures up to 150°C. Near zero loss of capacitance at peak temperature (see chart). Fully RoHS compliant. Available with flexible termination (Super Term) to minimize mechanical / thermal stress effects. Suitable for automotive, oil exploration (drilling and logging) and other demanding high temperature environments and applications. Instrumentation and other equipment circuit operating at high temperatures. Summary of Specifications -55~+150 ℃ Operating Temperature Rated Voltage 25V ~ 250Vdc Temperature Coefficient X8R : ≤ ± 15% , -55~+150 ℃ (EIA Class II ) Capacitance Range 180pF ~ 390nF Dissipation Factor 2.5 % max. at 1KHz 25℃ Insulation Resistance 100GΩ or 1000/C Ω whichever is smaller at 25℃ < 200V : 250% rated voltage for 5 second @ 50mA max. current Dielectric Strength 200~500V : 150% rated voltage for 5 second @ 50mA max. current Capacitance Tolerance ± 5% , ± 10% , ± 20% Ageing 2.0% per decade hr, typical How To Order HTC 1206 H 103 K 025 X T Product Code Chip Size Dielectric Capacitance Unit : pF Tolerance Rated Voltage Packagin g Special Requirement HTC : High Temperature Capacitor Ex. : 0603 0805 1206 1210 Ex. : X8R Ex. : 102:10×102 224:22×104 Ex. : J : +/- 5% K : +/- 10% M : +/- 20% Ex. : 025:25Vdc 050:50Vdc 101:100Vdc 251:250Vdc T : Tape & Reel B : Bulk X:Super Term O:Arc Prevention Coating - 28 - Ex. : HTC Series - High Temperature Capacitors X8R-1206 / 100nF Characteristics 20.0 15.0 10.0 dC/C (%) 5.0 0.0 -5.0 -10.0 -15.0 -20.0 -25.0 -55 -40 -25 -10 5 20 35 50 65 80 95 110 140 150 125 Dimensions BW Unit : mm [inches] B TYPE W 0.80±0.1 0603 [.063±.004] [.031 ±.004] 0805 2.00±0.2 1.25±0.2 [.079±.008] 1206 [.126±.012] 1210 [.126±.012] T W L 1.60±0.1 3.20±0.3 3.20±0.3 [.049 ±.008] 1.60±0.2 [.063±.008] 2.50±0.2 [.098±.008] T (max) 0.90 B (min) 0.40 1.45 0.70 [.039] [.057] 1.80 [.071] 1.80 [.071] [.016] [.028] 1.50 [.059] 1.60 [.063] BW (min) 0.15 [.006] 0.20 [.008] 0.30 [.012] 0.30 [.012] L Capacitance Range Size 0603 0805 X8R 1206 1210 Rated Voltage Capacitance Range (pF) 181 221 271 331 391 471 561 681 102 122 152 182 222 272 332 392 472 562 682 103 123 153 183 223 273 333 393 473 563 683 104 124 154 184 224 274 334 394 474 564 684 105 155 225 Temperature Characteristic 25V 50V 25V 50V 100V 250V 25V 50V 100V 250V 25V 50V 100V 250V Other dimensions, capacitance values and voltage ratings are available. Please contact HEC. - 29 - LCC Series - Large Size MLCC Capacitors LCC Series Large Size NP0 & X7R MLCC Capacitors 50V – 8KV Features Applications. Optimized internal design offers the highest possible Voltage multipliers Power supplies DC-DC converters Surge protection Industrial control circuits Isolation Ballast Snubber Custom applications voltage rating up to 8KVdc. Capacitance range from 470pF - 33uF and case sizes from 1515 – 7565. Available with proprietary surface coating for arc prevention Available with flexible termination (Super Term) to minimize the effects of mechanical stress. High reliability screening is available. Pd/Ag, 100% Sn and 90/10 Sn/Pb terminations available. RoHS compliant. Summary of Specifications -55~+125 ℃ Operating Temperature Rated Voltage 50Vdc to 8KVdc NP0 : ≤ ± 30ppm/ ℃ , -55~+125 ℃ (EIA Class Ι ) Temperature Coefficient X7R : ≤ ± 15% Capacitance Range NP0 :100pF to 820nF ; X7R :1000pF to 33uF Dissipation Factor NP0 : Q≧1000 ; X7R : D.F.≦2.5% , -55~+125 ℃ (EIA Class Ⅱ ) Insulation Resistance 10GΩ or 500/C Ω whichever is smaller (C in Farad ) Ageing NP0:0% ; X7R: 1.0 % per decade of time V ≤ 500V Dielectric Strength : 200% rated voltage 500V ≤ V < 1000V : 150% rated voltage V ≥1000V : 120% rated voltage How To Order C 2520 X Product Chip Size Dielectric Code C: MLCC EX.: Ex.: Multilayer 1515 N: NP0 Ceramic 2520 X: X7R Capacitor 3530 3640 4540 5550 6560 7565 103 K Capacitance Tolerance Unit : pF Ex.: Ex.: 100:10×100 C:+/-0.25pF 471:47×101 D:+/-0.50pF 102:10×102 J:+/- 5% K:+/-10% M:+/-20% 102 T N Rated Packaging Termination Voltage Ex.: Ex.: Ex.: T: Tape S:Solderable 050:50Vdc & Reel Ag 251:250Vdc W: Waffle P:Pd/Ag 631:630Vdc Pack 102:1000Vdc N: 100% B: Bulk Sn Plated W:90/10 Sn/Pb Plated - 30 - S Testing Requirement Ex.: S: Standard Electrical H: Hi-Reliability X Special Requirement Ex.: Blank: Standard O: Arc Prevention Coating X: Flexible Termination (Super Term) Z: Arc Prevention and SuperTerm LCC Series-Large Size Multilayer Ceramic Chip Capacitors Dimensions TYPE BW B T W L 1515 L 3.80±0.50 2520 6.35±0.50 W 3.80±0.50 [.15 ±.020] 5.00±0.50 3530 8.90±0.50 7.60±0.50 3640 9.20±0.50 10.2±0.50 4540 11.5±0.50 10.2±0.50 5550 14.0±0.50 12.7±0.50 6560 16.5±0.50 15.3±0.50 7565 19.0±0.50 16.5±0.50 [.15±.020] [.25±.020] [.35±.020] [.36±.020] [.45±.020] [.55±.020] [.65±.020] [.750±.020] [.20±.020] [.30±.020] [.40±.020] [.40±.020] [.50±.020] [.60±.020] [.65±.020] T (max) 3.20 [.126] 3.20 [.126] 5.00 [.200] 5.00 [.200] 5.00 [.200] 5.00 Unit : mm [inches] B (min) BW (min) 1.60 0.30 [.059] [.012] 5.50 0.30 [.217] [.012] 6.00 0.30 [.236] [.012] 7.50 0.30 [.295] [.012] 9.00 [.354] 5.00 11.50 5.00 14.00 [.200] 0.30 [.157] [.200] [.200] [.012] 4.00 0.30 [.012] 0.30 [.453] [.012] 0.30 [.551] [.012] Capacitance Range Size 1515 2520 3530 3640 4540 5550 6560 7565 Dielectric NPO X7R NPO X7R NPO X7R NPO X7R NPO X7R NPO X7R NPO X7R NPO X7R 50V 473 225 823 475 154 106 224 126 284 156 364 186 654 226 844 336 100V 393 105 683 225 134 475 184 565 244 685 304 825 484 186 674 226 200V 363 474 563 474 104 225 124 225 184 225 224 275 404 106 504 186 500V 103 124 473 224 823 824 104 105 154 125 184 225 304 335 474 475 Capacitance maximum 1KV 2KV 3KV 222 821 473 682 103 392 222 473 153 472 253 103 472 224 473 183 373 153 562 274 683 273 483 203 962 394 104 393 683 273 153 474 124 823 104 423 223 105 224 104 134 553 283 125 364 154 4KV 5KV 8KV 102 222 332 822 362 153 472 223 562 333 682 563 103 823 471 102 102 472 122 103 152 153 182 223 332 333 472 473 471 102 561 182 621 392 681 562 821 103 102 153 All values are capacitance EIA codes. Other dimensions, capacitance values and voltage ratings are available. Please contact HEC. *Soldering and handling precautions: Large ceramic capacitors are more prone to thermal and mechanical cracks. To minimize mechanical cracks, capacitors have to be handled carefully in the original waffle pack container, carrier tape or other suitable container. Care must be taken that ceramic chips do not come into contact with one another causing chip outs, cracks or other mechanical damage. The recommended method for soldering large chips is reflow soldering. Wave soldering and manual soldering are not recommended. Ceramic capacitors should be preheated to within 50°C of the peak soldering temperature and then use a maximum 2°C/second ramp rate for both heating and cooling. A sudden increase or decrease in temperature during soldering may cause internal thermal cracks. Available Options: • HEC offers flexible termination (Super Term) for very large chips to minimize mechanical cracks due to board flexing. • To minimize the potential for surface arcing in higher voltage applications, HEC offers the option of a proprietary surface coating. • Pure tin terminated / ROHS compliant products are offered as standard, however, lead (Pb) content plated termination is also available. • Pd/Ag termination is also available as an option for hybrid circuits and other applications. - 31 - SMC Series - Stacked MLCC Capacitors SMC Series Stacked MLCC Capacitors Features Application Power supplies DC-DC converters Surge protection Industrial control circuits Snubbers Filtering, smoothing and decoupling applications HIREL applications Custom applications Stacked designs offer the high capacitance similar to tantalum but with the advantage of very low ESR. ‘J’, ‘L’ and ‘N’ leaded configurations provide mechanical and thermal stress relief. Capacitance values up to 34µF Voltages from 50V to 1000V. Available in NP0 and X7R dielectrics. HIREL screening available. RoHS compliant. Summary of Specifications -55 to +125 ℃ Operating Temperature Rated Voltage 50Vdc to 1000Vdc Temperature Coefficient of Capacitance NPO : ≤ ± 30ppm/ ℃ X7R : ≤ ± 15% NPO: 1.0nF to 400nF Capacitance Range , -55 to +125 ℃ (EIA Class Ι ) , -55 to +125 ℃ (EIA Class Ⅱ ) X7R : 27nF to 34uF NPO : Q≧ 1000 at 1KHz Dissipation Factor X7R : 2.5%max. at 1KHz Insulation Resistance 10GΩ or 500/C Ω whichever is smaller Aging NPO : 0% , X7R : 2.5% per decade of time V ≤50V ; 250% Rated Voltage 100V ≤ V <500V ; 200% Rated Voltage Dielectric Withstand Voltage 500V ≤ V <1KV ; 150% Rated Voltage 1000V = 120% Rated Voltage ± 1% & ± 2% tolerances are only available in NPO Tolerance How To Order SMC Product Code SMC: Commercial Size Switchmode Stack Capacitor 49 J X 224 K 501 T H 01 Stack and Size Lead Configuration Material Capacitance (pF) Tolerance Rated Voltage Packaging Special test Requirement Special Requirement The first digit : # of chips in stack Ex.: J : J Lead for h=0.070” L : L Lead for h=0.070” N : Straight Lead P : J Lead for h=0.045” S : L Lead for h=0.045” Ex.: N : NPO X : X7R Ex.: 103 : 10x103 224 : 22x104 475 : 47x105 Ex.: F : +/-1.0% G : +/-2.0% J : +/-5.0% K : +/- 10% M : +/- 20% Ex.: 050 : 101 : 201 : 501 : 102 : Ex.: S : Standard electrical test H : Hi-Rel Testing Blank : No special requirement 01~99 : Customer special requirement Second Digit: Chip Size 5 : 1210 6 : 1812 7 : 2220 8 : 1825 9 : 2225 - 32 - Ex.: 50Vdc T : Tape & 100Vdc Reel 200Vdc W : Waffle 500Vdc pack 1000Vdc SMC Series - Stacked MLCC Capacitors Dimensions 1210 Size 1825/2225 J Type 1812 Size 1825/2225 L Type - 33 - 2220 Size 1825/2225 N Type SMC Series - Stacked MLCC Capacitors Unit : mm [inches] EIA Size Code Size Code L W (max.) H (max.) S 1210 1812 1825 25 16 26 17 27 18 28 3.80 Max [.150 Max] 2.90 [.114] 2.15 [.083] 1.65±0.50 [.065±.020] 3.80 Max [.150 Max] 2.90 [.114] 4.30 [.165] 1.65±0.50 [.065±.020] 1.30 Max [.051 Max] 1.30 Max [.051 Max] 5.50 Max [.217 Max] 4.00 [.157] 2.10 [.083] 1.65±0.50 [.065±.020] 2.54±0.25 [.100±.010] 1.30 Max [.051 Max] 5.50 Max [.217 Max] 4.00 [.157] 4.20 [.165] 1.65±0.50 [.065±.020] 2.54±0.25 [.100±.010] 1.30 Max [.051 Max] 6.50 Max [.256 Max] 5.50 [.217] 2.10 [.083] 1.65±0.50 [.065±.020] 2.54±0.25 [.100±.010] 1.30 Max [.051 Max] 6.50 Max [.256 Max] 5.50 [.217] 4.20 [.165] 1.65±0.50 [.065±.020] 2.54±0.25 [.100±.010] 1.30 Max [.051 Max] 2.54 [.100] 0.50±0.10 [.020±.004] 5.35±0.50 [.210±.020] 6.85 [.270] 2.54 [.100] 1.65±0.50 [.065±.020] 2.54±0.25 [.100±.010] 1.78 [.070] 1.14 [.045] 2.54 [.100] 0.50±0.10 [.020±.004] 5.35±0.50 [.210±.020] 6.85 [.270] 5.08 [.200] 1.65±0.50 [.065±.020] 2.54±0.25 [.100±.010] 1.78 [.070] 1.14 [.045] 2.54 [.100] 0.50±0.10 [.020±.004] 3 3 P h* (Typical) 2220 15 h* (P/S Type) 2.25±0.1 [.089±.004] 2.25±0.1 [.089±.004] 0.50±0.05 [.020±.002] 0.50±0.05 [.020±.002] 2.54 [.100] 0.50±0.10 [.020±.004] 1 1 2 2 2 2 38 1825 48 58 19 29 2225 39 49 59 5.35±0.50 [.210±.020] 6.85 [.270] 7.62 [.300] 1.65±0.50 [.065±.020] 2.54±0.25 [.100±.010] 1.78 [.070] 1.14 [.045] 2.54 [.100] 0.50±0.10 [.020±.004] 5.35±0.50 [.210±.020] 6.85 [.270] 10.16 [.400] 1.65±0.50 [.065±.020] 2.54±0.25 [.100±.010] 1.78 [.070] 1.14 [.045] 2.54 [.100] 0.50±0.10 [.020±.004] 5.35±0.50 [.210±.020] 6.85 [.270] 12.7 [.500] 1.65±0.50 [.065±.020] 2.54±0.25 [.100±.010] 1.78 [.070] 1.14 [.045] 2.54 [.100] 0.50±0.10 [.020±.004] 6.35±0.50 [.250±.020] 6.85 [.270] 2.54 [.100] 1.65±0.50 [.065±.020] 2.54±0.25 [.100±.010] 1.78 [.070] 1.14 [.045] 2.54 [.100] 0.50±0.10 [.020±.004] 6.35±0.50 [.250±.020] 6.85 [.270] 5.08 [.200] 1.65±0.50 [.065±.020] 2.54±0.25 [.100±.010] 1.78 [.070] 1.14 [.045] 2.54 [.100] 0.50±0.10 [.020±.004] 6.35±0.50 [.250±.020] 6.85 [.270] 7.62 [.300] 1.65±0.50 [.065±.020] 2.54±0.25 [.100±.010] 1.78 [.070] 1.14 [.045] 2.54 [.100] 0.50±0.10 [.020±.004] 6.35±0.50 [.250±.020] 6.85 [.270] 10.16 [.400] 1.65±0.50 [.065±.020] 2.54±0.25 [.100±.010] 1.78 [.070] 1.14 [.045] 2.54 [.100] 0.50±0.10 [.020±.004] 6.35±0.50 [.250±.020] 6.85 [.270] 12.70 [.500] 1.65±0.50 [.065±.020] 2.54±0.25 [.100±.010] 1.78 [.070] 1.14 [.045] 2.54 [.100] 0.50±0.10 [.020±.004] 3 3 3 3 3 3 3 3 LL** (min.) t # of leads per side EIA Size Code Size Code L W (max.) H (max.) S P h* (Typical) h* (P/S Type) LL** (min.) t # of leads per side * ‘h’ varies depends on the lead style. See lead configuration above ** “LL” Applies only to straight (N) leads Capacitance Range EIA Chip Size 1210 15 (1×Cap) 25 (2×Cap) 1812 16 (1×Cap) 26 (2×Cap) 2220 17 (1×Cap) 27 (2×Cap) 18 (1×Cap) 28 (2×Cap) 1825 38 (3×Cap) 48 (4×Cap) 58 (5×Cap) 19 (1×Cap) 29 (2×Cap) 2225 39 (3×Cap) 49 (4×Cap) 59 (5×Cap) NPO Maximum Capacitance Size Code X7R Maximum Capacitance 50V 100V 200V/250V 500V 1000V 50V 100V 200V/250V 500V 1000V 183 363 293 583 623 124 653 134 194 264 324 813 164 244 324 404 103 203 183 363 543 104 563 114 164 224 284 653 134 194 264 324 822 163 123 243 453 903 473 943 144 184 234 563 114 164 224 284 222 442 822 163 393 783 393 783 114 154 194 473 943 144 184 234 102 204 562 113 123 243 123 243 363 483 603 153 303 453 603 753 125 245 335 665 475 945 475 945 146 186 236 685 136 206 276 346 105 205 155 305 335 665 335 665 995 136 166 475 945 146 186 236 224 444 824 165 155 305 155 305 455 605 755 225 445 665 885 116 683 134 154 304 274 544 274 544 814 105 135 394 784 115 155 195 273 543 683 134 823 164 823 164 244 324 414 104 204 304 404 504 Other stacked configuration with other sizes, capacitance values and voltage rating sare available. Please contact HEC. *Soldering And Handling Precautions: The recommended method for soldering large capacitors is reflow soldering. Wave soldering and manual soldering are not recommended. Ceramic capacitors should be preheated to within 50ºC of the peak soldering temperature and then use a maximum of 2º/second ramp rate for both heating and cooling. A sudden increase or decrease in temperature during soldering may cause internal thermal cracking. - 34 - Technical Specifications Specifications & Test Conditions Item Operating Temperature Specification Char. NP0(N) SL (L) X5R (B) X7R (X) X8R (H) X7E (C) X6S (S) Y5V (Y) Test Conditions Operating Temp. -55°~ +125°C -55°C~+125°C -55°C~ +85°C -55°C~ +125°C -55°C~+150°C -55°C~+125°C -55°C~+105°C -30°C~ +85°C Visual No abnormal exterior appearance Visual Inspection Capacitance Within the specified tolerance Char. NP0/SL Quality Factor ClassⅠ(NP0/SL): More Than 30pF : Q ≧1000 30pF & Below: Q≧400＋20C (C:Cap., pF) Dissipation Factor ClassⅡ(X7R/X5R/X8R/X6S/Y5V): Please see table 1 for details ClassⅡ(X7E: Insulation Resistance Dielectric Withstand Voltage (DWV) (Unless otherwise Maximum 1% 1KHz±10% 1.0±0.2Vrms 1.0±0.2Vrms 10,000MΩ or 500/C Ω whichever is smaller for rated voltage>10V and greater 100/C Ω for rated voltage≤10V. Applied voltage : rated voltage Charge time : 60±5 sec. Charge-discharge current shall be less than 50mA current. X1/Y2 and X2/Y3: 10GΩ min Applied voltage: 500V charge time 60 sec No dielectric breakdown or mechanical breakdown V ≤ 50V : 250% rated voltage 100V ≤ V < 500V : 200% rated voltage 500V ≤ V < 1000V : 120% rated voltage Voltage applied for 1~5 sec. Current is limited to less than 50mA X Capacitor : Applied voltage 1075Vdc(4.3Ur) Y Capacitor: Applied Voltage 1500Vac For 1 Min. Current limited to less than 50mA X1/Y2 and X2/Y3 Adhesive Strength of Termination 1MHz±10% 1KHz±10% Voltage Perform a heat temperature at 150±5℃ for 30min. then place at room temp. for 24±2hr. stated on product descriptions) Temperature Capacitance Coefficient C≤100pF C>100pF Frequency Char. NP0(N) SL (L) Temp. Range -55°C~+125°C -55°C~+85°C X7R (X) X5R (B) X8R (H) X5E (C) X6S (S) Y5V (Y) -55°C~ +85°C -55°C~ +125°C -55°C~+150°C -55°C~ +85°C -55°C~+105°C -30°C~ +85°C Cap. Change ± 30ppm/℃ +350/ -1000ppm/ °C ± 15% ± 15% ± 15% ± 4.7% ± 22% +22/-82% No indication of peeling shall occur on the terminal electrode. - 35 - ClassΙ: [C2-C1/C1(T2-T1)] × 100% ClassⅡ: (C2-C1)/C1 × 100% T1:Standard temperature(25℃) T2:Test temperature C1:Capacitance at standard temperature C2:Capacitance at test temperature A 5N⋅f (≈ 0.5Kg⋅f) pull force 5N⋅f shall be applied for 10±1 sec. Technical Specifications Specifications & Test Conditions Item Specification Resistance to Flexure of Substrate No mechanical damage or capacitance change more than the following table. Solderability Resistance to Soldering Heat Char. NP0(N)/SL(L) X7R (X) X5R (B) X8R (H) X7E (C) X6S (S) Y5V (Y) Capacitance Change ≦ ± 5.0% of initial value ≦ ± 12.5% of initial value ≦ ± 12.5% of initial value ≦ ± 12.5% of initial value ≦ ± 12.5% of initial value ≦ ± 12.5% of initial value ≦ ± 30.0% of initial value More than 90% of the termination surface should be soldered so the metal part does not come out or dissolve . The board should bend 1.0mm with a rate of 1.0 mm/sec. R230 Bending Limit C Meter 45±1mm 45±1mm Solder Temperature : 245±5℃ Dip Time : 5 ± 0.5 sec. Immersing Speed : 25±10% mm/s Solder : H63A Flux :Rosin Preheat : At 80~120 ℃ For 10~30sec. ClassⅡ capacitor shall be set for 48± 4 hours at room temperature after one hour heat treatment at 150 +0/-10℃ before initial measuring. Capacitance ClassⅠ(NP0): Preheat : at 150±10°C for 60~120sec. Within 2.5% or ±0.25pF whichever is larger of initial value Dip : solder temperature of 260±5℃ Dip Time : 10 ± 1sec. ClassⅡ: Char. Cap. change Immersing Speed : 25±10% mm/s X5R(B) ≤ ±7.5% of initial value Solder : H63A : Rosin X7R(X) ≤ ±7.5% of initial value Flux X8R (H) ≤ ±7.5% of initial value X7E (C) ≤ ±7.5% of initial value Measure at room temperature after cooling for X6S (S) ≤ ±7.5% of initial value ClassⅠ: 24 ± 2 Hours Y5V(Y) ≤ ±20% of initial value ClassⅡ: 48 ± 4 Hours Appearance No mechanical damage shall occur Q / Tanδ To satisfy the specified initial value To satisfy the specified initial value Insulation Resistance Temperature Cycle Test Conditions Appearance Capacitance No mechanical damage shall occur ClassⅠ(NP0): Within 2.5% or ±0.25pF whichever is larger of initial value Char. X5R(B) X7R(X) X8R(H) X7E(C) X6S(S) Y5V(Y) Cap. change ≤ ±7.5% of initial value ≤ ±7.5% of initial value ≤ ±7.5% of initial value ≤ ±7.5% of initial value ≤ ±7.5% of initial value ≤ ±20% of initial value Q / Tanδ To satisfy the specified initial value Insulation Resistance To satisfy the specified initial value - 36 - ClassⅡ capacitor shall be set for 48±4 hours at room temperature after one hour heat treatment at 150 +0/-10 ℃ before initial measuring. Capacitor shall be subjected to five cycles of the temperature cycle as following: Step 1 2 3 4 Temp.(℃) Min Rated Temp.+0/-3 25 Max Rated Temp.+3/-0 25 Time(min) 30 3 30 3 Measure at room temperature after cooling for ClassⅠ: 24 ± 2 Hours ClassⅡ: 48 ± 4 Hours Technical Specifications Specifications & Test Conditions Item Humidity Specification Appearance Capacitance Damp Heat/ Steady State Test Conditions No mechanical damage shall occur ClassⅠNP0(N)/SL(L): Within 5.0% or ±0.5pF whichever is larger of initial value ClassⅡ: Char. Cap. change X5R(B) ≤ ±12.5% of initial value X7R(X) ≤ ±12.5% of initial value X8R(H) ≤ ±12.5% of initial value X7E(C) ≤ ±12.5% of initial value X6S(S) ≤ ±12.5% of initial value Y5V(Y) ≤ ±30% of initial value Q Class Ι 30pF & over : Q ≧350 10 to 30pF : Q≧275+2.5C 30pF & below: Q≧200+10C Tanδ ClassⅡ Please see table 1 for details Insulation Resistance 1,000MΩ or 50/C Ω whichever is smaller for rated voltage>10V and greater 10/C Ω for rated voltage≦10V. (C in Farad) Appearance No mechanical damage shall occur Capacitance ClassⅠ(NP0)/SL(L): Within 7.5% or ±0.75pF whichever is larger of initial value ClassⅡ: Char. X5R(B) X7R(X) X8R(H) X7E(C) X6S(S) Y5V(Y) Cap. change ≤ ±12.5% of initial value ≤ ±12.5% of initial value ≤ ±12.5% of initial value ≤ ±12.5% of initial value ≤ ±12.5% of initial value ≤ ±30% of initial value Q Class Ι 30pF & Over : Q ≧350 10 to 30pF : Q≧275+2.5C 30pF & Below: Q≧200+10C Tanδ ClassⅡ Please see table 1 for details Insulation Resistance 500MΩ or 25/C Ω whichever is smaller for rated voltage>10V and greater 5/C Ω for rated voltage≦10V. (C in Farad) - 37 - ClassⅡ capacitor shall be set for 48±4 hours at room temperature after one hour heat treatment at 150 +0/-10 ℃before initial measure. Temperature : 40± 2 ℃ Relative humidity : 90 ~95%RH Test Time : 500 +12/-0 hr Measure at room temperature after cooling for ClassⅠ: 24 ± 2 Hours ClassⅡ: 48 ± 4 Hours ClassⅡ capacitors applied DC voltage of the rated voltage is applied for one hour at maximum Operating temperature ±3℃ then shall be set for 48±4 hours at room temperature and the initial measurement shall be conducted. Applied Voltage :Rated Voltage Temperature : 40±2℃ Relative humidity : 90 ~95%RH Test time : 500 +12/-0Hr Current applied : 50 mA Max. Measure at room temperature after cooling for ClassⅠ: 24 ± 2 Hours ClassⅡ: 48 ± 4 Hours Technical Specifications Specifications & Test Conditions Item High Temperature Load (Life Test) Vibration Specification Test Conditions Appearance No mechanical damage shall occur Capacitance ClassⅠ(NP0)/SL(L): Within 5.0% or ±0.5pF whichever is larger of initial value ClassⅡ: Char. Cap. change X5R(B) ≤ ±12.5% of initial value X7R(X) ≤ ±12.5% of initial value X8R(H) ≤ ±12.5% of initial value X7E(C) ≤ ±12.5% of initial value X7R(S) ≤ ±12.5% of initial value Y5V(Y) ≤ ±30% of initial value Q Class Ι 30pF & Over : Q ≧350 10 to 30pF : Q≧275+2.5C 30pF & Below: Q≧200+10C Tanδ ClassⅡ Please see table 1 for details Insulation Resistance 1,000MΩ or 50/C Ω whichever is smaller . For rated voltage>10V and greater 10/C Ω for rated voltage≦10V. (C in Farad) Appearance No mechanical damage shall occur Capacitance Within the specified tolerance Q / Tanδ To satisfy the specified initial value - 38 - ClassⅡ Capacitors : The applied DC test voltage is applied for one hour at maximum operating temperature ±3℃, then left to stabilize for 48±4 hours at room temperature before the initial measurement is taken. Applied voltage : please see HEC specification data sheet. Temperature : max. operating temperature Test Time : 1000 +48/-0Hr Current applied : 50 mA max. Measure at room temperature after cooling for ClassⅠ: 24 ± 2 hours ClassⅡ: 48 ± 4 hours Solder the capacitor on P.C. board. Vibrate the capacitor with an amplitude of 1.5mm P-P changing the frequencies from 10Hz to 55Hz and back to 10Hz in about 1 min. Repeat this for 2 hours each in 3 perpendicular directions. Technical Specifications Table 1 Dielectrics: X5R, X7R, X8R, X7E, X6S Tanδ Size Rated Voltage DC 6.3V DC 10V 0201 DC 16V DC 25V DC 50V DC 6.3V 0402 DC 10V DC 16V DC 25V DC 50V DC 4V DC 6.3V DC 10V 0603 DC 16V DC 25V DC 50V DC 4V DC 6.3V DC 10V 0805 DC 16V DC 25V DC ≥ 50V Capacitance Range -Initial -Vibration -Resistance to solder heat -Temperature Cycle C≤0.01µF C=0.1µF C≤0.01µF C≤2.2nF 2.2nF<C≤3.3nF C≤2.2nF C≤1.0nF C≤0.22µF C≥0.47µF C≤0.1µF 0.1µF<C≤1µF C≤0.22µF C≤0.1µF C≤3.9nF C≥10µF C<1µF 1µF≤C<2.2µF 2.2µF≤C<4.7µF C≥4.7µF C<1µF 1µF≤C<2.2µF C≥2.2µF C≤0.1µF C<1µF C≥1µF C≤0.1µF 0.1µF<C≤0.47µF C>0.47µF C<0.1µF C≥0.1µF C≥10µF C≤3.3µF C≥4.7µF C≥10µF C≤2.2µF 2.2µF<C≤4.7µF C>4.7µF C≤0.47µF 0.47µF<C≤1µF 1µF<C≤4.7µF C>04.7µF C≤0.47µF 0.47µF<C≤4.7µF C≤0.033µF 0.033µF<C≤0.47µF 5.0% 15.0% 5.0% 3.5% 5.0% 2.5% 2.5% 10.0% 15.0% 5.0% 15.0% 5.0% 3.5% 2.5% 15.0% 7.5% 10.0% 10.0% 15.0% 5.0% 7.5% 10.0% 3.5% 5.0% 7.5% 3.5% 5.0% 7.5% 2.5% 3.5% 15.0% 7.5% 10.0% 15.0% 5.0% 10.0% 2.5% 2.5% 5.0% 10.0% 15.0% 3.5% 10.0% 2.5% 3.5% - 39 - -Humidity -Damp Heat/Steady state -High Temperature Loading 7.5% 25.0% 7.5% 7.5% 7.5% 5.0% 5.0% 15.0% 25.0% 7.5% 25.0% 7.5% 7.5% 5.0% 25.0% 12.5% 15.0% 15.0% 25.0% 7.5% 12.5% 15.0% 7.5% 7.5% 12.5% 7.5% 7.5% 12.5% 5.0% 7.5% 25.0% 12.5% 15.0% 25.0% 7.5% 15.0% 5.0% 5.0% 7.5% 15.0% 25.0% 7.5% 15.0% 5.0% 7.5% Technical Specifications Table 1 cont. Dielectrics: X5R, X7R, X8R, X7E, X6S Tanδ Size 1206 1210 1812 ≥2220 -Initial Rated Voltage Capacitance Range -Vibration -Resistance to solder heat -Temperature Cycle C<10µF 10.0% DC 6.3V C≥10µF 15.0% C≤10µF 5.0% DC 10V C>10µF 10.0% C<4.7µF 5.0% DC 16V C≥4.7µF 10.0% C≤2.2µF 3.5% DC 25V 2.2µF<C≤4.7µF 5.0% 4.7µF<C≤10µF 10.0% C≤0.22µF 2.5% DC ≥ 50V 0.22µF<C≤1µF 3.5% C≤47µF 10.0% DC 6.3V 47µF<C≤100µF 15.0% C≤10µF 5.0% DC 10V 10µF<C≤22µF 10.0% 22µF<C≤47µF 15.0% C≤10µF 5.0% DC 16V 10µF<C≤47µF 15.0% C≤10µF 5.0% DC 25V 10µF<C≤22µF 15.0% C<4.7µF 5.0% DC 35V C≥4.7µF 10.0% DC ≥ 50V C≤1µF 3.5% DC 6.3V All Capacitance 10.0% DC 10V 10.0% DC 16V 5.0% DC 25V 5.0% DC 25V 2.5% DC 35V 2.5% DC ≥ 50V 2.5% All Voltages All Capacitance 2.5% -Humidity -Damp Heat/Steady state -High Temperature Loading 15.0% 25.0% 7.5% 15.0% 7.5% 15.0% 7.5% 7.5% 15.0% 5.0% 7.5% 15.0% 25.0% 7.5% 15.0% 25.0% 7.5% 25.0% 7.5% 25.0% 7.5% 15.0% 7.5% 15.0% 15.0% 7.5% 7.5% 5.0% 5.0% 5.0% 5.0% Dielectric: Y5V Tanδ Size 0201 0402 -Initial Rated Voltage Capacitance Range -Vibration -Resistance to solder heat -Temperature Cycle -Humidity -Damp Heat/Steady state -High Temperature Loading DC 6.3V All Capacitance 20.0% 30.0% DC 10V All Capacitance 20.0% 30.0% DC 16V All Capacitance 12.5% 20.0% DC 25V All Capacitance 9.0% 11.0% DC 25V All Capacitance 5.0% 7.5% DC 50V All Capacitance 5.0% 7.5% - 40 - Technical Specifications Table 1 cont. Dielectric: Y5V Tanδ Size Rated Voltage Capacitance Range DC 6.3V DC 10V 0603 DC 16V DC 25V DC 50V DC 6.3V DC 10V 0805 DC 16V DC 25V DC 50V DC 10V DC 16V 1206 DC 25V DC 35V DC 50V DC 6.3V DC 10V DC 16V 1210 1812 DC 25V DC 35V DC 50V DC 6.3V DC 10V DC 16V DC 25V DC 35V DC 50V All Capacitance C<1µF C≥1µF C≥2.2µF C<1µF C≥1µF C≤0.1µF C<1µF C≥1µF C<0.1µF C≥0.1µF All Capacitance C≤4.7µF C≥10µF C≥1µF 1µF≤C<4.7µF C≥4.7µF C<1µF C≥1µF C<1µF C≥1µF C≤1.0µF C≥2.2µF C<1µF 1µF≤C<10µF C≥10µF C<1µF 1µF≤C<4.7µF C≥4.7µF C≥10µF C≤2.2µF C<1µF C≥1µF All Capacitance All Capacitance All Capacitance C<1µF C≤10µF 10µF<C≤22µF C≤10µF All Capacitance All Capacitance All Capacitance All Capacitance All Capacitance All Capacitance All Capacitance -Initial -Vibration -Resistance to solder heat -Temperature Cycle 20.0% 7.0% 16.0% 20.0% 7.0% 16.0% 5.0% 7.0% 12.5% 5.0% 7.0% 20.0% 12.5% 20.0% 7.0% 10.0% 12.5% 7.0% 10.0% 5.0% 10.0% 12.5% 20.0% 7.0% 10.0% 12.5% 5.0% 7.0% 10.0% 12.5% 7.0% 5.0% 7.0% 20.0% 20.0% 12.5% 7.0% 10.0% 12.5% 10.0% 7.0% 20.0% 20.0% 12.5% 10.0% 10.0% 10.0% - 41 - -Humidity -Damp Heat/Steady state -High Temperature Loading 30.0% 10.5% 25.0% 30.0% 10.5% 25.0% 7.5% 10.5% 20.0% 7.5% 10.5% 30.0% 20.0% 30.0% 10.5% 15.0% 20.0% 10.5% 15.0% 7.5% 15.0% 20.0% 30.0% 10.5% 15.0% 20.0% 7.5% 10.5% 15.0% 20.0% 10.5% 7.5% 10.5% 30.0% 30.0% 20.0% 10.5% 15.0% 20.0% 15.0% 10.5% 30.0% 30.0% 20.0% 15.0% 15.0% 15.0% Packing Information Multilayer Ceramic Chip Capacitor Bulk Packing Standard packing 10Kpcs/pack. Special customer requirements considered. Tape Packing Paper Tape Embossed Tape Top Cover Tape Top Cover Tape Embossed Carrier Tape Carrier Tape Bottom Cover Tape Trailer Section 40mm min. Leader Section 20mm min. Chip Section 400mm min. Drawing Direction Material And Quantity (¢180mm) Chip Size (EIA Code) L Dimension (mm) W 0201 0402 0603 0805 0.6 1.0 1.6 2.0 0.3 0.5 0.8 1.25 1206 3.2 1.6 1210 3.2 2.5 1808 4.6 2.0 1812 4.6 3.2 1825 4.6 6.35 2208 2211 5.7 5.7 2.0 2.8 2220 5.7 5.0 2225 5.7 6.35 T Paper Tape T≤0.33 T≤0.55 T≤0.90 T≤0.90 0.9< T≤1.25 T≤0.90 0.9< T≤1.25 T>1.25 T≤1.25 T>1.25 T≤1.25 T>1.25 T≤2.20 T>2.20 T≤2.20 T>2.20 T≤2.20 T≤2.20 T>2.20 T≤2.20 T>2.20 T≤2.20 T>2.20 NA：Not Available -42 - 15,000 pcs/reel 10,000 pcs/reel 4,000 pcs/reel 4,000 pcs/reel N/A 4,000 pcs/reel N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A ¢180mm reel Plastic Tape N/A N/A N/A N/A 3,000 pcs/reel N/A 3,000 pcs/reel 2,000 pcs/reel 3,000 pcs/reel 2,000 pcs/reel 3,000 pcs/reel 2,000 pcs/reel 1,000 pcs/reel 700 pcs/reel 700 pcs/reel 400 pcs/reel 1,000 pcs/reel 1,000 pcs/reel 700 pcs/reel 1,000 pcs/reel 700 pcs/reel 700 pcs/reel 400 pcs/reel Packing Information Dimensions of Tape Specification Paper Tape Pitching Hole Chip Cavity I F A G B C t A B C D E F G H I t 0201 0.37±0.1 0.67±0.1 4.00±0.1 2.0±0.05 2.00±0.1 1.75±0.1 3.5±0.05 8.00±0.3 ¢1.5+0.1/-0 1.1 max. 0402 0.61±0.1 1.20±0.1 -- --> -- --> -- --> -- --> -- --> -- --> -- --> -- --> D H E 0603 1.10±0.2 1.90±0.2 0805 1.50±0.2 2.30±0.2 4.00±0.1 -- --> 1206 1.90±0.2 3.50±0.2 Unit：mm 1210 2.90±0.2 3.60±0.2 Embossed Tape Pitching Hole Chip Cavity I F A G B t O C D H E J A B C D E F G H I J t O Unit：mm 0805 1206 1.5±0.1 1.9±0.2 2.3±0.2 3.5±0.2 4.0±0.1 2.0±0.05 4.0±0.1 1.75±0.1 3.5±0.05 8.0±0.3 ¢1.5+0.1/-0 3.0 max. 0.3 max. 0.15 min. 1210 2.9±0.2 3.6±0.2 1808 2.5±0.2 4.9±0.2 2208 2.5±0.2 6.1±0.2 1812 3.6±0.2 4.9±0.2 8.0±0.1 5.5±0.05 12.0 +3/-0 4.0 max. - 43 - 1825 6.9±0.2 4.9±0.2 2211 3.2±0.2 6.1±0.2 2220 5.4±0.2 6.1±0.2 2225 6.9±0.2 6.1±0.2 Packing Information Reel Dimension Unit：mm E A B C D E W t r C B D r A W 0402 to 1210 ¢ 382 max. ¢ 50 min. ¢ 13±0.5 ¢ 21±0.8 ¢ 2.0±0.5 10±0.15 2.0±0.5 1.0 1808 to 2220 ¢ 178±0.2 ¢ 60±0.2 ¢ 13±0.5 ¢ 21±0.8 ¢ 2.0±0.5 13±0.3 17±1.4 1.0 t mm +0 -0.2 36.0 Cassette Packing Chip Size Length Width Thickness Quantity 19.0mm mm +0.2 -0 1.5 +0.1 -0 mm 2.0 +0-0.1 mm +0.2 3.0 -0 mm 31.5 10mm 12.0±0.1mm 53.3mm 8.8±0.1mm 6.8±0.1mm Bulk Cassette Packing 110±0.7 mm 5.0mm Cover Tape Peel Off Force Peel direction 165 to 180° Top Tape Bottom Tape The peel off force of cover tape is 5 to 70 grams in the direction of the arrow. - 44- 0402 1.00±0.05 0.50±0.05 0.50±0.05 50,000pcs 0603 1.60±0.10 0.80±0.10 0.80±0.10 15,000pcs Unit：mm 0805 2.00±0.20 1.25±0.20 0.60±0.10 10,000pcs EIA Designations EIA Designations For Class Ι Dielectrics Coefficient of capacitance (ppm/ ℃) 0.0 1.0 1.5 2.2 3.3 4.7 7.5 For Class Π Dielectrics Multiplier applicable to column C M P R S T U -1.0 -10 -100 -1000 -10000 +1 +10 +100 +1000 +10000 0 1 2 3 4 5 6 7 8 9 Tolerance of temp. coeff.(ppm/ ℃) 30 60 120 250 500 1000 2500 G H J K L M N Ex.: C0G 0±30ppm/ ℃ U2J Negative 750±120ppm/ ℃ Low Temp. Symbol High Temp. Symbol Max. %△C Symbol -55℃ -30℃ +10℃ +45℃ +65℃ +85℃ +105℃ +125℃ +150 ℃ +200 ℃ ±1.0% ±1.2% ±2.2% ±3.3% ±4.7% ±7.5% ±10.0% ±15.0% ±22.0% +22% /-33% +22% /-56% +22% /-82% Ex.: X7R Y5V Temperature Coefficient Performance Class EIA Symbol Ι NP0 Π Dielectric Code N Temperature Range(℃) -55℃ ~ +125 ℃ X Y Z 3 4 5 6 7 8 9 -55 ~ +125 ℃ ±15% -30 ~ +85 ℃ +22%/-82% Capacitance Change 0±30 ppm/℃ Reference Temperature 25℃ +350/-1000 ppm/℃ 25℃ ±15% 25℃ C -25℃ ~ +85 ℃ -55℃ ~ +125℃ ±4.7% 25℃ B -55℃ ~ +85℃ ±15% 25℃ SL L X7R X X7E X5R -55℃ ~ +125℃ A B C D E F P R S T U V Y5V Y -30℃ ~ +85℃ +22/-82% 25℃ Y5U E -30℃ ~ +85℃ +22/-56% 25℃ Z5U Z +10℃ ~ +85℃ +22/-56% 25℃ Dielectric Material – Ageing Rate Ageing Rate NP0: 0 X7R/X5R : 1 ~ 4 % /decade Y5V : 6~10 % /decade After performing de-ageing at 150±5 ℃ for 30 minutes and placement at room temperature for 48 hours. - 45 - Precautionary Information Construction of Board Pattern Improper circuit layout and pad/land size may cause poor solder joints between the component and the PC board. Insufficient solder may create weak joints and excessive solder may increase the potential of mechanical or thermal cracks within the ceramic capacitor. Therefore we recommend the solder pad/land size to be as shown in the following table: 1. Size and recommended land dimensions for reflow soldering Capacitor C Slit Land E Solder Resistor D B Chip (mm) EIA Code A L 0.60 1.00 1.60 2.00 3.20 3.20 4.60 4.60 4.60 5.70 5.70 5.70 5.70 0201 0402 0603 0805 1206 1210 1808 1812 1825 2208 2211 2220 2225 W 0.30 0.50 0.80 1.25 1.60 2.50 2.00 3.20 6.35 2.00 2.80 5.00 6.35 Land (mm) A 0.2~0.3 0.3~0.5 0.4~0.6 0.7~0.9 2.2~2.4 2.2~2.4 2.8~3.4 2.8~3.4 2.8~3.4 4.0~4.6 4.0~4.6 4.0~4.6 4.0~4.6 B 0.2~0.4 0.3~0.5 0.6~0.7 0.6~0.8 0.8~0.9 1.0~1.2 1.8~2.0 1.8~2.0 1.8~2.0 2.0~2.2 2.0~2.2 2.0~2.2 2.0~2.2 C 0.2~0.4 0.4~0.6 0.6~0.8 0.8~1.1 1.0~1.4 1.8~2.3 1.5~1.8 2.3~3.0 5.1~5.8 1.5~1.8 2.0~2.6 3.5~4.8 5.1~5.8 D ----1.0~2.0 1.0~2.0 1.0~2.8 1.0~2.8 1.0~4.0 1.0~4.0 1.0~4.0 1.0~4.0 1.0~4.0 E ----3.2~3.7 4.1~4.6 3.6~4.1 4.8~5.3 7.1~8.3 3.6~4.1 4.4~4.9 6.6~7.1 7.1~8.3 2. Mechanical strength varies according to the location of the chip capacitors on the P.C. board. Design the layout of the PCB in such a way as to minimize stress imposed on the components upon flexing the boards during depanelization or other processes. e perforation c b slit Component layout close to the edge of the board or the “depanelization line” is not recommended. Susceptibility to stress is in the order of: a>b>c and d>e d a Mounting 1. Sometimes cracking can be caused by the impact load of the pick and place nozzle. In the pick and place operation, if the low dead point is too low, excessive stress is applied to component. This may cause cracks in the ceramic capacitor, it is therefore recommended to move the low dead point of the nozzle to a higher level to minimize board warpage and stress on the components. Nozzle pressure should be adjusted to 1N to 3N (static load) during the pick and place operation. Excessive Stress Warping of Board Warping of Board Nozzle PCB Crack Support pin 2. Amount of Adhesive a a b c Example : 0805 & 1206 a 0.2mm min. b 70 ~ 100 μm c Do not touch the solder land c - 46 - Precautionary Information Handling after chip mounting 1. Proper handling of the PCB is recommended since excessive bending and twisting of the PCB may induce mechanical stress and cause internal cracking of the capacitor. High potential of cracking Low potential of cracking Bending Twist 2. There is a potential of cracking if the board is warped due to excessive load from the check pin. Bad Good Support Pin Check pin Check pin 3. Examples of PCB de-panelization jigs: The outline of a PCB breaking jig is shown below. It is recommended when dividing or breaking PCBs that they are held near the jig where no bending will occur. In this way there will be no compressive stress applied to the components or capacitors on the PCB. Do not hold the PCB at a position which is far away from the jig. Tensile stress may cause the capacitors to crack. PCB V-groove PCB splitting jig Poor Dividing Load Direction PCB V-groove Recommend Dividing Load Direction Load Direction Chip Component Chip Component Load Direction - 47 - Precautionary Information Soldering 1. Wave Soldering Most components are wave soldered with solder at 230 to 250°C. Adequate care must be taken to prevent the potential of thermal cracks in the ceramic capacitors. Refer to the soldering methods below for optimum soldering benefits. For SMC range see special recommendations on page 34. Recommended wave soldering profile Soldering Pre-heating Cooling Temperature (°C) 300 Soldering Method Change in Temp.(℃) 250 230 1206 and Under ∆T ≤100~130℃max. 1210 to 1812 ∆T ≤70~100℃max 200 2220 and greater Not recommended ∆T 120seconds or more 60seconds or more 2 to 3 sec. To optimize the result of soldering, proper preheating is essential: 1) Preheat temperature is too low a. Flux flows too easily b. Possibility of thermal cracks 2) Preheat temperature is too high a. Flux deteriorates even when oxide film is removed b. Causes warping of the circuit board c. Loss of reliability in chips and other components Cooling Condition: Natural cooling using air is recommended. Forced cooling should be avoided. However if the chips are dipped into a solvent for cleaning, the temperature difference (ΔT ) between the solvent and the chips must be less than 100°C. 2. Reflow Soldering Preheating to the reflow temperature is recommended to decrease the potential of thermal cracking in the components. The recommended heating rate depends on the size of component, however it should not exceed 3°C/Sec. Recommend reflow profile for lead-free soldering temperature profile (MIL-STD-202G #210F) Pre-heating Soldering Cooling 260 °C max./ 10 sec. 260max. Temperature (°C) 217 ∆T Soldering Method Change in Temp.(℃) 1206 and Under ∆T ≤190℃ 1210 and Over ∆T ≤130℃ ※ Number of soldering cycles : 2 (max.) 150°C /60sec. Min. 70 to 90 sec. - 48 - Precautionary Information 3. Hand Soldering Sudden temperature changes in ceramic capacitors will result in a temperature gradient within the component and may therefore cause internal thermal cracking. In general a hand soldering method is not recommended particularly on sizes 2220 and over, unless proper preheating and handling precautions are taken. Care must also be taken not to touch the ceramic body of the capacitor with the tip of soldering iron. The soldering iron tip should always be placed on to the solder pad. For SMC range see special recommendations on page 34. 350 Temperature (°C) 250 Soldering Method Change in Temp.(℃) 1206 and Under ∆T ≤150℃ 1210 and Over ∆T ≤130℃ 200 ∆T Within 5 seconds. How to Solder Repair by Solder Iron 1) Selection of the soldering iron tip The required temperature of the soldering iron for any type of repair depends on the type of the tip, the substrate material and the solder land size. 2) Recommended solder iron condition a.) Preheat the substrate to 60°C to 120°C on a hot plate. Note that due to the heat loss, the actual setting of the hot plate may have to be higher (for example 100°C to 150°C). b.) Soldering iron power should not exceed 30 W. c.) Soldering iron tip diameter should not exceed 3mm. d.) Temperature of the iron tip should not exceed 350°C and the process should be finished within 5 seconds (refer to MIL-STD-202G). e.) Do not touch the ceramic body with the tip of solder iron. Direct contact of the soldering iron tip to the ceramic body may cause thermal cracks. f.) After soldering, products should be allowed to cool naturally in air. Storage Capacitors should be stored where temperature and relative humidity do not exceed 40°C and 70%RH. We recommend capacitors be used within 12 months from the date of manufacturing. Products should be stored in the original packaging and should not be removed from the outer polyethylene bag until just before usage. If the packaging is open, seal it as soon as possible or keep it in a desiccant with a desiccation agent. - 49 - Eliminating Mechanical Cracking – Super Term Internal MLCC cracking can result in serious failure modes. If ceramic capacitors are subjected to severe mechanical stress, a bending crack may occur. This crack can run through two or more electrodes of opposing polarity and result in a short circuit. Typical bending cracks are shown below. In the worst case scenario, these short circuits may lead to the MLCC overheating and catastrophic failure. Super Term Advantages • “Flexible” Termination Layer incorporated • Reduce Cracking due to Mechanical Stress Typical Applications are power circuit input and output filtering, smoothing… force Ag/Cu Plating-Ni Plating-Sn Solder PCB Crack Bending Standard termination construction may result in cracking during PCB bending, vibration, Depanelizing, etc. Actual Examples: Failure Mode Type 1 Crack running through at least two electrodes. Surface View The failure mode results from PCB bending forces. These cracks may not be visible on the MLCC surface. Cross sectional analysis is required to determine these internal Crack cracks. Cross Section View Failure Mode Type 2 (wetting greater than 2/3 of thickness) Crack Top View MLCC cracking frequently occurs during the circuit board depanelizing process. The root cause is knife (blade) vibration during the process. Crack Cross Section View - 50 - Eliminating Mechanical Cracking – Super Term Holy Stone has developed the “Super Term” Series (TX suffix in the part number), which incorporates a “flexible layer” in the termination structure. This construction effectively absorbs external forces, reduces the incidence of cracking and improves overall product reliability. Super Term product applications include : high temperature automotive, power circuits and other critical end products with extreme processing conditions. Super Term ‘TX’ Product force Ag/Cu Flexible Layer Plating-Ni Plating-Sn Solder Bending PCB Crack Prevention Reliability/Durability Comparison (b) Substrate Flexure Comparison ( 0805/X7R) (a) Thermal Shock Comparison ( 0805/X7R) Thermal Shock 50 Normal Normal 40 SuperTerm 40 Failure Rate Failure Rate Thermal Shock 50 SuperTerm 30 20 10 30 20 10 0 0 1 10 100 Cycles 1000 1 10000 Thermal shock test on standard termination results in inception of failure at 500 cycles. Super Term TX Series reliability improves to over 3000 cycles. 10 100 Cycles 1000 10000 Bending test on Super Term shows an improvement of about 5.0 mm bend vs. an average of about 2.0 mm. for standard termination. Polymer Ag No cracking apparent in the ceramic During destructive bending tests, the PCB is subjected to bending until capacitor failure. With Super Term there is no cracking damage in the ceramic. Super Term effectively prevents ceramic body cracking during extreme mechanical stress as simulated by this test. Plating : Sn Plating : Ni Glass Ag Polymer Ag Super Term failures resulting from destructive bending test tend to occur in the OPEN mode and not short circuit mode typical of standard termination failures. The Super Term material is a ”polymer silver” material and can be seen in the above photo. - 51 - Coated Products for Surface Arc Prevention MLCC Arc Prevention – for Hi-Pot Testing Due to the open and porous nature of the surface of the X7R dielectric, moisture and/or dirt which will have a lower resistance than the dielectric grains, can become entrapped in the surface. Dirt can also include any flux residues as a result of the soldering process. This dirt/flux as well as becoming entrapped into the surface will, in itself, attract additional moisture onto the surface thus reducing the surface resistance and the voltage at which arcing occurs. Surface arcing or flashover at worst can cause equipment failure during isolation testing and, in addition, will leave a carbon track on the surface which can lead to eventual failure of the capacitor. Arc Prevention Increases voltage at which arcing occurrs Passed IEEE 802.3 1500VAC or 2250VDC Typical Applications for telecommunication devices(IEEE802.3) in LAN interface, Ballast… Holy Stone has developed an Arc Prevention coating process that coats the surface of the dielectric without encroaching onto the termination material. This coating makes the surface of the dielectric non porous and prevents moisture and dirt becoming trapped thus reducing the surface resistance and the arcing voltage of the capacitor. It has been shown that the arcing voltage can be increased by up to 65% on soldered parts by using the Holy Stone Arc Prevention Coating. Typical surface arcing on X7R MLCC is from termination-totermination (shown in polarized light) NP0 & X7R Material Characteristic Comparison Item NP0 X7R Dielectric Constant 30 ~ 100 2000 ~ 4000 I. Resistance >1013 Ω >1011 Ω B.D. Voltage 70~80 Vdc/um 40~50 Vdc/um < 500nm 900nm ~ 1500nm Grain Size • The different grain shape and size will lead to different grain density after sintering. • The grain size of NP0 dielectric is smaller than that of X7R resulting a denser and less porous structure. • Surface porosity will trap dirt, flux and moisture causing the surface resistance to dramatically decrease. Grain Size (x8000) • Low surface resistance will cause the arcing voltage to reduce, possibly leading to failure of the capacitor or equipment during isolation testing. Porosity (x1000) • Using the Holy Stone Arc Prevention coating effectively makes the surface of X7R dielectric similar to that of NP0. - 52 - Coated Products for Surface Arc Prevention Creepage distance v.s. Arcing Voltage Recommended Solder Pad Design Capacitor Land C Solder Dam Solder Ball 3.2mm A B Chip (mm) L W 4.6±0.3 2.0 ±0.2 4.6±0.3 3.2 ±0.2 5.7±0.4 2.0 ±0.2 5.7±0.4 2.0 ±0.3 5.7±0.4 5.0 ±0.4 EIA Code Solder balls reduce the creepage distance between terminations and thus reduce the arcing voltage 1808 1812 2208 2211 2220 A 3.2~3.6 3.2~3.6 4.0~4.6 4.0~4.6 4.0~4.6 Land (mm) B 1.2~2.4 1.2~2.4 1.2~2.4 1.2~2.4 1.2~2.4 C 1.5~1.8 2.3~3.0 1.5~1.8 2.0~2.6 3.5~4.8 Distance between terminations also has a direct effect on the arcing voltage. The greater the distance (chip size) the higher this voltage will be. Solder pad design will have a significant effect on the arcing of high voltage capacitors. Above is our recommended solder pad land design or each chip size. Arc Prevention Coating. The application of the Arc Prevention coating, which is a high insulation resistance material, coats the surface of the dielectric with a smooth and non porous layer that prevents moisture entering the surface pours and also aids cleaning post soldering. The following diagrams show the difference between coated and non coated X7R components. High Voltage Test Comparison Surface Comparison Item Porosity (x1000) High Voltage Test 70 Failure Rate (%) Before After Surface Appearance of non coated and coated product. 60 50 Normal Type Coated Product 40 30 20 10 0 100 1000 Voltage (Vdc) 10000 • The coating reduces the porosity of the X7R surface and provides a smooth surface which help prevent surface arcing. • The maximum Hi-pot test level may be increased by >1000Vdc after coating with both unsoldered and soldered components. Using the Holy Stone Arc Prevention coating increases the surface arcing voltage of X7R capacitors to almost that of an equivalent NP0 part, however the higher dielectric constant of X7R allows for higher capacitance values to be achieved in any given case size. The Holy Stone Arc Prevention coating provides a total solution to the harmful effects of surface arcing. - 53 - RoHS Compliant Description: MLCC , Ceramic Disc Capacitors: NP0, SL, X7R, X5R, X6S, X7E, Y5V and Y5U dielectrics. Basic Construction/Homogenous Material : (a) Standard Type (b) “X” Type: Super Termination (Option) Solder Metal Solder Metal Barrier Polymer Electrodes External Electrodes Inner Electrodes Barrier External Electrodes Inner Electrodes Ceramic Body Ceramic Body ․Multi-layer Ceramic Chip capacitors are homogenous devices manufactured from materials that cannot be mechanically disjointed into different materials. ․Multi-layer Ceramic Chip products : Standard sizes are fully RoHS compliant. Group Series RoHS Status Limit MLC Family Surface Mount Products Cadmium Hexavalent Chromium <0.01% <0.01% Lead * Mercury <0.1% <0.01% PBBs PBDE <0.01% 0.01% NCC,HCC,VAC,RFC, HCX, SMC, LCC Available √ √ √ √ √ √ TCX,LDC, HTC Available √ √ √ √ √ √ HCN,SAC SCC, Available √ √ √/√* √ √ √ NP0 Available √ √ √ / √* √ √ √ X7R Available √ √ √/√* √ √ √ HVC * Pb in internal ceramic insert – exempt from RoHS annex 7 to Article 4.1 RoHS Status Lead-Free Status / MSL level ※ External plating : 100% Matte Sn as standard. ※ Pb-free reflow & wave solder compliant, MSL=1 ․Reflow : 260℃ max recommended. ․Wave : 260℃ max recommended, Wave & reflow profile refer to HEC recommended solder profile. Part Number Designation: (Generally no change to P/N, but available as P/N prefix at customer request) RoHS compliant : Pb-free : Product marking : (available at customer request, highlighted or marked on reel and container) Pb free : Pb free No change to P/N No change to P/N refer to JEDEC&IPC Std. -54 - ISO Certifications ISO Certifications Plant Certificated Date Organization Registration No. Taipei HQ/Lung Tan Factory ISO 9001:2000 20,Mar.,2002 BVQI TW08098Q Taipei HQ/Lung Tan Factory ISO 14001:1996 29,May,2003 BVQI 131145 Dongguan Manufacturing ISO 9001:2000 16.Dec.,2003 BVQI TW08098Q Taipei HQ/Lung Tan Factory QS 9000 : 1998 04.Oct.,2004 BVQI 162522 ISO 9001:2000 ISO 14001:1996 - 55 - QS 9000:2004 MEMO - 56 - Worldwide Sales Contacts A Partner You Can Trust Location in Taiwan • Taipei HQ / 台北總公司 台北市內湖區環山路二段62號1樓 1FL, No. 62, Sec. 2, Huang Shan Rd., Nei Hu Dist., Taipei, Taiwan, R.O.C. Tel: 886-2-26270383 Fax: 886-2-27987181 Zip code: 114 • Lungtan Plant / 龍潭生產事業處 桃園縣龍潭鄉烏林村工五路90巷56號 No.56, Lane 90, Kung Wu Road, Wu Lin Village, Lung Tan Hsiang, Tao Yuan County, Taiwan, R.O.C. Tel: 886-3-4995288 Fax: 886-3-4995299 Zip code: 325 • Kaohsiung Sales Office / 高雄分公司 高雄市前鎮區一心一路239號8樓之一 8FL-1, No.239, Yi-Hsin 1st. Road, Chien Chen Dist., Kaohsiung, Taiwan, R.O.C. Tel: 886-7-5366115 Fax: 886-7- 5366105 Zip code: 806 Location in China • Shanghai Sales Office / 上海分公司 上海市延安西路1160号首信银都大厦16楼 16F, Shouxinyindu Building, 1160 YanAn (W) Road, Shanghai, China. Tel: 86-21-51875266 Fax: 86-21-62826722 Zip Code: 200052 • Suzhou Sales Office / 蘇州分公司 蘇州市新區鄧尉路9號潤捷廣場 1棟208室 Room 208, Building 1 Runjie Plaza, No.9 Dengwel Road, Suzhou New Area, China Tel: 86-512-82100058 Fax: 86-512-68026968 Zip code: 215021 • Dongguan Plant / 東莞廠 廣東省東莞市塘廈鎮蛟乙塘村寶石工業區 Baoshi Industrial Area, Jiaoyitang Tangxia Town, Dongguan Guangdong, China. Tel: 86-769-87928002 Fax: 86-769-87914761 Zip code: 523723 • Hong Kong Office / 香港分公司 香港九龍灣宏開道15號九龍灣工業中心726室 Room 726, Kowloon Bay Industrial Center , 15 Wang Hoi Road, Kowloon Bay, Hong Kong. Tel: 852-23055141 Fax: 852-23055789 Location in Singapore • Holy Stone Holdings Co., Ltd. Blk 7 Kallang Place #03-04 ,Singapore 339153 Tel : (65) 6513 2343 Fax: (65)6563 6705 Location in USA Location in Europe • Holy Stone International 26395 Jefferson Ave. Suite H Murrieta, CA, 92562, USA Tel : 951-696-4300 Fax: 951-696-4301 Website: http//www.holystonecaps.com Email: [email protected] • Holy Stone (Europe) Ltd. Henderson Business Centre, Unit 24, Ivy Road, Norwich, Norfolk, NR5 8BF, United Kingdom Tel: +44 (0)1603 251780 Fax: +44 (0)1603 251786 Website: http//www.holystonecaps.com Email: [email protected] 禾伸堂企業股份有限公司 Holy Stone Enterprise Co., Ltd. Edition 2010.10